Результат пошуку "8100800" : 95
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| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
| 2348-1-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
 Description: TERM TURRET SNGPackaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: Single End Flange Diameter: 0.094" (2.39mm) Length - Overall: 0.209" (5.31mm) Termination: Swage Length - Above Board: 0.156" (3.96mm) Mounting Hole Diameter: 0.064" (1.63mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.061" (1.55mm) Number of Turrets: Double Length - Below Flange: 0.053" (1.35mm) Staking Side OD: 0.061" (1.55mm) Staking Side ID: 0.046" (1.17mm) |
товар відсутній |
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| 2508-1-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SNG Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: Single End Flange Diameter: 0.125" (3.18mm) Length - Overall: 0.364" (9.25mm) Termination: Swage Length - Above Board: 0.301" (7.65mm) Mounting Hole Diameter: 0.094" (2.39mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.093" (2.36mm) Number of Turrets: Triple Length - Below Flange: 0.063" (1.60mm) Staking Side OD: 0.090" (2.29mm) Staking Side ID: 0.064" (1.63mm) |
товар відсутній |
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2508-1-00-80-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN OVER NI |
товар відсутній |
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| 2708-1-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET DBL Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: Double End Flange Diameter: 0.156" (3.96mm) Length - Overall: 0.436" (11.07mm) Termination: Swage Length - Above Board: 0.187" (4.75mm) Mounting Hole Diameter: 0.120" (3.05mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Diameter - Turret Head: 0.067" (1.70mm), 0.089" (2.26mm) Number of Turrets: Single Length - Below Flange: 0.249" (6.32mm) |
товар відсутній |
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3118-1-00-80-00-00-08-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN OVER NI |
товар відсутній |
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3118-1-00-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Board Thickness: 0.031" (0.79mm) Terminal Type: PC Pin Flange Diameter: 0.050" (1.27mm) Length - Overall: 0.371" (9.42mm) Termination: Swage Mounting Hole Diameter: 0.035" (0.89mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Single End Pin Size - Above Flange: 0.025" (0.64mm) Dia Length - Below Flange: 0.051" (1.30mm) Length - Above Flange: 0.150" (3.81mm) Part Status: Active |
товар відсутній |
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3128-1-00-80-00-00-08-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN OVER NI |
товар відсутній |
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3408-1-00-80-00-00-03-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN OVER NI |
товар відсутній |
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| 3408-1-00-80-00-00-03-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC Packaging: Bulk Contact Finish: Tin Mounting Type: Through Hole Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.072" (1.83mm) Length - Overall: 0.402" (10.20mm) Termination: Press-Fit Mounting Hole Diameter: 0.057" (1.45mm) Contact Finish Thickness: 200.0µin (5.08µm) Contact Material: Brass Alloy Terminal Style: Wire Pin Size - Above Flange: 0.039" (0.99mm) Dia Pin Size - Below Flange: 0.061" (1.55mm) Dia Length - Below Flange: 0.142" (3.60mm) Length - Above Flange: 0.260" (6.60mm) |
товар відсутній |
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DEL-046227008100800LF | Kyocera AVX Components |
Conn FFC/FPC Connector SKT 8 POS 1mm Solder RA SMD T/R |
товар відсутній |
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V838-100-80-0.13 | t-Global Technology |
Description: THERM PAD 100MMX80MM GRAY Packaging: Bulk Color: Gray Material: Phase Change Compound Shape: Rectangular Thickness: 0.0051" (0.130mm) Type: Phase Change Pad, Sheet Usage: Multi Outline: 100.00mm x 80.00mm Thermal Conductivity: 3.8W/m-K Part Status: Active |
товар відсутній |
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V838-100-80-0.2 | t-Global Technology |
Description: THERM PAD 100MMX80MM GRAY Packaging: Bulk Color: Gray Material: Phase Change Compound Shape: Rectangular Thickness: 0.0079" (0.200mm) Type: Phase Change Pad, Sheet Usage: Multi Outline: 100.00mm x 80.00mm Thermal Conductivity: 3.8W/m-K Part Status: Active |
товар відсутній |
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| 008370081000800LF | Kyocera AVX Components |
Conn FFC/FPC Connector SKT 8 POS 1.25mm Solder ST Thru-Hole Tray |
товар відсутній |
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008370181000800 | Kyocera AVX Components |
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray |
товар відсутній |
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| 008370181000800LF | Kyocera AVX Components |
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray |
товар відсутній |
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2108-1-00-01-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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| 2108-1-00-50-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER |
товар відсутній |
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2308-1-00-01-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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2318-1-00-01-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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2318-1-00-50-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER |
товар відсутній |
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2348-1-00-01-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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| 2348-1-00-50-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER |
товар відсутній |
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2508-1-00-01-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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| 2508-1-00-50-00-00-07-0 | Mill-Max |
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER |
товар відсутній |
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| 3138-1-00-01-00-00-08-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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3408-1-00-01-00-00-03-0 | Mill-Max |
Circuit Board Hardware - PCB 200u SN/PB OVER NI |
товар відсутній |
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399-10-108-10-008000 | Mill-Max |
Conn Spring Loaded Connector HDR 8 POS 2.54mm Solder RA Thru-Hole |
товар відсутній |
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| 800-80-008-10-002101 | Preci-Dip |
Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole |
товар відсутній |
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| 81000800 | Sumitomo Electric | JNT-3L-SN |
товар відсутній |
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850-80-008-10-001101 | Preci-Dip |
Conn Unshrouded Header HDR 8 POS 1.27mm Solder ST Top Entry Thru-Hole Box |
товар відсутній |
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| 952-08-008-1-00 | W+P Products GmbH |
Pin Headers, 2.54mm Pitch, Straight, Single-Double Row 0.5mm Round Contacts |
товар відсутній |
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| INSUL KPT/KSP 14-18S | ITT Cannon | D-Sub Standard Connectors |
товар відсутній |
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| X1G004281000800 | Epson |
Clock Oscillator |
товар відсутній |
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X1G004481000800 | Epson |
Oscillator XO 20MHz ±50ppm 15pF CMOS 55% 1.8V/2.5V/3.3V 4-Pin SMD T/R |
товар відсутній |
| 2348-1-00-80-00-00-07-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.094" (2.39mm)
Length - Overall: 0.209" (5.31mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.064" (1.63mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.061" (1.55mm)
Number of Turrets: Double
Length - Below Flange: 0.053" (1.35mm)
Staking Side OD: 0.061" (1.55mm)
Staking Side ID: 0.046" (1.17mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.094" (2.39mm)
Length - Overall: 0.209" (5.31mm)
Termination: Swage
Length - Above Board: 0.156" (3.96mm)
Mounting Hole Diameter: 0.064" (1.63mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.061" (1.55mm)
Number of Turrets: Double
Length - Below Flange: 0.053" (1.35mm)
Staking Side OD: 0.061" (1.55mm)
Staking Side ID: 0.046" (1.17mm)
товар відсутній
| 2508-1-00-80-00-00-07-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.125" (3.18mm)
Length - Overall: 0.364" (9.25mm)
Termination: Swage
Length - Above Board: 0.301" (7.65mm)
Mounting Hole Diameter: 0.094" (2.39mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.093" (2.36mm)
Number of Turrets: Triple
Length - Below Flange: 0.063" (1.60mm)
Staking Side OD: 0.090" (2.29mm)
Staking Side ID: 0.064" (1.63mm)
Description: TERM TURRET SNG
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Single End
Flange Diameter: 0.125" (3.18mm)
Length - Overall: 0.364" (9.25mm)
Termination: Swage
Length - Above Board: 0.301" (7.65mm)
Mounting Hole Diameter: 0.094" (2.39mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.093" (2.36mm)
Number of Turrets: Triple
Length - Below Flange: 0.063" (1.60mm)
Staking Side OD: 0.090" (2.29mm)
Staking Side ID: 0.064" (1.63mm)
товар відсутній
| 2508-1-00-80-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN OVER NI
Circuit Board Hardware - PCB 200u SN OVER NI
товар відсутній
| 2708-1-00-80-00-00-07-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: TERM TURRET DBL
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Double End
Flange Diameter: 0.156" (3.96mm)
Length - Overall: 0.436" (11.07mm)
Termination: Swage
Length - Above Board: 0.187" (4.75mm)
Mounting Hole Diameter: 0.120" (3.05mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.067" (1.70mm), 0.089" (2.26mm)
Number of Turrets: Single
Length - Below Flange: 0.249" (6.32mm)
Description: TERM TURRET DBL
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: Double End
Flange Diameter: 0.156" (3.96mm)
Length - Overall: 0.436" (11.07mm)
Termination: Swage
Length - Above Board: 0.187" (4.75mm)
Mounting Hole Diameter: 0.120" (3.05mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Diameter - Turret Head: 0.067" (1.70mm), 0.089" (2.26mm)
Number of Turrets: Single
Length - Below Flange: 0.249" (6.32mm)
товар відсутній
| 3118-1-00-80-00-00-08-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN OVER NI
Circuit Board Hardware - PCB 200u SN OVER NI
товар відсутній
| 3118-1-00-80-00-00-08-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.050" (1.27mm)
Length - Overall: 0.371" (9.42mm)
Termination: Swage
Mounting Hole Diameter: 0.035" (0.89mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.025" (0.64mm) Dia
Length - Below Flange: 0.051" (1.30mm)
Length - Above Flange: 0.150" (3.81mm)
Part Status: Active
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Board Thickness: 0.031" (0.79mm)
Terminal Type: PC Pin
Flange Diameter: 0.050" (1.27mm)
Length - Overall: 0.371" (9.42mm)
Termination: Swage
Mounting Hole Diameter: 0.035" (0.89mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Single End
Pin Size - Above Flange: 0.025" (0.64mm) Dia
Length - Below Flange: 0.051" (1.30mm)
Length - Above Flange: 0.150" (3.81mm)
Part Status: Active
товар відсутній
| 3128-1-00-80-00-00-08-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN OVER NI
Circuit Board Hardware - PCB 200u SN OVER NI
товар відсутній
| 3408-1-00-80-00-00-03-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN OVER NI
Circuit Board Hardware - PCB 200u SN OVER NI
товар відсутній
| 3408-1-00-80-00-00-03-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.402" (10.20mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Pin Size - Below Flange: 0.061" (1.55mm) Dia
Length - Below Flange: 0.142" (3.60mm)
Length - Above Flange: 0.260" (6.60mm)
Description: CONN PC PIN CIRC
Packaging: Bulk
Contact Finish: Tin
Mounting Type: Through Hole
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.402" (10.20mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Pin Size - Below Flange: 0.061" (1.55mm) Dia
Length - Below Flange: 0.142" (3.60mm)
Length - Above Flange: 0.260" (6.60mm)
товар відсутній
| DEL-046227008100800LF |
|
Виробник: Kyocera AVX Components
Conn FFC/FPC Connector SKT 8 POS 1mm Solder RA SMD T/R
Conn FFC/FPC Connector SKT 8 POS 1mm Solder RA SMD T/R
товар відсутній
| V838-100-80-0.13 |
|
Виробник: t-Global Technology
Description: THERM PAD 100MMX80MM GRAY
Packaging: Bulk
Color: Gray
Material: Phase Change Compound
Shape: Rectangular
Thickness: 0.0051" (0.130mm)
Type: Phase Change Pad, Sheet
Usage: Multi
Outline: 100.00mm x 80.00mm
Thermal Conductivity: 3.8W/m-K
Part Status: Active
Description: THERM PAD 100MMX80MM GRAY
Packaging: Bulk
Color: Gray
Material: Phase Change Compound
Shape: Rectangular
Thickness: 0.0051" (0.130mm)
Type: Phase Change Pad, Sheet
Usage: Multi
Outline: 100.00mm x 80.00mm
Thermal Conductivity: 3.8W/m-K
Part Status: Active
товар відсутній
| V838-100-80-0.2 |
|
Виробник: t-Global Technology
Description: THERM PAD 100MMX80MM GRAY
Packaging: Bulk
Color: Gray
Material: Phase Change Compound
Shape: Rectangular
Thickness: 0.0079" (0.200mm)
Type: Phase Change Pad, Sheet
Usage: Multi
Outline: 100.00mm x 80.00mm
Thermal Conductivity: 3.8W/m-K
Part Status: Active
Description: THERM PAD 100MMX80MM GRAY
Packaging: Bulk
Color: Gray
Material: Phase Change Compound
Shape: Rectangular
Thickness: 0.0079" (0.200mm)
Type: Phase Change Pad, Sheet
Usage: Multi
Outline: 100.00mm x 80.00mm
Thermal Conductivity: 3.8W/m-K
Part Status: Active
товар відсутній
| 008370081000800LF |
|
Виробник: Kyocera AVX Components
Conn FFC/FPC Connector SKT 8 POS 1.25mm Solder ST Thru-Hole Tray
Conn FFC/FPC Connector SKT 8 POS 1.25mm Solder ST Thru-Hole Tray
товар відсутній
| 008370181000800 |
|
Виробник: Kyocera AVX Components
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray
товар відсутній
| 008370181000800LF |
|
Виробник: Kyocera AVX Components
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray
Conn FFC/FPC Connector SKT 18 POS 1.25mm Solder ST Thru-Hole Tray
товар відсутній
| 2108-1-00-01-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 2108-1-00-50-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
товар відсутній
| 2308-1-00-01-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 2318-1-00-01-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 2318-1-00-50-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
товар відсутній
| 2348-1-00-01-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 2348-1-00-50-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
товар відсутній
| 2508-1-00-01-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 2508-1-00-50-00-00-07-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
Circuit Board Hardware - PCB 300u ELECTRO-SOLDER
товар відсутній
| 3138-1-00-01-00-00-08-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 3408-1-00-01-00-00-03-0 |
|
Виробник: Mill-Max
Circuit Board Hardware - PCB 200u SN/PB OVER NI
Circuit Board Hardware - PCB 200u SN/PB OVER NI
товар відсутній
| 399-10-108-10-008000 |
|
Виробник: Mill-Max
Conn Spring Loaded Connector HDR 8 POS 2.54mm Solder RA Thru-Hole
Conn Spring Loaded Connector HDR 8 POS 2.54mm Solder RA Thru-Hole
товар відсутній
| 800-80-008-10-002101 |
|
Виробник: Preci-Dip
Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole
Conn Unshrouded Header HDR 8 POS 2.54mm Solder ST Thru-Hole
товар відсутній
| 850-80-008-10-001101 |
|
Виробник: Preci-Dip
Conn Unshrouded Header HDR 8 POS 1.27mm Solder ST Top Entry Thru-Hole Box
Conn Unshrouded Header HDR 8 POS 1.27mm Solder ST Top Entry Thru-Hole Box
товар відсутній
| 952-08-008-1-00 |
|
Виробник: W+P Products GmbH
Pin Headers, 2.54mm Pitch, Straight, Single-Double Row 0.5mm Round Contacts
Pin Headers, 2.54mm Pitch, Straight, Single-Double Row 0.5mm Round Contacts
товар відсутній
| X1G004481000800 |
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Виробник: Epson
Oscillator XO 20MHz ±50ppm 15pF CMOS 55% 1.8V/2.5V/3.3V 4-Pin SMD T/R
Oscillator XO 20MHz ±50ppm 15pF CMOS 55% 1.8V/2.5V/3.3V 4-Pin SMD T/R
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