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W66AP6NBQAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBQAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAFJ W66AP6NBUAFJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAFJ TR W66AP6NBUAFJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAGJ W66AP6NBUAGJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAGJ TR W66AP6NBUAGJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAHJ W66AP6NBUAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AP6NBUAHJ TR W66AP6NBUAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AQ6NBHAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AQ6NBHAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AQ6NBQAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
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W66AQ6NBQAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBUAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66AQ6NBUAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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W66BM6NBUAFJ W66BM6NBUAFJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
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W66BM6NBUAFJ TR W66BM6NBUAFJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
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W66BM6NBUAGJ W66BM6NBUAGJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
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W66BM6NBUAGJ TR W66BM6NBUAGJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
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W66BM6NBUAHJ W66BM6NBUAHJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
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W66BM6NBUAHJ TR W66BM6NBUAHJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
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W66BP2NQQAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BP2NQQAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BP2NQUAHJ Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BP2NQUAHJ TR Winbond Electronics levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BP6NBHAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
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W66BP6NBHAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
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W66BP6NBQAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
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W66BP6NBQAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
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W66BQ2NQQAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BQ2NQQAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BQ2NQUAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BQ2NQUAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
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W66BQ6NBHAHJ Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
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W66BQ6NBHAHJ TR Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBQAHJ Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBQAHJ TR Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAFJ W66BQ6NBUAFJ Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
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В кошику  од. на суму  грн.
W66BQ6NBUAFJ TR W66BQ6NBUAFJ TR Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAGJ W66BQ6NBUAGJ Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAGJ TR W66BQ6NBUAGJ TR Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAHJ W66BQ6NBUAHJ Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAHJ TR W66BQ6NBUAHJ TR Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFI TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFJ W66CM2NQUAFJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFJ TR W66CM2NQUAFJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGI TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGI TR W66CM2NQUAGI TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGJ W66CM2NQUAGJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGJ TR W66CM2NQUAGJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHI TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHJ W66CM2NQUAHJ Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHJ TR W66CM2NQUAHJ TR Winbond Electronics W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQQAHJ Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQQAHJ TR Winbond Electronics levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQUAFJ W66CP2NQUAFJ Winbond Electronics W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
на замовлення 298 шт:
термін постачання 21-31 дні (днів)
1+431.33 грн
10+385.93 грн
25+374.25 грн
50+342.95 грн
144+330.38 грн
288+322.23 грн
В кошику  од. на суму  грн.
W66CQ2NQQAHJ Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQQAHJ TR Winbond Electronics DA00-W66BQ6NB.html&level=1 Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQUAFJ W66CQ2NQUAFJ Winbond Electronics W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
1+738.51 грн
10+654.22 грн
25+640.59 грн
40+599.11 грн
В кошику  од. на суму  грн.
W66CQ2NQUAFJ TR W66CQ2NQUAFJ TR Winbond Electronics W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQUAGJ W66CQ2NQUAGJ Winbond Electronics W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBQAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBQAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAFJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAFJ
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAFJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAFJ TR
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAGJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAGJ
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAGJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAGJ TR
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAHJ
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AP6NBUAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
W66AP6NBUAHJ TR
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBHAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBHAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBQAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBQAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBUAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66AQ6NBUAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAFJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAFJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAFJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAFJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAGJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAGJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAGJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAGJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAHJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAHJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BM6NBUAHJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66BM6NBUAHJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BP2NQQAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BP2NQQAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BP2NQUAHJ levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BP2NQUAHJ TR levelOne.jsp?__locale=en_TW&DocNo=DA00-W66AP6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BP6NBHAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BP6NBHAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BP6NBQAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BP6NBQAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 2GB LPDDR4, X16, 2133MHZ, -40C~1
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ2NQQAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ2NQQAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ2NQUAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ2NQUAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66AQ6NBU
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBHAHJ DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBHAHJ TR DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBQAHJ DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBQAHJ TR DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 128M x 16
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAFJ W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAFJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAFJ TR W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAFJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1600MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAGJ W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAGJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAGJ TR W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAGJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 1866MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAHJ W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAHJ
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66BQ6NBUAHJ TR W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66BQ6NBUAHJ TR
Виробник: Winbond Electronics
Description: 2GB LPDDR4X, X16, 2133MHZ, -40C~
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFI TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAFJ
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAFJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAFJ TR
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGI TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGI TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAGI TR
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAGJ
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAGJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAGJ TR
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHI TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHJ W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAHJ
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CM2NQUAHJ TR W66xMxNx_LPDDR4X_WFBGA200_SDP_DDP_datasheet_A01-003_20190918.pdf
W66CM2NQUAHJ TR
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQQAHJ levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQQAHJ TR levelOne.jsp?__locale=en&DocNo=DA00-W66BP6NB
Виробник: Winbond Electronics
Description: 4GB LPDDR4, DDP, X32, 2133MHZ, -
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CP2NQUAFJ W66BP6NB_W66CP2NQ_WFBGA200_datasheet_A01-001_20200623.pdf
W66CP2NQUAFJ
Виробник: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
на замовлення 298 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+431.33 грн
10+385.93 грн
25+374.25 грн
50+342.95 грн
144+330.38 грн
288+322.23 грн
В кошику  од. на суму  грн.
W66CQ2NQQAHJ DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQQAHJ TR DA00-W66BQ6NB.html&level=1
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 2133MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 128M x 32
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQUAFJ W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf
W66CQ2NQUAFJ
Виробник: Winbond Electronics
Description: IC DRAM 4GBIT LVSTL 11 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Part Status: Active
Memory Interface: LVSTL_11
Access Time: 3.5 ns
Memory Organization: 128M x 32
DigiKey Programmable: Not Verified
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+738.51 грн
10+654.22 грн
25+640.59 грн
40+599.11 грн
В кошику  од. на суму  грн.
W66CQ2NQUAFJ TR W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf
W66CQ2NQUAFJ TR
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1600MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
W66CQ2NQUAGJ W66BQ6NB_W66CQ2NQ_WFBGA200_datasheet_A01-001_20200624.pdf
W66CQ2NQUAGJ
Виробник: Winbond Electronics
Description: 4GB LPDDR4X, DDP, X32, 1866MHZ,
товару немає в наявності
В кошику  од. на суму  грн.
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