Продукція > WINBOND ELECTRONICS > Всі товари виробника WINBOND ELECTRONICS (2899) > Сторінка 39 з 49
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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W632GU8KB15I | Winbond Electronics |
 Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8KB15I TR | Winbond Electronics |
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8KB-15 TR | Winbond Electronics |
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-09 | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.067 GHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB09I | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.067 GHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-11 | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB11I | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-12 | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB12I | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB12I TR | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB12J | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-12 TR | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-15 | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 667 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB15I | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tray Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 667 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB15I TR | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 667 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8MB-15 TR | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3 Clock Frequency: 667 MHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Memory Interface: Parallel Access Time: 20 ns Memory Organization: 128M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8NB-09 | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8NB09I | Winbond Electronics |
Description: IC DRAM 2GBIT PARALLEL 78VFBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8NB09I TR | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W632GU8NB-09 TR | Winbond Electronics |
Description: IC DRAM 2GBIT PAR 78VFBGA Packaging: Tape & Reel (TR) Package / Case: 78-VFBGA Mounting Type: Surface Mount Memory Size: 2Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 78-VFBGA (8x10.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 8 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W634GU6NB-12 | Winbond Electronics |
Description: IC DRAM 4GBIT 96-VFBGA Packaging: Tray Package / Case: 96-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 96-VFBGA (9x13) Part Status: Active Write Cycle Time - Word, Page: 15ns Access Time: 20 ns Memory Organization: 256M x 16 DigiKey Programmable: Not Verified |
на замовлення 725 шт: термін постачання 21-31 дні (днів) |
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| W634GU6QB-09 | Winbond Electronics |
Description: IC DRAM 4GBIT PAR 96VFBGA Packaging: Tray Package / Case: 96-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: 0°C ~ 95°C (TC) Voltage - Supply: 1.283V ~ 1.45V Technology: SDRAM - DDR3L Clock Frequency: 1.06 GHz Memory Format: DRAM Supplier Device Package: 96-VFBGA (7.5x13) Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Access Time: 20 ns Memory Organization: 256M x 16 DigiKey Programmable: Not Verified |
на замовлення 198 шт: термін постачання 21-31 дні (днів) |
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| W63AH2NBVABE | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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W63AH2NBVABE TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVABI | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVABI TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 800 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVACE | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVACE TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVACI | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVACI TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| W63AH2NBVADE | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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W63AH2NBVADE TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVADI | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W63AH2NBVADI TR | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tape & Reel (TR) Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 32M x 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| W63AH6NBVADE | Winbond Electronics |
Description: 1GB LPDDR3, X16, 1066MHZ |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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W63AH6NBVADI | Winbond Electronics |
Description: IC DRAM 1GBIT HSUL 12 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 1.066 GHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Part Status: Active Write Cycle Time - Word, Page: 15ns Memory Interface: HSUL_12 Access Time: 5.5 ns Memory Organization: 64M x 16 DigiKey Programmable: Not Verified |
на замовлення 181 шт: термін постачання 21-31 дні (днів) |
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| W63CH6MBVACE | Winbond Electronics |
Description: IC DRAM 4GBIT PAR 178VFBGA Packaging: Tray Package / Case: 178-VFBGA Mounting Type: Surface Mount Memory Size: 4Gbit Memory Type: Volatile Operating Temperature: -25°C ~ 85°C (TC) Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR3 Clock Frequency: 933 MHz Memory Format: DRAM Supplier Device Package: 178-VFBGA (11x11.5) Write Cycle Time - Word, Page: 15ns Memory Interface: Parallel Memory Organization: 256M x 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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W66AP6NBHAFJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tray Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBHAFJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBHAGJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tray Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBHAGJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBHAHJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tray Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBHAHJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 100VFBGA Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
 |
W66AP6NBQAFJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
на замовлення 127 шт: термін постачання 21-31 дні (днів) |
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| W66AP6NBQAFJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AP6NBQAGJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AP6NBQAGJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AP6NBQAHJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AP6NBQAHJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200TFBGA Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
 |
W66AP6NBUAFJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBUAFJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.6 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
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W66AP6NBUAGJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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W66AP6NBUAGJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 1.867 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
|
W66AP6NBUAHJ | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
|
|
W66AP6NBUAHJ TR | Winbond Electronics |
Description: IC DRAM 1GBIT LVSTL 200WFBGA Packaging: Tape & Reel (TR) Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4 Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_11 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| W66AQ6NBHAHJ | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tray Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AQ6NBHAHJ TR | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 100-VFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 100-VFBGA (10x7.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AQ6NBQAHJ | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tray Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AQ6NBQAHJ TR | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tape & Reel (TR) Package / Case: 200-TFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-TFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| W66AQ6NBUAHJ | Winbond Electronics |
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~ Packaging: Tray Package / Case: 200-WFBGA Mounting Type: Surface Mount Memory Size: 1Gbit Memory Type: Volatile Operating Temperature: -40°C ~ 105°C (TC) Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V Technology: SDRAM - Mobile LPDDR4X Clock Frequency: 2.133 GHz Memory Format: DRAM Supplier Device Package: 200-WFBGA (10x14.5) Write Cycle Time - Word, Page: 18ns Memory Interface: LVSTL_06 Access Time: 3.6 ns Memory Organization: 64M x 16 |
товару немає в наявності |
В кошику од. на суму грн. |
| W632GU8KB15I |
|
Виробник: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8KB15I TR |
|
Виробник: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ I
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8KB-15 TR |
|
Виробник: Winbond Electronics
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
Description: 2G DDR3L SDRAM 1.35V X8 667MHZ
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB-09 |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB09I |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.067 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB-11 |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB11I |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB-12 |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB12I |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB12I TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB12J |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB-12 TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| W632GU8MB-15 |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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| W632GU8MB15I |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tray
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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| W632GU8MB15I TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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од. на суму грн.
| W632GU8MB-15 TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3
Clock Frequency: 667 MHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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| W632GU8NB-09 |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
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| W632GU8NB09I |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
Description: IC DRAM 2GBIT PARALLEL 78VFBGA
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| W632GU8NB09I TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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од. на суму грн.
| W632GU8NB-09 TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
Description: IC DRAM 2GBIT PAR 78VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 78-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 78-VFBGA (8x10.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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од. на суму грн.
| W634GU6NB-12 |
|
Виробник: Winbond Electronics
Description: IC DRAM 4GBIT 96-VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (9x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT 96-VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (9x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
на замовлення 725 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 637.45 грн |
| 10+ | 544.86 грн |
| 25+ | 519.56 грн |
| 40+ | 475.84 грн |
| 190+ | 454.43 грн |
| W634GU6QB-09 |
|
Виробник: Winbond Electronics
Description: IC DRAM 4GBIT PAR 96VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.06 GHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (7.5x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 96VFBGA
Packaging: Tray
Package / Case: 96-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 95°C (TC)
Voltage - Supply: 1.283V ~ 1.45V
Technology: SDRAM - DDR3L
Clock Frequency: 1.06 GHz
Memory Format: DRAM
Supplier Device Package: 96-VFBGA (7.5x13)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Access Time: 20 ns
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
на замовлення 198 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 584.33 грн |
| 10+ | 513.77 грн |
| 25+ | 503.89 грн |
| 40+ | 469.48 грн |
| 198+ | 421.26 грн |
| W63AH2NBVABE |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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| W63AH2NBVABE TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| W63AH2NBVABI |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| W63AH2NBVABI TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 800 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH2NBVACE |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH2NBVACE TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH2NBVACI |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH2NBVACI TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| W63AH2NBVADE |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| W63AH2NBVADE TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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| W63AH2NBVADI |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH2NBVADI TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 32M x 32
DigiKey Programmable: Not Verified
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од. на суму грн.
| W63AH6NBVADE |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR3, X16, 1066MHZ
Description: 1GB LPDDR3, X16, 1066MHZ
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В кошику
од. на суму грн.
| W63AH6NBVADI |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 1GBIT HSUL 12 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 1.066 GHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Part Status: Active
Write Cycle Time - Word, Page: 15ns
Memory Interface: HSUL_12
Access Time: 5.5 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
на замовлення 181 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 519.59 грн |
| 10+ | 456.94 грн |
| 25+ | 448.20 грн |
| 40+ | 417.57 грн |
| W63CH6MBVACE |
|
Виробник: Winbond Electronics
Description: IC DRAM 4GBIT PAR 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
Description: IC DRAM 4GBIT PAR 178VFBGA
Packaging: Tray
Package / Case: 178-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Gbit
Memory Type: Volatile
Operating Temperature: -25°C ~ 85°C (TC)
Voltage - Supply: 1.14V ~ 1.3V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR3
Clock Frequency: 933 MHz
Memory Format: DRAM
Supplier Device Package: 178-VFBGA (11x11.5)
Write Cycle Time - Word, Page: 15ns
Memory Interface: Parallel
Memory Organization: 256M x 16
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| W66AP6NBHAFJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBHAFJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBHAGJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBHAGJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBHAHJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBHAHJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 100VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBQAFJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
на замовлення 127 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 431.61 грн |
| 10+ | 317.63 грн |
| 25+ | 293.11 грн |
| W66AP6NBQAFJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBQAGJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBQAGJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBQAHJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBQAHJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBUAFJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AP6NBUAFJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.6 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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| W66AP6NBUAGJ |
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Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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| W66AP6NBUAGJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 1.867 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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од. на суму грн.
| W66AP6NBUAHJ |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
товару немає в наявності
В кошику
од. на суму грн.
| W66AP6NBUAHJ TR |
|
Виробник: Winbond Electronics
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: IC DRAM 1GBIT LVSTL 200WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_11
Access Time: 3.6 ns
Memory Organization: 64M x 16
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од. на суму грн.
| W66AQ6NBHAHJ |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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| W66AQ6NBHAHJ TR |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 100-VFBGA (10x7.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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од. на суму грн.
| W66AQ6NBQAHJ |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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од. на суму грн.
| W66AQ6NBQAHJ TR |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tape & Reel (TR)
Package / Case: 200-TFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-TFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.
| W66AQ6NBUAHJ |
|
Виробник: Winbond Electronics
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
Description: 1GB LPDDR4X, X16, 2133MHZ, -40C~
Packaging: Tray
Package / Case: 200-WFBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 105°C (TC)
Voltage - Supply: 1.06V ~ 1.17V, 1.7V ~ 1.95V
Technology: SDRAM - Mobile LPDDR4X
Clock Frequency: 2.133 GHz
Memory Format: DRAM
Supplier Device Package: 200-WFBGA (10x14.5)
Write Cycle Time - Word, Page: 18ns
Memory Interface: LVSTL_06
Access Time: 3.6 ns
Memory Organization: 64M x 16
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В кошику
од. на суму грн.