| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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EP1S80B956C6 | Altera |
Description: IC FPGA 683 I/O 956BGAPackaging: Tray Package / Case: 956-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 79040 Supplier Device Package: 956-BGA (40x40) Number of LABs/CLBs: 7904 Total RAM Bits: 7427520 Number of I/O: 683 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EP1S40F780C8 | Altera |
Description: IC FPGA 615 I/O 780FBGAPackaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 41250 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4125 Total RAM Bits: 3423744 Number of I/O: 615 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EP1S60F1020C7 | Altera |
Description: IC FPGA 773 I/O 1020FBGAPackaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 57120 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 5712 Total RAM Bits: 5215104 Number of I/O: 773 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
S82750LA | Altera |
Description: CONSUMER IC, PQFP160Packaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Function: Interface Voltage - Supply: 4.5V ~ 5.5V Applications: Video Display Standards: DVI 1.0 Supplier Device Package: 160-PQFP (28x28) Control Interface: Serial |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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SB80L186EC13 | Altera |
Description: MICROPROCESSOR, 16 BIT, 13MHZ, CPackaging: Bulk Package / Case: 100-BFQFP Mounting Type: Surface Mount Speed: 13MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 80C186 Voltage - I/O: 3.0V Supplier Device Package: 100-SQFP Number of Cores/Bus Width: 1 Core, 16-Bit RAM Controllers: DRAM Graphics Acceleration: No |
на замовлення 1210 шт: термін постачання 21-31 дні (днів) |
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EPF6016BC256-2 | Altera |
Description: IC FPGA 204 I/O 256BGAPackaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Number of Gates: 16000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1320 Supplier Device Package: 256-BGA (27x27) Number of LABs/CLBs: 132 Number of I/O: 204 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMB9R3H43C4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEB9R3H43C4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMBBR3H43C4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEBBR3H43C4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMB9R3H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMB9R3H43I4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEB9R3H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEB9R3H43I4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMBBR3H43I4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEBBR3H43I4G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEBBR3H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMB9R2H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXEB9R2H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 840000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 317000 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
5SGXMBBR2H43C3G | Altera |
Description: IC FPGA 600 I/O 1760HBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1760-HBGA (45x45) Number of LABs/CLBs: 359200 Total RAM Bits: 53248000 Number of I/O: 600 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EPM7128AEFC256-10 | Altera |
Description: IC CPLD 128MC 10NS 256FBGAPackaging: Bulk Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 2500 Number of Macrocells: 128 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 3V ~ 3.6V Number of I/O: 100 DigiKey Programmable: Not Verified |
на замовлення 1569 шт: термін постачання 21-31 дні (днів) |
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| IPR-RSCODEC-HS | Altera |
Description: REED-SOLOMON IP RENEWALPackaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||
| IP-RSCODEC-HS | Altera |
Description: REED-SOLOMON IPPackaging: Electronic Delivery Type: License Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
EP4SGX110DF29C4G | Altera |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 105600 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4224 Total RAM Bits: 9793536 Number of I/O: 372 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EP4SGX110DF29C3G | Altera |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 105600 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4224 Total RAM Bits: 9793536 Number of I/O: 372 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EP4SGX110DF29C2XG | Altera |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 105600 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4224 Total RAM Bits: 9793536 Number of I/O: 372 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EP4SGX110DF29I3G | Altera |
Description: IC FPGA 372 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 105600 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 4224 Total RAM Bits: 9793536 Number of I/O: 372 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| IPSR-ORU-SUITE | Altera |
Description: IP RNW OPEN RADIO UNIT W/IPSUITE Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
| IPS-ORU-SUITE | Altera |
Description: IP OPEN RADIO UNIT W/IPSUITE Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AI4S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AI5S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AI6S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AE6S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AE5S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AI6S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AE4S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AI5S | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AE6X | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC008BM16AI6X | Altera |
Description: FPGA AGILEX 5E 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AE6S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AE6S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AE5S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AE5S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AE4S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
| A5EC013BM16AI6S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AI6S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
| A5ED008BM16AE4S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
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В кошику од. на суму грн. | |||
| A5EC013BM16AI5S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AE6X | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AI4S | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AE6X | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AI4S | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5EC013BM16AI6X | Altera |
Description: FPGA AGILEX 5E 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED008BM16AI6X | Altera |
Description: FPGA AGILEX 5E SOC 85KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 85K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AE6S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AE5S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AE4S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AI5S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AE6X | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| A5ED013BM16AI4S | Altera |
Description: FPGA AGILEX5E SOC 138KLE 896MBGAPackaging: Tray Package / Case: 896-FBGA Speed: 1.5GHz, 1.8GHz RAM Size: 512KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™ Primary Attributes: FPGA - 138K Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DDR, DMA, PCIe, WDT Supplier Device Package: 896-BGA (16x16) Architecture: MPU, FPGA |
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В кошику од. на суму грн. |
| EP1S80B956C6 |
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Виробник: Altera
Description: IC FPGA 683 I/O 956BGA
Packaging: Tray
Package / Case: 956-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 79040
Supplier Device Package: 956-BGA (40x40)
Number of LABs/CLBs: 7904
Total RAM Bits: 7427520
Number of I/O: 683
DigiKey Programmable: Not Verified
Description: IC FPGA 683 I/O 956BGA
Packaging: Tray
Package / Case: 956-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 79040
Supplier Device Package: 956-BGA (40x40)
Number of LABs/CLBs: 7904
Total RAM Bits: 7427520
Number of I/O: 683
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| EP1S40F780C8 |
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Виробник: Altera
Description: IC FPGA 615 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 615
DigiKey Programmable: Not Verified
Description: IC FPGA 615 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 615
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| EP1S60F1020C7 |
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Виробник: Altera
Description: IC FPGA 773 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 57120
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5712
Total RAM Bits: 5215104
Number of I/O: 773
DigiKey Programmable: Not Verified
Description: IC FPGA 773 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 57120
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5712
Total RAM Bits: 5215104
Number of I/O: 773
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| S82750LA |
![]() |
Виробник: Altera
Description: CONSUMER IC, PQFP160
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Function: Interface
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 160-PQFP (28x28)
Control Interface: Serial
Description: CONSUMER IC, PQFP160
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Function: Interface
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 160-PQFP (28x28)
Control Interface: Serial
на замовлення 480 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 4876.60 грн |
| SB80L186EC13 |
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Виробник: Altera
Description: MICROPROCESSOR, 16 BIT, 13MHZ, C
Packaging: Bulk
Package / Case: 100-BFQFP
Mounting Type: Surface Mount
Speed: 13MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 3.0V
Supplier Device Package: 100-SQFP
Number of Cores/Bus Width: 1 Core, 16-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Description: MICROPROCESSOR, 16 BIT, 13MHZ, C
Packaging: Bulk
Package / Case: 100-BFQFP
Mounting Type: Surface Mount
Speed: 13MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 80C186
Voltage - I/O: 3.0V
Supplier Device Package: 100-SQFP
Number of Cores/Bus Width: 1 Core, 16-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
на замовлення 1210 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 19+ | 1290.30 грн |
| EPF6016BC256-2 |
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Виробник: Altera
Description: IC FPGA 204 I/O 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1320
Supplier Device Package: 256-BGA (27x27)
Number of LABs/CLBs: 132
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC FPGA 204 I/O 256BGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1320
Supplier Device Package: 256-BGA (27x27)
Number of LABs/CLBs: 132
Number of I/O: 204
DigiKey Programmable: Not Verified
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В кошику
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| 5SGXMB9R3H43C4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5SGXEB9R3H43C4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5SGXMBBR3H43C4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5SGXEBBR3H43C4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5SGXMB9R3H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5SGXMB9R3H43I4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
товару немає в наявності
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| 5SGXEB9R3H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXEB9R3H43I4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXMBBR3H43I4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXEBBR3H43I4G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXEBBR3H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXMB9R2H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXEB9R2H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 840000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 317000
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| 5SGXMBBR2H43C3G |
Виробник: Altera
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
Description: IC FPGA 600 I/O 1760HBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1760-HBGA (45x45)
Number of LABs/CLBs: 359200
Total RAM Bits: 53248000
Number of I/O: 600
DigiKey Programmable: Not Verified
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| EPM7128AEFC256-10 |
![]() |
Виробник: Altera
Description: IC CPLD 128MC 10NS 256FBGA
Packaging: Bulk
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC CPLD 128MC 10NS 256FBGA
Packaging: Bulk
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 100
DigiKey Programmable: Not Verified
на замовлення 1569 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2216.60 грн |
| IPR-RSCODEC-HS |
![]() |
Виробник: Altera
Description: REED-SOLOMON IP RENEWAL
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Description: REED-SOLOMON IP RENEWAL
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
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| IP-RSCODEC-HS |
![]() |
Виробник: Altera
Description: REED-SOLOMON IP
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
Description: REED-SOLOMON IP
Packaging: Electronic Delivery
Type: License
Media Delivery Type: Electronically Delivered
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| EP4SGX110DF29C4G |
Виробник: Altera
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
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| EP4SGX110DF29C3G |
Виробник: Altera
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
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| EP4SGX110DF29C2XG |
Виробник: Altera
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
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| EP4SGX110DF29I3G |
Виробник: Altera
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
Description: IC FPGA 372 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 105600
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 4224
Total RAM Bits: 9793536
Number of I/O: 372
DigiKey Programmable: Not Verified
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| A5EC008BM16AI4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5ED008BM16AI5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5ED013BM16AI6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5EC008BM16AE6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5EC008BM16AE5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5EC008BM16AI6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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| A5EC008BM16AE4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC008BM16AI5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC008BM16AE6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC008BM16AI6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AE6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AE6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AE5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AE5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AE4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AI6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AI6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AE4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AI5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AE6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AI4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AE6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AI4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5EC013BM16AI6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED008BM16AI6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX 5E SOC 85KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AE6S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AE5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AE4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AI5S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AE6X |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.
| A5ED013BM16AI4S |
![]() |
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
товару немає в наявності
В кошику
од. на суму грн.









