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A5ED013BM16AI6X Altera 762192?fileName=ug-762191-762192.pdf Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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AGIA035R39A2E2V Altera Description: AGIA035R39A2E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E2V Altera Description: AGIA040R39A2E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2E1V Altera Description: AGIA035R39A2E1V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E2V Altera Description: AGIA035R39A1E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I2V Altera Description: AGIA035R39A2I2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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EP20K200RC240-2X EP20K200RC240-2X Altera 20K_Family_DS.pdf Description: IC FPGA 174 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 526000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 8320
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 832
Total RAM Bits: 106496
Number of I/O: 174
DigiKey Programmable: Not Verified
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DK-DEV-10M50-C DK-DEV-10M50-C Altera Description: KIT DEV MAX 10 FPGA
Packaging: Bulk
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: 10M50DA
Platform: MAX 10 FPGA
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
1+32566.64 грн
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FMC-HDMI-BR11-A Altera Description: DAUGHTER CARD FMC HDMI
Packaging: Bulk
Function: FPGA Mezzanine Card (FMC)
Type: Interface
Contents: Board(s)
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EPM7032SLC44-6 EPM7032SLC44-6 Altera ALTES00397-1.pdf?t.download=true&u=5oefqw Description: IC CPLD 32MC 6NS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 1428 шт:
термін постачання 21-31 дні (днів)
15+1432.50 грн
Мінімальне замовлення: 15
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A3CZ100BM16AI7S A3CZ100BM16AI7S Altera agilex-3-fpgas-socs-product-brief.pdf Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+9207.34 грн
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A3CY100BM16AI7S A3CY100BM16AI7S Altera agilex-3-fpgas-socs-product-brief.pdf Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+9943.83 грн
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A3CY100BM16AI6S A3CY100BM16AI6S Altera agilex-3-fpgas-socs-product-brief.pdf Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+10440.98 грн
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5CSXFC4C6U23I7LN 5CSXFC4C6U23I7LN Altera Cyclone_V_Device_Overview_Web.pdf Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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5CSXFC5C6U23I7LN 5CSXFC5C6U23I7LN Altera Cyclone_V_Device_Overview_Web.pdf Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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5CSXFC6C6U23I7LN 5CSXFC6C6U23I7LN Altera Cyclone_V_Device_Overview_Web.pdf Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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EP20K1000CB652C7 EP20K1000CB652C7 Altera APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1000CB652C9 EP20K1000CB652C9 Altera APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1000CF33C7 EP20K1000CF33C7 Altera APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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EP20K1000CF33C8 EP20K1000CF33C8 Altera APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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EP20K1000CF33C9 EP20K1000CF33C9 Altera APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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LE82Q965 Altera Intel-82Q965-Graphics-and-Memory-Controller Description: MOBILE EXPRESS CHIPSET
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 43542 шт:
термін постачання 21-31 дні (днів)
13+1865.28 грн
Мінімальне замовлення: 13
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RGE7501MC Altera INTLS05510-1.pdf?t.download=true&u=5oefqw Description: INTEL E7501 CHIPSET MEMORY CONTR
Packaging: Bulk
Package / Case: 1005-BBGA, FCBGA
Mounting Type: Surface Mount
Controller Type: Controller Hub
Supplier Device Package: 1005-FCBGA (42.5x42.5)
на замовлення 2024 шт:
термін постачання 21-31 дні (днів)
3+10987.95 грн
Мінімальне замовлення: 3
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A5EC065BB23AE6SR0 Altera Description: A5EC065BB23AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5ED065BB23AE6SR0 Altera Description: A5ED065BB23AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE6SR0 Altera Description: A5EC065BB32AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5ED065BB32AE6SR0 Altera Description: A5ED065BB32AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5EC065BB23AE5SR0 Altera Description: A5EC065BB23AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE5SR0 Altera Description: A5EC065BB32AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5ED065BB32AE5SR0 Altera Description: A5ED065BB32AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5EC065BB23AE4SR0 Altera Description: A5EC065BB23AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5ED065BB23AE4SR0 Altera Description: A5ED065BB23AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE4SR0 Altera Description: A5EC065BB32AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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1SG165HU3F50E3VG 1SG165HU3F50E3VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG210HU3F50E3VG 1SG210HU3F50E3VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50I3VG 1SG165HU3F50I3VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50E2VG 1SG165HU3F50E2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST110ES3F50E3VG 1ST110ES3F50E3VG Altera s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG210HU3F50I3VG 1SG210HU3F50I3VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50I2VG 1SG165HU3F50I2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU2F50E2VG 1SG165HU2F50E2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG250HU3F50I3VG 1SG250HU3F50I3VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST165EU3F50E3VG 1ST165EU3F50E3VG Altera Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST110ES3F50I3VG 1ST110ES3F50I3VG Altera s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG165HU1F50E2VG 1SG165HU1F50E2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG210HU3F50I2VG 1SG210HU3F50I2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU2F50I2VG 1SG165HU2F50I2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG250HU3F50E1VG 1SG250HU3F50E1VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST250EU3F50E3VG 1ST250EU3F50E3VG Altera Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG250HU2F50E2VG 1SG250HU2F50E2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
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1ST165EU3F50I3VG 1ST165EU3F50I3VG Altera Stratix%2010%20TX%20Device%20Overview.pdf Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG280HU3F50E1VG 1SG280HU3F50E1VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG280LU3F50I2VGAS 1SG280LU3F50I2VGAS Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG280HU3F50I2VG 1SG280HU3F50I2VG Altera 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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EPM7512AEFC256-12N EPM7512AEFC256-12N Altera m7000a.pdf Description: IC CPLD 512MC 12NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 12 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EP4SGX360NF45C4G EP4SGX360NF45C4G Altera Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45I4G EP4SGX360NF45I4G Altera Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45C3G Altera Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45C2G EP4SGX360NF45C2G Altera Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45I3G Altera Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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A5ED013BM16AI6X 762192?fileName=ug-762191-762192.pdf
Виробник: Altera
Description: FPGA AGILEX5E SOC 138KLE 896MBGA
Packaging: Tray
Package / Case: 896-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 138K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 896-BGA (16x16)
Architecture: MPU, FPGA
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AGIA035R39A2E2V
Виробник: Altera
Description: AGIA035R39A2E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E2V
Виробник: Altera
Description: AGIA040R39A2E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2E1V
Виробник: Altera
Description: AGIA035R39A2E1V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E2V
Виробник: Altera
Description: AGIA035R39A1E2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I2V
Виробник: Altera
Description: AGIA035R39A2I2V
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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EP20K200RC240-2X 20K_Family_DS.pdf
EP20K200RC240-2X
Виробник: Altera
Description: IC FPGA 174 I/O 240RQFP
Packaging: Tray
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 526000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 8320
Supplier Device Package: 240-RQFP (32x32)
Number of LABs/CLBs: 832
Total RAM Bits: 106496
Number of I/O: 174
DigiKey Programmable: Not Verified
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DK-DEV-10M50-C
DK-DEV-10M50-C
Виробник: Altera
Description: KIT DEV MAX 10 FPGA
Packaging: Bulk
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: 10M50DA
Platform: MAX 10 FPGA
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+32566.64 грн
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FMC-HDMI-BR11-A
Виробник: Altera
Description: DAUGHTER CARD FMC HDMI
Packaging: Bulk
Function: FPGA Mezzanine Card (FMC)
Type: Interface
Contents: Board(s)
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EPM7032SLC44-6 ALTES00397-1.pdf?t.download=true&u=5oefqw
EPM7032SLC44-6
Виробник: Altera
Description: IC CPLD 32MC 6NS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 36
DigiKey Programmable: Not Verified
на замовлення 1428 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15+1432.50 грн
Мінімальне замовлення: 15
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A3CZ100BM16AI7S agilex-3-fpgas-socs-product-brief.pdf
A3CZ100BM16AI7S
Виробник: Altera
Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9207.34 грн
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A3CY100BM16AI7S agilex-3-fpgas-socs-product-brief.pdf
A3CY100BM16AI7S
Виробник: Altera
Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9943.83 грн
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A3CY100BM16AI6S agilex-3-fpgas-socs-product-brief.pdf
A3CY100BM16AI6S
Виробник: Altera
Description: FPGA AGILEX3 100KLE 896MBGA
Packaging: Tray
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+10440.98 грн
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5CSXFC4C6U23I7LN Cyclone_V_Device_Overview_Web.pdf
5CSXFC4C6U23I7LN
Виробник: Altera
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 40K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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5CSXFC5C6U23I7LN Cyclone_V_Device_Overview_Web.pdf
5CSXFC5C6U23I7LN
Виробник: Altera
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 85K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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5CSXFC6C6U23I7LN Cyclone_V_Device_Overview_Web.pdf
5CSXFC6C6U23I7LN
Виробник: Altera
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 110K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
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EP20K1000CB652C7 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K1000CB652C7
Виробник: Altera
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1000CB652C9 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K1000CB652C9
Виробник: Altera
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1000CF33C7 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K1000CF33C7
Виробник: Altera
Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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EP20K1000CF33C8 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K1000CF33C8
Виробник: Altera
Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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EP20K1000CF33C9 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K1000CF33C9
Виробник: Altera
Description: IC FPGA 708 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 1772000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 38400
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 3840
Total RAM Bits: 327680
Number of I/O: 708
DigiKey Programmable: Not Verified
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LE82Q965 Intel-82Q965-Graphics-and-Memory-Controller
Виробник: Altera
Description: MOBILE EXPRESS CHIPSET
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 43542 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13+1865.28 грн
Мінімальне замовлення: 13
В кошику  од. на суму  грн.
RGE7501MC INTLS05510-1.pdf?t.download=true&u=5oefqw
Виробник: Altera
Description: INTEL E7501 CHIPSET MEMORY CONTR
Packaging: Bulk
Package / Case: 1005-BBGA, FCBGA
Mounting Type: Surface Mount
Controller Type: Controller Hub
Supplier Device Package: 1005-FCBGA (42.5x42.5)
на замовлення 2024 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+10987.95 грн
Мінімальне замовлення: 3
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A5EC065BB23AE6SR0
Виробник: Altera
Description: A5EC065BB23AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5ED065BB23AE6SR0
Виробник: Altera
Description: A5ED065BB23AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE6SR0
Виробник: Altera
Description: A5EC065BB32AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5ED065BB32AE6SR0
Виробник: Altera
Description: A5ED065BB32AE6SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5EC065BB23AE5SR0
Виробник: Altera
Description: A5EC065BB23AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE5SR0
Виробник: Altera
Description: A5EC065BB32AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5ED065BB32AE5SR0
Виробник: Altera
Description: A5ED065BB32AE5SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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A5EC065BB23AE4SR0
Виробник: Altera
Description: A5EC065BB23AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5ED065BB23AE4SR0
Виробник: Altera
Description: A5ED065BB23AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 839-VPBGA (23x23)
Architecture: MPU, FPGA
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A5EC065BB32AE4SR0
Виробник: Altera
Description: A5EC065BB32AE4SR0
Packaging: Tray
Package / Case: 839-FBGA
Speed: 1.5GHz, 1.8GHz
RAM Size: 512KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A55 MPCore™ with CoreSight™, Dual ARM®Cortex™-A76 with CoreSight™
Primary Attributes: FPGA - 656K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe, WDT
Supplier Device Package: 1591-VPBGA (32x32)
Architecture: MPU, FPGA
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1SG165HU3F50E3VG 10_GX_SX_Device_Overview.pdf
1SG165HU3F50E3VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG210HU3F50E3VG 10_GX_SX_Device_Overview.pdf
1SG210HU3F50E3VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50I3VG 10_GX_SX_Device_Overview.pdf
1SG165HU3F50I3VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50E2VG 10_GX_SX_Device_Overview.pdf
1SG165HU3F50E2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST110ES3F50E3VG s10_datasheet-683181-666450.pdf
1ST110ES3F50E3VG
Виробник: Altera
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG210HU3F50I3VG 10_GX_SX_Device_Overview.pdf
1SG210HU3F50I3VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU3F50I2VG 10_GX_SX_Device_Overview.pdf
1SG165HU3F50I2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU2F50E2VG 10_GX_SX_Device_Overview.pdf
1SG165HU2F50E2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG250HU3F50I3VG 10_GX_SX_Device_Overview.pdf
1SG250HU3F50I3VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST165EU3F50E3VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST165EU3F50E3VG
Виробник: Altera
Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1ST110ES3F50I3VG s10_datasheet-683181-666450.pdf
1ST110ES3F50I3VG
Виробник: Altera
Description: IC FPGA STRATIX10TX 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1325000
Supplier Device Package: 2397-FBGA, FC (50x50)
Total RAM Bits: 112197632
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG165HU1F50E2VG 10_GX_SX_Device_Overview.pdf
1SG165HU1F50E2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG210HU3F50I2VG 10_GX_SX_Device_Overview.pdf
1SG210HU3F50I2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG165HU2F50I2VG 10_GX_SX_Device_Overview.pdf
1SG165HU2F50I2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG250HU3F50E1VG 10_GX_SX_Device_Overview.pdf
1SG250HU3F50E1VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST250EU3F50E3VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST250EU3F50E3VG
Виробник: Altera
Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG250HU2F50E2VG 10_GX_SX_Device_Overview.pdf
1SG250HU2F50E2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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1ST165EU3F50I3VG Stratix%2010%20TX%20Device%20Overview.pdf
1ST165EU3F50I3VG
Виробник: Altera
Description: IC FPGA 440 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 1650000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 206250
Number of I/O: 440
DigiKey Programmable: Not Verified
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1SG280HU3F50E1VG 10_GX_SX_Device_Overview.pdf
1SG280HU3F50E1VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG280LU3F50I2VGAS 10_GX_SX_Device_Overview.pdf
1SG280LU3F50I2VGAS
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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1SG280HU3F50I2VG 10_GX_SX_Device_Overview.pdf
1SG280HU3F50I2VG
Виробник: Altera
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 350000
Number of I/O: 704
DigiKey Programmable: Not Verified
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EPM7512AEFC256-12N m7000a.pdf
EPM7512AEFC256-12N
Виробник: Altera
Description: IC CPLD 512MC 12NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 10000
Number of Macrocells: 512
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 12 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 32
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EP4SGX360NF45C4G
EP4SGX360NF45C4G
Виробник: Altera
Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45I4G
EP4SGX360NF45I4G
Виробник: Altera
Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45C3G
Виробник: Altera
Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45C2G
EP4SGX360NF45C2G
Виробник: Altera
Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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EP4SGX360NF45I3G
Виробник: Altera
Description: IC FPGA 920 I/O 1932FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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