| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
| XCVU35P-L2FSVH2104E | AMD |
 Description: IC FPGA 416 I/O 2104FCBGADigiKey Programmable: Not Verified Number of I/O: 416 Total RAM Bits: 49597645 Number of LABs/CLBs: 108960 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 1906800 Voltage - Supply: 0.698V ~ 0.742V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU45P-2FSVH2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 416 Total RAM Bits: 49597645 Number of LABs/CLBs: 108960 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 1906800 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU35P-3FSVH2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 416 Total RAM Bits: 49597645 Number of LABs/CLBs: 108960 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 1906800 Voltage - Supply: 0.873V ~ 0.927V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU45P-L2FSVH2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 416 Total RAM Bits: 49597645 Number of LABs/CLBs: 108960 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 1906800 Voltage - Supply: 0.698V ~ 0.742V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XCVU45P-3FSVH2104E | AMD |
Description: IC FPGA 416 I/O 2104FCBGA DigiKey Programmable: Not Verified Number of I/O: 416 Total RAM Bits: 49597645 Number of LABs/CLBs: 108960 Supplier Device Package: 2104-FCBGA (47.5x47.5) Number of Logic Elements/Cells: 1906800 Voltage - Supply: 0.825V ~ 0.876V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 2104-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XC4062XL-3HQ240C0624 | AMD |
Description: FPGA, 2304 CLBS, 40000 GATES Packaging: Bulk Package / Case: 240-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 40000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 240-PQFP (32x32) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Part Status: Active Number of I/O: 193 DigiKey Programmable: Not Verified |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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| XC4062XL-3BG432C | AMD |
Description: IC FPGA 352 I/O 432MBGA Packaging: Bulk Package / Case: 432-LBGA Exposed Pad, Metal Mounting Type: Surface Mount Number of Gates: 62000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 5472 Supplier Device Package: 432-MBGA (40x40) Number of LABs/CLBs: 2304 Total RAM Bits: 73728 Number of I/O: 352 DigiKey Programmable: Not Verified |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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XC4052XLA-09HQ208C | AMD |
Description: FPGA, 1936 CLBS, 33000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 52000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 4598 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1936 Total RAM Bits: 61952 Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 1189 шт: термін постачання 21-31 дні (днів) |
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XC5210-5PQG208C | AMD |
Description: FPGA, 324 CLBS, 10000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 16000 Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 1296 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 324 Number of I/O: 164 DigiKey Programmable: Not Verified |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| EF-VIVADO-ENTER-NL | AMD |
Description: VIVADO ENTERPRISE NODE-LOCKED Packaging: Electronic Delivery For Use With/Related Products: Xilinx Type: Integrated Software Environment (ISE) Applications: Programming Operating System: Linux, Windows Edition: Enterprise License - User Details: Fixed Node Media Delivery Type: Electronically Delivered |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XC1765ELPC20C | AMD |
Description: IC PROM SER C-TEMP 3.3V 20-PLCC Packaging: Tube Package / Case: 20-LCC (J-Lead) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 20-PLCC (9x9) DigiKey Programmable: Not Verified |
на замовлення 4238 шт: термін постачання 21-31 дні (днів) |
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XC1765ELVOG8C | AMD |
Description: IC 3V SER CFG PROM 65K 8-SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Memory Size: 65kb Programmable Type: OTP Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Supplier Device Package: 8-TSOP DigiKey Programmable: Not Verified |
на замовлення 6809 шт: термін постачання 21-31 дні (днів) |
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| XC95144XV-5TQG100C | AMD |
Description: FLASH PLD, 5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
 |
XC95144XV-7CSG144C | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 978 шт: термін постачання 21-31 дні (днів) |
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XC95144XV-7TQ144I | AMD |
Description: FLASH PLD, 7.5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 89 шт: термін постачання 21-31 дні (днів) |
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XC95144XV-5TQ100C | AMD |
Description: FLASH PLD, 5NS, 144-CELL Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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XC95288XV-6PQ208C | AMD |
Description: FLASH PLD, 6NS, 288-CELL PQFP208 Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 392 шт: термін постачання 21-31 дні (днів) |
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XC4028XL-3HQ208I | AMD |
Description: IC FPGA 160 I/O 208QFP DigiKey Programmable: Not Verified Number of I/O: 160 Total RAM Bits: 32768 Number of LABs/CLBs: 1024 Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Cells: 2432 Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 28000 Mounting Type: Surface Mount Package / Case: 208-BFQFP Exposed Pad Packaging: Bulk |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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XCZU7EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCZU7EV-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU11EG-1FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EV-L1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU11EG-1FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 500MHz, 600MHz, 1.2GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU11EG-2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU7EG-3FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 600MHz, 667MHz, 1.5GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU11EG-2FFVC1156I | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU11EG-L2FFVC1156E | AMD |
Description: IC SOC CORTEX-A53 1156FCBGA Architecture: MCU, FPGA Supplier Device Package: 1156-FCBGA (35x35) Peripherals: DMA, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 533MHz, 600MHz, 1.3GHz Package / Case: 1156-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| A-SN1022-P4N-PQ | AMD |
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB Operating Temperature: 0°C ~ 30°C Interface: PCI Express Power (Watts): 75W Packaging: Box Part Status: Active Cooling Type: Fan Bandwidth: 2GHz |
товару немає в наявності |
В кошику од. на суму грн. | |||
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XCZU9EG-2FFVC900E | AMD |
Description: IC SOC CORTEX-A53 900FCBGA Packaging: Tray Package / Case: 900-BBGA, FCBGA Speed: 533MHz, 600MHz, 1.3GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 900-FCBGA (31x31) Architecture: MCU, FPGA Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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SK-KV260-G | AMD |
Description: KRIA KV260 VISION AI STARTER Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s) Utilized IC / Part: SM-K26, XCK26 Platform: Kria KV260 Vision AI Starter Part Status: Active |
на замовлення 179 шт: термін постачання 21-31 дні (днів) |
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SK-KV260-G-ED | AMD |
Description: KRIA KV260 VISION AI STARTER ED Packaging: Box For Use With/Related Products: SM-K26, XCK26 Type: FPGA + MCU/MPU SoC Contents: Board(s) Utilized IC / Part: SM-K26, XCK26 Platform: Kria KV260 Vision AI Starter Encryption Disabled |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SM-K26-XCL2GC-ED | AMD |
Description: SOM K26C VISION ZYNQ MPSOC ED Packaging: Box Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Speed: 533MHz, 1.333GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C (TJ) Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Flash Size: 16GB eMMC, 64MB QSPI Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SM-K26-XCL2GC | AMD |
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26 Packaging: Box Connector Type: 2 x 240 Pin Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm) Speed: 533MHz, 1.333GHz RAM Size: 4GB Operating Temperature: 0°C ~ 85°C (TJ) Module/Board Type: FPGA Core Core Processor: ARM® Cortex®-A53 Co-Processor: Arm® Cortex®-R5F Flash Size: 16GB eMMC, 64MB QSPI Part Status: Active |
на замовлення 1206 шт: термін постачання 21-31 дні (днів) |
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XA7A35T-2CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 33280 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 2600 Total RAM Bits: 1843200 Grade: Automotive Number of I/O: 210 DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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XCZU3EG-1SFVC784E | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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XCZU3EG-1SFVC784I | AMD |
Description: IC SOC CORTEX-A53 784FCBGA Packaging: Tray Package / Case: 784-BFBGA, FCBGA Speed: 500MHz, 600MHz, 1.2GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 784-FCBGA (23x23) Architecture: MCU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
HW-DMB-1-G | AMD |
Description: CABLE PROGRAM ALVEO Packaging: Bag For Use With/Related Products: Alveo Accessory Type: Cable Assembly |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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 |
XC5204-6VQ100I | AMD |
Description: FPGA, 120 CLBS, 4000 GATES DigiKey Programmable: Not Verified Number of I/O: 81 Part Status: Active Number of LABs/CLBs: 120 Supplier Device Package: 100-VQFP (14x14) Number of Logic Elements/Cells: 480 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 6000 Mounting Type: Surface Mount Package / Case: 100-TQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
EK-U1-ZCU216-V1-G | AMD |
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Utilized IC / Part: XCZU49DR |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
|
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| EK-U1-ZCU216-V1-G-J | AMD |
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK Packaging: Box For Use With/Related Products: XCZU49DR Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Accessories - Power Supply Not Included - Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan Utilized IC / Part: XCZU49DR |
товару немає в наявності |
В кошику од. на суму грн. | |||
| XC3190-PG175IPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 130 шт: термін постачання 21-31 дні (днів) |
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 |
XC3190-PQ160CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 160-BQFP Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 160-PQFP (28x28) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Part Status: Active Number of I/O: 138 DigiKey Programmable: Not Verified |
на замовлення 283 шт: термін постачання 21-31 дні (днів) |
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| XC3190-PG175CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BCPGA Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 175-CPGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 1334 шт: термін постачання 21-31 дні (днів) |
|
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| XC3190-PP175CPH | AMD |
Description: XC3190 - XC3000 SERIES FIELD PRO Packaging: Bulk Package / Case: 175-BPGA Mounting Type: Through Hole Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 175-PGA (42.16x42.16) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 3347 шт: термін постачання 21-31 дні (днів) |
|
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 |
XC3190-4PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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XC3190-3PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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XC3190-5PQ208C | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 320 Total RAM Bits: 64160 Part Status: Active Number of I/O: 144 DigiKey Programmable: Not Verified |
на замовлення 710 шт: термін постачання 21-31 дні (днів) |
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XC3190-5PQ208I | AMD |
Description: FPGA, 320 CLBS, 5000 GATES Packaging: Bulk Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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 |
XC95144-15PQ100I | AMD |
Description: IC CPLD 144MC 15NS 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: In System Programmable (min 10K program/erase cycles) Number of Gates: 3200 Number of Macrocells: 144 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 15 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 8 Voltage Supply - Internal: 4.5V ~ 5.5V Part Status: Obsolete Number of I/O: 81 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XCKU035-2FBVA676I | AMD |
Description: IC FPGA 312 I/O 676FCBGA DigiKey Programmable: Not Verified Number of I/O: 312 Total RAM Bits: 19456000 Number of LABs/CLBs: 25391 Supplier Device Package: 676-FCBGA (27x27) Number of Logic Elements/Cells: 444343 Voltage - Supply: 0.922V ~ 0.979V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 676-BBGA, FCBGA Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XC9536XV-5VQ44C0779 | AMD |
Description: FLASH PLD, 5NS, 36-CELL, CMOS Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
 |
XA7A50T-1CSG324I | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Bulk Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. | ||
|
|
XA7A50T-1CSG324Q | AMD |
Description: IC FPGA 210 I/O 324CSBGA Packaging: Tray Package / Case: 324-LFBGA, CSPBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.95V ~ 1.05V Number of Logic Elements/Cells: 52160 Supplier Device Package: 324-CSPBGA (15x15) Number of LABs/CLBs: 4075 Total RAM Bits: 2764800 Part Status: Active Number of I/O: 210 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 4 шт В кошику од. на суму грн. | ||
|
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XC4052XLA-09HQ208I | AMD |
Description: FPGA, 1936 CLBS, 33000 GATES Packaging: Bulk Package / Case: 208-BFQFP Exposed Pad Mounting Type: Surface Mount Number of Gates: 52000 Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 3V ~ 3.6V Number of Logic Elements/Cells: 4598 Supplier Device Package: 208-PQFP (28x28) Number of LABs/CLBs: 1936 Total RAM Bits: 61952 Number of I/O: 160 DigiKey Programmable: Not Verified |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
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| XC4VSX35-12FF668C | AMD |
Description: IC FPGA 448 I/O 668FCBGA |
товару немає в наявності |
В кошику од. на суму грн. |
| XCVU35P-L2FSVH2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU45P-2FSVH2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU35P-3FSVH2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.873V ~ 0.927V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.873V ~ 0.927V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU45P-L2FSVH2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.698V ~ 0.742V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCVU45P-3FSVH2104E |
|
Виробник: AMD
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 416 I/O 2104FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 416
Total RAM Bits: 49597645
Number of LABs/CLBs: 108960
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of Logic Elements/Cells: 1906800
Voltage - Supply: 0.825V ~ 0.876V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 2104-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XC4062XL-3HQ240C0624 |
|
Виробник: AMD
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
Description: FPGA, 2304 CLBS, 40000 GATES
Packaging: Bulk
Package / Case: 240-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 40000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 240-PQFP (32x32)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Part Status: Active
Number of I/O: 193
DigiKey Programmable: Not Verified
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 13216.00 грн |
| XC4062XL-3BG432C |
|
Виробник: AMD
Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
Description: IC FPGA 352 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 62000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 5472
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 2304
Total RAM Bits: 73728
Number of I/O: 352
DigiKey Programmable: Not Verified
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 16686.42 грн |
| XC4052XLA-09HQ208C |
|
Виробник: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 1189 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 16126.25 грн |
| XC5210-5PQG208C |
|
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 324
Number of I/O: 164
DigiKey Programmable: Not Verified
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5422.71 грн |
| EF-VIVADO-ENTER-NL |
Виробник: AMD
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Description: VIVADO ENTERPRISE NODE-LOCKED
Packaging: Electronic Delivery
For Use With/Related Products: Xilinx
Type: Integrated Software Environment (ISE)
Applications: Programming
Operating System: Linux, Windows
Edition: Enterprise
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
товару немає в наявності
В кошику
од. на суму грн.
| XC1765ELPC20C |
|
Виробник: AMD
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
Description: IC PROM SER C-TEMP 3.3V 20-PLCC
Packaging: Tube
Package / Case: 20-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 20-PLCC (9x9)
DigiKey Programmable: Not Verified
на замовлення 4238 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 51+ | 425.39 грн |
| XC1765ELVOG8C |
|
Виробник: AMD
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
Description: IC 3V SER CFG PROM 65K 8-SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 65kb
Programmable Type: OTP
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 8-TSOP
DigiKey Programmable: Not Verified
на замовлення 6809 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 51+ | 421.23 грн |
| XC95144XV-5TQG100C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| XC95144XV-7CSG144C |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 978 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 27+ | 724.81 грн |
| XC95144XV-7TQ144I |
|
Виробник: AMD
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 7.5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 28+ | 818.63 грн |
| XC95144XV-5TQ100C |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 144-CELL
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 21+ | 968.32 грн |
| XC95288XV-6PQ208C |
|
Виробник: AMD
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 6NS, 288-CELL PQFP208
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 392 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2226.42 грн |
| XC4028XL-3HQ208I |
|
Виробник: AMD
Description: IC FPGA 160 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 160
Total RAM Bits: 32768
Number of LABs/CLBs: 1024
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 2432
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 28000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
Description: IC FPGA 160 I/O 208QFP
DigiKey Programmable: Not Verified
Number of I/O: 160
Total RAM Bits: 32768
Number of LABs/CLBs: 1024
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Cells: 2432
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 28000
Mounting Type: Surface Mount
Package / Case: 208-BFQFP Exposed Pad
Packaging: Bulk
на замовлення 123 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4802.39 грн |
| XCZU7EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
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В кошику
од. на суму грн.
| XCZU7EV-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EV-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU11EG-1FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EV-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Description: IC SOC CORTEX-A53 1156FCBGA
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
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В кошику
од. на суму грн.
| XCZU7EV-L1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| XCZU7EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU11EG-1FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Description: IC SOC CORTEX-A53 1156FCBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 500MHz, 600MHz, 1.2GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
товару немає в наявності
В кошику
од. на суму грн.
| XCZU11EG-2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU7EG-3FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 600MHz, 667MHz, 1.5GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU11EG-2FFVC1156I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| XCZU11EG-L2FFVC1156E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A53 1156FCBGA
Architecture: MCU, FPGA
Supplier Device Package: 1156-FCBGA (35x35)
Peripherals: DMA, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 533MHz, 600MHz, 1.3GHz
Package / Case: 1156-BBGA, FCBGA
Packaging: Tray
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од. на суму грн.
| A-SN1022-P4N-PQ |
|
Виробник: AMD
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Operating Temperature: 0°C ~ 30°C
Interface: PCI Express
Power (Watts): 75W
Packaging: Box
Part Status: Active
Cooling Type: Fan
Bandwidth: 2GHz
Description: SMARTNIC ALVEO SN1022 PQ ED DCAB
Operating Temperature: 0°C ~ 30°C
Interface: PCI Express
Power (Watts): 75W
Packaging: Box
Part Status: Active
Cooling Type: Fan
Bandwidth: 2GHz
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од. на суму грн.
| XCZU9EG-2FFVC900E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 293233.07 грн |
| SK-KV260-G |
|
Виробник: AMD
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter
Part Status: Active
Description: KRIA KV260 VISION AI STARTER
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter
Part Status: Active
на замовлення 179 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 19236.76 грн |
| SK-KV260-G-ED |
|
Виробник: AMD
Description: KRIA KV260 VISION AI STARTER ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter Encryption Disabled
Description: KRIA KV260 VISION AI STARTER ED
Packaging: Box
For Use With/Related Products: SM-K26, XCK26
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Utilized IC / Part: SM-K26, XCK26
Platform: Kria KV260 Vision AI Starter Encryption Disabled
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| SM-K26-XCL2GC-ED |
|
Виробник: AMD
Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Description: SOM K26C VISION ZYNQ MPSOC ED
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
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В кошику
од. на суму грн.
| SM-K26-XCL2GC |
|
Виробник: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: 0°C ~ 85°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 1206 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 28412.11 грн |
| XA7A35T-2CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 33280
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 2600
Total RAM Bits: 1843200
Grade: Automotive
Number of I/O: 210
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5215.88 грн |
| XCZU3EG-1SFVC784E |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
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В кошику
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| XCZU3EG-1SFVC784I |
|
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 500MHz, 600MHz, 1.2GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
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В кошику
од. на суму грн.
| HW-DMB-1-G |
|
Виробник: AMD
Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
Description: CABLE PROGRAM ALVEO
Packaging: Bag
For Use With/Related Products: Alveo
Accessory Type: Cable Assembly
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 33478.00 грн |
| XC5204-6VQ100I |
|
Виробник: AMD
Description: FPGA, 120 CLBS, 4000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Active
Number of LABs/CLBs: 120
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
Description: FPGA, 120 CLBS, 4000 GATES
DigiKey Programmable: Not Verified
Number of I/O: 81
Part Status: Active
Number of LABs/CLBs: 120
Supplier Device Package: 100-VQFP (14x14)
Number of Logic Elements/Cells: 480
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 6000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Bulk
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В кошику
од. на суму грн.
| EK-U1-ZCU216-V1-G |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
Utilized IC / Part: XCZU49DR
Description: ZYNQ US+ RFSOC ZCU216 V1 EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Zynq UltraScale+ RFSoC ZCU216 V1
Utilized IC / Part: XCZU49DR
на замовлення 61 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1271489.04 грн |
| EK-U1-ZCU216-V1-G-J |
|
Виробник: AMD
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
Utilized IC / Part: XCZU49DR
Description: ZYNQ US+ RFSOC ZCU216 V1 J EVK
Packaging: Box
For Use With/Related Products: XCZU49DR
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Accessories - Power Supply Not Included -
Platform: Zynq UltraScale+ RFSoC ZCU216 V1 Japan
Utilized IC / Part: XCZU49DR
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В кошику
од. на суму грн.
| XC3190-PG175IPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 130 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2171.25 грн |
| XC3190-PQ160CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 138
DigiKey Programmable: Not Verified
на замовлення 283 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2171.25 грн |
| XC3190-PG175CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-CPGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 1334 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 10+ | 2171.25 грн |
| XC3190-PP175CPH |
|
Виробник: AMD
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: XC3190 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Package / Case: 175-BPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 175-PGA (42.16x42.16)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 3347 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 9+ | 2436.98 грн |
| XC3190-4PQ208C |
|
на замовлення 72 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 25+ | 893.40 грн |
| XC3190-3PQ208C |
|
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 18+ | 1250.92 грн |
| XC3190-5PQ208C |
|
Виробник: AMD
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
Description: FPGA, 320 CLBS, 5000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 320
Total RAM Bits: 64160
Part Status: Active
Number of I/O: 144
DigiKey Programmable: Not Verified
на замовлення 710 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 14+ | 1664.33 грн |
| XC3190-5PQ208I |
|
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 17+ | 1629.46 грн |
| XC95144-15PQ100I |
|
Виробник: AMD
Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
Description: IC CPLD 144MC 15NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
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од. на суму грн.
| XCKU035-2FBVA676I |
|
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 312
Total RAM Bits: 19456000
Number of LABs/CLBs: 25391
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 444343
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
Description: IC FPGA 312 I/O 676FCBGA
DigiKey Programmable: Not Verified
Number of I/O: 312
Total RAM Bits: 19456000
Number of LABs/CLBs: 25391
Supplier Device Package: 676-FCBGA (27x27)
Number of Logic Elements/Cells: 444343
Voltage - Supply: 0.922V ~ 0.979V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 676-BBGA, FCBGA
Packaging: Bulk
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В кошику
од. на суму грн.
| XC9536XV-5VQ44C0779 |
|
Виробник: AMD
Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: FLASH PLD, 5NS, 36-CELL, CMOS
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| XA7A50T-1CSG324I |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Bulk
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 4 шт
В кошику
од. на суму грн.
| XA7A50T-1CSG324Q |
|
Виробник: AMD
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
Description: IC FPGA 210 I/O 324CSBGA
Packaging: Tray
Package / Case: 324-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 52160
Supplier Device Package: 324-CSPBGA (15x15)
Number of LABs/CLBs: 4075
Total RAM Bits: 2764800
Part Status: Active
Number of I/O: 210
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 4 шт
В кошику
од. на суму грн.
| XC4052XLA-09HQ208I |
|
Виробник: AMD
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: FPGA, 1936 CLBS, 33000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 52000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 3V ~ 3.6V
Number of Logic Elements/Cells: 4598
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1936
Total RAM Bits: 61952
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 20946.66 грн |
| XC4VSX35-12FF668C |
|
Виробник: AMD
Description: IC FPGA 448 I/O 668FCBGA
Description: IC FPGA 448 I/O 668FCBGA
товару немає в наявності
В кошику
од. на суму грн.