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XCVC1802-1MSEVIVA1596 XCVC1802-1MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XC3195-PG223CPH AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 223-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 223-CPGA (47.24x47.24)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 176
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
9+2575.80 грн
Мінімальне замовлення: 9
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XCV300-4BG432C4307 XCV300-4BG432C4307 AMD ds022.pdf?t.download=true&u=ovmfp3 Description: IC FPGA 316 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Number of I/O: 316
DigiKey Programmable: Not Verified
на замовлення 1426 шт:
термін постачання 21-31 дні (днів)
2+19890.23 грн
Мінімальне замовлення: 2
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XCKU040-1FBVA676I XCKU040-1FBVA676I AMD ds892-kintex-ultrascale-data-sheet Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+174622.99 грн
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XC17S200AVQ44I XC17S200AVQ44I AMD ds078 Description: IC PROM SER 200000 I-TEMP 44VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
на замовлення 1861 шт:
термін постачання 21-31 дні (днів)
65+328.27 грн
Мінімальне замовлення: 65
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A-U50-P00G-PQ-G A-U50-P00G-PQ-G AMD oL1ODQjXHi5LZ_4pOY9k0A Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Operating Temperature: 0°C ~ 50°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 872k
INT8 TOPs: 16.2
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+269219.68 грн
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A-SN1022-P4E-PQ AMD rllO00cN~P_4HGlYrQWB6w Description: SMARTNIC ALVEO SN1022 DCAB
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 30°C
Bandwidth: 2GHz
Cooling Type: Heat Sink
LUTs: 1030k
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XC7Z100-2FF900I XC7Z100-2FF900I AMD ds191-XC7Z030-XC7Z045-data-sheet Description: IC SOC CORTEX-A9 800MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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EK-VCK190-G-ED-J EK-VCK190-G-ED-J AMD xilinx-vck190-product-brief.pdf Description: EVAL VCK190 VERSAL AICORE NO PWR
Packaging: Box
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal AI Core Adaptive SoC VCK190 Encryption Disabled Japan PCIe Card
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XC95288XL-7CS280I AMD ds055 Description: IC CPLD 288MC 7.5NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
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XC95288XL-6TQ144C XC95288XL-6TQ144C AMD GTHnyVMVaIJYQdBwKSx6iw Description: IC CPLD 288MC 6NS 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95288XL-10TQ144C XC95288XL-10TQ144C AMD GTHnyVMVaIJYQdBwKSx6iw Description: IC CPLD 288MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 117
DigiKey Programmable: Not Verified
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EK-U1-KCU116-G-J AMD xtp471-kcu116-quickstart.pdf Description: XILINX KINTEX ULTRASCALE+ FPGA K
Packaging: Box
For Use With/Related Products: XCKU5P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Kintex UltraScale+ FPGA KCU116 Japan PCIe Card
Part Status: Active
Utilized IC / Part: XCKU5P
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XC3195A-4PQ160C XC3195A-4PQ160C AMD 1153000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Voltage - Supply: 4.25V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Total RAM Bits: 94984
Part Status: Active
Number of I/O: 138
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
14+1665.33 грн
Мінімальне замовлення: 14
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XCKU19P-2FFVJ1760I XCKU19P-2FFVJ1760I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-3FFVB2104E XCKU19P-3FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVJ1760I XCKU19P-1FFVJ1760I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVJ1760E XCKU19P-2FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-3FFVJ1760E XCKU19P-3FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L2FFVJ1760E XCKU19P-L2FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVJ1760E XCKU19P-1FFVJ1760E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVB2104I XCKU19P-1FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVB2104E XCKU19P-1FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L2FFVB2104E XCKU19P-L2FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVB2104E XCKU19P-2FFVB2104E AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVB2104I XCKU19P-2FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L1FFVJ1760I XCKU19P-L1FFVJ1760I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L1FFVB2104I XCKU19P-L1FFVB2104I AMD ds890-ultrascale-overview Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XC5210-5BG225CO373 XC5210-5BG225CO373 AMD 1605200.pdf?t.download=true&u=ovmfp3 Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 324
Number of I/O: 196
DigiKey Programmable: Not Verified
на замовлення 248 шт:
термін постачання 21-31 дні (днів)
8+2637.66 грн
Мінімальне замовлення: 8
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XQ18V04VQ44N XQ18V04VQ44N AMD XQ18V04.pdf Description: IC CONFIG PROM 4MBIT 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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A-U280-A32G-DEV-G AMD Description: BOARD DCAB SERVER U280 ACTIVE
Packaging: Box
Power (Watts): 225W
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Fan + Heat Sink
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XC4044XLA-09HQ208C XC4044XLA-09HQ208C AMD 4000.pdf?t.download=true&u=ovmfp3 Description: FPGA, 1600 CLBS, 27000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 27000
Operating Temperature: 0°C ~ 85°C (TJ)
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1600
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
3+9056.13 грн
Мінімальне замовлення: 3
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XCZU1CG-2SFVC784I XCZU1CG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+35200.51 грн
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XCZU2EG-2SFVC784I XCZU2EG-2SFVC784I AMD Zynq%20UltraScale%2B_Datasheet.pdf Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+39599.12 грн
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XCZU1EG-2SFVC784I XCZU1EG-2SFVC784I AMD ds891-zynq-ultrascale-plus-overview Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+34982.73 грн
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SM-K26-XCL2GI SM-K26-XCL2GI AMD SM-K26-XCL2GI.pdf Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 638 шт:
термін постачання 21-31 дні (днів)
1+39954.35 грн
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XA7A12T-2CPG238I AMD s3NwarfUcQdgTa4CDreCuQ Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
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XC4VFX100-11FF1152C XC4VFX100-11FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC4VFX60-12FFG1152C XC4VFX60-12FFG1152C AMD pfAe4jHWJY3n938PD92zlw Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 56880
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 6320
Total RAM Bits: 4276224
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC4VFX100-10FF1152C XC4VFX100-10FF1152C AMD ds112 Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Bulk
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC95144XL-10CS144I AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-7CS144I AMD ds056 Description: IC CPLD 144MC 7.5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-10TQ144C XC95144XL-10TQ144C AMD ds056 Description: IC CPLD 144MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-5CS144C AMD ds056 Description: IC CPLD 144MC 5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-10TQ100C XC95144XL-10TQ100C AMD ds056 Description: IC CPLD 144MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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XC95144XL-10CS144C AMD ds056 Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XCVC1802-1MSIVIVA1596 XCVC1802-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-1MSIVIVA1596 XCVC1902-1MSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2LSEVIVA1596 XCVC1902-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MSEVIVA1596 XCVC1802-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MSEVIVA1596 XCVC1902-2MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MLEVIVA1596 XCVC1902-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2LSEVIVA1596 XCVC1802-2LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-1MSEVIVA1596 XCVC1902-1MSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MLEVIVA1596 XCVC1802-2MLEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1LSEVIVA1596 XCVC1802-1LSEVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1MLIVIVA1596 XCVC1802-1MLIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1LSIVIVA1596 XCVC1802-1LSIVIVA1596 AMD ds950-versal-overview Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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EK-S7-SP701-G-J EK-S7-SP701-G-J AMD Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Spartan-7 FPGA SP701 Japan
Utilized IC / Part: XC7S100
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XCZU19EG-L2FFVC1760E AMD ds891-zynq-ultrascale-plus-overview Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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XCVC1802-1MSEVIVA1596 ds950-versal-overview
XCVC1802-1MSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XC3195-PG223CPH 1153000.pdf?t.download=true&u=ovmfp3
Виробник: AMD
Description: XC3195 - XC3000 SERIES FIELD PRO
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Package / Case: 223-BCPGA
Mounting Type: Through Hole
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 223-CPGA (47.24x47.24)
Number of LABs/CLBs: 484
Total RAM Bits: 94944
Number of I/O: 176
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+2575.80 грн
Мінімальне замовлення: 9
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XCV300-4BG432C4307 ds022.pdf?t.download=true&u=ovmfp3
XCV300-4BG432C4307
Виробник: AMD
Description: IC FPGA 316 I/O 432MBGA
Packaging: Bulk
Package / Case: 432-LBGA Exposed Pad, Metal
Mounting Type: Surface Mount
Number of Gates: 322970
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 6912
Supplier Device Package: 432-MBGA (40x40)
Number of LABs/CLBs: 1536
Total RAM Bits: 65536
Number of I/O: 316
DigiKey Programmable: Not Verified
на замовлення 1426 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+19890.23 грн
Мінімальне замовлення: 2
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XCKU040-1FBVA676I ds892-kintex-ultrascale-data-sheet
XCKU040-1FBVA676I
Виробник: AMD
Description: IC FPGA 312 I/O 676FCBGA
Packaging: Tray
Package / Case: 676-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.922V ~ 0.979V
Number of Logic Elements/Cells: 530250
Supplier Device Package: 676-FCBGA (27x27)
Number of LABs/CLBs: 30300
Total RAM Bits: 21606000
Part Status: Active
Number of I/O: 312
DigiKey Programmable: Not Verified
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+174622.99 грн
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XC17S200AVQ44I ds078
XC17S200AVQ44I
Виробник: AMD
Description: IC PROM SER 200000 I-TEMP 44VQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 2MB
Programmable Type: OTP
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
DigiKey Programmable: Not Verified
на замовлення 1861 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
65+328.27 грн
Мінімальне замовлення: 65
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A-U50-P00G-PQ-G oL1ODQjXHi5LZ_4pOY9k0A
A-U50-P00G-PQ-G
Виробник: AMD
Description: BOARD DCAB ALVEO U50 NET PASSIVE
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Operating Temperature: 0°C ~ 50°C
Bandwidth: 460GB/s
Cooling Type: Heat Sink
LUTs: 872k
INT8 TOPs: 16.2
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+269219.68 грн
В кошику  од. на суму  грн.
A-SN1022-P4E-PQ rllO00cN~P_4HGlYrQWB6w
Виробник: AMD
Description: SMARTNIC ALVEO SN1022 DCAB
Packaging: Box
Power (Watts): 75W
Memory Size: 8GB
Interface: PCI Express
Operating Temperature: 30°C
Bandwidth: 2GHz
Cooling Type: Heat Sink
LUTs: 1030k
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XC7Z100-2FF900I ds191-XC7Z030-XC7Z045-data-sheet
XC7Z100-2FF900I
Виробник: AMD
Description: IC SOC CORTEX-A9 800MHZ 900FCBGA
Packaging: Tray
Package / Case: 900-BBGA, FCBGA
Speed: 800MHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: Kintex™-7 FPGA, 444K Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
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EK-VCK190-G-ED-J xilinx-vck190-product-brief.pdf
EK-VCK190-G-ED-J
Виробник: AMD
Description: EVAL VCK190 VERSAL AICORE NO PWR
Packaging: Box
For Use With/Related Products: XCVC1902
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Versal AI Core Adaptive SoC VCK190 Encryption Disabled Japan PCIe Card
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XC95288XL-7CS280I ds055
Виробник: AMD
Description: IC CPLD 288MC 7.5NS 280CSBGA
Packaging: Bulk
Package / Case: 280-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 280-CSBGA (16x16)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 192
DigiKey Programmable: Not Verified
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XC95288XL-6TQ144C GTHnyVMVaIJYQdBwKSx6iw
XC95288XL-6TQ144C
Виробник: AMD
Description: IC CPLD 288MC 6NS 100TQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 6 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95288XL-10TQ144C GTHnyVMVaIJYQdBwKSx6iw
XC95288XL-10TQ144C
Виробник: AMD
Description: IC CPLD 288MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 6400
Number of Macrocells: 288
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 117
DigiKey Programmable: Not Verified
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EK-U1-KCU116-G-J xtp471-kcu116-quickstart.pdf
Виробник: AMD
Description: XILINX KINTEX ULTRASCALE+ FPGA K
Packaging: Box
For Use With/Related Products: XCKU5P
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Kintex UltraScale+ FPGA KCU116 Japan PCIe Card
Part Status: Active
Utilized IC / Part: XCKU5P
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XC3195A-4PQ160C 1153000.pdf?t.download=true&u=ovmfp3
XC3195A-4PQ160C
Виробник: AMD
Description: FPGA, 484 CLBS, 6500 GATES
Packaging: Bulk
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Voltage - Supply: 4.25V ~ 5.25V
Supplier Device Package: 160-PQFP (28x28)
Total RAM Bits: 94984
Part Status: Active
Number of I/O: 138
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+1665.33 грн
Мінімальне замовлення: 14
В кошику  од. на суму  грн.
XCKU19P-2FFVJ1760I ds890-ultrascale-overview
XCKU19P-2FFVJ1760I
Виробник: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-3FFVB2104E ds890-ultrascale-overview
XCKU19P-3FFVB2104E
Виробник: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVJ1760I ds890-ultrascale-overview
XCKU19P-1FFVJ1760I
Виробник: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVJ1760E ds890-ultrascale-overview
XCKU19P-2FFVJ1760E
Виробник: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-3FFVJ1760E ds890-ultrascale-overview
XCKU19P-3FFVJ1760E
Виробник: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.873V ~ 0.927V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L2FFVJ1760E ds890-ultrascale-overview
XCKU19P-L2FFVJ1760E
Виробник: AMD
Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVJ1760E ds890-ultrascale-overview
XCKU19P-1FFVJ1760E
Виробник: AMD
Description: IC FPGA KINTEX UP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVB2104I ds890-ultrascale-overview
XCKU19P-1FFVB2104I
Виробник: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-1FFVB2104E ds890-ultrascale-overview
XCKU19P-1FFVB2104E
Виробник: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L2FFVB2104E ds890-ultrascale-overview
XCKU19P-L2FFVB2104E
Виробник: AMD
Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 110°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVB2104E ds890-ultrascale-overview
XCKU19P-2FFVB2104E
Виробник: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-2FFVB2104I ds890-ultrascale-overview
XCKU19P-2FFVB2104I
Виробник: AMD
Description: IC FPGA KINTEX UP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.825V ~ 0.876V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L1FFVJ1760I ds890-ultrascale-overview
XCKU19P-L1FFVJ1760I
Виробник: AMD
Description: IC FPGA KINTEX UP LP 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XCKU19P-L1FFVB2104I ds890-ultrascale-overview
XCKU19P-L1FFVB2104I
Виробник: AMD
Description: IC FPGA KINTEX UP LP 2104FCBGA
Packaging: Tray
Package / Case: 2104-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.698V ~ 0.742V
Number of Logic Elements/Cells: 1842750
Supplier Device Package: 2104-FCBGA (47.5x47.5)
Number of LABs/CLBs: 105300
Total RAM Bits: 63753421
Number of I/O: 540
DigiKey Programmable: Not Verified
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XC5210-5BG225CO373 1605200.pdf?t.download=true&u=ovmfp3
XC5210-5BG225CO373
Виробник: AMD
Description: FPGA, 324 CLBS, 10000 GATES
Packaging: Bulk
Part Status: Active
Package / Case: 225-BEBGA
Mounting Type: Surface Mount
Number of Gates: 16000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 1296
Supplier Device Package: 225-PBGA (27x27)
Number of LABs/CLBs: 324
Number of I/O: 196
DigiKey Programmable: Not Verified
на замовлення 248 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+2637.66 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
XQ18V04VQ44N XQ18V04.pdf
XQ18V04VQ44N
Виробник: AMD
Description: IC CONFIG PROM 4MBIT 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Memory Size: 4MB
Programmable Type: In System Programmable
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 3V ~ 3.6V
Supplier Device Package: 44-VQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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A-U280-A32G-DEV-G
Виробник: AMD
Description: BOARD DCAB SERVER U280 ACTIVE
Packaging: Box
Power (Watts): 225W
Memory Size: 16GB
Interface: PCI Express
Operating Temperature: 0°C ~ 45°C
Cooling Type: Fan + Heat Sink
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XC4044XLA-09HQ208C 4000.pdf?t.download=true&u=ovmfp3
XC4044XLA-09HQ208C
Виробник: AMD
Description: FPGA, 1600 CLBS, 27000 GATES
Packaging: Bulk
Package / Case: 208-BFQFP Exposed Pad
Mounting Type: Surface Mount
Number of Gates: 27000
Operating Temperature: 0°C ~ 85°C (TJ)
Supplier Device Package: 208-PQFP (28x28)
Number of LABs/CLBs: 1600
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+9056.13 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
XCZU1CG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1CG-2SFVC784I
Виробник: AMD
Description: IC ZUP MPSOC CG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+35200.51 грн
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XCZU2EG-2SFVC784I Zynq%20UltraScale%2B_Datasheet.pdf
XCZU2EG-2SFVC784I
Виробник: AMD
Description: IC SOC CORTEX-A53 784FCBGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MCU, FPGA
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+39599.12 грн
В кошику  од. на суму  грн.
XCZU1EG-2SFVC784I ds891-zynq-ultrascale-plus-overview
XCZU1EG-2SFVC784I
Виробник: AMD
Description: IC ZUP MPSOC EG A53 FPGA 784BGA
Packaging: Tray
Package / Case: 784-BFBGA, FCBGA
Speed: 533MHz, 600MHz, 1.333GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals: DMA, WDT
Supplier Device Package: 784-FCBGA (23x23)
Architecture: MPU, FPGA
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+34982.73 грн
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SM-K26-XCL2GI SM-K26-XCL2GI.pdf
SM-K26-XCL2GI
Виробник: AMD
Description: SOM ARM A53 ZYNQ MPSOC KRIA K26
Packaging: Box
Connector Type: 2 x 240 Pin
Size / Dimension: 3.030" L x 2.360" W (77.00mm x 60.00mm)
Speed: 533MHz, 1.333GHz
RAM Size: 4GB
Operating Temperature: -40°C ~ 100°C (TJ)
Module/Board Type: FPGA Core
Core Processor: ARM® Cortex®-A53
Co-Processor: Arm® Cortex®-R5F
Flash Size: 16GB eMMC, 64MB QSPI
Part Status: Active
на замовлення 638 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+39954.35 грн
В кошику  од. на суму  грн.
XA7A12T-2CPG238I s3NwarfUcQdgTa4CDreCuQ
Виробник: AMD
Description: IC FPGA 112 I/O 238CSBGA
Packaging: Tray
Package / Case: 238-LFBGA, CSPBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.95V ~ 1.05V
Number of Logic Elements/Cells: 12800
Supplier Device Package: 238-CSBGA (10x10)
Number of LABs/CLBs: 1000
Total RAM Bits: 737280
Part Status: Active
Number of I/O: 112
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XC4VFX100-11FF1152C ds112
XC4VFX100-11FF1152C
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC4VFX60-12FFG1152C pfAe4jHWJY3n938PD92zlw
XC4VFX60-12FFG1152C
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 56880
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 6320
Total RAM Bits: 4276224
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC4VFX100-10FF1152C ds112
XC4VFX100-10FF1152C
Виробник: AMD
Description: IC FPGA 576 I/O 1152FCBGA
Packaging: Bulk
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.14V ~ 1.26V
Number of Logic Elements/Cells: 94896
Supplier Device Package: 1152-FCBGA (35x35)
Number of LABs/CLBs: 10544
Total RAM Bits: 6930432
Number of I/O: 576
DigiKey Programmable: Not Verified
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XC95144XL-10CS144I ds056
Виробник: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-7CS144I ds056
Виробник: AMD
Description: IC CPLD 144MC 7.5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-10TQ144C ds056
XC95144XL-10TQ144C
Виробник: AMD
Description: IC CPLD 144MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-5CS144C ds056
Виробник: AMD
Description: IC CPLD 144MC 5NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XC95144XL-10TQ100C ds056
XC95144XL-10TQ100C
Виробник: AMD
Description: IC CPLD 144MC 10NS 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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XC95144XL-10CS144C ds056
Виробник: AMD
Description: IC CPLD 144MC 10NS 144LCSBGA
Packaging: Bulk
Package / Case: 144-TFBGA, CSPBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable (min 10K program/erase cycles)
Number of Gates: 3200
Number of Macrocells: 144
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-LCSBGA (12x12)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Active
Number of I/O: 117
DigiKey Programmable: Not Verified
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XCVC1802-1MSIVIVA1596 ds950-versal-overview
XCVC1802-1MSIVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-1MSIVIVA1596 ds950-versal-overview
XCVC1902-1MSIVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2LSEVIVA1596 ds950-versal-overview
XCVC1902-2LSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MSEVIVA1596 ds950-versal-overview
XCVC1802-2MSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MSEVIVA1596 ds950-versal-overview
XCVC1902-2MSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-2MLEVIVA1596 ds950-versal-overview
XCVC1902-2MLEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2LSEVIVA1596 ds950-versal-overview
XCVC1802-2LSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 450MHz, 1.08GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1902-1MSEVIVA1596 ds950-versal-overview
XCVC1902-1MSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-2MLEVIVA1596 ds950-versal-overview
XCVC1802-2MLEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1LSEVIVA1596 ds950-versal-overview
XCVC1802-1LSEVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1MLIVIVA1596 ds950-versal-overview
XCVC1802-1MLIVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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XCVC1802-1LSIVIVA1596 ds950-versal-overview
XCVC1802-1LSIVIVA1596
Виробник: AMD
Description: IC VERSAL AICORE FPGA 1596BGA
Packaging: Tray
Package / Case: 1596-BFBGA, FCBGA
Speed: 400MHz, 1GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DDR, DMA, PCIe
Supplier Device Package: 1596-FCBGA (40x40)
Architecture: MPU, FPGA
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EK-S7-SP701-G-J Spartan-7-FPGAs-Data-Sheet-DC-and-AC-Switching-Characteristics
EK-S7-SP701-G-J
Виробник: AMD
Description: SPARTAN7 SP701 FPGA KIT NO PS
Packaging: Box
For Use With/Related Products: XC7S100
Type: FPGA
Contents: Board(s), Cable(s) - Power Supply Not Included -
Platform: Spartan-7 FPGA SP701 Japan
Utilized IC / Part: XC7S100
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XCZU19EG-L2FFVC1760E ds891-zynq-ultrascale-plus-overview
Виробник: AMD
Description: IC SOC CORTEX-A53 1760FCBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 533MHz, 600MHz, 1.3GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes: Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FCBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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