| Фото | Назва | Виробник | Інформація |
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EPM7064BTC100-5 | Intel |
 Description: IC CPLD 64MC 5NS 100TQFPPackaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Number of I/O: 68 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C5 | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C7 | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25CF672C7N | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672C5 | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672C7 | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672I6N | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25DF672C7N | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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EP1SGX25CF672I6N | Intel |
Description: IC FPGA 455 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.425V ~ 1.575V Number of Logic Elements/Cells: 25660 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2566 Total RAM Bits: 1944576 Number of I/O: 455 DigiKey Programmable: Not Verified |
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| HLDC-DDR4-4GB-A | Intel |
Description: DAUGHTER CARD HILO DDR4 4GB Packaging: Bulk Function: SDRAM Type: Memory Contents: Board(s) Utilized IC / Part: EDY4016AABG-DR-F Platform: Arria |
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10M40DDF256C8G | Intel |
Description: IC FPGA/CPLD NV 178 I/O 256FBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 256-FBGA (17x17) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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| SPTSBP3PCCWA002 | Intel |
Description: OPTOELECTRONICS Packaging: Bulk Connector Type: LC Mounting Type: Pluggable, SFP28 Applications: Optical Data Rate: 100Gbps |
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10M40DDF484C8G | Intel |
Description: IC FPGA/CPLD NV 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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10M40DDF672C8G | Intel |
Description: IC FPGA/CPLD NV 500 I/O 672FBGA Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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10M40DDF484I7G | Intel |
Description: IC FPGA/CPLD NV 360 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 360 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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10M40DDF672I7G | Intel |
Description: IC FPGA/CPLD NV 500 I/O 672FBGA Packaging: Tray Package / Case: 672-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V Number of Logic Elements/Cells: 40000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 2500 Total RAM Bits: 1290240 Number of I/O: 500 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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EPM2210GF256C3 | Intel |
Description: IC CPLD 1700MC 7NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
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EPM2210GF256C4N | Intel |
Description: IC CPLD 1700MC 7NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 7 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 204 DigiKey Programmable: Not Verified |
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| EPM2210F256C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
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| EPM2210F256C5NGA | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
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| EPM2210F256C5RR | Intel |
Description: IC CPLD 1700MC 11.2NS 256FBGA Packaging: Tray Package / Case: 256-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 11.2 ns Supplier Device Package: 256-FBGA (17x17) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 204 DigiKey Programmable: Not Verified |
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| EPM2210F324C4RR | Intel |
Description: IC CPLD 1700MC 9.1NS 324FBGA Packaging: Tray Package / Case: 324-BGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 1700 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9.1 ns Supplier Device Package: 324-FBGA (19x19) Number of Logic Elements/Blocks: 2210 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of I/O: 272 DigiKey Programmable: Not Verified |
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5SEEBF45C4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45I4G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45C3G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45C2G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45I3LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45C2LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45I3G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45I2G | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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5SEEBF45I2LG | Intel |
Description: IC FPGA 840 I/O 1932FBGA Packaging: Tray Package / Case: 1932-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 952000 Supplier Device Package: 1932-FBGA, FC (45x45) Number of LABs/CLBs: 359250 Total RAM Bits: 53248000 Number of I/O: 840 DigiKey Programmable: Not Verified |
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EPM570GT100I5 | Intel |
Description: IC CPLD 440MC 5.4NS 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 76 DigiKey Programmable: Not Verified |
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| EPM570ZM144C7N | Intel |
Description: IC CPLD 440MC 9NS 144MBGA Packaging: Tray Package / Case: 144-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 144-MBGA (7x7) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 116 DigiKey Programmable: Not Verified |
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| EPM570GT100I5NRR | Intel |
Description: IC CPLD 440MC 5.4NS 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 160 DigiKey Programmable: Not Verified |
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EPM570GT144C4N | Intel |
Description: IC CPLD 440MC 5.4NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 116 DigiKey Programmable: Not Verified |
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5962-9099703MRA | Intel |
Description: MICROPROCESSOR CIRCUIT, CMOS Packaging: Bulk Package / Case: 20-CDIP (0.300", 7.62mm) Function: Controller Interface: Bus Operating Temperature: -55°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Current - Supply: 75mA Supplier Device Package: 20-CDIP DigiKey Programmable: Not Verified |
на замовлення 826 шт: термін постачання 21-31 дні (днів) |
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| UG80960HA4016 | Intel |
Description: RISC MICROCONTROLLER, 32BIT, I96 Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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| DK-DEV-AGF023FA | Intel |
Description: DEV KIT AGILEX-F/CRYPT QUARTUSDK Packaging: Bulk For Use With/Related Products: AGFD023 Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply, Accessories Platform: Agilex F-Series SoC FPGA PCIe Card |
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| MK-A5E065BB32AES1 | Intel |
Description: AGILEX 5 E-SERIES MODULAR DEV BD Packaging: Box For Use With/Related Products: A5E 065B Type: FPGA Contents: Board(s) |
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| DK-A5E065BB32AES1 | Intel |
Description: AGILEX 5 E-SERIES PREMIUM DEV BD Packaging: Box For Use With/Related Products: A5E 065B Type: FPGA Contents: Board(s) |
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| AGFA006R16A3E4F | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFA006R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFB006R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFA006R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFB006R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFA006R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFB006R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFA008R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFB008R16A3E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFA006R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
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| AGFB006R16A3E3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFA008R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFB008R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFA006R24C3E3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFB006R24C3E3E | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFA008R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFB008R16A3I3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 764K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFA006R16A3I3E | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFA006R16A2E3V | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
||||||
| AGFB006R16A2E4F | Intel |
Description: IC FPGA AGILEX-F 1546FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 573K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA |
товар відсутній |
| EPM7064BTC100-5 |
|
Виробник: Intel
Description: IC CPLD 64MC 5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 5NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Number of I/O: 68
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25CF672C5 |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25CF672C7 |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25CF672C7N |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25DF672C5 |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25DF672C7 |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25DF672I6N |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25DF672C7N |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| EP1SGX25CF672I6N |
|
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
товар відсутній
| HLDC-DDR4-4GB-A |
Виробник: Intel
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
Description: DAUGHTER CARD HILO DDR4 4GB
Packaging: Bulk
Function: SDRAM
Type: Memory
Contents: Board(s)
Utilized IC / Part: EDY4016AABG-DR-F
Platform: Arria
товар відсутній
| 10M40DDF256C8G |
|
Виробник: Intel
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 178 I/O 256FBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 256-FBGA (17x17)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 180 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8858.4 грн |
| 25+ | 7165.29 грн |
| SPTSBP3PCCWA002 |
Виробник: Intel
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
товар відсутній
| 10M40DDF484C8G |
|
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9502.38 грн |
| 25+ | 7685.72 грн |
| 10M40DDF672C8G |
|
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10760.8 грн |
| 25+ | 8704.66 грн |
| 10M40DDF484I7G |
|
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12669.11 грн |
| 25+ | 10248.72 грн |
| 10M40DDF672I7G |
|
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14349.21 грн |
| 25+ | 11605.78 грн |
| EPM2210GF256C3 |
|
Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
| EPM2210GF256C4N |
|
Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
| EPM2210F256C4RR |
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
| EPM2210F256C5NGA |
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
| EPM2210F256C5RR |
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
товар відсутній
| EPM2210F324C4RR |
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45C4G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45I4G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45C3G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45C2G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45I3LG |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45C2LG |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45I3G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45I2G |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| 5SEEBF45I2LG |
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
товар відсутній
| EPM570GT100I5 |
|
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
товар відсутній
| EPM570ZM144C7N |
|
Виробник: Intel
Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
| EPM570GT100I5NRR |
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
товар відсутній
| EPM570GT144C4N |
|
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
товар відсутній
| 5962-9099703MRA |
|
Виробник: Intel
Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
на замовлення 826 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 6246.86 грн |
| UG80960HA4016 |
Виробник: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 4097.49 грн |
| DK-DEV-AGF023FA |
Виробник: Intel
Description: DEV KIT AGILEX-F/CRYPT QUARTUSDK
Packaging: Bulk
For Use With/Related Products: AGFD023
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA PCIe Card
Description: DEV KIT AGILEX-F/CRYPT QUARTUSDK
Packaging: Bulk
For Use With/Related Products: AGFD023
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA PCIe Card
товар відсутній
| MK-A5E065BB32AES1 |
Виробник: Intel
Description: AGILEX 5 E-SERIES MODULAR DEV BD
Packaging: Box
For Use With/Related Products: A5E 065B
Type: FPGA
Contents: Board(s)
Description: AGILEX 5 E-SERIES MODULAR DEV BD
Packaging: Box
For Use With/Related Products: A5E 065B
Type: FPGA
Contents: Board(s)
товар відсутній
| DK-A5E065BB32AES1 |
Виробник: Intel
Description: AGILEX 5 E-SERIES PREMIUM DEV BD
Packaging: Box
For Use With/Related Products: A5E 065B
Type: FPGA
Contents: Board(s)
Description: AGILEX 5 E-SERIES PREMIUM DEV BD
Packaging: Box
For Use With/Related Products: A5E 065B
Type: FPGA
Contents: Board(s)
товар відсутній
| AGFA006R16A3E4F |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R16A3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R16A3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R24C3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R24C3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R16A3I3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R16A3I3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA008R16A3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB008R16A3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R16A3E3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R16A3E3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA008R24C3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB008R24C3E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R24C3E3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R24C3E3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA008R16A3I3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB008R16A3I3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R16A3I3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFA006R16A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
| AGFB006R16A2E4F |
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній