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AGFB006R16A3I3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA008R16A3E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R16A3E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R24D2E3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
AGFA012R24B3E3E Intel Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C3I3E Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C2E4F Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C2E3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R24C2E3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R24C3I3E Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA008R24C3E3E Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R24C3E3E Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E2V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E2VB Intel Description: IC FPGA AGILEX-F 1546BGA
Packaging: Tray
Package / Case: 1546-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1546-BGA (37.5x34)
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E2V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E2VB Intel Description: IC FPGA AGILEX-F 1546BGA
Packaging: Tray
Package / Case: 1546-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1546-BGA (37.5x34)
Architecture: MPU, FPGA
товар відсутній
AGFB008R24D2E2V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
1ST280EY2F55E2VGS1 1ST280EY2F55E2VGS1 Intel Stratix 10 TX Device Overview.pdf Description: IC FPGA 296 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 296
DigiKey Programmable: Not Verified
товар відсутній
1SD21BPT1F53E1VG Intel Intel® Stratix® 10 DX Device Errata.pdf Description: IC FPGA STRATIX10DX 2597FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
1SD21BPT2F53E2VG Intel Intel® Stratix® 10 DX Device Errata.pdf Description: IC FPGA STRATIX10DX 2597FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
10M16SAU324C8G Intel Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Number of I/O: 246
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
1+3969.48 грн
25+ 3057.52 грн
10M04SAU324C8G Intel Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 250
Total RAM Bits: 193536
Number of I/O: 246
на замовлення 119 шт:
термін постачання 21-31 дні (днів)
1+1505.82 грн
25+ 1159.7 грн
100+ 1131.46 грн
D8741A8 D8741A8 Intel INTLD043-4-88.pdf?t.download=true&u=5oefqw Description: 8-BIT, UVPROM, 8048 CPU
Packaging: Bulk
Package / Case: 40-CDIP
Mounting Type: Through Hole
Speed: 3.3MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 64 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EPROM
Core Processor: 8741A
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: DMA
Supplier Device Package: 40-CDIP
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 1489 шт:
термін постачання 21-31 дні (днів)
22+948.01 грн
Мінімальне замовлення: 22
EPM7192EQC160-20 EPM7192EQC160-20 Intel MAX7000_Family_DS.pdf Description: IC CPLD 192MC 20NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3750
Number of Macrocells: 192
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 20 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 12
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 124
DigiKey Programmable: Not Verified
товар відсутній
IP-ECPRI Intel Description: PROTOTYPE
Packaging: Bulk
Type: License
Applications: Programming
товар відсутній
DK-SI-AGF014EB Intel Intel_Agilex_F-Series_FPGA_Development_Kit_User_Guide.pdf Description: KIT AGILEX F-SERIES TRANSCVR-SOC
Packaging: Bulk
For Use With/Related Products: AGFB014
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA Transceiver-SoC
товар відсутній
DK-DEV-AGF027F1ES Intel Intel®_Agilex™_F-Series_FPGA_(Two F-Tiles)_Development_Kit_User_Guide.pdf Description: DEV KIT AGILEX-F QUARTUS-DK
Packaging: Bulk
For Use With/Related Products: AGFB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA PCIe Card
товар відсутній
10CL080ZF780I8G 10CL080ZF780I8G Intel Cyclone%C2%AE_10_LP_Device.pdf Description: IC FPGA 423 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.0V
Number of Logic Elements/Cells: 81264
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 5079
Total RAM Bits: 2810880
Number of I/O: 423
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+9401.95 грн
25+ 8602.03 грн
EP1SGX40GF1020C6 EP1SGX40GF1020C6 Intel Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX40GF1020C7 EP1SGX40GF1020C7 Intel Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
5AGXMA5G6F31C6G 5AGXMA5G6F31C6G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
NE80532KE056512 Intel Description: MPU XEON PROCESSOR, X86 ARCH. 2.
Packaging: Bulk
на замовлення 24762 шт:
термін постачання 21-31 дні (днів)
176+115.14 грн
Мінімальне замовлення: 176
NE80532EC041512 Intel Description: MPU XEON PROCESSOR, X86 ARCH. 2G
Packaging: Bulk
на замовлення 1355 шт:
термін постачання 21-31 дні (днів)
38+546.07 грн
Мінімальне замовлення: 38
RC28F128P33B85A RC28F128P33B85A Intel NUMXS00026-1.pdf?t.download=true&u=5oefqw Description: IC FLASH 128MBIT PAR 64EASYBGA
Packaging: Tray
Package / Case: 64-TBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 64-EasyBGA (8x10)
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
на замовлення 12175 шт:
термін постачання 21-31 дні (днів)
44+472.48 грн
Мінімальне замовлення: 44
TE28F128P30T85A TE28F128P30T85A Intel NUMXS00160-1.pdf?t.download=true&u=5oefqw Description: IC FLASH 128MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP (18.4x14)
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
на замовлення 4086 шт:
термін постачання 21-31 дні (днів)
25+827.69 грн
Мінімальне замовлення: 25
5AGXBA3D4F27C4G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
5AGXBA7D4F31C5G 5AGXBA7D4F31C5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 242000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 11460
Total RAM Bits: 15470592
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
1ST040EH2F35I2VG 1ST040EH2F35I2VG Intel s10_datasheet-683181-666450.pdf Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
EP2S90H484C4 Intel pkgds.pdf#page=115-116 Description: IC FPGA 308 I/O 484HBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 90960
Supplier Device Package: 484-HBGA (27x27)
Number of LABs/CLBs: 4548
Total RAM Bits: 4520488
Number of I/O: 308
DigiKey Programmable: Not Verified
товар відсутній
EP2S90H484C5 Intel pkgds.pdf#page=115-116 Description: IC FPGA 308 I/O 484HBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 90960
Supplier Device Package: 484-HBGA (27x27)
Number of LABs/CLBs: 4548
Total RAM Bits: 4520488
Number of I/O: 308
DigiKey Programmable: Not Verified
товар відсутній
10CX085YU484E6G 10CX085YU484E6G Intel Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672E6G 10CX085YF672E6G Intel Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
10CX085YU484I6G 10CX085YU484I6G Intel Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672I6G 10CX085YF672I6G Intel Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672E5G 10CX085YF672E5G Intel Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
CYCLONE 10 GX Intel Intel®_Cyclone®_10%20GX_Device_Datasheet.pdf Description: PROTOTYPE
Packaging: Bulk
товар відсутній
5AGXBA5D4F27C5G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
AGFB019R24C3E3V Intel Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.9M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
MD8751H Intel Description: MCU, 8-BIT, UVPROM
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
4+5504.29 грн
Мінімальне замовлення: 4
MR8751H8 MR8751H8 Intel INTLS03368-1.pdf?t.download=true&u=5oefqw Description: 8-BIT, UVPROM, 8051 CPU, 8MHZ
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
3+9045.74 грн
Мінімальне замовлення: 3
5AGXBA3D4F31C5G 5AGXBA3D4F31C5G Intel Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
QGE7230 Intel Description: E7520 MEMORY CONTROLLER HUB
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 2060 шт:
термін постачання 21-31 дні (днів)
71+286.82 грн
Мінімальне замовлення: 71
5AGXBA3D6F27C6G Intel Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
EPM570F100A5NBR Intel Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 125°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 76
DigiKey Programmable: Not Verified
товар відсутній
EPM570F256C5NRR Intel Description: IC CPLD 440MC 8.7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 160
DigiKey Programmable: Not Verified
товар відсутній
1SG210HN2F43I2VGAS 1SG210HN2F43I2VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
1SG210HU3F50E2VG 1SG210HU3F50E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
AGFB006R16A3I3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA008R16A3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R16A3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R24D2E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
AGFA012R24B3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C3I3E
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C2E4F
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R24C2E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R24C2E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R24C3I3E
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA008R24C3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB008R24C3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E2V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFA006R16A2E2VB
Виробник: Intel
Description: IC FPGA AGILEX-F 1546BGA
Packaging: Tray
Package / Case: 1546-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1546-BGA (37.5x34)
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E2V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
товар відсутній
AGFB006R16A2E2VB
Виробник: Intel
Description: IC FPGA AGILEX-F 1546BGA
Packaging: Tray
Package / Case: 1546-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1546-BGA (37.5x34)
Architecture: MPU, FPGA
товар відсутній
AGFB008R24D2E2V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
1ST280EY2F55E2VGS1 Stratix 10 TX Device Overview.pdf
1ST280EY2F55E2VGS1
Виробник: Intel
Description: IC FPGA 296 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 296
DigiKey Programmable: Not Verified
товар відсутній
1SD21BPT1F53E1VG Intel® Stratix® 10 DX Device Errata.pdf
Виробник: Intel
Description: IC FPGA STRATIX10DX 2597FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
1SD21BPT2F53E2VG Intel® Stratix® 10 DX Device Errata.pdf
Виробник: Intel
Description: IC FPGA STRATIX10DX 2597FBGA
Packaging: Tray
DigiKey Programmable: Not Verified
товар відсутній
10M16SAU324C8G Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf
Виробник: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 16000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 1000
Total RAM Bits: 562176
Number of I/O: 246
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+3969.48 грн
25+ 3057.52 грн
10M04SAU324C8G Intel%C2%AE_MAX%C2%AE_10%20FPGA_Device_Datasheet.pdf
Виробник: Intel
Description: IC FPGA 246 I/O 324UBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 4000
Supplier Device Package: 324-UBGA (15x15)
Number of LABs/CLBs: 250
Total RAM Bits: 193536
Number of I/O: 246
на замовлення 119 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1505.82 грн
25+ 1159.7 грн
100+ 1131.46 грн
D8741A8 INTLD043-4-88.pdf?t.download=true&u=5oefqw
D8741A8
Виробник: Intel
Description: 8-BIT, UVPROM, 8048 CPU
Packaging: Bulk
Package / Case: 40-CDIP
Mounting Type: Through Hole
Speed: 3.3MHz
Program Memory Size: 1KB (1K x 8)
RAM Size: 64 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: EPROM
Core Processor: 8741A
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: DMA
Supplier Device Package: 40-CDIP
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 1489 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
22+948.01 грн
Мінімальне замовлення: 22
EPM7192EQC160-20 MAX7000_Family_DS.pdf
EPM7192EQC160-20
Виробник: Intel
Description: IC CPLD 192MC 20NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 3750
Number of Macrocells: 192
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 20 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 12
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of I/O: 124
DigiKey Programmable: Not Verified
товар відсутній
IP-ECPRI
Виробник: Intel
Description: PROTOTYPE
Packaging: Bulk
Type: License
Applications: Programming
товар відсутній
DK-SI-AGF014EB Intel_Agilex_F-Series_FPGA_Development_Kit_User_Guide.pdf
Виробник: Intel
Description: KIT AGILEX F-SERIES TRANSCVR-SOC
Packaging: Bulk
For Use With/Related Products: AGFB014
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA Transceiver-SoC
товар відсутній
DK-DEV-AGF027F1ES Intel®_Agilex™_F-Series_FPGA_(Two F-Tiles)_Development_Kit_User_Guide.pdf
Виробник: Intel
Description: DEV KIT AGILEX-F QUARTUS-DK
Packaging: Bulk
For Use With/Related Products: AGFB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply, Accessories
Platform: Agilex F-Series SoC FPGA PCIe Card
товар відсутній
10CL080ZF780I8G Cyclone%C2%AE_10_LP_Device.pdf
10CL080ZF780I8G
Виробник: Intel
Description: IC FPGA 423 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.0V
Number of Logic Elements/Cells: 81264
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 5079
Total RAM Bits: 2810880
Number of I/O: 423
DigiKey Programmable: Not Verified
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+9401.95 грн
25+ 8602.03 грн
EP1SGX40GF1020C6 Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf
EP1SGX40GF1020C6
Виробник: Intel
Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
EP1SGX40GF1020C7 Stratix%20GX%20FPGA%20Family%20Data%20Sheet.pdf
EP1SGX40GF1020C7
Виробник: Intel
Description: IC FPGA 624 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 41250
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 4125
Total RAM Bits: 3423744
Number of I/O: 624
DigiKey Programmable: Not Verified
товар відсутній
5AGXMA5G6F31C6G
5AGXMA5G6F31C6G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
NE80532KE056512
Виробник: Intel
Description: MPU XEON PROCESSOR, X86 ARCH. 2.
Packaging: Bulk
на замовлення 24762 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
176+115.14 грн
Мінімальне замовлення: 176
NE80532EC041512
Виробник: Intel
Description: MPU XEON PROCESSOR, X86 ARCH. 2G
Packaging: Bulk
на замовлення 1355 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
38+546.07 грн
Мінімальне замовлення: 38
RC28F128P33B85A NUMXS00026-1.pdf?t.download=true&u=5oefqw
RC28F128P33B85A
Виробник: Intel
Description: IC FLASH 128MBIT PAR 64EASYBGA
Packaging: Tray
Package / Case: 64-TBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.3V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 52 MHz
Memory Format: FLASH
Supplier Device Package: 64-EasyBGA (8x10)
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
на замовлення 12175 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
44+472.48 грн
Мінімальне замовлення: 44
TE28F128P30T85A NUMXS00160-1.pdf?t.download=true&u=5oefqw
TE28F128P30T85A
Виробник: Intel
Description: IC FLASH 128MBIT PAR 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 40 MHz
Memory Format: FLASH
Supplier Device Package: 56-TSOP (18.4x14)
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
на замовлення 4086 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
25+827.69 грн
Мінімальне замовлення: 25
5AGXBA3D4F27C4G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
5AGXBA7D4F31C5G
5AGXBA7D4F31C5G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 242000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 11460
Total RAM Bits: 15470592
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
1ST040EH2F35I2VG s10_datasheet-683181-666450.pdf
1ST040EH2F35I2VG
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
EP2S90H484C4 pkgds.pdf#page=115-116
Виробник: Intel
Description: IC FPGA 308 I/O 484HBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 90960
Supplier Device Package: 484-HBGA (27x27)
Number of LABs/CLBs: 4548
Total RAM Bits: 4520488
Number of I/O: 308
DigiKey Programmable: Not Verified
товар відсутній
EP2S90H484C5 pkgds.pdf#page=115-116
Виробник: Intel
Description: IC FPGA 308 I/O 484HBGA
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 90960
Supplier Device Package: 484-HBGA (27x27)
Number of LABs/CLBs: 4548
Total RAM Bits: 4520488
Number of I/O: 308
DigiKey Programmable: Not Verified
товар відсутній
10CX085YU484E6G Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf
10CX085YU484E6G
Виробник: Intel
Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672E6G Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf
10CX085YF672E6G
Виробник: Intel
Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
10CX085YU484I6G Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf
10CX085YU484I6G
Виробник: Intel
Description: IC FPGA 208 I/O 484UBGA
Packaging: Tray
Package / Case: 484-FBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 188
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672I6G Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf
10CX085YF672I6G
Виробник: Intel
Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
10CX085YF672E5G Intel%C2%AE_Cyclone%C2%AE_10%2520GX_Device_Datasheet.pdf
10CX085YF672E5G
Виробник: Intel
Description: IC FPGA 212 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Number of Logic Elements/Cells: 85000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 31000
Total RAM Bits: 5959680
Number of I/O: 216
DigiKey Programmable: Not Verified
товар відсутній
CYCLONE 10 GX Intel®_Cyclone®_10%20GX_Device_Datasheet.pdf
Виробник: Intel
Description: PROTOTYPE
Packaging: Bulk
товар відсутній
5AGXBA5D4F27C5G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
AGFB019R24C3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Package / Case: 2340-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.9M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2340-BGA (45x42)
Architecture: MPU, FPGA
товар відсутній
MD8751H
Виробник: Intel
Description: MCU, 8-BIT, UVPROM
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
4+5504.29 грн
Мінімальне замовлення: 4
MR8751H8 INTLS03368-1.pdf?t.download=true&u=5oefqw
MR8751H8
Виробник: Intel
Description: 8-BIT, UVPROM, 8051 CPU, 8MHZ
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
3+9045.74 грн
Мінімальне замовлення: 3
5AGXBA3D4F31C5G
5AGXBA3D4F31C5G
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
товар відсутній
QGE7230
Виробник: Intel
Description: E7520 MEMORY CONTROLLER HUB
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 2060 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
71+286.82 грн
Мінімальне замовлення: 71
5AGXBA3D6F27C6G
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
товар відсутній
EPM570F100A5NBR
Виробник: Intel
Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 125°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 76
DigiKey Programmable: Not Verified
товар відсутній
EPM570F256C5NRR
Виробник: Intel
Description: IC CPLD 440MC 8.7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 160
DigiKey Programmable: Not Verified
товар відсутній
1SG210HN2F43I2VGAS 10_GX_SX_Device_Overview.pdf
1SG210HN2F43I2VGAS
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 262500
Number of I/O: 688
DigiKey Programmable: Not Verified
товар відсутній
1SG210HU3F50E2VG 10_GX_SX_Device_Overview.pdf
1SG210HU3F50E2VG
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2100000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 262500
Number of I/O: 704
DigiKey Programmable: Not Verified
товар відсутній
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