| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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5AGXFB5K6F40C6G | Intel |
Description: IC FPGA 704 I/O 1517FBGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 158491 Total RAM Bits: 23625728 Part Status: Active Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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5AGXFB5K4F40C4G | Intel |
Description: IC FPGA 704 I/O 1517FBGAPackaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 420000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 158491 Total RAM Bits: 23625728 Part Status: Active Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 5962-9089901M | Intel |
Description: IC FLASH 1MBIT PARALLELPackaging: Bulk Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: FLASH Memory Format: FLASH Part Status: Active Memory Interface: Parallel Access Time: 250 ns Memory Organization: 128K x 8 |
товару немає в наявності |
В кошику од. на суму грн. | |||
|
EPCQ512SI16N | Intel |
Description: IC QUAD-SERIAL CONFIG DEVICE 512 Part Status: Discontinued at Digi-Key Supplier Device Package: 16-SOIC Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C Programmable Type: In System Programmable Memory Size: 512MB Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||
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IPT-DSPBUILDER | Intel |
Description: DSP BUILDER SOFTWAREPart Status: Active Media Delivery Type: Electronically Delivered Type: License For Use With/Related Products: Altera Packaging: Electronic Delivery |
товару немає в наявності |
В кошику од. на суму грн. | ||
| FW82443ZXM | Intel |
Description: PCI BUS CONTROLLER Packaging: Bulk Part Status: Active |
на замовлення 2880 шт: термін постачання 21-31 дні (днів) |
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| MQ80960MC-25 | Intel |
Description: IC MPU 25MHZ 164CQFPPackaging: Bulk Package / Case: 164-BCQFP Exposed Pad Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 85°C (TC) Core Processor: Intel® 80960XA Voltage - I/O: 5V Supplier Device Package: 164-CQFP (28.71x28.71) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Active |
на замовлення 373 шт: термін постачання 21-31 дні (днів) |
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FC80960HA33 | Intel |
Description: RISC MPU, 32-BIT, 33MHZ, MOS,Core Processor: i960 Operating Temperature: 0°C ~ 85°C (TC) Speed: 33MHz Mounting Type: Surface Mount Package / Case: 208-QFP Packaging: Bulk Part Status: Active Graphics Acceleration: No RAM Controllers: DRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 208-PQFP Voltage - I/O: 3.3V |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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| EPF8820ABC225-2 | Intel |
Description: IC FPGA 152 I/O 225BGADigiKey Programmable: Not Verified Number of I/O: 152 Part Status: Obsolete Number of LABs/CLBs: 84 Supplier Device Package: 225-BGA (19x19) Number of Logic Elements/Cells: 672 Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: 0°C ~ 70°C (TA) Number of Gates: 8000 Mounting Type: Surface Mount Package / Case: 225-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| RK80530RY005256 | Intel |
Description: IC MPU 1 1.1GHZ 370PPGAPackaging: Bulk Package / Case: 370-PGA Mounting Type: Through Hole Speed: 1.1GHz Operating Temperature: 69°C (TC) Core Processor: Intel® Celeron® Processor Voltage - I/O: 1.475V Supplier Device Package: 370-PPGA (49x49) Number of Cores/Bus Width: 1 Core, 32-Bit Part Status: Active |
на замовлення 5273 шт: термін постачання 21-31 дні (днів) |
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| EVB-EN2392QI | Intel |
Description: EVAL BOARD FOR EN2392QIPart Status: Obsolete Outputs and Type: 1, Non-Isolated Main Purpose: DC/DC, Step Down Supplied Contents: Board(s) Utilized IC / Part: EN2392QI Board Type: Fully Populated Regulator Topology: Buck Frequency - Switching: 1MHz Current - Output: 9A Voltage - Input: 4.5V ~ 13.2V Voltage - Output: 0.75V ~ 3.3V Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EPM7032STC44-7 | Intel |
Description: IC CPLD 32MC 7.5NS 44TQFPPackaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 600 Number of Macrocells: 32 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 44-TQFP (10x10) Number of Logic Elements/Blocks: 2 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPM7032SQC44-5 | Intel |
Description: IC CPLD 32MC 5NS 44TQFPPackaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 600 Number of Macrocells: 32 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 44-TQFP (10x10) Number of Logic Elements/Blocks: 2 Voltage Supply - Internal: 4.5V ~ 5.5V Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 5962-8766801MXA | Intel |
Description: IC MPU MG80386 16MHZ 132CPGACore Processor: 80386 Operating Temperature: -55°C ~ 125°C (TC) Speed: 16MHz Mounting Type: Through Hole Package / Case: 132-BCPGA Packaging: Bulk Part Status: Active Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 132-CPGA (37.59x37.59) Voltage - I/O: 5V |
на замовлення 1865 шт: термін постачання 21-31 дні (днів) |
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| HH80556KJ0534M | Intel |
Description: IC MPU 5140 2.33GHZ 771LGAPackaging: Bulk Package / Case: 771-LGA Mounting Type: Surface Mount Speed: 2.33GHz Operating Temperature: 65°C (TC) Core Processor: Intel® Xeon® Processor 5140 Voltage - I/O: 0.85V, 1V, 1.5V Supplier Device Package: 771-LGA (37.5x37.5) Number of Cores/Bus Width: 2 Core, 64-Bit Graphics Acceleration: No Part Status: Active |
на замовлення 753 шт: термін постачання 21-31 дні (днів) |
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NG82357 | Intel |
Description: IC INTEG SYST PERIPHERAL 132QFPDigiKey Programmable: Not Verified Part Status: Active Supplier Device Package: 132-PQFP Type: Integrated System Peripheral Mounting Type: Surface Mount Package / Case: 132-QFP Packaging: Bulk |
на замовлення 877 шт: термін постачання 21-31 дні (днів) |
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| GWIXP425BCT | Intel |
Description: IC MPU INTEL 400MHZ PBGA492Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 3487 шт: термін постачання 21-31 дні (днів) |
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| GWIXP425ABCT | Intel |
Description: IC MPU INTEL 400MHZ PBGA492Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 1441 шт: термін постачання 21-31 дні (днів) |
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| GWIXP425ABBT | Intel |
Description: IC MPU INTEL 266MHZ PBGA492Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 3734 шт: термін постачання 21-31 дні (днів) |
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| HH80552RE083512 | Intel |
Description: IC MPU INTEL CEL 3.06GHZ 775LGAPackaging: Bulk Package / Case: 775-BLGA Mounting Type: Surface Mount Speed: 3.06GHz Operating Temperature: 69.2°C (TC) Core Processor: Intel® Celeron® D Processor 347 Voltage - I/O: 1.25V, 1.325V Supplier Device Package: 775-LGA (37.5x37.5) Number of Cores/Bus Width: 1 Core, 64-Bit Part Status: Active |
на замовлення 259285 шт: термін постачання 21-31 дні (днів) |
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| FWIXP422ABB | Intel |
Description: IC MPU INTEL 266MHZ PBGA492Packaging: Bulk Package / Case: 492-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: Intel® IXP42X Voltage - I/O: 3.3V Supplier Device Package: 492-PBGA (35x35) Ethernet: 10/100Mbps (2) USB: USB 1.1 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate RAM Controllers: SDRAM Graphics Acceleration: No Security Features: 3DES, AES, DES, MD5, SHA-1 Part Status: Active |
на замовлення 1662 шт: термін постачання 21-31 дні (днів) |
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5962-8961402MXA | Intel |
Description: IC EPROM 1MBIT 32CDIPPackaging: Bulk Package / Case: 32-CDIP Mounting Type: Through Hole Memory Size: 1Mbit Memory Type: Non-Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: EPROM - UV Memory Format: EPROM Supplier Device Package: 32-CDIP Part Status: Active Access Time: 250 ns Memory Organization: 128K x 8 DigiKey Programmable: Not Verified |
на замовлення 3553 шт: термін постачання 21-31 дні (днів) |
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| EP1C4F400C8NAB | Intel |
Description: IC FPGA 301 I/O 400FBGADigiKey Programmable: Not Verified Number of I/O: 301 Part Status: Obsolete Total RAM Bits: 78336 Number of LABs/CLBs: 400 Supplier Device Package: 400-FBGA (21x21) Number of Logic Elements/Cells: 4000 Voltage - Supply: 1.425V ~ 1.575V Operating Temperature: 0°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: 400-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EPM1270GT144C5 | Intel |
Description: IC CPLD 980MC 6.2NS 144TQFPDigiKey Programmable: Not Verified Number of I/O: 116 Part Status: Active Voltage Supply - Internal: 1.71V ~ 1.89V Number of Logic Elements/Blocks: 1270 Supplier Device Package: 144-TQFP (20x20) Delay Time tpd(1) Max: 6.2 ns Operating Temperature: 0°C ~ 85°C (TJ) Number of Macrocells: 980 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
EPM1270GT144C3 | Intel |
Description: IC CPLD 980MC 6.2NS 144TQFPDigiKey Programmable: Not Verified Number of I/O: 116 Part Status: Active Voltage Supply - Internal: 1.71V ~ 1.89V Number of Logic Elements/Blocks: 1270 Supplier Device Package: 144-TQFP (20x20) Delay Time tpd(1) Max: 6.2 ns Operating Temperature: 0°C ~ 85°C (TJ) Number of Macrocells: 980 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
MD2148H | Intel |
Description: IC SRAM 4KBIT PARALLEL 18CDIPPackaging: Bulk Package / Case: 18-CDIP Mounting Type: Through Hole Memory Size: 4Kbit Memory Type: Volatile Operating Temperature: -55°C ~ 125°C (TC) Voltage - Supply: 4.5V ~ 5.5V Technology: SRAM - Asynchronous Memory Format: SRAM Supplier Device Package: 18-CDIP Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 1K x 4 DigiKey Programmable: Not Verified |
на замовлення 209 шт: термін постачання 21-31 дні (днів) |
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| EPM7128SQC160-15YY | Intel |
Description: IC CPLD 128MC 15NS 160QFPDigiKey Programmable: Not Verified Number of I/O: 100 Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 Supplier Device Package: 160-PQFP (28x28) Delay Time tpd(1) Max: 15 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 128 Number of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM7128SQC160-10YY | Intel |
Description: IC CPLD 128MC 10NS 160QFPSupplier Device Package: 160-PQFP (28x28) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 128 Number of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM7128SQC160-15ES | Intel |
Description: IC CPLD 128MC 15NS 160QFPDigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 Supplier Device Package: 160-PQFP (28x28) Delay Time tpd(1) Max: 15 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 128 Number of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EPM7128SQCI100-10 | Intel |
Description: IC CPLD 128MC 10NS 100QFPNumber of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 84 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 Supplier Device Package: 100-PQFP (20x14) Delay Time tpd(1) Max: 10 ns Operating Temperature: -40°C ~ 85°C (TA) Number of Macrocells: 128 |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EPM7128SQC160-10ES | Intel |
Description: IC CPLD 128MC 10NS 160QFPDigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 Supplier Device Package: 160-PQFP (28x28) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 128 Number of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM7128SQC160-7YY | Intel |
Description: IC CPLD 128MC 7.5NS 160QFPDigiKey Programmable: Not Verified Number of I/O: 100 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 8 Supplier Device Package: 160-PQFP (28x28) Delay Time tpd(1) Max: 7.5 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 128 Number of Gates: 2500 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 160-BQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM570F100C5NAA | Intel |
Description: IC CPLD 440MC 8.7NS 100FBGA DigiKey Programmable: Not Verified Number of I/O: 76 Part Status: Active Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 570 Supplier Device Package: 100-FBGA (11x11) Delay Time tpd(1) Max: 8.7 ns Operating Temperature: 0°C ~ 85°C (TJ) Number of Macrocells: 440 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 100-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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AN87C196JQ | Intel |
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZPackaging: Bulk Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 12KB (12K x 8) RAM Size: 488 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: EPROM Core Processor: 87C196JQ Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SSIO, UART/USART Supplier Device Package: 52-PLCC Part Status: Active Number of I/O: 41 DigiKey Programmable: Not Verified |
на замовлення 3864 шт: термін постачання 21-31 дні (днів) |
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AN8398JC | Intel |
Description: MICROCONTROLLER, 16-BIT, MROM, 8Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 347 шт: термін постачання 21-31 дні (днів) |
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EPM570GM256C5N | Intel |
Description: IC CPLD 440MC 5.4NS 256MBGAPackaging: Tray Package / Case: 256-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 256-MBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 160 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPM570GT144C5 | Intel |
Description: IC CPLD 440MC 5.4NS 144TQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 116 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43E2VGS1 | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43E2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43I1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LU3F50I2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LH3F55E3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43E3VGS1 | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LH3F55E2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LU3F50E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN2F43E2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LH3F55I1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LU2F50E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LU2F50E1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LH2F55E1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LH3F55E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LN3F43E1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LH2F55I1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN2F43I2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LU3F50I1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43E3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LU3F50E2VGS1 | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SX280LN3F43I2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGAPackaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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1SX280LU2F50E2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGAPackaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 5AGXFB5K6F40C6G |
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Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Part Status: Active
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Part Status: Active
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5AGXFB5K4F40C4G |
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Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Part Status: Active
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 420000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 158491
Total RAM Bits: 23625728
Part Status: Active
Number of I/O: 704
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 5962-9089901M |
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Виробник: Intel
Description: IC FLASH 1MBIT PARALLEL
Packaging: Bulk
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Part Status: Active
Memory Interface: Parallel
Access Time: 250 ns
Memory Organization: 128K x 8
Description: IC FLASH 1MBIT PARALLEL
Packaging: Bulk
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Part Status: Active
Memory Interface: Parallel
Access Time: 250 ns
Memory Organization: 128K x 8
товару немає в наявності
В кошику
од. на суму грн.
| EPCQ512SI16N |
Виробник: Intel
Description: IC QUAD-SERIAL CONFIG DEVICE 512
Part Status: Discontinued at Digi-Key
Supplier Device Package: 16-SOIC
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Programmable Type: In System Programmable
Memory Size: 512MB
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC QUAD-SERIAL CONFIG DEVICE 512
Part Status: Discontinued at Digi-Key
Supplier Device Package: 16-SOIC
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Programmable Type: In System Programmable
Memory Size: 512MB
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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од. на суму грн.
| IPT-DSPBUILDER |
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Виробник: Intel
Description: DSP BUILDER SOFTWARE
Part Status: Active
Media Delivery Type: Electronically Delivered
Type: License
For Use With/Related Products: Altera
Packaging: Electronic Delivery
Description: DSP BUILDER SOFTWARE
Part Status: Active
Media Delivery Type: Electronically Delivered
Type: License
For Use With/Related Products: Altera
Packaging: Electronic Delivery
товару немає в наявності
В кошику
од. на суму грн.
| FW82443ZXM |
на замовлення 2880 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 19+ | 1275.20 грн |
| MQ80960MC-25 |
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Виробник: Intel
Description: IC MPU 25MHZ 164CQFP
Packaging: Bulk
Package / Case: 164-BCQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 85°C (TC)
Core Processor: Intel® 80960XA
Voltage - I/O: 5V
Supplier Device Package: 164-CQFP (28.71x28.71)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
Description: IC MPU 25MHZ 164CQFP
Packaging: Bulk
Package / Case: 164-BCQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 85°C (TC)
Core Processor: Intel® 80960XA
Voltage - I/O: 5V
Supplier Device Package: 164-CQFP (28.71x28.71)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Active
на замовлення 373 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 79670.43 грн |
| FC80960HA33 |
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Виробник: Intel
Description: RISC MPU, 32-BIT, 33MHZ, MOS,
Core Processor: i960
Operating Temperature: 0°C ~ 85°C (TC)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 208-QFP
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 208-PQFP
Voltage - I/O: 3.3V
Description: RISC MPU, 32-BIT, 33MHZ, MOS,
Core Processor: i960
Operating Temperature: 0°C ~ 85°C (TC)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 208-QFP
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 208-PQFP
Voltage - I/O: 3.3V
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 4492.94 грн |
| EPF8820ABC225-2 |
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Виробник: Intel
Description: IC FPGA 152 I/O 225BGA
DigiKey Programmable: Not Verified
Number of I/O: 152
Part Status: Obsolete
Number of LABs/CLBs: 84
Supplier Device Package: 225-BGA (19x19)
Number of Logic Elements/Cells: 672
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 8000
Mounting Type: Surface Mount
Package / Case: 225-BGA
Packaging: Tray
Description: IC FPGA 152 I/O 225BGA
DigiKey Programmable: Not Verified
Number of I/O: 152
Part Status: Obsolete
Number of LABs/CLBs: 84
Supplier Device Package: 225-BGA (19x19)
Number of Logic Elements/Cells: 672
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 8000
Mounting Type: Surface Mount
Package / Case: 225-BGA
Packaging: Tray
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| RK80530RY005256 |
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Виробник: Intel
Description: IC MPU 1 1.1GHZ 370PPGA
Packaging: Bulk
Package / Case: 370-PGA
Mounting Type: Through Hole
Speed: 1.1GHz
Operating Temperature: 69°C (TC)
Core Processor: Intel® Celeron® Processor
Voltage - I/O: 1.475V
Supplier Device Package: 370-PPGA (49x49)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
Description: IC MPU 1 1.1GHZ 370PPGA
Packaging: Bulk
Package / Case: 370-PGA
Mounting Type: Through Hole
Speed: 1.1GHz
Operating Temperature: 69°C (TC)
Core Processor: Intel® Celeron® Processor
Voltage - I/O: 1.475V
Supplier Device Package: 370-PPGA (49x49)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
на замовлення 5273 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 67+ | 323.21 грн |
| EVB-EN2392QI |
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Виробник: Intel
Description: EVAL BOARD FOR EN2392QI
Part Status: Obsolete
Outputs and Type: 1, Non-Isolated
Main Purpose: DC/DC, Step Down
Supplied Contents: Board(s)
Utilized IC / Part: EN2392QI
Board Type: Fully Populated
Regulator Topology: Buck
Frequency - Switching: 1MHz
Current - Output: 9A
Voltage - Input: 4.5V ~ 13.2V
Voltage - Output: 0.75V ~ 3.3V
Packaging: Bulk
Description: EVAL BOARD FOR EN2392QI
Part Status: Obsolete
Outputs and Type: 1, Non-Isolated
Main Purpose: DC/DC, Step Down
Supplied Contents: Board(s)
Utilized IC / Part: EN2392QI
Board Type: Fully Populated
Regulator Topology: Buck
Frequency - Switching: 1MHz
Current - Output: 9A
Voltage - Input: 4.5V ~ 13.2V
Voltage - Output: 0.75V ~ 3.3V
Packaging: Bulk
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| EPM7032STC44-7 |
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Виробник: Intel
Description: IC CPLD 32MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 32MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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| EPM7032SQC44-5 |
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Виробник: Intel
Description: IC CPLD 32MC 5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 32MC 5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 600
Number of Macrocells: 32
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 2
Voltage Supply - Internal: 4.5V ~ 5.5V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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| 5962-8766801MXA |
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Виробник: Intel
Description: IC MPU MG80386 16MHZ 132CPGA
Core Processor: 80386
Operating Temperature: -55°C ~ 125°C (TC)
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 132-BCPGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 132-CPGA (37.59x37.59)
Voltage - I/O: 5V
Description: IC MPU MG80386 16MHZ 132CPGA
Core Processor: 80386
Operating Temperature: -55°C ~ 125°C (TC)
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 132-BCPGA
Packaging: Bulk
Part Status: Active
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 132-CPGA (37.59x37.59)
Voltage - I/O: 5V
на замовлення 1865 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 47632.33 грн |
| HH80556KJ0534M |
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Виробник: Intel
Description: IC MPU 5140 2.33GHZ 771LGA
Packaging: Bulk
Package / Case: 771-LGA
Mounting Type: Surface Mount
Speed: 2.33GHz
Operating Temperature: 65°C (TC)
Core Processor: Intel® Xeon® Processor 5140
Voltage - I/O: 0.85V, 1V, 1.5V
Supplier Device Package: 771-LGA (37.5x37.5)
Number of Cores/Bus Width: 2 Core, 64-Bit
Graphics Acceleration: No
Part Status: Active
Description: IC MPU 5140 2.33GHZ 771LGA
Packaging: Bulk
Package / Case: 771-LGA
Mounting Type: Surface Mount
Speed: 2.33GHz
Operating Temperature: 65°C (TC)
Core Processor: Intel® Xeon® Processor 5140
Voltage - I/O: 0.85V, 1V, 1.5V
Supplier Device Package: 771-LGA (37.5x37.5)
Number of Cores/Bus Width: 2 Core, 64-Bit
Graphics Acceleration: No
Part Status: Active
на замовлення 753 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 29754.46 грн |
| NG82357 |
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Виробник: Intel
Description: IC INTEG SYST PERIPHERAL 132QFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 132-PQFP
Type: Integrated System Peripheral
Mounting Type: Surface Mount
Package / Case: 132-QFP
Packaging: Bulk
Description: IC INTEG SYST PERIPHERAL 132QFP
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 132-PQFP
Type: Integrated System Peripheral
Mounting Type: Surface Mount
Package / Case: 132-QFP
Packaging: Bulk
на замовлення 877 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 2200.70 грн |
| GWIXP425BCT |
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Виробник: Intel
Description: IC MPU INTEL 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 3487 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 2664.63 грн |
| GWIXP425ABCT |
![]() |
Виробник: Intel
Description: IC MPU INTEL 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 1441 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9+ | 2664.63 грн |
| GWIXP425ABBT |
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Виробник: Intel
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 3734 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 1974.61 грн |
| HH80552RE083512 |
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Виробник: Intel
Description: IC MPU INTEL CEL 3.06GHZ 775LGA
Packaging: Bulk
Package / Case: 775-BLGA
Mounting Type: Surface Mount
Speed: 3.06GHz
Operating Temperature: 69.2°C (TC)
Core Processor: Intel® Celeron® D Processor 347
Voltage - I/O: 1.25V, 1.325V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
Part Status: Active
Description: IC MPU INTEL CEL 3.06GHZ 775LGA
Packaging: Bulk
Package / Case: 775-BLGA
Mounting Type: Surface Mount
Speed: 3.06GHz
Operating Temperature: 69.2°C (TC)
Core Processor: Intel® Celeron® D Processor 347
Voltage - I/O: 1.25V, 1.325V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 1 Core, 64-Bit
Part Status: Active
на замовлення 259285 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 28+ | 802.59 грн |
| FWIXP422ABB |
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Виробник: Intel
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
Description: IC MPU INTEL 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 1662 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 15+ | 1603.00 грн |
| 5962-8961402MXA |
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Виробник: Intel
Description: IC EPROM 1MBIT 32CDIP
Packaging: Bulk
Package / Case: 32-CDIP
Mounting Type: Through Hole
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - UV
Memory Format: EPROM
Supplier Device Package: 32-CDIP
Part Status: Active
Access Time: 250 ns
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Description: IC EPROM 1MBIT 32CDIP
Packaging: Bulk
Package / Case: 32-CDIP
Mounting Type: Through Hole
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EPROM - UV
Memory Format: EPROM
Supplier Device Package: 32-CDIP
Part Status: Active
Access Time: 250 ns
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
на замовлення 3553 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2542.58 грн |
| EP1C4F400C8NAB |
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Виробник: Intel
Description: IC FPGA 301 I/O 400FBGA
DigiKey Programmable: Not Verified
Number of I/O: 301
Part Status: Obsolete
Total RAM Bits: 78336
Number of LABs/CLBs: 400
Supplier Device Package: 400-FBGA (21x21)
Number of Logic Elements/Cells: 4000
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 400-BGA
Packaging: Tray
Description: IC FPGA 301 I/O 400FBGA
DigiKey Programmable: Not Verified
Number of I/O: 301
Part Status: Obsolete
Total RAM Bits: 78336
Number of LABs/CLBs: 400
Supplier Device Package: 400-FBGA (21x21)
Number of Logic Elements/Cells: 4000
Voltage - Supply: 1.425V ~ 1.575V
Operating Temperature: 0°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: 400-BGA
Packaging: Tray
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| EPM1270GT144C5 |
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Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 116
Part Status: Active
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC CPLD 980MC 6.2NS 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 116
Part Status: Active
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| EPM1270GT144C3 |
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Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 116
Part Status: Active
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC CPLD 980MC 6.2NS 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 116
Part Status: Active
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 144-TQFP (20x20)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| MD2148H |
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Виробник: Intel
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
на замовлення 209 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 28+ | 868.39 грн |
| EPM7128SQC160-15YY |
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Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 15 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Part Status: Obsolete
Description: IC CPLD 128MC 15NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 15 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Part Status: Obsolete
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| EPM7128SQC160-10YY |
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Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Description: IC CPLD 128MC 10NS 160QFP
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
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| EPM7128SQC160-15ES |
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Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 15 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC CPLD 128MC 15NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 15 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| EPM7128SQCI100-10 |
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Виробник: Intel
Description: IC CPLD 128MC 10NS 100QFP
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-PQFP (20x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 128
Description: IC CPLD 128MC 10NS 100QFP
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 100-PQFP (20x14)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 85°C (TA)
Number of Macrocells: 128
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| EPM7128SQC160-10ES |
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Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC CPLD 128MC 10NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| EPM7128SQC160-7YY |
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Виробник: Intel
Description: IC CPLD 128MC 7.5NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
Description: IC CPLD 128MC 7.5NS 160QFP
DigiKey Programmable: Not Verified
Number of I/O: 100
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 8
Supplier Device Package: 160-PQFP (28x28)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 128
Number of Gates: 2500
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Packaging: Tray
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| EPM570F100C5NAA |
Виробник: Intel
Description: IC CPLD 440MC 8.7NS 100FBGA
DigiKey Programmable: Not Verified
Number of I/O: 76
Part Status: Active
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 570
Supplier Device Package: 100-FBGA (11x11)
Delay Time tpd(1) Max: 8.7 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 440
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Packaging: Tray
Description: IC CPLD 440MC 8.7NS 100FBGA
DigiKey Programmable: Not Verified
Number of I/O: 76
Part Status: Active
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 570
Supplier Device Package: 100-FBGA (11x11)
Delay Time tpd(1) Max: 8.7 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 440
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 100-LBGA
Packaging: Tray
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| AN87C196JQ |
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Виробник: Intel
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
на замовлення 3864 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 70+ | 325.75 грн |
| AN8398JC |
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Виробник: Intel
Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 347 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 3091.78 грн |
| EPM570GM256C5N |
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Виробник: Intel
Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
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В кошику
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| EPM570GT144C5 |
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Виробник: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| 1SX280LN3F43E2VGS1 |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
| 1SX280LU3F50I2LG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH3F55E3VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43E3VGS1 |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH3F55E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU3F50E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN2F43E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH3F55I1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU2F50E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU2F50E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH2F55E1VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH3F55E2VG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43E1VG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LH2F55I1VG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LN2F43I2LG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LU3F50I1VG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LN3F43E3VG |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LU3F50E2VGS1 |
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Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
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| 1SX280LN3F43I2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LU2F50E2LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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