| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1SX280LH3F55E1VG | Intel |
 Description: IC SOC CORTEX-A53 1.5GHZ 2912BGAPackaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH3F55I2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LN2F43E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LN3F43I2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LU2F50I2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LU3F50I2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH2F55E2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LU3F50I3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH2F55I2VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LN2F43E1VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA, FC (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH2F55E2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH3F55I2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LU2F50I2LG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LH3F55I3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA Packaging: Tray Package / Case: 2912-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2912-FBGA, FC (55x55) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX280LU3F50E3VG | Intel |
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 2800K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| EPM7256AETI144-7AA | Intel |
Description: IC CPLD 256MC 7.5NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Number of Gates: 5000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Part Status: Obsolete Number of I/O: 164 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| QCIXF1002ED | Intel |
Description: NETWORK PROC 3.3V 165.89MHZ 432P Packaging: Bulk Package / Case: 304-BGA Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2756 шт: термін постачання 21-31 дні (днів) |
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EP2S130F1020C5NRB | Intel |
Description: IC FPGA 742 I/O 1020FBGA Packaging: Tray Package / Case: 1020-BBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.15V ~ 1.25V Number of Logic Elements/Cells: 132540 Supplier Device Package: 1020-FBGA (33x33) Number of LABs/CLBs: 6627 Part Status: Obsolete Number of I/O: 742 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HN1F43E2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1760-FBGA (42.5x42.5) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 1650K Logic Elements |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HU1F50I2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 2397-FBGA, FC (50x50) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 1650K Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 2397-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HN3F43E3VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1760-FBGA (42.5x42.5) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 1650K Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HU1F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HU2F50E2VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HN3F43I2VG | Intel |
Description: IC FPGA STRATIX 10 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 1760-FBGA (42.5x42.5) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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1SX165HU3F50E3VG | Intel |
Description: IC FPGA STRATIX 10 2397FBGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ Primary Attributes: FPGA - 1650K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 2397-FBGA, FC (50x50) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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5CSEBA2U23I7LN | Intel |
Description: IC SOC CORTEX-A9 925MHZ 672UBGA Packaging: Tray Package / Case: 672-FBGA Speed: 925MHz RAM Size: 64KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 25K Logic Elements Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 672-UBGA (23x23) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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10AS066K2F40I1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 660K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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10AS066H2F34E1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1152-FBGA, FC (35x35) Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 660K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 1152-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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10AS066K1F40I1HG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA Part Status: Active Architecture: MCU, FPGA Supplier Device Package: 1517-FCBGA (40x40) Peripherals: DMA, POR, WDT Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 660K Logic Elements Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.5GHz Package / Case: 1517-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| DK-DEV-1SGX-H-0ES | Intel |
Description: DEV KIT STRATIX 10 ENG SAMPLE Part Status: Obsolete Platform: Stratix 10 GX FPGA PCIe Card Contents: Board(s) Type: FPGA For Use With/Related Products: 1SG280H Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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10AS027H4F35I3LG | Intel |
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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EPM7064BFC49-5 | Intel |
Description: IC CPLD 64MC 5NS 49UBGA Packaging: Tray Package / Case: 49-LFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 49-UBGA (7x7) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Part Status: Obsolete Number of I/O: 41 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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EPM7064TC44-7YY | Intel |
Description: IC CPLD 64MC 7.5NS 44TQFP DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Obsolete Voltage Supply - Internal: 4.75V ~ 5.25V Number of Logic Elements/Blocks: 4 Supplier Device Package: 44-TQFP (10x10) Delay Time tpd(1) Max: 7.5 ns Operating Temperature: 0°C ~ 70°C (TA) Number of Macrocells: 64 Number of Gates: 1250 Programmable Type: EE PLD Mounting Type: Surface Mount Package / Case: 44-TQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| 5SGXEF40I2LAB | Intel |
Description: IC FPGA I/O FBGA DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| 5SGXEF40I2LAA | Intel |
Description: IC FPGA I/O FBGA DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| 5SGXEF40I2LNAC | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| 5SGXEF40I2LNAD | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGIC040R39A2E2VR0 | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| F28F020-150 | Intel |
Description: FLASH NOR 2MB TSOP REVERSE 150ns Packaging: Tray Mounting Type: Surface Mount Memory Size: 2Mbit Memory Type: Non-Volatile Voltage - Supply: 12V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 32-TSOP REVERSE Part Status: Active Memory Interface: Parallel Access Time: 70 ns Memory Organization: 256K x 8 DigiKey Programmable: Not Verified |
на замовлення 3372 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
| RD48F2100W0YTQ0 | Intel |
Description: STRATAFLASH EMBEDDED MEMORY Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
 |
EP2AGX45DF29I3NAD | Intel |
Description: IC FPGA 364 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 42959 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 1805 Total RAM Bits: 3517440 Part Status: Obsolete Number of I/O: 364 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| NE80546RE072256 | Intel |
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA Packaging: Bulk Package / Case: 478-BFCPGA Mounting Type: Through Hole Speed: 2.8GHz Operating Temperature: 67°C (TC) Core Processor: Intel® Celeron® D Voltage - I/O: 1.25V, 1.4V Supplier Device Package: 478-FCPGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit Part Status: Active |
на замовлення 3249 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
| D2912-A | Intel |
Description: IC PCM CODEC FILTER 16CDIP Packaging: Bulk Package / Case: 16-CDIP Mounting Type: Through Hole Type: PCM Codec Filter Supplier Device Package: 16-CDIP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
|
|||||||||
 |
5CGXFC4C6F23I7N | Intel |
Description: IC FPGA 240 I/O 484FBGA Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 18868 Total RAM Bits: 2862080 Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
|
||||||||
 |
EPM570ZM100C6N | Intel |
Description: IC CPLD 440MC 9NS 100MBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 100-MBGA (6x6) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
 |
EPM7064QC100-10YY | Intel |
Description: IC CPLD 64MC 10NS 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
| AGFB012R24B2I2V | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGFB012R24C2I1V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
| AGFB012R24C3E3V | Intel |
Description: IC FPGA AGILEX-F 2340FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
| 1SX280LH3F55E1VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH3F55I2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN2F43E2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN3F43I2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU2F50I2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU3F50I2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH2F55E2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LU3F50I3VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LH2F55I2VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 1SX280LN2F43E1VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LH2F55E2LG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LH3F55I2LG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LU2F50I2LG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LH3F55I3VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX280LU3F50E3VG |
|
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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| EPM7256AETI144-7AA |
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
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| QCIXF1002ED |
Виробник: Intel
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2756 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 12487.21 грн |
| EP2S130F1020C5NRB |
Виробник: Intel
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
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| 1SX165HN1F43E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
Description: IC FPGA STRATIX 10 1760FBGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
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| 1SX165HU1F50I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 2397-FBGA, FC (50x50)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 2397-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA STRATIX 10 2397FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 2397-FBGA, FC (50x50)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 2397-BBGA, FCBGA
Packaging: Tray
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| 1SX165HN3F43E3VG |
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA STRATIX 10 1760FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1760-FBGA (42.5x42.5)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 1650K Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| 1SX165HU1F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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од. на суму грн.
| 1SX165HU2F50E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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од. на суму грн.
| 1SX165HN3F43I2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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| 1SX165HU3F50E3VG |
|
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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| 5CSEBA2U23I7LN |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 925MHZ 672UBGA
Packaging: Tray
Package / Case: 672-FBGA
Speed: 925MHz
RAM Size: 64KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 25K Logic Elements
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-UBGA (23x23)
Architecture: MCU, FPGA
Part Status: Active
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| 10AS066K2F40I1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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| 10AS066H2F34E1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1152-FBGA, FC (35x35)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1152-FBGA, FC (35x35)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1152-BBGA, FCBGA
Packaging: Tray
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| 10AS066K1F40I1HG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Part Status: Active
Architecture: MCU, FPGA
Supplier Device Package: 1517-FCBGA (40x40)
Peripherals: DMA, POR, WDT
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 660K Logic Elements
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.5GHz
Package / Case: 1517-BBGA, FCBGA
Packaging: Tray
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| DK-DEV-1SGX-H-0ES |
Виробник: Intel
Description: DEV KIT STRATIX 10 ENG SAMPLE
Part Status: Obsolete
Platform: Stratix 10 GX FPGA PCIe Card
Contents: Board(s)
Type: FPGA
For Use With/Related Products: 1SG280H
Packaging: Box
Description: DEV KIT STRATIX 10 ENG SAMPLE
Part Status: Obsolete
Platform: Stratix 10 GX FPGA PCIe Card
Contents: Board(s)
Type: FPGA
For Use With/Related Products: 1SG280H
Packaging: Box
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| 10AS027H4F35I3LG |
|
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
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| EPM7064BFC49-5 |
|
Виробник: Intel
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
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| EPM7064TC44-7YY |
|
Виробник: Intel
Description: IC CPLD 64MC 7.5NS 44TQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 4
Supplier Device Package: 44-TQFP (10x10)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 64
Number of Gates: 1250
Programmable Type: EE PLD
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
Description: IC CPLD 64MC 7.5NS 44TQFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Voltage Supply - Internal: 4.75V ~ 5.25V
Number of Logic Elements/Blocks: 4
Supplier Device Package: 44-TQFP (10x10)
Delay Time tpd(1) Max: 7.5 ns
Operating Temperature: 0°C ~ 70°C (TA)
Number of Macrocells: 64
Number of Gates: 1250
Programmable Type: EE PLD
Mounting Type: Surface Mount
Package / Case: 44-TQFP
Packaging: Tray
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| 5SGXEF40I2LAB |
Виробник: Intel
Description: IC FPGA I/O FBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Description: IC FPGA I/O FBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
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| 5SGXEF40I2LAA |
Виробник: Intel
Description: IC FPGA I/O FBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Description: IC FPGA I/O FBGA
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
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| 5SGXEF40I2LNAC |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Description: IC FPGA STRATIX V GX FLIP CHIP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
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| 5SGXEF40I2LNAD |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Description: IC FPGA STRATIX V GX FLIP CHIP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
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| AGIC040R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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| AGIC040R39A2E2VR0 |
|
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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| F28F020-150 |
Виробник: Intel
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
на замовлення 3372 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 100+ | 215.14 грн |
| 300+ | 203.41 грн |
| 500+ | 199.64 грн |
| 1000+ | 183.82 грн |
| RD48F2100W0YTQ0 |
Виробник: Intel
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 707.23 грн |
| EP2AGX45DF29I3NAD |
Виробник: Intel
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
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| NE80546RE072256 |
|
Виробник: Intel
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
на замовлення 3249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 3858.60 грн |
| D2912-A |
|
Виробник: Intel
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 84 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 3163.75 грн |
| 5CGXFC4C6F23I7N |
|
Виробник: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 19813.36 грн |
| EPM570ZM100C6N |
|
Виробник: Intel
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
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| EPM7064QC100-10YY |
|
Виробник: Intel
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
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од. на суму грн.
| AGFB012R24B2I2V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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| AGFB012R24C2I1V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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| AGFB012R24C3E3V |
|
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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