| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|
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10AX032E3F29I2LG | Intel |
 Description: IC FPGA 360 I/O 780FBGAPackaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 320000 Supplier Device Package: 780-FBGA, FC (29x29) Number of LABs/CLBs: 119900 Total RAM Bits: 21040128 Number of I/O: 360 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| BXC80557E2140 | Intel |
Description: IC MPU E2000 1.6GHZ 775LGA Voltage - I/O: 0.85V, 1.5V Core Processor: Intel® Pentium® Dual-Core Desktop Processor Operating Temperature: 73.3°C (TC) Speed: 1.6GHz Mounting Type: Surface Mount Package / Case: 775-LGA Packaging: Bulk Display & Interface Controllers: Video Graphics Acceleration: Yes Number of Cores/Bus Width: 2 Core, 64-Bit Supplier Device Package: 775-LGA (37.5x37.5) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| FW82810 | Intel |
Description: MULTIFUNCTION PERIPHERAL PBGA421 Packaging: Bulk Package / Case: 421-BBGA Mounting Type: Surface Mount Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 421-PBGA (31x31) |
на замовлення 1080 шт: термін постачання 21-31 дні (днів) |
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| FW82810E | Intel |
Description: MULTIFUNCTION PERIPHERAL PBGA421 Packaging: Bulk Package / Case: 421-BBGA Mounting Type: Surface Mount Voltage - Supply: 1.7V ~ 1.9V Controller Type: Dynamic RAM (DRAM) Supplier Device Package: 421-PBGA (31x31) |
на замовлення 22680 шт: термін постачання 21-31 дні (днів) |
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EP1K10TC100-2NGZ | Intel |
Description: IC FPGA 66 I/O 100TQFP DigiKey Programmable: Not Verified Number of I/O: 66 Total RAM Bits: 12288 Number of LABs/CLBs: 72 Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Cells: 576 Voltage - Supply: 2.375V ~ 2.625V Operating Temperature: 0°C ~ 70°C (TA) Number of Gates: 56000 Mounting Type: Surface Mount Package / Case: 100-TQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43E3VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43E2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43I3VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43E1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43I2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43E2VGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43E2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43E2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43E3XG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43I1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43E1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43E2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43I2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43E2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2110000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 263750 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43I2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.82V ~ 0.88V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN3F43I3XG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.82V ~ 0.88V |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43E1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43I1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43I2VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43E2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Voltage - Supply: 0.82V ~ 0.88V Operating Temperature: 0°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN2F43I2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.82V ~ 0.88V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43I1VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.77V ~ 0.97V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG211HN1F43I2LG | Intel |
Description: IC FPGA 688 I/O 1760FBGA DigiKey Programmable: Not Verified Number of I/O: 688 Number of LABs/CLBs: 263750 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of Logic Elements/Cells: 2110000 Voltage - Supply: 0.82V ~ 0.88V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 1760-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
| AT80573JH0366M S LBB3 | Intel |
Description: AT80573J - Intel Xeon Processor Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AT80573JH0366M S LBB3-CONS | Intel |
Description: AT805INTXEPROCESSL5215 Packaging: Tape & Box (TB) |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM1270F256I5RR | Intel |
Description: IC CPLD 980MC 10NS 256FBGA DigiKey Programmable: Not Verified Number of I/O: 212 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 1270 Supplier Device Package: 256-FBGA (17x17) Delay Time tpd(1) Max: 10 ns Operating Temperature: -40°C ~ 100°C (TJ) Number of Macrocells: 980 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 256-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM1270F256C5NRR | Intel |
Description: IC CPLD 980MC 10NS 256FBGA DigiKey Programmable: Not Verified Number of I/O: 212 Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V Number of Logic Elements/Blocks: 1270 Supplier Device Package: 256-FBGA (17x17) Delay Time tpd(1) Max: 10 ns Operating Temperature: 0°C ~ 85°C (TJ) Number of Macrocells: 980 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 256-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| EPM1270GF256C5RR | Intel |
Description: IC CPLD 980MC 6.2NS 256FBGA DigiKey Programmable: Not Verified Number of I/O: 212 Voltage Supply - Internal: 1.71V ~ 1.89V Number of Logic Elements/Blocks: 1270 Supplier Device Package: 256-FBGA (17x17) Delay Time tpd(1) Max: 6.2 ns Operating Temperature: 0°C ~ 85°C (TJ) Number of Macrocells: 980 Programmable Type: In System Programmable Mounting Type: Surface Mount Package / Case: 256-BGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
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EP20K400CF672C9 | Intel |
Description: IC FPGA 488 I/O 672FBGA Mounting Type: Surface Mount Package / Case: 672-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 488 Total RAM Bits: 212992 Number of LABs/CLBs: 1664 Supplier Device Package: 672-FBGA (27x27) Number of Logic Elements/Cells: 16640 Voltage - Supply: 1.71V ~ 1.89V Operating Temperature: 0°C ~ 85°C (TJ) Number of Gates: 1052000 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EP20K400EFI672-2N | Intel |
Description: IC FPGA 488 I/O 672FBGA DigiKey Programmable: Not Verified Number of I/O: 488 Total RAM Bits: 212992 Number of LABs/CLBs: 1664 Supplier Device Package: 672-FBGA (27x27) Number of Logic Elements/Cells: 16640 Voltage - Supply: 1.71V ~ 1.89V Operating Temperature: -40°C ~ 100°C (TJ) Number of Gates: 1052000 Mounting Type: Surface Mount Package / Case: 672-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPM570GT100C4 | Intel |
Description: IC CPLD 440MC 5.4NS 100TQFP Packaging: Tray Package / Case: 100-TQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 5.4 ns Supplier Device Package: 100-TQFP (14x14) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 76 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPM3256AQC208-7 | Intel |
Description: IC CPLD 256MC 7.5NS 208QFP Packaging: Tray Package / Case: 208-BFQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 5000 Number of Macrocells: 256 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 208-PQFP (28x28) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Number of I/O: 158 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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EPM3256ATI144-10 | Intel |
Description: IC CPLD 256MC 10NS 144TQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 5000 Number of Macrocells: 256 Operating Temperature: -40°C ~ 85°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 144-TQFP (20x20) Number of Logic Elements/Blocks: 16 Voltage Supply - Internal: 3V ~ 3.6V Number of I/O: 116 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| EP2AGX95DF25I3G | Intel |
Description: IC FPGA 260 I/O 572FBGA DigiKey Programmable: Not Verified Number of I/O: 260 Total RAM Bits: 6839296 Number of LABs/CLBs: 3747 Supplier Device Package: 572-FBGA, FC (25x25) Number of Logic Elements/Cells: 89178 Voltage - Supply: 0.87V ~ 0.93V Operating Temperature: -40°C ~ 100°C (TJ) Mounting Type: Surface Mount Package / Case: 572-BGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||
| DK-DEV-5CGXC7N/P | Intel |
Description: DEVELOPMENT KIT CYCLONE Packaging: Box For Use With/Related Products: 5CGXFC7 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V GX FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| DK-DEV-5CGXC7N | Intel |
Description: DEVELOPMENT KIT CYCLONE Packaging: Box For Use With/Related Products: 5CGXFC7 Type: FPGA Contents: Board(s), Cable(s), Power Supply Platform: Cyclone V GX FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
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1SG280HN3F43E3VG | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG280HN3F43E3VGAS | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG280HN3F43E3VGS3 | Intel |
Description: IC FPGA 688 I/O 1760FBGA Packaging: Tray Package / Case: 1760-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 2800000 Supplier Device Package: 1760-FBGA (42.5x42.5) Number of LABs/CLBs: 350000 Number of I/O: 688 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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1SG250HU3F50I3XG | Intel |
Description: IC FPGA 704 I/O 2397BGA Packaging: Tray Package / Case: 2397-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.82V ~ 0.88V Number of Logic Elements/Cells: 2500000 Supplier Device Package: 2397-FBGA, FC (50x50) Number of LABs/CLBs: 312500 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
| AGIA040R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA040R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA040R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA040R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948BGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA040R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIC035R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIC035R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA040R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA035R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA035R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA035R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA035R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIC035R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIC035R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIA035R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 3.54M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA |
товару немає в наявності |
В кошику од. на суму грн. |
| 10AX032E3F29I2LG |
|
Виробник: Intel
Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| BXC80557E2140 |
|
Виробник: Intel
Description: IC MPU E2000 1.6GHZ 775LGA
Voltage - I/O: 0.85V, 1.5V
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Operating Temperature: 73.3°C (TC)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 775-LGA
Packaging: Bulk
Display & Interface Controllers: Video
Graphics Acceleration: Yes
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 775-LGA (37.5x37.5)
Description: IC MPU E2000 1.6GHZ 775LGA
Voltage - I/O: 0.85V, 1.5V
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Operating Temperature: 73.3°C (TC)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 775-LGA
Packaging: Bulk
Display & Interface Controllers: Video
Graphics Acceleration: Yes
Number of Cores/Bus Width: 2 Core, 64-Bit
Supplier Device Package: 775-LGA (37.5x37.5)
товару немає в наявності
В кошику
од. на суму грн.
| FW82810 |
|
Виробник: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 1080 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 30+ | 711.11 грн |
| FW82810E |
|
Виробник: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 22680 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 30+ | 711.11 грн |
| EP1K10TC100-2NGZ |
|
Виробник: Intel
Description: IC FPGA 66 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 12288
Number of LABs/CLBs: 72
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 576
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 56000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
Description: IC FPGA 66 I/O 100TQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Total RAM Bits: 12288
Number of LABs/CLBs: 72
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Cells: 576
Voltage - Supply: 2.375V ~ 2.625V
Operating Temperature: 0°C ~ 70°C (TA)
Number of Gates: 56000
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43E3VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43E2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43I3VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43E1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43I2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN2F43E2VGAS |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN2F43E2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43E2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43E3XG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 1SG211HN3F43I1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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| 1SG211HN2F43E1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG211HN1F43E2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG211HN2F43I2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG211HN2F43E2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG211HN3F43I2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| 1SG211HN3F43I3XG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Description: IC FPGA 688 I/O 1760FBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
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| 1SG211HN1F43E1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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| 1SG211HN2F43I1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| 1SG211HN1F43I2VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| 1SG211HN1F43E2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Description: IC FPGA 688 I/O 1760FBGA
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: 0°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
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| 1SG211HN2F43I2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| 1SG211HN1F43I1VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.77V ~ 0.97V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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од. на суму грн.
| 1SG211HN1F43I2LG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
Description: IC FPGA 688 I/O 1760FBGA
DigiKey Programmable: Not Verified
Number of I/O: 688
Number of LABs/CLBs: 263750
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of Logic Elements/Cells: 2110000
Voltage - Supply: 0.82V ~ 0.88V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 1760-BBGA, FCBGA
Packaging: Tray
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| EPM1270F256I5RR |
Виробник: Intel
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
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| EPM1270F256C5NRR |
Виробник: Intel
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Description: IC CPLD 980MC 10NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 10 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
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| EPM1270GF256C5RR |
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
Description: IC CPLD 980MC 6.2NS 256FBGA
DigiKey Programmable: Not Verified
Number of I/O: 212
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of Logic Elements/Blocks: 1270
Supplier Device Package: 256-FBGA (17x17)
Delay Time tpd(1) Max: 6.2 ns
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Macrocells: 980
Programmable Type: In System Programmable
Mounting Type: Surface Mount
Package / Case: 256-BGA
Packaging: Tray
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| EP20K400CF672C9 |
|
Виробник: Intel
Description: IC FPGA 488 I/O 672FBGA
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 1052000
Description: IC FPGA 488 I/O 672FBGA
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: 0°C ~ 85°C (TJ)
Number of Gates: 1052000
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| EP20K400EFI672-2N |
|
Виробник: Intel
Description: IC FPGA 488 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1052000
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
Description: IC FPGA 488 I/O 672FBGA
DigiKey Programmable: Not Verified
Number of I/O: 488
Total RAM Bits: 212992
Number of LABs/CLBs: 1664
Supplier Device Package: 672-FBGA (27x27)
Number of Logic Elements/Cells: 16640
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 100°C (TJ)
Number of Gates: 1052000
Mounting Type: Surface Mount
Package / Case: 672-BBGA
Packaging: Tray
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| EPM570GT100C4 |
|
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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| EPM3256AQC208-7 |
|
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
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| EPM3256ATI144-10 |
|
Виробник: Intel
Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
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| EP2AGX95DF25I3G |
Виробник: Intel
Description: IC FPGA 260 I/O 572FBGA
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 6839296
Number of LABs/CLBs: 3747
Supplier Device Package: 572-FBGA, FC (25x25)
Number of Logic Elements/Cells: 89178
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 572-BGA, FCBGA
Packaging: Tray
Description: IC FPGA 260 I/O 572FBGA
DigiKey Programmable: Not Verified
Number of I/O: 260
Total RAM Bits: 6839296
Number of LABs/CLBs: 3747
Supplier Device Package: 572-FBGA, FC (25x25)
Number of Logic Elements/Cells: 89178
Voltage - Supply: 0.87V ~ 0.93V
Operating Temperature: -40°C ~ 100°C (TJ)
Mounting Type: Surface Mount
Package / Case: 572-BGA, FCBGA
Packaging: Tray
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| DK-DEV-5CGXC7N/P |
Виробник: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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| DK-DEV-5CGXC7N |
Виробник: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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| 1SG280HN3F43E3VG |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG280HN3F43E3VGAS |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG280HN3F43E3VGS3 |
|
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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| 1SG250HU3F50I3XG |
|
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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| AGIA040R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA040R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA040R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA040R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA040R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIC035R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIC035R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA040R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA035R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA035R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA035R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA035R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIC035R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIC035R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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| AGIA035R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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