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RJ80530VY800256 Intel Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
на замовлення 5066 шт:
термін постачання 21-31 дні (днів)
17+1416.06 грн
Мінімальне замовлення: 17
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EP2SEVOL2F672NAA Intel Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
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10M50DDF484C8G 10M50DDF484C8G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+14985.63 грн
25+12121.30 грн
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10M50DDF672C8G 10M50DDF672C8G Intel Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+17614.37 грн
25+14248.07 грн
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10M50DDF484I7G 10M50DDF484I7G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+19980.84 грн
25+16162.43 грн
В кошику  од. на суму  грн.
10M50DDF672I7G 10M50DDF672I7G Intel Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
1+23485.82 грн
25+18997.19 грн
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10AX032H3F34E2SG 10AX032H3F34E2SG Intel arria-10-aib.pdf Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FBGA, FC (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
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10AX032E3F29I2LG 10AX032E3F29I2LG Intel arria-10-aib.pdf Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
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BXC80557E2140 Intel INTLS02014-1.pdf?t.download=true&u=5oefqw Description: IC MPU E2000 1.6GHZ 775LGA
Packaging: Bulk
Package / Case: 775-LGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 73.3°C (TC)
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Voltage - I/O: 0.85V, 1.5V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 2 Core, 64-Bit
Graphics Acceleration: Yes
Display & Interface Controllers: Video
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FW82810 Intel INTLS00337-1.pdf?t.download=true&u=5oefqw Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 1080 шт:
термін постачання 21-31 дні (днів)
30+695.01 грн
Мінімальне замовлення: 30
В кошику  од. на суму  грн.
FW82810E Intel INTLS02129-1.pdf?t.download=true&u=5oefqw Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 22680 шт:
термін постачання 21-31 дні (днів)
30+695.01 грн
Мінімальне замовлення: 30
В кошику  од. на суму  грн.
EP1K10TC100-2NGZ EP1K10TC100-2NGZ Intel ACEX_1K_Ver3.4_May2003.pdf Description: IC FPGA 66 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 66
DigiKey Programmable: Not Verified
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DK-SI-AGI027FA DK-SI-AGI027FA Intel Description: I-SERIES TRANSCEIVER-SOC DEVELOP
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Agilex I-Series SoC FPGA Transceiver-SoC
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1SG211HN3F43E3VG 1SG211HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E2VG 1SG211HN3F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN3F43I3VG 1SG211HN3F43I3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E1VG 1SG211HN3F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I2VG 1SG211HN3F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2VGAS 1SG211HN2F43E2VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2VG 1SG211HN2F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN3F43E2LG 1SG211HN3F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN3F43E3XG 1SG211HN3F43E3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN3F43I1VG 1SG211HN3F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN2F43E1VG 1SG211HN2F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN1F43E2VG 1SG211HN1F43E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN2F43I2VG 1SG211HN2F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2LG 1SG211HN2F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I2LG 1SG211HN3F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I3XG 1SG211HN3F43I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E1VG 1SG211HN1F43E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
товару немає в наявності
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1SG211HN2F43I1VG 1SG211HN2F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I2VG 1SG211HN1F43I2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E2LG 1SG211HN1F43E2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43I2LG 1SG211HN2F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I1VG 1SG211HN1F43I1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I2LG 1SG211HN1F43I2LG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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AT80573JH0366M S LBB3 Intel Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
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AT80573JH0366M S LBB3-CONS Intel Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
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EPM1270F256I5RR Intel Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EPM1270F256C5NRR Intel Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EPM1270GF256C5RR Intel Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EP20K400CF672C9 EP20K400CF672C9 Intel APEX_20KC_Ver2.2_Feb2004.pdf Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K400EFI672-2N EP20K400EFI672-2N Intel 20K_Family_DS.pdf Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
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EPM570GT100C4 EPM570GT100C4 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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EPM3256AQC208-7 EPM3256AQC208-7 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
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EPM3256ATI144-10 EPM3256ATI144-10 Intel MAX_3000A_Device_Family.pdf Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
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EP2AGX95DF25I3G Intel Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
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DK-DEV-5CGXC7N/P Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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DK-DEV-5CGXC7N Intel Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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1SG280HN3F43E3VG 1SG280HN3F43E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGAS 1SG280HN3F43E3VGAS Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGS3 1SG280HN3F43E3VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG250HU3F50I3XG 1SG250HU3F50I3XG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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AGIA040R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2E3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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RJ80530VY800256
Виробник: Intel
Description: TUALITAN PENTIUM PROCESSOR
Packaging: Bulk
на замовлення 5066 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
17+1416.06 грн
Мінімальне замовлення: 17
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EP2SEVOL2F672NAA
Виробник: Intel
Description: IC FPGA STRATIX II 672BGA
Packaging: Tray
DigiKey Programmable: Not Verified
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10M50DDF484C8G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M50DDF484C8G
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14985.63 грн
25+12121.30 грн
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10M50DDF672C8G Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf
10M50DDF672C8G
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+17614.37 грн
25+14248.07 грн
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10M50DDF484I7G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M50DDF484I7G
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+19980.84 грн
25+16162.43 грн
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10M50DDF672I7G Intel®_MAX®_10%20FPGA_Device_Datasheet.pdf
10M50DDF672I7G
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3125
Total RAM Bits: 1677312
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+23485.82 грн
25+18997.19 грн
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10AX032H3F34E2SG arria-10-aib.pdf
10AX032H3F34E2SG
Виробник: Intel
Description: IC FPGA 384 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 1152-FBGA, FC (35x35)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 384
DigiKey Programmable: Not Verified
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10AX032E3F29I2LG arria-10-aib.pdf
10AX032E3F29I2LG
Виробник: Intel
Description: IC FPGA 360 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 780-FBGA, FC (29x29)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 360
DigiKey Programmable: Not Verified
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BXC80557E2140 INTLS02014-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: IC MPU E2000 1.6GHZ 775LGA
Packaging: Bulk
Package / Case: 775-LGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 73.3°C (TC)
Core Processor: Intel® Pentium® Dual-Core Desktop Processor
Voltage - I/O: 0.85V, 1.5V
Supplier Device Package: 775-LGA (37.5x37.5)
Number of Cores/Bus Width: 2 Core, 64-Bit
Graphics Acceleration: Yes
Display & Interface Controllers: Video
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FW82810 INTLS00337-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 1080 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
30+695.01 грн
Мінімальне замовлення: 30
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FW82810E INTLS02129-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: MULTIFUNCTION PERIPHERAL PBGA421
Packaging: Bulk
Package / Case: 421-BBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.7V ~ 1.9V
Controller Type: Dynamic RAM (DRAM)
Supplier Device Package: 421-PBGA (31x31)
на замовлення 22680 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
30+695.01 грн
Мінімальне замовлення: 30
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EP1K10TC100-2NGZ ACEX_1K_Ver3.4_May2003.pdf
EP1K10TC100-2NGZ
Виробник: Intel
Description: IC FPGA 66 I/O 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Number of Gates: 56000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 576
Supplier Device Package: 100-TQFP (14x14)
Number of LABs/CLBs: 72
Total RAM Bits: 12288
Number of I/O: 66
DigiKey Programmable: Not Verified
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DK-SI-AGI027FA
DK-SI-AGI027FA
Виробник: Intel
Description: I-SERIES TRANSCEIVER-SOC DEVELOP
Packaging: Bulk
For Use With/Related Products: AGIB027
Type: FPGA + MCU/MPU SoC
Contents: Board(s)
Platform: Agilex I-Series SoC FPGA Transceiver-SoC
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1SG211HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I3VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2VGAS 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VGAS
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43E3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43E3XG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43E2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN3F43I3XG 10_GX_SX_Device_Overview.pdf
1SG211HN3F43I3XG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I2VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43E2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43E2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN2F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN2F43I2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I1VG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I1VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG211HN1F43I2LG 10_GX_SX_Device_Overview.pdf
1SG211HN1F43I2LG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2110000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 263750
Number of I/O: 688
DigiKey Programmable: Not Verified
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AT80573JH0366M S LBB3
Виробник: Intel
Description: AT80573J - Intel Xeon Processor
Packaging: Bulk
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AT80573JH0366M S LBB3-CONS
Виробник: Intel
Description: AT805INTXEPROCESSL5215
Packaging: Tape & Box (TB)
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EPM1270F256I5RR
Виробник: Intel
Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EPM1270F256C5NRR
Виробник: Intel
Description: IC CPLD 980MC 10NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EPM1270GF256C5RR
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 212
DigiKey Programmable: Not Verified
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EP20K400CF672C9 APEX_20KC_Ver2.2_Feb2004.pdf
EP20K400CF672C9
Виробник: Intel
Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K400EFI672-2N 20K_Family_DS.pdf
EP20K400EFI672-2N
Виробник: Intel
Description: IC FPGA 488 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Number of Gates: 1052000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 16640
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 1664
Total RAM Bits: 212992
Number of I/O: 488
DigiKey Programmable: Not Verified
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EPM570GT100C4 max2_mii51006.pdf
EPM570GT100C4
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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EPM3256AQC208-7 MAX_3000A_Device_Family.pdf
EPM3256AQC208-7
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 208QFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 208-PQFP (28x28)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 158
DigiKey Programmable: Not Verified
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EPM3256ATI144-10 MAX_3000A_Device_Family.pdf
EPM3256ATI144-10
Виробник: Intel
Description: IC CPLD 256MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
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EP2AGX95DF25I3G
Виробник: Intel
Description: IC FPGA 260 I/O 572FBGA
Packaging: Tray
Package / Case: 572-BGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 89178
Supplier Device Package: 572-FBGA, FC (25x25)
Number of LABs/CLBs: 3747
Total RAM Bits: 6839296
Number of I/O: 260
DigiKey Programmable: Not Verified
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DK-DEV-5CGXC7N/P
Виробник: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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DK-DEV-5CGXC7N
Виробник: Intel
Description: DEVELOPMENT KIT CYCLONE
Packaging: Box
For Use With/Related Products: 5CGXFC7
Type: FPGA
Contents: Board(s), Cable(s), Power Supply
Platform: Cyclone V GX FPGA
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1SG280HN3F43E3VG 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VG
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGAS 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGAS
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG280HN3F43E3VGS3 10_GX_SX_Device_Overview.pdf
1SG280HN3F43E3VGS3
Виробник: Intel
Description: IC FPGA 688 I/O 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 1760-FBGA (42.5x42.5)
Number of LABs/CLBs: 350000
Number of I/O: 688
DigiKey Programmable: Not Verified
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1SG250HU3F50I3XG 10_GX_SX_Device_Overview.pdf
1SG250HU3F50I3XG
Виробник: Intel
Description: IC FPGA 704 I/O 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 2500000
Supplier Device Package: 2397-FBGA, FC (50x50)
Number of LABs/CLBs: 312500
Number of I/O: 704
DigiKey Programmable: Not Verified
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AGIA040R39A2E3E
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIA040R39A2E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIA040R39A2E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIA040R39A1E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948BGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIA040R39A1E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIC035R39A2E3E
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
AGIC035R39A2I3V
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
В кошику  од. на суму  грн.
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