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AGIA040R39A2I3V Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1E2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
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AGIC035R39A2I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I3E Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
товару немає в наявності
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AGIA035R39A2I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1E1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1I2VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1I1VB Intel Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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EP1SGX25DF672I6N EP1SGX25DF672I6N Intel Stratix GX FPGA Family Data Sheet.pdf Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
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SPTSBP3PCCWA002 Intel Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
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10M40DDF484C8G 10M40DDF484C8G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
1+9838.26 грн
25+7957.38 грн
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10M40DDF672C8G 10M40DDF672C8G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+11141.16 грн
25+9012.35 грн
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10M40DDF484I7G 10M40DDF484I7G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+13116.92 грн
25+10610.98 грн
В кошику  од. на суму  грн.
10M40DDF672I7G 10M40DDF672I7G Intel Intel®_MAX®_10 FPGA_Device_Datasheet.pdf Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+14856.41 грн
25+12016.01 грн
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EPM2210GF256C3 EPM2210GF256C3 Intel max2_mii51006.pdf Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210GF256C4N EPM2210GF256C4N Intel max2_mii51006.pdf Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C4RR Intel Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C5NGA Intel Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C5RR Intel Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F324C4RR Intel Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
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5SEEBF45C4G 5SEEBF45C4G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I4G 5SEEBF45I4G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C3G 5SEEBF45C3G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C2G 5SEEBF45C2G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I3LG 5SEEBF45I3LG Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C2LG 5SEEBF45C2LG Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I3G 5SEEBF45I3G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I2G 5SEEBF45I2G Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I2LG 5SEEBF45I2LG Intel Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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EPM570GT100I5 EPM570GT100I5 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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EPM570ZM144C7N Intel max2_mii51006.pdf Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
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EPM570GT100I5NRR Intel Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
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EPM570GT144C4N EPM570GT144C4N Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
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5962-9099703MRA 5962-9099703MRA Intel 5962-90997.pdf?t.download=true&u=5oefqw Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
на замовлення 826 шт:
термін постачання 21-31 дні (днів)
4+6467.66 грн
Мінімальне замовлення: 4
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UG80960HA4016 Intel Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
6+4242.32 грн
Мінімальне замовлення: 6
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AGFA006R16A3E4F Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3E3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3E3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R24C3E3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R24C3E3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3I3V Intel Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3I3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA008R16A3E3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB008R16A3E3V Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3E3E Intel Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGIA040R39A2I3V
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I3E
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1E2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I3E
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I3E
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A2I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1E1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A2I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1I2VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A2I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA035R39A1I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIC035R39A1I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 3.54M Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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AGIA040R39A1I1VB
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
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EP1SGX25DF672I6N Stratix GX FPGA Family Data Sheet.pdf
EP1SGX25DF672I6N
Виробник: Intel
Description: IC FPGA 455 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.425V ~ 1.575V
Number of Logic Elements/Cells: 25660
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2566
Total RAM Bits: 1944576
Number of I/O: 455
DigiKey Programmable: Not Verified
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SPTSBP3PCCWA002
Виробник: Intel
Description: OPTOELECTRONICS
Packaging: Bulk
Connector Type: LC
Mounting Type: Pluggable, SFP28
Applications: Optical
Data Rate: 100Gbps
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10M40DDF484C8G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M40DDF484C8G
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9838.26 грн
25+7957.38 грн
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10M40DDF672C8G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M40DDF672C8G
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11141.16 грн
25+9012.35 грн
В кошику  од. на суму  грн.
10M40DDF484I7G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M40DDF484I7G
Виробник: Intel
Description: IC FPGA/CPLD NV 360 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 360
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13116.92 грн
25+10610.98 грн
В кошику  од. на суму  грн.
10M40DDF672I7G Intel®_MAX®_10 FPGA_Device_Datasheet.pdf
10M40DDF672I7G
Виробник: Intel
Description: IC FPGA/CPLD NV 500 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 2.85V ~ 3.15V, 3.135V ~ 3.465V
Number of Logic Elements/Cells: 40000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 2500
Total RAM Bits: 1290240
Number of I/O: 500
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14856.41 грн
25+12016.01 грн
В кошику  од. на суму  грн.
EPM2210GF256C3 max2_mii51006.pdf
EPM2210GF256C3
Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210GF256C4N max2_mii51006.pdf
EPM2210GF256C4N
Виробник: Intel
Description: IC CPLD 1700MC 7NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 7 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C4RR
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C5NGA
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F256C5RR
Виробник: Intel
Description: IC CPLD 1700MC 11.2NS 256FBGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 11.2 ns
Supplier Device Package: 256-FBGA (17x17)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 204
DigiKey Programmable: Not Verified
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EPM2210F324C4RR
Виробник: Intel
Description: IC CPLD 1700MC 9.1NS 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 1700
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9.1 ns
Supplier Device Package: 324-FBGA (19x19)
Number of Logic Elements/Blocks: 2210
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 272
DigiKey Programmable: Not Verified
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5SEEBF45C4G
5SEEBF45C4G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I4G
5SEEBF45I4G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C3G
5SEEBF45C3G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C2G
5SEEBF45C2G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I3LG
5SEEBF45I3LG
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45C2LG
5SEEBF45C2LG
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I3G
5SEEBF45I3G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I2G
5SEEBF45I2G
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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5SEEBF45I2LG
5SEEBF45I2LG
Виробник: Intel
Description: IC FPGA 840 I/O 1932FBGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 952000
Supplier Device Package: 1932-FBGA, FC (45x45)
Number of LABs/CLBs: 359250
Total RAM Bits: 53248000
Number of I/O: 840
DigiKey Programmable: Not Verified
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EPM570GT100I5 max2_mii51006.pdf
EPM570GT100I5
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 76
DigiKey Programmable: Not Verified
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EPM570ZM144C7N max2_mii51006.pdf
Виробник: Intel
Description: IC CPLD 440MC 9NS 144MBGA
Packaging: Tray
Package / Case: 144-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 144-MBGA (7x7)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
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EPM570GT100I5NRR
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 100TQFP
Packaging: Tray
Package / Case: 100-TQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 100-TQFP (14x14)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
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EPM570GT144C4N max2_mii51006.pdf
EPM570GT144C4N
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 116
DigiKey Programmable: Not Verified
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5962-9099703MRA 5962-90997.pdf?t.download=true&u=5oefqw
5962-9099703MRA
Виробник: Intel
Description: MICROPROCESSOR CIRCUIT, CMOS
Packaging: Bulk
Package / Case: 20-CDIP (0.300", 7.62mm)
Function: Controller
Interface: Bus
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 75mA
Supplier Device Package: 20-CDIP
DigiKey Programmable: Not Verified
на замовлення 826 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+6467.66 грн
Мінімальне замовлення: 4
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UG80960HA4016
Виробник: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4242.32 грн
Мінімальне замовлення: 6
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AGFA006R16A3E4F
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R24C3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R24C3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3I3V
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3I3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA008R16A3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB008R16A3E3V
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 764K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFA006R16A3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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AGFB006R16A3E3E
Виробник: Intel
Description: IC FPGA AGILEX-F 1546FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 573K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
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