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EPM1270GT144C3 EPM1270GT144C3 Intel max2_mii51006.pdf Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
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MD2148H MD2148H Intel INTLS03338-1.pdf?t.download=true&u=5oefqw Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
на замовлення 209 шт:
термін постачання 21-31 дні (днів)
28+881.22 грн
Мінімальне замовлення: 28
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EPM7128SQC160-15YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-10YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-15ES Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQCI100-10 EPM7128SQCI100-10 Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
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EPM7128SQC160-10ES Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-7YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 128MC 7.5NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM570F100C5NAA Intel Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
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AN87C196JQ AN87C196JQ Intel INTLS03425-1.pdf?t.download=true&u=5oefqw Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
на замовлення 3864 шт:
термін постачання 21-31 дні (днів)
70+330.57 грн
Мінімальне замовлення: 70
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AN8398JC AN8398JC Intel INTLS03253-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 347 шт:
термін постачання 21-31 дні (днів)
8+3137.46 грн
Мінімальне замовлення: 8
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EPM570GM256C5N EPM570GM256C5N Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
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EPM570GT144C5 EPM570GT144C5 Intel max2_mii51006.pdf Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
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1SX280LN3F43E2VGS1 1SX280LN3F43E2VGS1 Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E2LG 1SX280LN3F43E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43I1VG 1SX280LN3F43I1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I2LG 1SX280LU3F50I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E3VG 1SX280LH3F55E3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E3VGS1 1SX280LN3F43E3VGS1 Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E2LG 1SX280LH3F55E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E2VG 1SX280LN3F43E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E2VG 1SX280LU3F50E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E2LG 1SX280LN2F43E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I1VG 1SX280LH3F55I1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E2VG 1SX280LU2F50E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E1VG 1SX280LU2F50E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E1VG 1SX280LH2F55E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E2VG 1SX280LH3F55E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E1VG 1SX280LN3F43E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55I1VG 1SX280LH2F55I1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43I2LG 1SX280LN2F43I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
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1SX280LU3F50I1VG 1SX280LU3F50I1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E3VG 1SX280LN3F43E3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E2VGS1 1SX280LU3F50E2VGS1 Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
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1SX280LN3F43I2LG 1SX280LN3F43I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E2LG 1SX280LU2F50E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E1VG 1SX280LH3F55E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I2VG 1SX280LH3F55I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E2VG 1SX280LN2F43E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43I2VG 1SX280LN3F43I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50I2VG 1SX280LU2F50I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I2VG 1SX280LU3F50I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E2VG 1SX280LH2F55E2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I3VG 1SX280LU3F50I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55I2VG 1SX280LH2F55I2VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E1VG 1SX280LN2F43E1VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E2LG 1SX280LH2F55E2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I2LG 1SX280LH3F55I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50I2LG 1SX280LU2F50I2LG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I3VG 1SX280LH3F55I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E3VG 1SX280LU3F50E3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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EPM7256AETI144-7AA Intel Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
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QCIXF1002ED Intel Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2756 шт:
термін постачання 21-31 дні (днів)
2+12671.71 грн
Мінімальне замовлення: 2
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KD82750PB-25 KD82750PB-25 Intel INTLS03387-1.pdf?t.download=true&u=5oefqw Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
на замовлення 2063 шт:
термін постачання 21-31 дні (днів)
2+14613.17 грн
Мінімальне замовлення: 2
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KU82307-25 KU82307-25 Intel INTLS05014-1.pdf?t.download=true&u=5oefqw Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 912 шт:
термін постачання 21-31 дні (днів)
5+5080.12 грн
Мінімальне замовлення: 5
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EP2S130F1020C5NRB EP2S130F1020C5NRB Intel Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
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1SX165HN1F43E2VG 1SX165HN1F43E2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HU1F50I2VG 1SX165HU1F50I2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HN3F43E3VG 1SX165HN3F43E3VG Intel Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HU1F50E2VG 1SX165HU1F50E2VG Intel Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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EPM1270GT144C3 max2_mii51006.pdf
EPM1270GT144C3
Виробник: Intel
Description: IC CPLD 980MC 6.2NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 6.2 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
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MD2148H INTLS03338-1.pdf?t.download=true&u=5oefqw
MD2148H
Виробник: Intel
Description: IC SRAM 4KBIT PARALLEL 18CDIP
Packaging: Bulk
Package / Case: 18-CDIP
Mounting Type: Through Hole
Memory Size: 4Kbit
Memory Type: Volatile
Operating Temperature: -55°C ~ 125°C (TC)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 18-CDIP
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 1K x 4
DigiKey Programmable: Not Verified
на замовлення 209 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
28+881.22 грн
Мінімальне замовлення: 28
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EPM7128SQC160-15YY MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-10YY MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-15ES MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 128MC 15NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 15 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQCI100-10 MAX_7000_Ver6.7_9-12-05.pdf
EPM7128SQCI100-10
Виробник: Intel
Description: IC CPLD 128MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
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EPM7128SQC160-10ES MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 128MC 10NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM7128SQC160-7YY MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 128MC 7.5NS 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 2500
Number of Macrocells: 128
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 160-PQFP (28x28)
Number of Logic Elements/Blocks: 8
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 100
DigiKey Programmable: Not Verified
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EPM570F100C5NAA
Виробник: Intel
Description: IC CPLD 440MC 8.7NS 100FBGA
Packaging: Tray
Package / Case: 100-LBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 8.7 ns
Supplier Device Package: 100-FBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
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AN87C196JQ INTLS03425-1.pdf?t.download=true&u=5oefqw
AN87C196JQ
Виробник: Intel
Description: 16-BIT, OTPROM, 8096 CPU, 8MHZ
Packaging: Bulk
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 488 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: EPROM
Core Processor: 87C196JQ
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSIO, UART/USART
Supplier Device Package: 52-PLCC
Part Status: Active
Number of I/O: 41
DigiKey Programmable: Not Verified
на замовлення 3864 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
70+330.57 грн
Мінімальне замовлення: 70
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AN8398JC INTLS03253-1.pdf?t.download=true&u=5oefqw
AN8398JC
Виробник: Intel
Description: MICROCONTROLLER, 16-BIT, MROM, 8
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 347 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+3137.46 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
EPM570GM256C5N max2_mii51006.pdf
EPM570GM256C5N
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 160
DigiKey Programmable: Not Verified
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EPM570GT144C5 max2_mii51006.pdf
EPM570GT144C5
Виробник: Intel
Description: IC CPLD 440MC 5.4NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 5.4 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 116
DigiKey Programmable: Not Verified
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1SX280LN3F43E2VGS1 Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E2VGS1
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43I1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55E3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E3VGS1 Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E3VGS1
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55E2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN2F43E2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50E1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55E1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55I1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55I1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN2F43I2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43E3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43E3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E2VGS1 Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50E2VGS1
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Discontinued at Digi-Key
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1SX280LN3F43I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50E2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55E1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN2F43E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN3F43I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50I2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55E2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50I3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55I2VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55I2VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LN2F43E1VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN2F43E1VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH2F55E2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH2F55E2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU2F50I2LG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU2F50I2LG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LH3F55I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LH3F55I3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
Part Status: Active
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1SX280LU3F50E3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LU3F50E3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 2397BGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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EPM7256AETI144-7AA
Виробник: Intel
Description: IC CPLD 256MC 7.5NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Number of Gates: 5000
Number of Macrocells: 256
Operating Temperature: -40°C ~ 85°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 16
Voltage Supply - Internal: 3V ~ 3.6V
Part Status: Obsolete
Number of I/O: 164
DigiKey Programmable: Not Verified
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QCIXF1002ED
Виробник: Intel
Description: NETWORK PROC 3.3V 165.89MHZ 432P
Packaging: Bulk
Package / Case: 304-BGA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2756 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+12671.71 грн
Мінімальне замовлення: 2
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KD82750PB-25 INTLS03387-1.pdf?t.download=true&u=5oefqw
KD82750PB-25
Виробник: Intel
Description: CONSUMER CIRCUIT, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-BQFP
Mounting Type: Surface Mount
Function: Processor
Voltage - Supply: 4.5V ~ 5.5V
Applications: Video Display
Standards: DVI 1.0
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Active
Control Interface: Serial
на замовлення 2063 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+14613.17 грн
Мінімальне замовлення: 2
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KU82307-25 INTLS05014-1.pdf?t.download=true&u=5oefqw
KU82307-25
Виробник: Intel
Description: DMA CONTROLLER, CMOS, PQFP132
Packaging: Bulk
Package / Case: 132-QFP Bumpered
Function: Controller
Interface: Bus
Operating Temperature: 0°C ~ 70°C (TC)
Voltage - Supply: 4.75V ~ 5.25V
Current - Supply: 180mA
Supplier Device Package: 132-QFP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 912 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+5080.12 грн
Мінімальне замовлення: 5
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EP2S130F1020C5NRB
EP2S130F1020C5NRB
Виробник: Intel
Description: IC FPGA 742 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.15V ~ 1.25V
Number of Logic Elements/Cells: 132540
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 6627
Part Status: Obsolete
Number of I/O: 742
DigiKey Programmable: Not Verified
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1SX165HN1F43E2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HN1F43E2VG
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HU1F50I2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU1F50I2VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HN3F43E3VG
1SX165HN3F43E3VG
Виробник: Intel
Description: IC FPGA STRATIX 10 1760FBGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA (42.5x42.5)
Architecture: MCU, FPGA
Part Status: Active
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1SX165HU1F50E2VG Intel%C2%AE%20Stratix%C2%AE%2010%20GX_SX%20Device%20Overview.pdf
1SX165HU1F50E2VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 1650K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
Part Status: Active
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