| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
|---|---|---|---|---|---|---|---|
 |
EPM570ZM256I8N | Intel |
 Description: IC CPLD 440MC 9NS 256MBGAPackaging: Tray Package / Case: 256-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: -40°C ~ 100°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 256-MBGA (11x11) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Number of I/O: 160 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 176 шт В кошику од. на суму грн. | ||
| PA28F008SA85 | Intel |
Description: IC FLASH 8MBIT 85NS 44PSOP Packaging: Bulk Package / Case: 44-PSOP Mounting Type: Surface Mount Memory Size: 8Mbit Memory Type: Non-Volatile Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Technology: FLASH Memory Format: FLASH Write Cycle Time - Word, Page: 85ns Memory Interface: Parallel Access Time: 85 ns Memory Organization: 1M x 8 DigiKey Programmable: Not Verified |
на замовлення 1160 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
1ST040EH3F35E3VG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
1ST040EH3F35I3VG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
1ST040EH3F35E3XG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
1ST040EH2F35E2VG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
1ST040EH1F35E2VG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.77V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
|
|
1ST040EH3F35I3XG | Intel |
Description: IC FPGA STRATIX10TX 1152FBGA Packaging: Tray Package / Case: 1152-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.97V Number of Logic Elements/Cells: 378000 Supplier Device Package: 1152-FBGA (35x35) Total RAM Bits: 31457280 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
| EPF8820ABC225-4 | Intel |
Description: IC FPGA 152 I/O 225BGA Packaging: Tray Package / Case: 225-BGA Mounting Type: Surface Mount Number of Gates: 8000 Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.75V ~ 5.25V Number of Logic Elements/Cells: 672 Supplier Device Package: 225-BGA (19x19) Number of LABs/CLBs: 84 Number of I/O: 152 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||
| AGIB022R29A2E3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A2E3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2E2V | Intel |
Description: IC Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2I3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A1E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2E1VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2E1V | Intel |
Description: IC Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A1E2V | Intel |
Description: IC Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A2E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A2E2V | Intel |
Description: IC Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A2I3V | Intel |
Description: IC FPGA AGILEX-I 2957BGA Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2I2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A2I2V | Intel |
Description: IC Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: -40°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A1E1VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB022R29A1E1V | Intel |
Description: IC Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.2M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A2E1VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A1E2VB | Intel |
Description: IC FPGA AGILEX-I 2957BGA Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| AGIB027R29A1E2V | Intel |
Description: IC Speed: 1.4GHz Package / Case: 2957-BFBGA Exposed Pad Packaging: Tray Architecture: MPU, FPGA Supplier Device Package: 2957-BGA (56x45) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Primary Attributes: FPGA - 2.7M Logic Elements Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Operating Temperature: 0°C ~ 100°C (TJ) RAM Size: 256KB |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | |||
| EE80C186XL20 | Intel |
Description: IC MPU I186 20MHZ 68PLCC Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Math Engine; 80C187 Number of Cores/Bus Width: 1 Core, 16-Bit Supplier Device Package: 68-PLCC Voltage - I/O: 5V Core Processor: 80C186 Operating Temperature: 0°C ~ 70°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 68-LCC (J-Lead) Packaging: Tube |
на замовлення 253 шт: термін постачання 21-31 дні (днів) |
|
|||
| DJLXP730LE.A1 | Intel |
Description: LXP730 - MULTI-RATE DSL FRAMER Packaging: Bulk |
на замовлення 1370 шт: термін постачання 21-31 дні (днів) |
|
|||
| UG80960HD8016 | Intel |
Description: RISC MICROCONTROLLER, 32BIT, I96 Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 968 шт: термін постачання 21-31 дні (днів) |
|
|||
| 5AGXBA1D6F27C6G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
 |
5AGXBA1D6F31C6G | Intel |
Description: IC FPGA 384 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
| 5AGXMA1D6F27C6G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
| 5AGXBA1D4F27C5G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
|
|
5AGXMA1D6F31C6G | Intel |
Description: IC FPGA 416 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
|
|
5AGXBA1D4F31C5G | Intel |
Description: IC FPGA 384 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
| 5AGXMA1D4F27C5G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
| 5AGXBA1D4F27C4G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
| 5AGXBA1D4F27I5G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
|
|
5AGXMA1D4F31C5G | Intel |
Description: IC FPGA 416 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
 |
5AGXBA1D4F31C4G | Intel |
Description: IC FPGA 384 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
|
|
5AGXBA1D4F31I5G | Intel |
Description: IC FPGA 384 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
| 5AGXMA1D4F27I5G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
|
|
5AGXMA1D4F31C4G | Intel |
Description: IC FPGA 416 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
|
|
5AGXMA1D4F31I5G | Intel |
Description: IC FPGA 416 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
 |
10AX016E4F29E3SG | Intel |
Description: IC FPGA 288 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 160000 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 61510 Total RAM Bits: 10086400 Number of I/O: 288 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
| 5AGXMA1D4F27I3G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 75000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
|
|
5AGXBA3D6F31C6G | Intel |
Description: IC FPGA 384 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 156000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 7362 Total RAM Bits: 11746304 Number of I/O: 384 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
| 5AGXMA3D6F27C6G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 156000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 7362 Total RAM Bits: 11746304 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
|
|
5AGXMA1D4F31I3G | Intel |
Description: IC FPGA 416 I/O 896FBGA Packaging: Tray Package / Case: 896-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.12V ~ 1.18V Number of Logic Elements/Cells: 75000 Supplier Device Package: 896-FBGA (31x31) Number of LABs/CLBs: 3537 Total RAM Bits: 8666112 Number of I/O: 416 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 27 шт В кошику од. на суму грн. | ||
| 5AGXBA5D6F27C6G | Intel |
Description: IC FPGA 336 I/O 672FBGA Packaging: Tray Package / Case: 672-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 190000 Supplier Device Package: 672-FBGA (27x27) Number of LABs/CLBs: 8962 Total RAM Bits: 13284352 Number of I/O: 336 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||
 |
10AX022C4U19I3SG | Intel |
Description: IC FPGA 240 I/O 484UBGA Packaging: Tray Package / Case: 484-BFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.98V Number of Logic Elements/Cells: 220000 Supplier Device Package: 484-UBGA (19x19) Number of LABs/CLBs: 80330 Total RAM Bits: 13752320 Number of I/O: 240 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||
| QG82945GSE S LB2R | Intel |
Description: CHIPSETS 945GSE EXPRESS CHIP SET Packaging: Bulk Package / Case: 998-BGA, FCBGA Mounting Type: Surface Mount Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V Controller Type: Graphics and Memory Controller Supplier Device Package: 998-FCBGA (27x27) |
на замовлення 810273 шт: термін постачання 21-31 дні (днів) |
|
|||
| PR21555BB | Intel |
Description: NON-TRANSPARENT PCI-TO PCI BRIDG Packaging: Bulk Package / Case: 304-BBGA Mounting Type: Surface Mount Interface: JTAG, PCI Voltage - Supply: 3V ~ 3.6V Applications: PCI-to-PCI Bridge Supplier Device Package: 304-PBGA (31x31) |
на замовлення 14384 шт: термін постачання 21-31 дні (днів) |
|
|||
 |
5AGXBB1D6F40C6G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 300000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 14151 Total RAM Bits: 17358848 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||
|
|
5AGXMB1G6F40C6G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 300000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 14151 Total RAM Bits: 17358848 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||
|
|
5AGXBB1D4F40C5G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 300000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 14151 Total RAM Bits: 17358848 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||
|
|
5AGXBB3D6F40C6G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 362000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 17110 Total RAM Bits: 19822592 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. | ||
|
|
5AGXMB1G4F40C5G | Intel |
Description: IC FPGA 704 I/O 1517FBGA Packaging: Tray Package / Case: 1517-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 300000 Supplier Device Package: 1517-FBGA, FC (40x40) Number of LABs/CLBs: 14151 Total RAM Bits: 17358848 Number of I/O: 704 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 21 шт В кошику од. на суму грн. |
| EPM570ZM256I8N |
|
Виробник: Intel
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 256MBGA
Packaging: Tray
Package / Case: 256-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: -40°C ~ 100°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 256-MBGA (11x11)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Number of I/O: 160
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 176 шт
В кошику
од. на суму грн.
| PA28F008SA85 |
|
Виробник: Intel
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 8MBIT 85NS 44PSOP
Packaging: Bulk
Package / Case: 44-PSOP
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH
Memory Format: FLASH
Write Cycle Time - Word, Page: 85ns
Memory Interface: Parallel
Access Time: 85 ns
Memory Organization: 1M x 8
DigiKey Programmable: Not Verified
на замовлення 1160 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 54+ | 405.81 грн |
| 1ST040EH3F35E3VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 1ST040EH3F35I3VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 1ST040EH3F35E3XG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 1ST040EH2F35E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 1ST040EH1F35E2VG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 1ST040EH3F35I3XG |
|
Виробник: Intel
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX10TX 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.97V
Number of Logic Elements/Cells: 378000
Supplier Device Package: 1152-FBGA (35x35)
Total RAM Bits: 31457280
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| EPF8820ABC225-4 |
|
Виробник: Intel
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
Description: IC FPGA 152 I/O 225BGA
Packaging: Tray
Package / Case: 225-BGA
Mounting Type: Surface Mount
Number of Gates: 8000
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.75V ~ 5.25V
Number of Logic Elements/Cells: 672
Supplier Device Package: 225-BGA (19x19)
Number of LABs/CLBs: 84
Number of I/O: 152
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| AGIB022R29A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
Description: IC FPGA AGILEX-I 2957BGA
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A2E3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2E2V |
Виробник: Intel
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2E1V |
Виробник: Intel
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A1E2V |
Виробник: Intel
Description: IC
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A2E2V |
Виробник: Intel
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Description: IC FPGA AGILEX-I 2957BGA
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A2I2V |
Виробник: Intel
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: -40°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB022R29A1E1V |
Виробник: Intel
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.2M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Description: IC FPGA AGILEX-I 2957BGA
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| AGIB027R29A1E2V |
Виробник: Intel
Description: IC
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
Description: IC
Speed: 1.4GHz
Package / Case: 2957-BFBGA Exposed Pad
Packaging: Tray
Architecture: MPU, FPGA
Supplier Device Package: 2957-BGA (56x45)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Primary Attributes: FPGA - 2.7M Logic Elements
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Operating Temperature: 0°C ~ 100°C (TJ)
RAM Size: 256KB
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| EE80C186XL20 |
Виробник: Intel
Description: IC MPU I186 20MHZ 68PLCC
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Math Engine; 80C187
Number of Cores/Bus Width: 1 Core, 16-Bit
Supplier Device Package: 68-PLCC
Voltage - I/O: 5V
Core Processor: 80C186
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
Description: IC MPU I186 20MHZ 68PLCC
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Math Engine; 80C187
Number of Cores/Bus Width: 1 Core, 16-Bit
Supplier Device Package: 68-PLCC
Voltage - I/O: 5V
Core Processor: 80C186
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 68-LCC (J-Lead)
Packaging: Tube
на замовлення 253 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 12+ | 842.94 грн |
| DJLXP730LE.A1 |
на замовлення 1370 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 31+ | 720.87 грн |
| UG80960HD8016 |
|
Виробник: Intel
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: RISC MICROCONTROLLER, 32BIT, I96
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 968 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5890.74 грн |
| 5AGXBA1D6F27C6G |
|
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXBA1D6F31C6G |
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXMA1D6F27C6G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F27C5G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXMA1D6F31C6G |
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F31C5G |
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F27C5G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F27C4G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F27I5G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F31C5G |
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F31C4G |
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXBA1D4F31I5G |
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F27I5G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F31C4G |
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F31I5G |
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 10AX016E4F29E3SG |
|
Виробник: Intel
Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
Description: IC FPGA 288 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 160000
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 61510
Total RAM Bits: 10086400
Number of I/O: 288
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F27I3G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXBA3D6F31C6G |
Виробник: Intel
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
Description: IC FPGA 384 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 384
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXMA3D6F27C6G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 156000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 7362
Total RAM Bits: 11746304
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 5AGXMA1D4F31I3G |
Виробник: Intel
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
Description: IC FPGA 416 I/O 896FBGA
Packaging: Tray
Package / Case: 896-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.12V ~ 1.18V
Number of Logic Elements/Cells: 75000
Supplier Device Package: 896-FBGA (31x31)
Number of LABs/CLBs: 3537
Total RAM Bits: 8666112
Number of I/O: 416
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 27 шт
В кошику
од. на суму грн.
| 5AGXBA5D6F27C6G |
Виробник: Intel
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
Description: IC FPGA 336 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 190000
Supplier Device Package: 672-FBGA (27x27)
Number of LABs/CLBs: 8962
Total RAM Bits: 13284352
Number of I/O: 336
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| 10AX022C4U19I3SG |
|
Виробник: Intel
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484UBGA
Packaging: Tray
Package / Case: 484-BFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.98V
Number of Logic Elements/Cells: 220000
Supplier Device Package: 484-UBGA (19x19)
Number of LABs/CLBs: 80330
Total RAM Bits: 13752320
Number of I/O: 240
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3 шт
В кошику
од. на суму грн.
| QG82945GSE S LB2R |
|
Виробник: Intel
Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
Description: CHIPSETS 945GSE EXPRESS CHIP SET
Packaging: Bulk
Package / Case: 998-BGA, FCBGA
Mounting Type: Surface Mount
Voltage - Supply: 1V ~ 1.1V, 1.425V ~ 1.575V
Controller Type: Graphics and Memory Controller
Supplier Device Package: 998-FCBGA (27x27)
на замовлення 810273 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 13+ | 1765.25 грн |
| PR21555BB |
|
Виробник: Intel
Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
Description: NON-TRANSPARENT PCI-TO PCI BRIDG
Packaging: Bulk
Package / Case: 304-BBGA
Mounting Type: Surface Mount
Interface: JTAG, PCI
Voltage - Supply: 3V ~ 3.6V
Applications: PCI-to-PCI Bridge
Supplier Device Package: 304-PBGA (31x31)
на замовлення 14384 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 4666.92 грн |
| 5AGXBB1D6F40C6G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 5AGXMB1G6F40C6G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 5AGXBB1D4F40C5G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 5AGXBB3D6F40C6G |
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 362000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 17110
Total RAM Bits: 19822592
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.
| 5AGXMB1G4F40C5G |
|
Виробник: Intel
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
Description: IC FPGA 704 I/O 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 300000
Supplier Device Package: 1517-FBGA, FC (40x40)
Number of LABs/CLBs: 14151
Total RAM Bits: 17358848
Number of I/O: 704
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 21 шт
В кошику
од. на суму грн.