Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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10AS066K2F40I1HG | Intel |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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10AS066H2F34E1HG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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10AS066K1F40I1HG | Intel |
![]() Packaging: Tray Package / Case: 1517-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 660K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1517-FCBGA (40x40) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
DK-DEV-1SGX-H-0ES | Intel |
Description: DEV KIT STRATIX 10 ENG SAMPLE Packaging: Box For Use With/Related Products: 1SG280H Type: FPGA Contents: Board(s) Platform: Stratix 10 GX FPGA PCIe Card Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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10AS027H4F35I3LG | Intel |
![]() Packaging: Tray Package / Case: 1152-BBGA, FCBGA Speed: 1.5GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Primary Attributes: FPGA - 270K Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, POR, WDT Supplier Device Package: 1152-FBGA, FC (35x35) Architecture: MCU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
QSHDC-QSPI-A | Intel |
![]() Packaging: Bulk Function: FLASH Type: Memory Contents: Board(s) Utilized IC / Part: MT25QU01GBBA8E12- 0SIT Platform: Arria Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
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EPM7064BFC49-5 | Intel |
![]() Packaging: Tray Package / Case: 49-LFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 5 ns Supplier Device Package: 49-UBGA (7x7) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 2.375V ~ 2.625V Part Status: Obsolete Number of I/O: 41 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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EPM7064TC44-7YY | Intel |
![]() Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 7.5 ns Supplier Device Package: 44-TQFP (10x10) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
5SGXEF40I2LAB | Intel |
Description: IC FPGA I/O FBGA Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
5SGXEF40I2LAA | Intel |
Description: IC FPGA I/O FBGA Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
5SGXEF40I2LNAC | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
5SGXEF40I2LNAD | Intel |
Description: IC FPGA STRATIX V GX FLIP CHIP Packaging: Tray Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2E3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2I3V | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A1I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A1E2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A1E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2I2VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2I3E | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2E1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A1I1VB | Intel |
Description: IC FPGA AGILEX-I 3948FBGA Packaging: Tray Package / Case: 3948-BFBGA Exposed Pad Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 4.047M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Supplier Device Package: 3948-BGA (56x56) Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGIC040R39A2E2VR0 | Intel |
![]() Packaging: Tray Part Status: Active DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
F28F020-150 | Intel |
Description: FLASH NOR 2MB TSOP REVERSE 150ns Packaging: Tray Mounting Type: Surface Mount Memory Size: 2Mbit Memory Type: Non-Volatile Voltage - Supply: 12V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 32-TSOP REVERSE Part Status: Active Memory Interface: Parallel Access Time: 70 ns Memory Organization: 256K x 8 DigiKey Programmable: Not Verified |
на замовлення 3372 шт: термін постачання 21-31 дні (днів) |
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RD48F2100W0YTQ0 | Intel |
Description: STRATAFLASH EMBEDDED MEMORY Packaging: Bulk Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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EP2AGX45DF29I3NAD | Intel |
Description: IC FPGA 364 I/O 780FBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.87V ~ 0.93V Number of Logic Elements/Cells: 42959 Supplier Device Package: 780-FBGA (29x29) Number of LABs/CLBs: 1805 Total RAM Bits: 3517440 Part Status: Obsolete Number of I/O: 364 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
NE80546RE072256 | Intel |
![]() Packaging: Bulk Package / Case: 478-BFCPGA Mounting Type: Through Hole Speed: 2.8GHz Operating Temperature: 67°C (TC) Core Processor: Intel® Celeron® D Voltage - I/O: 1.25V, 1.4V Supplier Device Package: 478-FCPGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit Part Status: Active |
на замовлення 3249 шт: термін постачання 21-31 дні (днів) |
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D2912-A | Intel |
![]() Packaging: Bulk Package / Case: 16-CDIP Mounting Type: Through Hole Type: PCM Codec Filter Supplier Device Package: 16-CDIP Part Status: Active DigiKey Programmable: Not Verified |
на замовлення 84 шт: термін постачання 21-31 дні (днів) |
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5CGXFC4C6F23I7N | Intel |
![]() Packaging: Tray Package / Case: 484-BGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 1.07V ~ 1.13V Number of Logic Elements/Cells: 50000 Supplier Device Package: 484-FBGA (23x23) Number of LABs/CLBs: 18868 Total RAM Bits: 2862080 Part Status: Active Number of I/O: 240 DigiKey Programmable: Not Verified |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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EPM570ZM100C6N | Intel |
![]() Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Programmable Type: In System Programmable Number of Macrocells: 440 Operating Temperature: 0°C ~ 85°C (TJ) Delay Time tpd(1) Max: 9 ns Supplier Device Package: 100-MBGA (6x6) Number of Logic Elements/Blocks: 570 Voltage Supply - Internal: 1.71V ~ 1.89V Part Status: Active Number of I/O: 76 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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EPM7064QC100-10YY | Intel |
![]() Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Programmable Type: EE PLD Number of Gates: 1250 Number of Macrocells: 64 Operating Temperature: 0°C ~ 70°C (TA) Delay Time tpd(1) Max: 10 ns Supplier Device Package: 100-PQFP (20x14) Number of Logic Elements/Blocks: 4 Voltage Supply - Internal: 4.75V ~ 5.25V Part Status: Obsolete Number of I/O: 68 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
AGFB012R24B2I2V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2I1V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C3E3V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E4X | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2E2V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E1V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2E4X | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C3I3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C3E4X | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2E4F | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2I3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B3E3E | Intel |
Description: IC FPGA AGILEX-F 2486FBGA Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2I3V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2E3V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2I2V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E4F | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2I3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C3E3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E3VAA | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B1E1V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B3I3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E3V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B1I1V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B2E3E | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24B3E4X | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C3I3V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: -40°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||
AGFB012R24C2E2V | Intel |
![]() Packaging: Tray Speed: 1.4GHz RAM Size: 256KB Operating Temperature: 0°C ~ 100°C (TJ) Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point Primary Attributes: FPGA - 1.2M Logic Elements Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Architecture: MPU, FPGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
10AS066K2F40I1HG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
10AS066H2F34E1HG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
10AS066K1F40I1HG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1517FBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 660K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1517-FCBGA (40x40)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DK-DEV-1SGX-H-0ES |
Виробник: Intel
Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
Description: DEV KIT STRATIX 10 ENG SAMPLE
Packaging: Box
For Use With/Related Products: 1SG280H
Type: FPGA
Contents: Board(s)
Platform: Stratix 10 GX FPGA PCIe Card
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
10AS027H4F35I3LG |
![]() |
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
Description: IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 1152-FBGA, FC (35x35)
Architecture: MCU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
QSHDC-QSPI-A |
![]() |
Виробник: Intel
Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
Description: ARRIA 10 QSPI DAUGHTER CARD
Packaging: Bulk
Function: FLASH
Type: Memory
Contents: Board(s)
Utilized IC / Part: MT25QU01GBBA8E12- 0SIT
Platform: Arria
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
EPM7064BFC49-5 |
![]() |
Виробник: Intel
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 5NS 49UBGA
Packaging: Tray
Package / Case: 49-LFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 5 ns
Supplier Device Package: 49-UBGA (7x7)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 2.375V ~ 2.625V
Part Status: Obsolete
Number of I/O: 41
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
EPM7064TC44-7YY |
![]() |
Виробник: Intel
Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 7.5NS 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 44-TQFP (10x10)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
5SGXEF40I2LAB |
Виробник: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
5SGXEF40I2LAA |
Виробник: Intel
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA I/O FBGA
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
5SGXEF40I2LNAC |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
5SGXEF40I2LNAD |
Виробник: Intel
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC FPGA STRATIX V GX FLIP CHIP
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
AGIC040R39A2E3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGIC040R39A2I3V |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGIC040R39A2E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGIC040R39A2I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGIC040R39A1I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A1E2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A1E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A2I2VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A2I3E |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A2E1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A1I1VB |
Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Package / Case: 3948-BFBGA Exposed Pad
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 4.047M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 3948-BGA (56x56)
Architecture: MPU, FPGA
Part Status: Active
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AGIC040R39A2E2VR0 |
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Виробник: Intel
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC FPGA AGILEX-I 3948FBGA
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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F28F020-150 |
Виробник: Intel
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Description: FLASH NOR 2MB TSOP REVERSE 150ns
Packaging: Tray
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Voltage - Supply: 12V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 32-TSOP REVERSE
Part Status: Active
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
на замовлення 3372 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
100+ | 218.85 грн |
300+ | 206.91 грн |
500+ | 203.08 грн |
1000+ | 186.99 грн |
RD48F2100W0YTQ0 |
Виробник: Intel
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
Description: STRATAFLASH EMBEDDED MEMORY
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
34+ | 719.41 грн |
EP2AGX45DF29I3NAD |
Виробник: Intel
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
Description: IC FPGA 364 I/O 780FBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 42959
Supplier Device Package: 780-FBGA (29x29)
Number of LABs/CLBs: 1805
Total RAM Bits: 3517440
Part Status: Obsolete
Number of I/O: 364
DigiKey Programmable: Not Verified
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NE80546RE072256 |
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Виробник: Intel
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
Description: IC MPU INTEL CEL 2.8GHZ 478FCPGA
Packaging: Bulk
Package / Case: 478-BFCPGA
Mounting Type: Through Hole
Speed: 2.8GHz
Operating Temperature: 67°C (TC)
Core Processor: Intel® Celeron® D
Voltage - I/O: 1.25V, 1.4V
Supplier Device Package: 478-FCPGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
Part Status: Active
на замовлення 3249 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6+ | 3925.07 грн |
D2912-A |
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Виробник: Intel
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC PCM CODEC FILTER 16CDIP
Packaging: Bulk
Package / Case: 16-CDIP
Mounting Type: Through Hole
Type: PCM Codec Filter
Supplier Device Package: 16-CDIP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 84 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 3218.25 грн |
5CGXFC4C6F23I7N |
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Виробник: Intel
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
Description: IC FPGA 240 I/O 484FBGA
Packaging: Tray
Package / Case: 484-BGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.07V ~ 1.13V
Number of Logic Elements/Cells: 50000
Supplier Device Package: 484-FBGA (23x23)
Number of LABs/CLBs: 18868
Total RAM Bits: 2862080
Part Status: Active
Number of I/O: 240
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 20154.67 грн |
EPM570ZM100C6N |
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Виробник: Intel
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
Description: IC CPLD 440MC 9NS 100MBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 440
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 9 ns
Supplier Device Package: 100-MBGA (6x6)
Number of Logic Elements/Blocks: 570
Voltage Supply - Internal: 1.71V ~ 1.89V
Part Status: Active
Number of I/O: 76
DigiKey Programmable: Not Verified
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EPM7064QC100-10YY |
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Виробник: Intel
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC CPLD 64MC 10NS 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 100-PQFP (20x14)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 68
DigiKey Programmable: Not Verified
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AGFB012R24B2I2V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2I1V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C3E3V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2E4X |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24B2E2V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2E1V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24B2E4X |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C3I3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C3E4X |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B2E4F |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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од. на суму грн.
AGFB012R24B2I3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B3E3E |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B2I3V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B2E3V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2I2V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2E4F |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2E3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2I3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C3E3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2E3VAA |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B1E1V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B3I3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24C2E3V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B1I1V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGFB012R24B2E3E |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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В кошику
од. на суму грн.
AGFB012R24B3E4X |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2486FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
AGFB012R24C3I3V |
![]() |
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2E2V |
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Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.