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AGFB012R24C2E2VAA Intel Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2I3V Intel Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2I1VB Intel Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Part Status: Active
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EPM7064LC68-7YY Intel MAX_7000_Ver6.7_9-12-05.pdf Description: IC CPLD 64MC 7.5NS 68PLCC
Packaging: Tray
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 68-PLCC (24x24)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
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RK80546KF1001M Intel Description: PRESCOTT CELERON PROCESSOR
Packaging: Bulk
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
4+5768.63 грн
Мінімальне замовлення: 4
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FWIXP425ABC Intel INTLS05369-1.pdf?t.download=true&u=5oefqw Description: IC MPU IXP425 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 12183 шт:
термін постачання 21-31 дні (днів)
10+2501.23 грн
Мінімальне замовлення: 10
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FWIXP425ABB Intel INTLS05369-1.pdf?t.download=true&u=5oefqw Description: IC MPU IXP425 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 117 шт:
термін постачання 21-31 дні (днів)
13+1869.36 грн
Мінімальне замовлення: 13
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EWIXP455BAB Intel INTLS05373-1.pdf?t.download=true&u=5oefqw Description: IC MPU IXP455 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, MD5, RNG, SHA1
Part Status: Active
на замовлення 44785 шт:
термін постачання 21-31 дні (днів)
11+2281.59 грн
Мінімальне замовлення: 11
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GWIXP455BAD Intel INTLS05373-1.pdf?t.download=true&u=5oefqw Description: IC MPU IXP455 533MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, MD5, RNG, SHA1
Part Status: Active
на замовлення 3907 шт:
термін постачання 21-31 дні (днів)
6+4232.12 грн
Мінімальне замовлення: 6
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FAGD1652248BA FAGD1652248BA Intel INTLS00947-1.pdf?t.download=true&u=5oefqw Description: CLOCK RECOVERY CIRCUIT, 1-FUNC
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Output: Clock, CML
Frequency - Max: 2.488GHz
Input: CML, LVTTL
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.97V ~ 3.6V
Main Purpose: Gigabit Ethernet, SONET/SDH, STM
Ratio - Input:Output: 4:7
Differential - Input:Output: Yes/Yes
Supplier Device Package: 48-TQFP-EDQUAD (7x7)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
на замовлення 1273 шт:
термін постачання 21-31 дні (днів)
7+3201.54 грн
Мінімальне замовлення: 7
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EP20K1500EBC652-2 EP20K1500EBC652-2 Intel 20K_Family_DS.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500EFC33-1 EP20K1500EFC33-1 Intel 20K_Family_DS.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-2 EP20K1500EFC33-2 Intel 20K_Family_DS.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-2X EP20K1500EFC33-2X Intel 20K_Family_DS.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-3 EP20K1500EFC33-3 Intel 20K_Family_DS.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500CB652C7 Intel Apex_20KC_Ver1.1_Apr_2001.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C7ES Intel Apex_20KC_Ver1.1_Apr_2001.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C8 Intel Apex_20KC_Ver1.1_Apr_2001.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C8ES Intel Apex_20KC_Ver1.1_Apr_2001.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C9 Intel Apex_20KC_Ver1.1_Apr_2001.pdf Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CF33C7 EP20K1500CF33C7 Intel Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C7ES EP20K1500CF33C7ES Intel Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C8 EP20K1500CF33C8 Intel Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C8ES EP20K1500CF33C8ES Intel Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C9 EP20K1500CF33C9 Intel Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EFC1020-1X EP20K1500EFC1020-1X Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC1020-2X EP20K1500EFC1020-2X Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EGC984-1 Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EGC984-2 Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EGC984-3 Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EXXC Intel Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500XXC Intel Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EPM1270T144C5NAA Intel Description: IC CPLD 980MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
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M30800SAGP-BL#U5 Intel m32c80-group-datasheet?language=en Description: M1SINGLE-CH16-BCMMICROCOMPUTM1SE
Packaging: Tray
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5AGZME5H2F35I3L 5AGZME5H2F35I3L Intel Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
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NU80579EZ009C Intel Intel-EP80579-Integrated-Processor-with-Intel-QuickAssist-Technology-600-MHz Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
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AT80574JH046NT S LBBT-CONS Intel Description: AT805INTXEPROCESSL5408
Packaging: Tape & Box (TB)
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EP20K100EF324I2XGZ Intel APEX_20K_Ver5.1_Mar2004.pdf Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
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10AS027E3F27E2LG 10AS027E3F27E2LG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
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EPM570XXA Intel Description: IC MAX IIZ CPLD 570
Packaging: Tray
DigiKey Programmable: Not Verified
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10AS027E2F27E1HG 10AS027E2F27E1HG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
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1SG280HH3F55E3VG 1SG280HH3F55E3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E3VGS3 1SG280HH3F55E3VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E3VGS3 1SX280HH3F55E3VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E3VG 1SX280HH3F55E3VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HU3F50E3VG 1SX280HU3F50E3VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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1SG280HH3F55E2VGS3 1SG280HH3F55E2VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55I3VG 1SG280HH3F55I3VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E2VG 1SG280HH3F55E2VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E2VG 1SX280HH3F55E2VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55I3VG 1SX280HH3F55I3VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E2VGS3 1SX280HH3F55E2VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280LN3F43I3VG 1SX280LN3F43I3VG Intel Stratix%2010%20GX,SX%20Device%20Overview.pdf Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
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1SG280HH3F55E1VG 1SG280HH3F55E1VG Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E1VGS3 1SG280HH3F55E1VGS3 Intel 10_GX_SX_Device_Overview.pdf Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E1VG 1SX280HH3F55E1VG Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E1VGS3 1SX280HH3F55E1VGS3 Intel Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HU3F50I3VG 1SX280HU3F50I3VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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1SX280HU3F50E2VG 1SX280HU3F50E2VG Intel Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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10AX032E3F27I2SG 10AX032E3F27I2SG Intel Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
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AGFB012R24C2E2VAA Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2I3V Intel%C2%AEAgilex%E2%84%A27_FPGAs_and_SoCs_Device_Datasheet.pdf
Виробник: Intel
Description: IC FPGA AGILEX-F 2340FBGA
Packaging: Tray
Speed: 1.4GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary Attributes: FPGA - 1.2M Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Architecture: MPU, FPGA
Part Status: Active
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AGFB012R24C2I1VB
Виробник: Intel
Description: IC FPGA AGILEX-F 2340BGA
Packaging: Tray
Part Status: Active
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EPM7064LC68-7YY MAX_7000_Ver6.7_9-12-05.pdf
Виробник: Intel
Description: IC CPLD 64MC 7.5NS 68PLCC
Packaging: Tray
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Programmable Type: EE PLD
Number of Gates: 1250
Number of Macrocells: 64
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 7.5 ns
Supplier Device Package: 68-PLCC (24x24)
Number of Logic Elements/Blocks: 4
Voltage Supply - Internal: 4.75V ~ 5.25V
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
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RK80546KF1001M
Виробник: Intel
Description: PRESCOTT CELERON PROCESSOR
Packaging: Bulk
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5768.63 грн
Мінімальне замовлення: 4
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FWIXP425ABC INTLS05369-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: IC MPU IXP425 400MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 12183 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+2501.23 грн
Мінімальне замовлення: 10
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FWIXP425ABB INTLS05369-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: IC MPU IXP425 266MHZ PBGA492
Packaging: Bulk
Package / Case: 492-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP42X
Voltage - I/O: 3.3V
Supplier Device Package: 492-PBGA (35x35)
Ethernet: 10/100Mbps (2)
USB: USB 1.1 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, DES, MD5, SHA-1
Part Status: Active
на замовлення 117 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13+1869.36 грн
Мінімальне замовлення: 13
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EWIXP455BAB INTLS05373-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: IC MPU IXP455 266MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, MD5, RNG, SHA1
Part Status: Active
на замовлення 44785 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
11+2281.59 грн
Мінімальне замовлення: 11
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GWIXP455BAD INTLS05373-1.pdf?t.download=true&u=5oefqw
Виробник: Intel
Description: IC MPU IXP455 533MHZ PBGA544
Packaging: Bulk
Package / Case: 544-BBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: Intel® IXP45X
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 544-PBGA (35x35)
Ethernet: Mll (3), SMII (3)
USB: USB 1.1 (1), USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: 3DES, AES, MD5, RNG, SHA1
Part Status: Active
на замовлення 3907 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+4232.12 грн
Мінімальне замовлення: 6
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FAGD1652248BA INTLS00947-1.pdf?t.download=true&u=5oefqw
FAGD1652248BA
Виробник: Intel
Description: CLOCK RECOVERY CIRCUIT, 1-FUNC
Packaging: Bulk
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Output: Clock, CML
Frequency - Max: 2.488GHz
Input: CML, LVTTL
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.97V ~ 3.6V
Main Purpose: Gigabit Ethernet, SONET/SDH, STM
Ratio - Input:Output: 4:7
Differential - Input:Output: Yes/Yes
Supplier Device Package: 48-TQFP-EDQUAD (7x7)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
на замовлення 1273 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+3201.54 грн
Мінімальне замовлення: 7
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EP20K1500EBC652-2 20K_Family_DS.pdf
EP20K1500EBC652-2
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500EFC33-1 20K_Family_DS.pdf
EP20K1500EFC33-1
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-2 20K_Family_DS.pdf
EP20K1500EFC33-2
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-2X 20K_Family_DS.pdf
EP20K1500EFC33-2X
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC33-3 20K_Family_DS.pdf
EP20K1500EFC33-3
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500CB652C7 Apex_20KC_Ver1.1_Apr_2001.pdf
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C7ES Apex_20KC_Ver1.1_Apr_2001.pdf
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C8 Apex_20KC_Ver1.1_Apr_2001.pdf
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C8ES Apex_20KC_Ver1.1_Apr_2001.pdf
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CB652C9 Apex_20KC_Ver1.1_Apr_2001.pdf
Виробник: Intel
Description: IC FPGA 488 I/O 652BGA
Packaging: Tray
Package / Case: 652-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 652-BGA (45x45)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 488
DigiKey Programmable: Not Verified
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EP20K1500CF33C7
EP20K1500CF33C7
Виробник: Intel
Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C7ES
EP20K1500CF33C7ES
Виробник: Intel
Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C8
EP20K1500CF33C8
Виробник: Intel
Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C8ES
EP20K1500CF33C8ES
Виробник: Intel
Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500CF33C9
EP20K1500CF33C9
Виробник: Intel
Description: IC FPGA 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 2.375V ~ 2.625V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EFC1020-1X APEX_20K_Ver5.1_Mar2004.pdf
EP20K1500EFC1020-1X
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EFC1020-2X APEX_20K_Ver5.1_Mar2004.pdf
EP20K1500EFC1020-2X
Виробник: Intel
Description: IC FPGA 808 I/O 1020FBGA
Packaging: Tray
Package / Case: 1020-BBGA
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Supplier Device Package: 1020-FBGA (33x33)
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
Number of I/O: 808
DigiKey Programmable: Not Verified
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EP20K1500EGC984-1 APEX_20K_Ver5.1_Mar2004.pdf
Виробник: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EGC984-2 APEX_20K_Ver5.1_Mar2004.pdf
Виробник: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EGC984-3 APEX_20K_Ver5.1_Mar2004.pdf
Виробник: Intel
Description: IC FPGA
Packaging: Tray
Mounting Type: Surface Mount
Number of Gates: 2392000
Operating Temperature: 0°C ~ 85°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500EXXC
Виробник: Intel
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EP20K1500XXC
Виробник: Intel
Description: IC FPGA
Packaging: Tray
Number of Gates: 2392000
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 51840
Number of LABs/CLBs: 5184
Total RAM Bits: 442368
DigiKey Programmable: Not Verified
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EPM1270T144C5NAA
Виробник: Intel
Description: IC CPLD 980MC 10NS 144TQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Programmable Type: In System Programmable
Number of Macrocells: 980
Operating Temperature: 0°C ~ 85°C (TJ)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 144-TQFP (20x20)
Number of Logic Elements/Blocks: 1270
Voltage Supply - Internal: 2.375V ~ 2.625V, 3V ~ 3.6V
Number of I/O: 116
DigiKey Programmable: Not Verified
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M30800SAGP-BL#U5 m32c80-group-datasheet?language=en
Виробник: Intel
Description: M1SINGLE-CH16-BCMMICROCOMPUTM1SE
Packaging: Tray
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5AGZME5H2F35I3L
5AGZME5H2F35I3L
Виробник: Intel
Description: IC FPGA 150960 I/O 1152FBGA
Packaging: Tray
Package / Case: 1152-BBGA, FCBGA
Mounting Type: Surface Mount
Number of Gates: 534
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.82V ~ 0.88V
Number of Logic Elements/Cells: 603840
Supplier Device Package: 1152-FBGA (35x35)
Number of LABs/CLBs: 400000
Total RAM Bits: 34322432
Number of I/O: 150960
DigiKey Programmable: Not Verified
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NU80579EZ009C Intel-EP80579-Integrated-Processor-with-Intel-QuickAssist-Technology-600-MHz
Виробник: Intel
Description: INTEL EP80579 INTEGRATED PROCESS
Packaging: Tray
Package / Case: 1088-BGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 95°C (TC)
Core Processor: Intel® EP80579 Integrated Processor
Supplier Device Package: 1088-FCBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
SATA: SATA (2)
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AT80574JH046NT S LBBT-CONS
Виробник: Intel
Description: AT805INTXEPROCESSL5408
Packaging: Tape & Box (TB)
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EP20K100EF324I2XGZ APEX_20K_Ver5.1_Mar2004.pdf
Виробник: Intel
Description: IC FPGA 246 I/O 324FBGA
Packaging: Tray
Package / Case: 324-BGA
Mounting Type: Surface Mount
Number of Gates: 263000
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 1.71V ~ 1.89V
Number of Logic Elements/Cells: 4160
Supplier Device Package: 324-FBGA (19x19)
Number of LABs/CLBs: 416
Total RAM Bits: 53248
Number of I/O: 246
DigiKey Programmable: Not Verified
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10AS027E3F27E2LG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS027E3F27E2LG
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
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EPM570XXA
Виробник: Intel
Description: IC MAX IIZ CPLD 570
Packaging: Tray
DigiKey Programmable: Not Verified
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10AS027E2F27E1HG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AS027E2F27E1HG
Виробник: Intel
Description: IC SOC CORTEX-A9 1.5GHZ 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary Attributes: FPGA - 270K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, POR, WDT
Supplier Device Package: 672-FBGA, FC (27x27)
Architecture: MCU, FPGA
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1SG280HH3F55E3VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E3VG
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E3VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E3VGS3
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E3VGS3
1SX280HH3F55E3VGS3
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E3VG
1SX280HH3F55E3VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HU3F50E3VG
1SX280HU3F50E3VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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1SG280HH3F55E2VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E2VGS3
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55I3VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55I3VG
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E2VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E2VG
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E2VG
1SX280HH3F55E2VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55I3VG
1SX280HH3F55I3VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E2VGS3
1SX280HH3F55E2VGS3
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280LN3F43I3VG Stratix%2010%20GX,SX%20Device%20Overview.pdf
1SX280LN3F43I3VG
Виробник: Intel
Description: IC SOC CORTEX-A53 1.5GHZ 1760BGA
Packaging: Tray
Package / Case: 1760-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 1760-FBGA, FC (42.5x42.5)
Architecture: MCU, FPGA
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1SG280HH3F55E1VG 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E1VG
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SG280HH3F55E1VGS3 10_GX_SX_Device_Overview.pdf
1SG280HH3F55E1VGS3
Виробник: Intel
Description: IC FPGA 1160 I/O 2912BGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Voltage - Supply: 0.77V ~ 0.97V
Number of Logic Elements/Cells: 2800000
Supplier Device Package: 2912-FBGA, FC (55x55)
Number of LABs/CLBs: 350000
Number of I/O: 1160
DigiKey Programmable: Not Verified
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1SX280HH3F55E1VG
1SX280HH3F55E1VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HH3F55E1VGS3
1SX280HH3F55E1VGS3
Виробник: Intel
Description: IC FPGA STRATIX 10 2912FBGA
Packaging: Tray
Package / Case: 2912-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2912-FBGA, FC (55x55)
Architecture: MCU, FPGA
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1SX280HU3F50I3VG
1SX280HU3F50I3VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: -40°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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1SX280HU3F50E2VG
1SX280HU3F50E2VG
Виробник: Intel
Description: IC FPGA STRATIX 10 2397FBGA
Packaging: Tray
Package / Case: 2397-BBGA, FCBGA
Speed: 1.5GHz
RAM Size: 256KB
Operating Temperature: 0°C ~ 100°C (TJ)
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Primary Attributes: FPGA - 2800K Logic Elements
Connectivity: EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Supplier Device Package: 2397-FBGA, FC (50x50)
Architecture: MCU, FPGA
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10AX032E3F27I2SG Intel%C2%AEArria%C2%AE10%20Device_Overview.pdf
10AX032E3F27I2SG
Виробник: Intel
Description: IC FPGA 240 I/O 672FBGA
Packaging: Tray
Package / Case: 672-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.87V ~ 0.93V
Number of Logic Elements/Cells: 320000
Supplier Device Package: 672-FBGA, FC (27x27)
Number of LABs/CLBs: 119900
Total RAM Bits: 21040128
Number of I/O: 240
DigiKey Programmable: Not Verified
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