Продукція > KESTER SOLDER > Всі товари виробника KESTER SOLDER (828) > Сторінка 11 з 14
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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70-1506-1710 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GMPackaging: Bulk Composition: Sn95Sb5 (95/5) Type: Solder Paste Melting Point: 450 ~ 464°F (232 ~ 240°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-1607-0504 | Kester Solder |
Description: SOLDERPASTE NO CLEAN 63/37 100GMStorage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Flux Type: No-Clean Process: Leaded Mesh Type: 3 Form: Syringe, 1.23 oz (35g), 10cc Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Dispenser Shelf Life: 6 Months Shelf Life Start: Date of Manufacture |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-1607-0520 | Kester Solder |
Description: SOLDERPASTE NO CLEAN 63/37 35GMPackaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 162 шт: термін постачання 21-31 дні (днів) |
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70-1608-0804 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 100GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 3.53 oz (100g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-1608-0820 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 35GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 67 шт: термін постачання 21-31 дні (днів) |
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70-1608-0904 | Kester Solder |
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Flux Type: No-Clean Process: Lead Free Form: Syringe, 3.53 oz (100g) Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-1708-0504 | Kester Solder |
Description: R500 SN63PB37 T3 86% 100G SYRPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Form: Syringe, 3.53 oz (100g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-1708-0520 | Kester Solder |
Description: SOLDERPASTE WATER SOL SYR 35GMPackaging: Dispenser Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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70-1709-0820 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 35GMPackaging: Bulk Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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70-1903-0810 | Kester Solder |
Description: SOLDER 500G JAR,SN96.5 AG3.0Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 4 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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| 70-1903-0911 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-2002-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GMShelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Part Status: Obsolete Flux Type: Water Soluble Process: Leaded Form: Jar, 17.64 oz (500g) Melting Point: 354°F (179°C) Type: Solder Paste Composition: Sn62Pb36Ag2 (62/36/2) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-2002-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GMPackaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Process: Leaded Flux Type: Water Soluble Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-2002-0510 | Kester Solder |
Description: SOLDERPASTE WATER SOLUABLE 500GMShelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Flux Type: Water Soluble Process: Leaded Mesh Type: 3 Form: Jar, 17.64 oz (500g) Melting Point: 361°F (183°C) Type: Solder Paste Composition: Sn63Pb37 (63/37) Packaging: Jar |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-2002-0511 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-2102-0310 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GMPackaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-2102-0311 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GMPackaging: Bulk Composition: Sn62Pb36Ag2 (62/36/2) Type: Solder Paste Melting Point: 354°F (179°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-2102-0510 | Kester Solder |
Description: R562 SOLDERPASTE WATER SOL 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-2102-0511 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-2102-0519 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 750GMPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-2102-0610 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 500GMPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: Water Soluble Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-2103-0511 | Kester Solder |
Description: SOLDER PASTE WATER SOLUBLE 600GM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-2501-0003 | Kester Solder |
Description: SOLDER FLUX RF741 NO CLEAN 30GMPackaging: Bulk Type: Flux - No Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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70-2501-0004 | Kester Solder |
Description: SOLDER FLUX RF741 NO CLEAN 100GMShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Type: Flux - No Clean Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-2601-0003 | Kester Solder |
Description: FLUX - WATER SOLUBLE SYRINGE 30G |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-3205-0819 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 750GMShelf Life: 8 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Flux Type: No-Clean Process: Lead Free Mesh Type: 3 Form: Cartridge, 24.69 oz (700g) Melting Point: 423 ~ 424°F (217 ~ 218°C) Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-3205-1810 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 500GMPackaging: Bulk Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Solder Paste Melting Point: 441°F (227°C) Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-3205-1812 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 1000GPackaging: Bulk Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3) Type: Solder Paste Form: Cartridge, 35.27 oz (1kg) Process: Lead Free Flux Type: No-Clean Part Status: Obsolete Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-3213-0810 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 500GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 8 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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70-3213-0811 | Kester Solder |
Description: SOLDER PASTE NXG1 NO CLEAN 600GMMelting Point: 423 ~ 424°F (217 ~ 218°C) Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Packaging: Bulk Shelf Life: 8 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Flux Type: No-Clean Process: Lead Free Mesh Type: 3 Form: Cartridge, 21.16 oz (600g) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-4003-2110 | Kester Solder |
Description: NP505 LT SN42BI57AG1 T4 89.0% 50 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-4003-2111 | Kester Solder |
Description: NP505 LT SN42BI57AG1 T4 89.0% 60 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-4006-2010 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4006-2011 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4021-0811 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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70-4021-0919 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 750GM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4021-1410 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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70-4102-0610 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GMPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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70-4102-0611 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GMPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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70-4105-0910 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 500GM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4105-0911 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 600GM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4105-0919 | Kester Solder |
Description: SOLDER PASTE NO CLEAN 750GM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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70-4823-0910 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 500 GShelf Life: 12 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Part Status: Active Flux Type: No-Clean Process: Lead Free Mesh Type: 4 Form: Jar, 17.64 oz (500g) Melting Point: 423 ~ 424°F (217 ~ 218°C) Type: Solder Paste Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Packaging: Bulk |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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70-4823-0911 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 600 GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Cartridge, 21.16 oz (600g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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70-4825-0904 | Kester Solder |
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GMPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Syringe, 3.53 oz (100g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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70-5022-0910 | Kester Solder |
Description: SOLDER PASTE WP616 500GM JARPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 70-5022-0911 | Kester Solder |
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8%Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Cartridge, 21.16 oz (600g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 70-5023-2210 | Kester Solder |
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3%Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Form: Jar, 17.64 oz (500g) Process: Lead Free Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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70-5306-2410 | Kester Solder |
Description: NP510-LT HRL1 T4 88% 500G JARShelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Part Status: Active Flux Type: No-Clean Process: Lead Free Mesh Type: 4 Form: Jar, 17.64 oz (500g) Melting Point: 304°F (151°C) Type: Solder Paste Packaging: Bulk |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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70-5426-2410 | Kester Solder |
Description: NP505-HR INNOLOT T4 88.2% 500G JShelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Part Status: Active Flux Type: No-Clean Process: Lead Free Mesh Type: 4 Form: Jar, 17.64 oz (500g) Type: Solder Paste Packaging: Bulk |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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70-5426-2411 | Kester Solder |
Description: NP505-HR INNOLOT T4 88.2% 600G C Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C) Part Status: Active Flux Type: No-Clean Process: Lead Free Mesh Type: 4 Form: Cartridge, 21.16 oz (600g) Type: Solder Paste Packaging: Bulk |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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77-6337-0030 | Kester Solder |
Description: SOLDER BAR 63/37 ULD FLO 10LBPart Status: Active Process: Leaded Form: Bar, 10 lbs (4.54kg) Melting Point: 361°F (183°C) Type: Bar Solder Composition: Sn63Pb37 (63/37) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
77-6337-0050 | Kester Solder |
Description: SOLDR BAR UP 63/37 FLO-BAR 10LBPackaging: Bulk Part Status: Active Process: Leaded Form: Bar, 10 lbs (4.54kg) Melting Point: 361°F (183°C) Type: Bar Solder Composition: Sn63Pb37 (63/37) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
77-6337-1930 | Kester Solder |
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5Part Status: Active Process: Leaded Form: Bar, 8.5 lbs (3.86kg) Melting Point: 361°F (183°C) Type: Bar Solder Composition: Sn63Pb37 (63/37) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
77-7031-1900 | Kester Solder |
Description: SOLDER BAR FLO-BAR 5LB 22.5" LPackaging: Bulk Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2) Type: Bar Solder Form: Bar, 7.4 lbs (3.36kg) Process: Lead Free |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
77-7033-0000 | Kester Solder |
Description: SOLDER BAR 5LB TRIANGULARPackaging: Bulk Composition: Sn97Ag3 (97/3) Type: Bar Solder Melting Point: 430 ~ 435°F (221 ~ 224°C) Form: Bar, 5 lbs (2.27kg) Process: Lead Free |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
7770680000 | Kester Solder |
Description: SOLDER BAR FLO-BAR 5LBPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Bar Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Bar, 5 lbs (2.27kg) Process: Lead Free Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
77-9574-0050 | Kester Solder |
Description: SOLDER BAR FLO-BAR 5LB |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
83-4000-0000 | KESTER SOLDER |
Description: KESTER SOLDER - 83-4000-0000 - Flux Type:-Schmelztemperatur: - Gewicht - imperial: - Lotlegierung: 60, 40 Sn, Pb Außendurchmesser - imperial: 0.031 Außendurchmesser - metrisch: 0.75 Flussmitteltyp: - Gewicht - metrisch: - Bleihaltig / bleifrei: Leaded Produktpalette: Kester Pocket-Pak™ SVHC: Lead |
на замовлення 295 шт: термін постачання 21-31 дні (днів) |
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83-7068-1402 | KESTER SOLDER |
Description: KESTER SOLDER - 83-7068-1402 - SOLDER, 96.5/3/0.5Sn/Ag/Cu, 217°C 12.19GtariffCode: 83113000 productTraceability: No rohsCompliant: YES Schmelztemperatur: 0 Gewicht - imperial: 0 Lotlegierung: 96.5, 3, 0.5 Sn, Ag, Cu Außendurchmesser - imperial: 0 euEccn: NLR Außendurchmesser - metrisch: 0 Flussmitteltyp: Rosin Activated RA Gewicht - metrisch: 0 hazardous: false rohsPhthalatesCompliant: YES directShipCharge: 25 usEccn: EAR99 Bleihaltig / bleifrei: Lead Free Produktpalette: Multicomp Pro RJ45 Adapter SVHC: No SVHC (19-Jan-2021) |
товару немає в наявності |
В кошику од. на суму грн. |
| 70-1506-1710 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn95Sb5 (95/5)
Type: Solder Paste
Melting Point: 450 ~ 464°F (232 ~ 240°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-1607-0504 |
![]() |
Виробник: Kester Solder
Description: SOLDERPASTE NO CLEAN 63/37 100GM
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Leaded
Mesh Type: 3
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Dispenser
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Description: SOLDERPASTE NO CLEAN 63/37 100GM
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Leaded
Mesh Type: 3
Form: Syringe, 1.23 oz (35g), 10cc
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Dispenser
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
товару немає в наявності
В кошику
од. на суму грн.
| 70-1607-0520 |
![]() |
Виробник: Kester Solder
Description: SOLDERPASTE NO CLEAN 63/37 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE NO CLEAN 63/37 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 162 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2835.53 грн |
| 5+ | 2353.54 грн |
| 10+ | 2207.34 грн |
| 25+ | 1902.98 грн |
| 50+ | 1784.35 грн |
| 100+ | 1672.87 грн |
| 70-1608-0804 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 100GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 100GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-1608-0820 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 35GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 35GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 67 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3556.28 грн |
| 5+ | 2951.45 грн |
| 10+ | 2768.14 грн |
| 25+ | 2386.19 грн |
| 50+ | 2237.32 грн |
| 70-1608-0904 |
![]() |
Виробник: Kester Solder
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Form: Syringe, 3.53 oz (100g)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Description: R276 SN96.5AG3.0CU0.5 T4 86% 100
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Form: Syringe, 3.53 oz (100g)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 70-1708-0504 |
![]() |
Виробник: Kester Solder
Description: R500 SN63PB37 T3 86% 100G SYR
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: R500 SN63PB37 T3 86% 100G SYR
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Form: Syringe, 3.53 oz (100g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-1708-0520 |
![]() |
Виробник: Kester Solder
Description: SOLDERPASTE WATER SOL SYR 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDERPASTE WATER SOL SYR 35GM
Packaging: Dispenser
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3100.57 грн |
| 5+ | 2572.96 грн |
| 10+ | 2413.19 грн |
| 70-1709-0820 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 35GM
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 35GM
Packaging: Bulk
Composition: Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4633.05 грн |
| 5+ | 3844.50 грн |
| 10+ | 3605.43 грн |
| 25+ | 3107.69 грн |
| 50+ | 2913.42 грн |
| 70-1903-0810 |
![]() |
Виробник: Kester Solder
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
Description: SOLDER 500G JAR,SN96.5 AG3.0
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 4 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 17213.33 грн |
| 5+ | 14275.74 грн |
| 70-1903-0911 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-2002-0310 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Obsolete
Flux Type: Water Soluble
Process: Leaded
Form: Jar, 17.64 oz (500g)
Melting Point: 354°F (179°C)
Type: Solder Paste
Composition: Sn62Pb36Ag2 (62/36/2)
Packaging: Bulk
Description: SOLDER PASTE WATER SOLUBLE 500GM
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Obsolete
Flux Type: Water Soluble
Process: Leaded
Form: Jar, 17.64 oz (500g)
Melting Point: 354°F (179°C)
Type: Solder Paste
Composition: Sn62Pb36Ag2 (62/36/2)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 70-2002-0311 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Process: Leaded
Flux Type: Water Soluble
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2002-0510 |
![]() |
Виробник: Kester Solder
Description: SOLDERPASTE WATER SOLUABLE 500GM
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: Water Soluble
Process: Leaded
Mesh Type: 3
Form: Jar, 17.64 oz (500g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Jar
Description: SOLDERPASTE WATER SOLUABLE 500GM
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: Water Soluble
Process: Leaded
Mesh Type: 3
Form: Jar, 17.64 oz (500g)
Melting Point: 361°F (183°C)
Type: Solder Paste
Composition: Sn63Pb37 (63/37)
Packaging: Jar
товару немає в наявності
В кошику
од. на суму грн.
| 70-2002-0511 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0310 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0311 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 600GM
Packaging: Bulk
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Solder Paste
Melting Point: 354°F (179°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0510 |
![]() |
Виробник: Kester Solder
Description: R562 SOLDERPASTE WATER SOL 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: R562 SOLDERPASTE WATER SOL 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0511 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0519 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 750GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 750GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2102-0610 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOLUBLE 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: Water Soluble
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-2103-0511 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WATER SOLUBLE 600GM
Description: SOLDER PASTE WATER SOLUBLE 600GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-2501-0003 |
![]() |
Виробник: Kester Solder
Description: SOLDER FLUX RF741 NO CLEAN 30GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER FLUX RF741 NO CLEAN 30GM
Packaging: Bulk
Type: Flux - No Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2909.11 грн |
| 5+ | 2567.93 грн |
| 10+ | 2217.78 грн |
| 70-2501-0004 |
![]() |
Виробник: Kester Solder
Description: SOLDER FLUX RF741 NO CLEAN 100GM
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Type: Flux - No Clean
Packaging: Bulk
Description: SOLDER FLUX RF741 NO CLEAN 100GM
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Type: Flux - No Clean
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 70-2601-0003 |
![]() |
Виробник: Kester Solder
Description: FLUX - WATER SOLUBLE SYRINGE 30G
Description: FLUX - WATER SOLUBLE SYRINGE 30G
товару немає в наявності
В кошику
од. на суму грн.
| 70-3205-0819 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 750GM
Shelf Life: 8 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 3
Form: Cartridge, 24.69 oz (700g)
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Description: SOLDER PASTE NXG1 NO CLEAN 750GM
Shelf Life: 8 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 3
Form: Cartridge, 24.69 oz (700g)
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 70-3205-1810 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Solder Paste
Melting Point: 441°F (227°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Solder Paste
Melting Point: 441°F (227°C)
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-3205-1812 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 1000G
Packaging: Bulk
Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3)
Type: Solder Paste
Form: Cartridge, 35.27 oz (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 1000G
Packaging: Bulk
Composition: Sn99Cu0.7Ag0.3 (99/0.7/0.3)
Type: Solder Paste
Form: Cartridge, 35.27 oz (1kg)
Process: Lead Free
Flux Type: No-Clean
Part Status: Obsolete
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-3213-0810 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
Description: SOLDER PASTE NXG1 NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 8 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 16482.29 грн |
| 5+ | 13669.76 грн |
| 10+ | 12814.19 грн |
| 70-3213-0811 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NXG1 NO CLEAN 600GM
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Shelf Life: 8 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 3
Form: Cartridge, 21.16 oz (600g)
Description: SOLDER PASTE NXG1 NO CLEAN 600GM
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Shelf Life: 8 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 3
Form: Cartridge, 21.16 oz (600g)
товару немає в наявності
В кошику
од. на суму грн.
| 70-4006-2010 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-4006-2011 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-4021-0811 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 16513.94 грн |
| 5+ | 13695.66 грн |
| 70-4021-0919 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 750GM
Description: SOLDER PASTE NO CLEAN 750GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-4021-1410 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 49 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 17049.56 грн |
| 5+ | 14139.52 грн |
| 10+ | 13254.47 грн |
| 30+ | 11222.39 грн |
| 70-4102-0610 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 500GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 12319.99 грн |
| 5+ | 10219.29 грн |
| 10+ | 9581.08 грн |
| 70-4102-0611 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 600GM
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 14455.34 грн |
| 5+ | 11989.86 грн |
| 70-4105-0910 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 500GM
Description: SOLDER PASTE NO CLEAN 500GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-4105-0911 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 600GM
Description: SOLDER PASTE NO CLEAN 600GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-4105-0919 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE NO CLEAN 750GM
Description: SOLDER PASTE NO CLEAN 750GM
товару немає в наявності
В кошику
од. на суму грн.
| 70-4823-0910 |
![]() |
Виробник: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 500 G
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
Description: NP560 SN96.5AG3.0CU0.5 T4 500 G
Shelf Life: 12 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Type: Solder Paste
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Packaging: Bulk
на замовлення 30 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 13159.41 грн |
| 5+ | 11644.12 грн |
| 10+ | 10959.29 грн |
| 25+ | 9642.06 грн |
| 70-4823-0911 |
![]() |
Виробник: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 600 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: NP560 SN96.5AG3.0CU0.5 T4 600 G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Cartridge, 21.16 oz (600g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 19555.17 грн |
| 5+ | 16215.89 грн |
| 10+ | 15200.26 грн |
| 70-4825-0904 |
![]() |
Виробник: Kester Solder
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: NP560 SN96.5AG3.0CU0.5 T4 100 GM
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Syringe, 3.53 oz (100g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8204.36 грн |
| 5+ | 6807.07 грн |
| 10+ | 6382.79 грн |
| 25+ | 5500.14 грн |
| 70-5022-0910 |
![]() |
Виробник: Kester Solder
Description: SOLDER PASTE WP616 500GM JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WP616 500GM JAR
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-5022-0911 |
![]() |
Виробник: Kester Solder
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WP616 SN96.5AG3.0CU0.5 T4 88.8%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Cartridge, 21.16 oz (600g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-5023-2210 |
![]() |
Виробник: Kester Solder
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: WP616 SN96.5AG3.0CU0.5 T5 88.3%
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Form: Jar, 17.64 oz (500g)
Process: Lead Free
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| 70-5306-2410 |
![]() |
Виробник: Kester Solder
Description: NP510-LT HRL1 T4 88% 500G JAR
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 304°F (151°C)
Type: Solder Paste
Packaging: Bulk
Description: NP510-LT HRL1 T4 88% 500G JAR
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Melting Point: 304°F (151°C)
Type: Solder Paste
Packaging: Bulk
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 11706.84 грн |
| 5+ | 10359.17 грн |
| 10+ | 9749.83 грн |
| 70-5426-2410 |
![]() |
Виробник: Kester Solder
Description: NP505-HR INNOLOT T4 88.2% 500G J
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Type: Solder Paste
Packaging: Bulk
Description: NP505-HR INNOLOT T4 88.2% 500G J
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Jar, 17.64 oz (500g)
Type: Solder Paste
Packaging: Bulk
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 19529.06 грн |
| 5+ | 17630.67 грн |
| 70-5426-2411 |
Виробник: Kester Solder
Description: NP505-HR INNOLOT T4 88.2% 600G C
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Cartridge, 21.16 oz (600g)
Type: Solder Paste
Packaging: Bulk
Description: NP505-HR INNOLOT T4 88.2% 600G C
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 32°F ~ 50°F (0°C ~ 10°C)
Part Status: Active
Flux Type: No-Clean
Process: Lead Free
Mesh Type: 4
Form: Cartridge, 21.16 oz (600g)
Type: Solder Paste
Packaging: Bulk
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 23435.03 грн |
| 5+ | 21156.87 грн |
| 10+ | 19746.36 грн |
| 77-6337-0030 |
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Виробник: Kester Solder
Description: SOLDER BAR 63/37 ULD FLO 10LB
Part Status: Active
Process: Leaded
Form: Bar, 10 lbs (4.54kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SOLDER BAR 63/37 ULD FLO 10LB
Part Status: Active
Process: Leaded
Form: Bar, 10 lbs (4.54kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 77-6337-0050 |
![]() |
Виробник: Kester Solder
Description: SOLDR BAR UP 63/37 FLO-BAR 10LB
Packaging: Bulk
Part Status: Active
Process: Leaded
Form: Bar, 10 lbs (4.54kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
Description: SOLDR BAR UP 63/37 FLO-BAR 10LB
Packaging: Bulk
Part Status: Active
Process: Leaded
Form: Bar, 10 lbs (4.54kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
товару немає в наявності
В кошику
од. на суму грн.
| 77-6337-1930 |
![]() |
Виробник: Kester Solder
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5
Part Status: Active
Process: Leaded
Form: Bar, 8.5 lbs (3.86kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
Description: SOLDER BAR 63/37 ULD FLO BAR 8.5
Part Status: Active
Process: Leaded
Form: Bar, 8.5 lbs (3.86kg)
Melting Point: 361°F (183°C)
Type: Bar Solder
Composition: Sn63Pb37 (63/37)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 77-7031-1900 |
![]() |
Виробник: Kester Solder
Description: SOLDER BAR FLO-BAR 5LB 22.5" L
Packaging: Bulk
Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2)
Type: Bar Solder
Form: Bar, 7.4 lbs (3.36kg)
Process: Lead Free
Description: SOLDER BAR FLO-BAR 5LB 22.5" L
Packaging: Bulk
Composition: Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2)
Type: Bar Solder
Form: Bar, 7.4 lbs (3.36kg)
Process: Lead Free
товару немає в наявності
В кошику
од. на суму грн.
| 77-7033-0000 |
![]() |
Виробник: Kester Solder
Description: SOLDER BAR 5LB TRIANGULAR
Packaging: Bulk
Composition: Sn97Ag3 (97/3)
Type: Bar Solder
Melting Point: 430 ~ 435°F (221 ~ 224°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
Description: SOLDER BAR 5LB TRIANGULAR
Packaging: Bulk
Composition: Sn97Ag3 (97/3)
Type: Bar Solder
Melting Point: 430 ~ 435°F (221 ~ 224°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
товару немає в наявності
В кошику
од. на суму грн.
| 7770680000 |
![]() |
Виробник: Kester Solder
Description: SOLDER BAR FLO-BAR 5LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
Part Status: Active
Description: SOLDER BAR FLO-BAR 5LB
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Bar Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Bar, 5 lbs (2.27kg)
Process: Lead Free
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 77-9574-0050 |
![]() |
Виробник: Kester Solder
Description: SOLDER BAR FLO-BAR 5LB
Description: SOLDER BAR FLO-BAR 5LB
товару немає в наявності
В кошику
од. на суму грн.
| 83-4000-0000 |
![]() |
Виробник: KESTER SOLDER
Description: KESTER SOLDER - 83-4000-0000 - Flux Type:-
Schmelztemperatur: -
Gewicht - imperial: -
Lotlegierung: 60, 40 Sn, Pb
Außendurchmesser - imperial: 0.031
Außendurchmesser - metrisch: 0.75
Flussmitteltyp: -
Gewicht - metrisch: -
Bleihaltig / bleifrei: Leaded
Produktpalette: Kester Pocket-Pak™
SVHC: Lead
Description: KESTER SOLDER - 83-4000-0000 - Flux Type:-
Schmelztemperatur: -
Gewicht - imperial: -
Lotlegierung: 60, 40 Sn, Pb
Außendurchmesser - imperial: 0.031
Außendurchmesser - metrisch: 0.75
Flussmitteltyp: -
Gewicht - metrisch: -
Bleihaltig / bleifrei: Leaded
Produktpalette: Kester Pocket-Pak™
SVHC: Lead
на замовлення 295 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 276.50 грн |
| 50+ | 269.93 грн |
| 100+ | 259.27 грн |
| 250+ | 231.61 грн |
| 83-7068-1402 |
![]() |
Виробник: KESTER SOLDER
Description: KESTER SOLDER - 83-7068-1402 - SOLDER, 96.5/3/0.5Sn/Ag/Cu, 217°C 12.19G
tariffCode: 83113000
productTraceability: No
rohsCompliant: YES
Schmelztemperatur: 0
Gewicht - imperial: 0
Lotlegierung: 96.5, 3, 0.5 Sn, Ag, Cu
Außendurchmesser - imperial: 0
euEccn: NLR
Außendurchmesser - metrisch: 0
Flussmitteltyp: Rosin Activated RA
Gewicht - metrisch: 0
hazardous: false
rohsPhthalatesCompliant: YES
directShipCharge: 25
usEccn: EAR99
Bleihaltig / bleifrei: Lead Free
Produktpalette: Multicomp Pro RJ45 Adapter
SVHC: No SVHC (19-Jan-2021)
Description: KESTER SOLDER - 83-7068-1402 - SOLDER, 96.5/3/0.5Sn/Ag/Cu, 217°C 12.19G
tariffCode: 83113000
productTraceability: No
rohsCompliant: YES
Schmelztemperatur: 0
Gewicht - imperial: 0
Lotlegierung: 96.5, 3, 0.5 Sn, Ag, Cu
Außendurchmesser - imperial: 0
euEccn: NLR
Außendurchmesser - metrisch: 0
Flussmitteltyp: Rosin Activated RA
Gewicht - metrisch: 0
hazardous: false
rohsPhthalatesCompliant: YES
directShipCharge: 25
usEccn: EAR99
Bleihaltig / bleifrei: Lead Free
Produktpalette: Multicomp Pro RJ45 Adapter
SVHC: No SVHC (19-Jan-2021)
товару немає в наявності
В кошику
од. на суму грн.

































