Продукція > KESTER SOLDER > Всі товари виробника KESTER SOLDER (797) > Сторінка 14 з 14
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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96-6337-9515 | Kester Solder |
![]() Packaging: Spool Diameter: 0.015" (0.38mm) Wire Gauge: 26 AWG, 27 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 74 шт: термін постачання 21-31 дні (днів) |
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96-6337-9531 | Kester Solder |
![]() Packaging: Spool Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 AWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 17.64 oz (500g) Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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96-7068-8815 | Kester Solder |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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96-7068-8820 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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96-7068-8832 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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96-7068-8840 | Kester Solder |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
![]() |
96-7069-9515 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 292 шт: термін постачання 21-31 дні (днів) |
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96-7069-9520 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 113 шт: термін постачання 21-31 дні (днів) |
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96-7069-9525 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 131 шт: термін постачання 21-31 дні (днів) |
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96-7069-9531 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 146 шт: термін постачання 21-31 дні (днів) |
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96-7069-9540 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 423 ~ 424°F (217 ~ 218°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 124 шт: термін постачання 21-31 дні (днів) |
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96-9574-9515 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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96-9574-9520 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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96-9574-9525 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Wire Gauge: 22 AWG, 23 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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96-9574-9531 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 100 шт: термін постачання 21-31 дні (днів) |
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96-9574-9540 | Kester Solder |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Wire Gauge: 18 AWG, 19 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 17.64 oz (500g) Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C) Shelf Life Start: Date of Manufacture Shelf Life: 36 Months |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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CB4460400050 | Kester Solder |
Description: SN60PB40 UP BAR 1 2/3 LB CAST Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
96-6337-9515 |
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Виробник: Kester Solder
Description: SN63PB37 3.3%/268 .015 500 G
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 26 AWG, 27 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN63PB37 3.3%/268 .015 500 G
Packaging: Spool
Diameter: 0.015" (0.38mm)
Wire Gauge: 26 AWG, 27 SWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 74 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 10769.17 грн |
5+ | 8934.20 грн |
10+ | 8376.74 грн |
25+ | 7217.38 грн |
50+ | 6763.83 грн |
96-6337-9531 |
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Виробник: Kester Solder
Description: SN63PB37 3.3%/268 .031 500 G
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 AWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN63PB37 3.3%/268 .031 500 G
Packaging: Spool
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 AWG
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Form: Spool, 17.64 oz (500g)
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 90 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5407.85 грн |
5+ | 4487.38 грн |
10+ | 4208.34 грн |
25+ | 3627.15 грн |
50+ | 3400.32 грн |
96-7068-8815 |
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Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .015" 500
Description: SOLDER FLUX-CORED/245 .015" 500
товару немає в наявності
В кошику
од. на суму грн.
96-7068-8820 |
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Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .020 500G
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товару немає в наявності
В кошику
од. на суму грн.
96-7068-8832 |
![]() |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Description: SOLDER FLUX-CORED/245 .031" 500
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
товару немає в наявності
В кошику
од. на суму грн.
96-7068-8840 |
![]() |
Виробник: Kester Solder
Description: SOLDER FLUX-CORED/245 .040 500G
Description: SOLDER FLUX-CORED/245 .040 500G
товару немає в наявності
В кошику
од. на суму грн.
96-7069-9515 |
![]() |
Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .015 5
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .015 5
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 292 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 16480.67 грн |
5+ | 13668.56 грн |
10+ | 12813.66 грн |
25+ | 11037.20 грн |
50+ | 10341.09 грн |
96-7069-9520 |
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Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .020 5
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .020 5
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 113 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 13214.74 грн |
5+ | 10961.58 грн |
10+ | 10276.85 грн |
25+ | 8853.42 грн |
50+ | 8296.09 грн |
96-7069-9525 |
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Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .025 5
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .025 5
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 131 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 13932.25 грн |
5+ | 11556.30 грн |
10+ | 10834.31 грн |
30+ | 9175.19 грн |
50+ | 8745.54 грн |
96-7069-9531 |
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Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .031 5
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .031 5
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 146 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 13949.39 грн |
5+ | 11570.13 грн |
10+ | 10847.13 грн |
25+ | 9344.45 грн |
50+ | 8755.94 грн |
96-7069-9540 |
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Виробник: Kester Solder
Description: SN96.5AG3.0CU0.5 3.3%/268 .040 5
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: SN96.5AG3.0CU0.5 3.3%/268 .040 5
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Wire Solder
Melting Point: 423 ~ 424°F (217 ~ 218°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 124 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 14260.40 грн |
5+ | 11827.80 грн |
10+ | 11088.68 грн |
30+ | 9390.55 грн |
50+ | 8950.69 грн |
96-9574-9515 |
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Виробник: Kester Solder
Description: K100LD 3.3%/268 .015 500 G ROBO
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .015 500 G ROBO
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 10818.15 грн |
5+ | 8974.45 грн |
10+ | 8414.47 грн |
96-9574-9520 |
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Виробник: Kester Solder
Description: K100LD 3.3%/268 .020 500 G ROBO
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .020 500 G ROBO
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 31 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8721.13 грн |
5+ | 7235.40 грн |
10+ | 6784.45 грн |
25+ | 5846.16 грн |
96-9574-9525 |
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Виробник: Kester Solder
Description: K100LD 3.3%/268 .025 500 G ROBO
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .025 500 G ROBO
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Wire Gauge: 22 AWG, 23 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 31 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 10112.07 грн |
5+ | 8389.32 грн |
10+ | 7866.05 грн |
30+ | 6663.36 грн |
96-9574-9531 |
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Виробник: Kester Solder
Description: K100LD 3.3%/268 .031 500 G ROBO
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .031 500 G ROBO
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 100 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7641.19 грн |
5+ | 6339.78 грн |
10+ | 5944.87 грн |
25+ | 5123.06 грн |
50+ | 4801.94 грн |
100+ | 4499.88 грн |
96-9574-9540 |
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Виробник: Kester Solder
Description: K100LD 3.3%/268 .040 500 G ROBO
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
Description: K100LD 3.3%/268 .040 500 G ROBO
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Wire Gauge: 18 AWG, 19 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 17.64 oz (500g)
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 104°F (10°C ~ 40°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 36 Months
на замовлення 73 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 9160.28 грн |
5+ | 7600.44 грн |
10+ | 7126.69 грн |
30+ | 6037.37 грн |
50+ | 5755.75 грн |