Продукція > LUMISSIL MICROSYSTEMS > Всі товари виробника LUMISSIL MICROSYSTEMS (732) > Сторінка 13 з 13
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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T40XP | Lumissil Microsystems |
 Description: 4K VIDEO AND AI VISION APPLICATIPackaging: Tray Package / Case: 356-LFBGA Mounting Type: Surface Mount Voltage - Supply: 1.62V ~ 1.98V Applications: Professional Video Supplier Device Package: 356-BGA (14x14) Part Status: Active Control Interface: I2C, I2S, Serial, UART |
на замовлення 186 шт: термін постачання 21-31 дні (днів) |
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X1600 | Lumissil Microsystems |
Description: IC MPU 1GHZ 159BGA Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI Graphics Acceleration: Yes RAM Controllers: DDR2,LPDDR2 Number of Cores/Bus Width: 1 Core USB: USB 2.0 OTG (1) Supplier Device Package: 159-BGA (9x9) Voltage - I/O: 1.8V, 3.3V Core Processor: XBurst® 1 Operating Temperature: -40°C ~ 85°C (TA) Speed: 1GHz Mounting Type: Surface Mount Package / Case: 159-LFBGA Packaging: Cut Tape (CT) Part Status: Active Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 |
на замовлення 2600 шт: термін постачання 21-31 дні (днів) |
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X1600 | Lumissil Microsystems |
Description: IC MPU 1GHZ 159BGA Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART Part Status: Active Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI Graphics Acceleration: Yes RAM Controllers: DDR2,LPDDR2 Number of Cores/Bus Width: 1 Core USB: USB 2.0 OTG (1) Supplier Device Package: 159-BGA (9x9) Voltage - I/O: 1.8V, 3.3V Core Processor: XBurst® 1 Operating Temperature: -40°C ~ 85°C (TA) Speed: 1GHz Mounting Type: Surface Mount Package / Case: 159-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| X1600E | Lumissil Microsystems |
Low-power Micro-Processor |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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X1600E | Lumissil Microsystems |
Description: LOW-POWER AIOT MICRO-PROCESSOR, Packaging: Tray Package / Case: 159-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 1 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 159-BGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, LPDDR2, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2 Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
на замовлення 2549 шт: термін постачання 21-31 дні (днів) |
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X1600HN | Lumissil Microsystems |
Description: INTEGRATED APPLICATION PROCESSOR Packaging: Tray Package / Case: 159-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 1 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 159-BGA (9x9) Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| X2000 | Lumissil Microsystems |
Multi-CPU Multi-App Micro-Processor |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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X2000 | Lumissil Microsystems |
Description: IC MPU 1.2GHZ 270BGA Packaging: Tray Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG Part Status: Active |
на замовлення 1192 шт: термін постачання 21-31 дні (днів) |
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X2000E | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-AP Packaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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X2000H | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-AP Packaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ Supplier Device Package: 209-FBGA (11x11) Voltage - I/O: 1.8V, 3.3V Core Processor: RISC-V, XBurst® 2 Operating Temperature: -40°C ~ 85°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 209-TFBGA Packaging: Cut Tape (CT) Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG (2) |
на замовлення 1759 шт: термін постачання 21-31 дні (днів) |
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X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG (2) Supplier Device Package: 209-FBGA (11x11) Voltage - I/O: 1.8V, 3.3V Core Processor: RISC-V, XBurst® 2 Operating Temperature: -40°C ~ 85°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 209-TFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
| T40XP |
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Виробник: Lumissil Microsystems
Description: 4K VIDEO AND AI VISION APPLICATI
Packaging: Tray
Package / Case: 356-LFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.62V ~ 1.98V
Applications: Professional Video
Supplier Device Package: 356-BGA (14x14)
Part Status: Active
Control Interface: I2C, I2S, Serial, UART
Description: 4K VIDEO AND AI VISION APPLICATI
Packaging: Tray
Package / Case: 356-LFBGA
Mounting Type: Surface Mount
Voltage - Supply: 1.62V ~ 1.98V
Applications: Professional Video
Supplier Device Package: 356-BGA (14x14)
Part Status: Active
Control Interface: I2C, I2S, Serial, UART
на замовлення 186 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1213.64 грн |
| 10+ | 970.69 грн |
| 25+ | 908.56 грн |
| 100+ | 782.89 грн |
| X1600 |
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Виробник: Lumissil Microsystems
Description: IC MPU 1GHZ 159BGA
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI
Graphics Acceleration: Yes
RAM Controllers: DDR2,LPDDR2
Number of Cores/Bus Width: 1 Core
USB: USB 2.0 OTG (1)
Supplier Device Package: 159-BGA (9x9)
Voltage - I/O: 1.8V, 3.3V
Core Processor: XBurst® 1
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Description: IC MPU 1GHZ 159BGA
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI
Graphics Acceleration: Yes
RAM Controllers: DDR2,LPDDR2
Number of Cores/Bus Width: 1 Core
USB: USB 2.0 OTG (1)
Supplier Device Package: 159-BGA (9x9)
Voltage - I/O: 1.8V, 3.3V
Core Processor: XBurst® 1
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 159-LFBGA
Packaging: Cut Tape (CT)
Part Status: Active
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
на замовлення 2600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 640.05 грн |
| 10+ | 414.68 грн |
| 25+ | 361.94 грн |
| 100+ | 283.70 грн |
| 250+ | 256.22 грн |
| 500+ | 250.51 грн |
| X1600 |
|
Виробник: Lumissil Microsystems
Description: IC MPU 1GHZ 159BGA
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Part Status: Active
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI
Graphics Acceleration: Yes
RAM Controllers: DDR2,LPDDR2
Number of Cores/Bus Width: 1 Core
USB: USB 2.0 OTG (1)
Supplier Device Package: 159-BGA (9x9)
Voltage - I/O: 1.8V, 3.3V
Core Processor: XBurst® 1
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MPU 1GHZ 159BGA
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Part Status: Active
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Display & Interface Controllers: LCD, MIPI-DBI, MIPI-DPI
Graphics Acceleration: Yes
RAM Controllers: DDR2,LPDDR2
Number of Cores/Bus Width: 1 Core
USB: USB 2.0 OTG (1)
Supplier Device Package: 159-BGA (9x9)
Voltage - I/O: 1.8V, 3.3V
Core Processor: XBurst® 1
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 159-LFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| X1600E |
|
Виробник: Lumissil Microsystems
Low-power Micro-Processor
Low-power Micro-Processor
товару немає в наявності
В кошику
од. на суму грн.
| X1600E |
|
Виробник: Lumissil Microsystems
Description: LOW-POWER AIOT MICRO-PROCESSOR,
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR2, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: LOW-POWER AIOT MICRO-PROCESSOR,
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, LPDDR2, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA-1/2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
на замовлення 2549 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 435.93 грн |
| 10+ | 347.79 грн |
| 25+ | 323.49 грн |
| 100+ | 275.16 грн |
| 250+ | 270.17 грн |
| X1600HN |
|
Виробник: Lumissil Microsystems
Description: INTEGRATED APPLICATION PROCESSOR
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: INTEGRATED APPLICATION PROCESSOR
Packaging: Tray
Package / Case: 159-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 1
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 159-BGA (9x9)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, RGB
Security Features: AES, Boot Security, Encryption Engine, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: AIC, CIM, CSI, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| X2000 |
|
Виробник: Lumissil Microsystems
Multi-CPU Multi-App Micro-Processor
Multi-CPU Multi-App Micro-Processor
товару немає в наявності
В кошику
од. на суму грн.
| X2000 |
|
Виробник: Lumissil Microsystems
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
на замовлення 1192 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1079.15 грн |
| 10+ | 862.35 грн |
| 25+ | 806.44 грн |
| 100+ | 693.78 грн |
| 250+ | 662.02 грн |
| 500+ | 642.50 грн |
| X2000E |
|
Виробник: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
товару немає в наявності
В кошику
од. на суму грн.
| X2000H |
|
Виробник: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
товару немає в наявності
В кошику
од. на суму грн.
| X2600H |
|
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
на замовлення 1759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 671.70 грн |
| 10+ | 535.74 грн |
| 25+ | 499.14 грн |
| 100+ | 426.18 грн |
| 250+ | 404.47 грн |
| 500+ | 391.00 грн |
| X2600H |
|
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Tape & Reel (TR)
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.