Продукція > LUMISSIL MICROSYSTEMS > Всі товари виробника LUMISSIL MICROSYSTEMS (726) > Сторінка 13 з 13
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| X2000 | Lumissil Microsystems |
Multi-CPU Multi-App Micro-Processor |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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X2000 | Lumissil Microsystems |
Description: IC MPU 1.2GHZ 270BGAPackaging: Tray Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG Part Status: Active |
на замовлення 1192 шт: термін постачання 21-31 дні (днів) |
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X2000E | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-APPackaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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X2000H | Lumissil Microsystems |
Description: MULTI-CPU HETEROGENEOUS MULTI-APPackaging: Tape & Reel (TR) Package / Case: 270-LFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 270-BGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (1) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: LPDDR3 Graphics Acceleration: No Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI Security Features: AES, RSA, TRNG, MD5, SHA, SHA2 Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZPackaging: Tape & Reel (TR) Package / Case: 209-TFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: RISC-V, XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 209-FBGA (11x11) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZPackaging: Cut Tape (CT) Package / Case: 209-TFBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: RISC-V, XBurst® 2 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 209-FBGA (11x11) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART |
на замовлення 1759 шт: термін постачання 21-31 дні (днів) |
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| X2000 |
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Виробник: Lumissil Microsystems
Multi-CPU Multi-App Micro-Processor
Multi-CPU Multi-App Micro-Processor
товару немає в наявності
В кошику
од. на суму грн.
| X2000 |
![]() |
Виробник: Lumissil Microsystems
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
Description: IC MPU 1.2GHZ 270BGA
Packaging: Tray
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Part Status: Active
на замовлення 1192 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1072.34 грн |
| 10+ | 856.91 грн |
| 25+ | 801.36 грн |
| 100+ | 689.41 грн |
| 250+ | 657.85 грн |
| 500+ | 638.45 грн |
| X2000E |
![]() |
Виробник: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
товару немає в наявності
В кошику
од. на суму грн.
| X2000H |
![]() |
Виробник: Lumissil Microsystems
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
Description: MULTI-CPU HETEROGENEOUS MULTI-AP
Packaging: Tape & Reel (TR)
Package / Case: 270-LFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 270-BGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: LPDDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD, DVP, MIPI-CSI, MIPI-DSI
Security Features: AES, RSA, TRNG, MD5, SHA, SHA2
Additional Interfaces: DMA, I2C, I2S, PCM, MMC/SD/SDIO, SSI, UART, USB OTG
товару немає в наявності
В кошику
од. на суму грн.
| X2600H |
![]() |
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Tape & Reel (TR)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Tape & Reel (TR)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| X2600H |
![]() |
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Cut Tape (CT)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Packaging: Cut Tape (CT)
Package / Case: 209-TFBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: RISC-V, XBurst® 2
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 209-FBGA (11x11)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
на замовлення 1759 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 667.46 грн |
| 10+ | 532.36 грн |
| 25+ | 495.99 грн |
| 100+ | 423.49 грн |
| 250+ | 401.92 грн |
| 500+ | 388.53 грн |


