X2600H Lumissil Microsystems
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Cut Tape (CT)
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
| Кількість | Ціна |
|---|---|
| 1+ | 671.70 грн |
| 10+ | 535.74 грн |
| 25+ | 499.14 грн |
| 100+ | 426.18 грн |
| 250+ | 404.47 грн |
| 500+ | 391.00 грн |
Відгуки про товар
Написати відгук
Технічний опис X2600H Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ, Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART, Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2, Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB, Graphics Acceleration: No, RAM Controllers: DDR3, DDR3L, Number of Cores/Bus Width: 2 Core, 32-Bit, USB: USB 2.0 OTG (2), Supplier Device Package: 209-FBGA (11x11), Voltage - I/O: 1.8V, 3.3V, Core Processor: RISC-V, XBurst® 2, Operating Temperature: -40°C ~ 85°C (TA), Speed: 1.2GHz, Mounting Type: Surface Mount, Package / Case: 209-TFBGA, Packaging: Tape & Reel (TR).
Інші пропозиції X2600H
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
|
|
X2600H | Lumissil Microsystems |
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2 Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 OTG (2) Supplier Device Package: 209-FBGA (11x11) Voltage - I/O: 1.8V, 3.3V Core Processor: RISC-V, XBurst® 2 Operating Temperature: -40°C ~ 85°C (TA) Speed: 1.2GHz Mounting Type: Surface Mount Package / Case: 209-TFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
| X2600H |
|
Виробник: Lumissil Microsystems
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Tape & Reel (TR)
Description: MPU, MIPS@1.2GHZ, +RISC-V@600MHZ
Additional Interfaces: DMA, GPIO, I2C, I2S, MMC/SD/SDIO, SPI, UART
Security Features: AES, Boot Security, MD5, Random Number Generator, SHA, SHA-2
Display & Interface Controllers: DVP, LCD, MIPI-DSI, RGB
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 OTG (2)
Supplier Device Package: 209-FBGA (11x11)
Voltage - I/O: 1.8V, 3.3V
Core Processor: RISC-V, XBurst® 2
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 209-TFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.