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DSA1223CL2-100M0000VAO DSA1223CL2-100M0000VAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000VAO DSA1124CL2-100.0000VAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1223CL2-100M0000TVAO DSA1223CL2-100M0000TVAO Microchip Technology DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000TVAO DSA1124CL2-100.0000TVAO Microchip Technology DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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2N4860 2N4860 Microchip Technology 6078-2n4856-pdf Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 100 mA @ 15 V
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MQ2N4860UB/TR MQ2N4860UB/TR Microchip Technology Description: JFET N-CH 30V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MQ2N4860UB MQ2N4860UB Microchip Technology Description: JFET N-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MQ2N4860 MQ2N4860 Microchip Technology Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MX1.5KE9.1CAe3 Microchip Technology 9459-m1-5ke-datasheet Description: TVS DIODE 7.78VWM 13.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 112A
Voltage - Reverse Standoff (Typ): 7.78V
Supplier Device Package: CASE-1
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.65V
Voltage - Clamping (Max) @ Ipp: 13.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
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JANTXV1N5551 JANTXV1N5551 Microchip Technology 11519-lds-0230-datasheet Description: DIODE GEN PURP 400V 5A
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 400 V
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551US JANS1N5551US Microchip Technology Description: DIODE GEN PURP 400V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551 JANS1N5551 Microchip Technology Description: DIODE GEN PURP 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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AT32UC3B0512AU-Z2UR AT32UC3B0512AU-Z2UR Microchip Technology doc32174.pdf Description: IC MCU 32BIT 512KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
Number of I/O: 44
DigiKey Programmable: Not Verified
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AT32UC3B0512AU-Z2UR AT32UC3B0512AU-Z2UR Microchip Technology doc32174.pdf Description: IC MCU 32BIT 512KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATTINY426-MUR ATTINY426-MUR Microchip Technology ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf Description: IC MCU 8BIT 4KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 11347 шт:
термін постачання 21-31 дні (днів)
6+58.09 грн
25+50.88 грн
100+45.95 грн
Мінімальне замовлення: 6
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PIC24FJ256GA606T-I/PT PIC24FJ256GA606T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 1200 шт:
термін постачання 21-31 дні (днів)
1200+325.25 грн
Мінімальне замовлення: 1200
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PIC24FJ256GA606T-I/PT PIC24FJ256GA606T-I/PT Microchip Technology PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 1409 шт:
термін постачання 21-31 дні (днів)
1+392.33 грн
25+347.03 грн
100+313.20 грн
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PIC24FJ32GB002T-I/ML PIC24FJ32GB002T-I/ML Microchip Technology 39940d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1600+270.45 грн
Мінімальне замовлення: 1600
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PIC24FJ32GB002T-I/ML PIC24FJ32GB002T-I/ML Microchip Technology 39940d.pdf Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 3675 шт:
термін постачання 21-31 дні (днів)
1+326.28 грн
25+289.03 грн
100+260.43 грн
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JANSD2N2222AUA JANSD2N2222AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
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JANSD2N2222AUBC/TR JANSD2N2222AUBC/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MNS2N2222AUBP MNS2N2222AUBP Microchip Technology Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANSF2N2222AUBC Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MSR2N2222AL MSR2N2222AL Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MCP9700T-H/TTVAO MCP9700T-H/TTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-150C SOT-23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SOT-23-3
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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MCP9700T-H/TTVAO MCP9700T-H/TTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-150C SOT-23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SOT-23-3
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700AT-E/LTVAO MCP9700AT-E/LTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-125C SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-2°C, +4°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700AT-E/LTVAO MCP9700AT-E/LTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-125C SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-2°C, +4°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700T-H/LTVAO MCP9700T-H/LTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-150C SC70
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700T-H/LTVAO MCP9700T-H/LTVAO Microchip Technology MCP970X-Family-Data-Sheet-DS20001942.pdf Description: SENSOR ANALOG -40C-150C SC70
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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JANSR2N2369AU/TR Microchip Technology Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSL2N2369A JANSL2N2369A Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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MSR2N2369AUBC Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 3mA, 30mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UBC
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 360 mW
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JANKCAP2N2369A JANKCAP2N2369A Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANKCAM2N2369A JANKCAM2N2369A Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSM2N2369AUB JANSM2N2369AUB Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UB
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 400 mW
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JANSM2N2369AU Microchip Technology Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSF2N2369AUA/TR Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANTXV2N2369AU/TR Microchip Technology Description: DUAL SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSP2N2369AU/TR Microchip Technology Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSD2N2369AUB JANSD2N2369AUB Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UB
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 400 mW
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JANSM2N2369AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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MSR2N2369AUA Microchip Technology Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 3mA, 30mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 360 mW
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1N4469US 1N4469US Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 15V 1.5W D5A
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: D-5A
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
на замовлення 94 шт:
термін постачання 21-31 дні (днів)
1+785.46 грн
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AT89C5131A-S3SUL AT89C5131A-S3SUL Microchip Technology doc4338.pdf Description: IC MCU 8BIT 32KB FLASH 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: LED, POR, PWM, WDT
Supplier Device Package: 52-PLCC (19.15x19.15)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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JANS1N7037CCU1 JANS1N7037CCU1 Microchip Technology Description: POWER SCHOTTKY
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTXV1N7037CCU1/TR JANTXV1N7037CCU1/TR Microchip Technology Description: DIODE POWER SCHOTTKY
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTXV1N7037CCU1 JANTXV1N7037CCU1 Microchip Technology Description: DIODE POWER SCHOTTKY
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTX1N7037CCU1 JANTX1N7037CCU1 Microchip Technology 124186-lds-0235-datasheet Description: DIODE SCHOTTKY 35A 100V SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JAN1N7037CCU1 JAN1N7037CCU1 Microchip Technology 124186-lds-0235-datasheet Description: DIODE SCHOTTKY 35A 100V SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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1N7037CCU1 1N7037CCU1 Microchip Technology 124186-lds-0235-datasheet Description: DIODE SCHOTTKY 100V 35A SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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ATMEGA325V-8AUR ATMEGA325V-8AUR Microchip Technology 2570S.pdf Description: IC MCU 8BIT 32KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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ATMEGA325PV-10MU ATMEGA325PV-10MU Microchip Technology 8023S.pdf Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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ATMEGA325V-8MUR ATMEGA325V-8MUR Microchip Technology 2570S.pdf Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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ATMEGA325V-8MUR ATMEGA325V-8MUR Microchip Technology 2570S.pdf Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MCP6497T-E/SN MCP6497T-E/SN Microchip Technology MCP6496-Data-Sheet-DS20006758.pdf Description: DUAL, 30MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 2mA (x2 Channels)
Slew Rate: 40V/µs
Gain Bandwidth Product: 30 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 55 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+43.93 грн
Мінімальне замовлення: 3300
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MCP6497T-E/SN MCP6497T-E/SN Microchip Technology MCP6496-Data-Sheet-DS20006758.pdf Description: DUAL, 30MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 2mA (x2 Channels)
Slew Rate: 40V/µs
Gain Bandwidth Product: 30 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 55 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 7701 шт:
термін постачання 21-31 дні (днів)
6+57.30 грн
25+45.95 грн
100+42.30 грн
Мінімальне замовлення: 6
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MCP1703AT-5002E/DBVAO MCP1703AT-5002E/DBVAO Microchip Technology 20005122B.pdf Description: IC REG LINEAR 5V 250MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.65V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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MCP1703AT-5002E/DBVAO MCP1703AT-5002E/DBVAO Microchip Technology 20005122B.pdf Description: IC REG LINEAR 5V 250MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.65V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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MCP1703AT-3302E/DBVAO MCP1703AT-3302E/DBVAO Microchip Technology 20005122B.pdf Description: IC REG LIN 3.3V 250MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.725V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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DSA1223CL2-100M0000VAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf
DSA1223CL2-100M0000VAO
Виробник: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000VAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1124CL2-100.0000VAO
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1223CL2-100M0000TVAO DSA12x2-3-4-High-Performance-Differential-MEMS-Oscillators-for-Automotive-DS20006378C.pdf
DSA1223CL2-100M0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC, AUTOMOTIVE, 100MHZ, LV
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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DSA1124CL2-100.0000TVAO DSA1104-24-Low-Jitter-Precision-HCSL-Oscillator-for-Automotive-DS20005894A.pdf
DSA1124CL2-100.0000TVAO
Виробник: Microchip Technology
Description: MEMS OSC AUTO LOWPWR -40C-105C
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 42mA
Height - Seated (Max): 0.035" (0.90mm)
Part Status: Active
Frequency: 100 MHz
Base Resonator: MEMS
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2N4860 6078-2n4856-pdf
2N4860
Виробник: Microchip Technology
Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 6 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 100 mA @ 15 V
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MQ2N4860UB/TR
MQ2N4860UB/TR
Виробник: Microchip Technology
Description: JFET N-CH 30V UB
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MQ2N4860UB
MQ2N4860UB
Виробник: Microchip Technology
Description: JFET N-CH 30V UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: UB
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MQ2N4860
MQ2N4860
Виробник: Microchip Technology
Description: JFET N-CH 30V TO18
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 200°C (TJ)
FET Type: N-Channel
Input Capacitance (Ciss) (Max) @ Vds: 18pF @ 10V
Voltage - Breakdown (V(BR)GSS): 30 V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Drain to Source Voltage (Vdss): 30 V
Power - Max: 360 mW
Resistance - RDS(On): 40 Ohms
Voltage - Cutoff (VGS off) @ Id: 2 V @ 500 pA
Current - Drain (Idss) @ Vds (Vgs=0): 20 mA @ 15 V
Grade: Military
Qualification: MIL-PRF-19500/385
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MX1.5KE9.1CAe3 9459-m1-5ke-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 7.78VWM 13.4VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 112A
Voltage - Reverse Standoff (Typ): 7.78V
Supplier Device Package: CASE-1
Bidirectional Channels: 1
Voltage - Breakdown (Min): 8.65V
Voltage - Clamping (Max) @ Ipp: 13.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Part Status: Active
Grade: Military
Qualification: MIL-PRF-19500
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JANTXV1N5551 11519-lds-0230-datasheet
JANTXV1N5551
Виробник: Microchip Technology
Description: DIODE GEN PURP 400V 5A
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 400 V
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551US
JANS1N5551US
Виробник: Microchip Technology
Description: DIODE GEN PURP 400V 3A B SQ-MELF
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, SQ-MELF
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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JANS1N5551
JANS1N5551
Виробник: Microchip Technology
Description: DIODE GEN PURP 400V 5A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Grade: Military
Qualification: MIL-PRF-19500/420
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AT32UC3B0512AU-Z2UR doc32174.pdf
AT32UC3B0512AU-Z2UR
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
Number of I/O: 44
DigiKey Programmable: Not Verified
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AT32UC3B0512AU-Z2UR doc32174.pdf
AT32UC3B0512AU-Z2UR
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I²C, IrDA, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Obsolete
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATTINY426-MUR ATtiny424-426-427-824-826-827-DataSheet-DS40002311A.pdf
ATTINY426-MUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 4KB FLASH 20VQFN
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: AVR
Data Converters: A/D 15x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-VQFN (3x3)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 11347 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+58.09 грн
25+50.88 грн
100+45.95 грн
Мінімальне замовлення: 6
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PIC24FJ256GA606T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ256GA606T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 1200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1200+325.25 грн
Мінімальне замовлення: 1200
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PIC24FJ256GA606T-I/PT PIC24FJ1024GA610-GB610-Family-Data-Sheet-DS30010074G.pdf
PIC24FJ256GA606T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 256KB (85.5K x 24)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, LINbus, PMP, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, HLVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 1409 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+392.33 грн
25+347.03 грн
100+313.20 грн
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PIC24FJ32GB002T-I/ML 39940d.pdf
PIC24FJ32GB002T-I/ML
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1600+270.45 грн
Мінімальне замовлення: 1600
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PIC24FJ32GB002T-I/ML 39940d.pdf
PIC24FJ32GB002T-I/ML
Виробник: Microchip Technology
Description: IC MCU 16BIT 32KB FLASH 28QFN
Packaging: Cut Tape (CT)
Package / Case: 28-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (11K x 24)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 28-QFN (6x6)
Part Status: Active
Number of I/O: 19
DigiKey Programmable: Not Verified
на замовлення 3675 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+326.28 грн
25+289.03 грн
100+260.43 грн
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JANSD2N2222AUA
JANSD2N2222AUA
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UA
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 650 mW
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JANSD2N2222AUBC/TR
JANSD2N2222AUBC/TR
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MNS2N2222AUBP
MNS2N2222AUBP
Виробник: Microchip Technology
Description: TRANS NPN 50V 0.8A UB
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UB
Grade: Military
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
Qualification: MIL-PRF-19500/255
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JANSF2N2222AUBC
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: UBC
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MSR2N2222AL
MSR2N2222AL
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 50mA, 500mA
Current - Collector Cutoff (Max): 50nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 150mA, 10V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Current - Collector (Ic) (Max): 800 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 500 mW
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MCP9700T-H/TTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700T-H/TTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-150C SOT-23-3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SOT-23-3
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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MCP9700T-H/TTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700T-H/TTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-150C SOT-23-3
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SOT-23-3
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700AT-E/LTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700AT-E/LTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-125C SC70-5
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-2°C, +4°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700AT-E/LTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700AT-E/LTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-125C SC70-5
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-2°C, +4°C)
Sensing Temperature - Local: -40°C ~ 125°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700T-H/LTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700T-H/LTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-150C SC70
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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MCP9700T-H/LTVAO MCP970X-Family-Data-Sheet-DS20001942.pdf
MCP9700T-H/LTVAO
Виробник: Microchip Technology
Description: SENSOR ANALOG -40C-150C SC70
Packaging: Cut Tape (CT)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Analog Voltage
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.3V ~ 5.5V
Sensor Type: Analog, Local
Resolution: 10mV/°C
Supplier Device Package: SC-70-5
Test Condition: 0°C ~ 70°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (-4°C, +6°C)
Sensing Temperature - Local: -40°C ~ 150°C
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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JANSR2N2369AU/TR
Виробник: Microchip Technology
Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSL2N2369A
JANSL2N2369A
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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MSR2N2369AUBC
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 3mA, 30mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UBC
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 360 mW
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JANKCAP2N2369A
JANKCAP2N2369A
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANKCAM2N2369A
JANKCAM2N2369A
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: TO-206AA, TO-18-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: TO-18 (TO-206AA)
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSM2N2369AUB
JANSM2N2369AUB
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UB
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 400 mW
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JANSM2N2369AU
Виробник: Microchip Technology
Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSF2N2369AUA/TR
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANTXV2N2369AU/TR
Виробник: Microchip Technology
Description: DUAL SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSP2N2369AU/TR
Виробник: Microchip Technology
Description: RH DUAL - SMALL-SIGNAL BJT
Packaging: Tape & Reel (TR)
Package / Case: 6-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: U
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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JANSD2N2369AUB
JANSD2N2369AUB
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UB
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 400 mW
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JANSM2N2369AUA
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 450mV @ 10mA, 100mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 500 mW
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MSR2N2369AUA
Виробник: Microchip Technology
Description: RH SMALL-SIGNAL BJT
Packaging: Bulk
Package / Case: 4-SMD, No Lead
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 3mA, 30mA
Current - Collector Cutoff (Max): 400nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Supplier Device Package: UA
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 360 mW
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1N4469US 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
1N4469US
Виробник: Microchip Technology
Description: DIODE ZENER 15V 1.5W D5A
Packaging: Bulk
Tolerance: ±5%
Package / Case: SQ-MELF, A
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 9 Ohms
Supplier Device Package: D-5A
Part Status: Active
Power - Max: 1.5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 50 nA @ 12 V
на замовлення 94 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+785.46 грн
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AT89C5131A-S3SUL doc4338.pdf
AT89C5131A-S3SUL
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: LED, POR, PWM, WDT
Supplier Device Package: 52-PLCC (19.15x19.15)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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JANS1N7037CCU1
JANS1N7037CCU1
Виробник: Microchip Technology
Description: POWER SCHOTTKY
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTXV1N7037CCU1/TR
JANTXV1N7037CCU1/TR
Виробник: Microchip Technology
Description: DIODE POWER SCHOTTKY
Packaging: Tape & Reel (TR)
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTXV1N7037CCU1
JANTXV1N7037CCU1
Виробник: Microchip Technology
Description: DIODE POWER SCHOTTKY
Packaging: Bulk
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JANTX1N7037CCU1 124186-lds-0235-datasheet
JANTX1N7037CCU1
Виробник: Microchip Technology
Description: DIODE SCHOTTKY 35A 100V SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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JAN1N7037CCU1 124186-lds-0235-datasheet
JAN1N7037CCU1
Виробник: Microchip Technology
Description: DIODE SCHOTTKY 35A 100V SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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1N7037CCU1 124186-lds-0235-datasheet
1N7037CCU1
Виробник: Microchip Technology
Description: DIODE SCHOTTKY 100V 35A SMD
Packaging: Tray
Package / Case: 3-SMD, No Lead
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 35A
Supplier Device Package: U1 (SMD-1)
Operating Temperature - Junction: -65°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.22 V @ 35 A
Current - Reverse Leakage @ Vr: 500 µA @ 100 V
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ATMEGA325V-8AUR 2570S.pdf
ATMEGA325V-8AUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Packaging: Cut Tape (CT)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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ATMEGA325PV-10MU 8023S.pdf
ATMEGA325PV-10MU
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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ATMEGA325V-8MUR 2570S.pdf
ATMEGA325V-8MUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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ATMEGA325V-8MUR 2570S.pdf
ATMEGA325V-8MUR
Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: AVR
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: SPI, UART/USART, USI
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MCP6497T-E/SN MCP6496-Data-Sheet-DS20006758.pdf
MCP6497T-E/SN
Виробник: Microchip Technology
Description: DUAL, 30MHZ OP AMP, E TEMP
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 2mA (x2 Channels)
Slew Rate: 40V/µs
Gain Bandwidth Product: 30 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 55 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+43.93 грн
Мінімальне замовлення: 3300
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MCP6497T-E/SN MCP6496-Data-Sheet-DS20006758.pdf
MCP6497T-E/SN
Виробник: Microchip Technology
Description: DUAL, 30MHZ OP AMP, E TEMP
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Current - Supply: 2mA (x2 Channels)
Slew Rate: 40V/µs
Gain Bandwidth Product: 30 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 1.6 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 55 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 5.5 V
на замовлення 7701 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+57.30 грн
25+45.95 грн
100+42.30 грн
Мінімальне замовлення: 6
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MCP1703AT-5002E/DBVAO 20005122B.pdf
MCP1703AT-5002E/DBVAO
Виробник: Microchip Technology
Description: IC REG LINEAR 5V 250MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.65V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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MCP1703AT-5002E/DBVAO 20005122B.pdf
MCP1703AT-5002E/DBVAO
Виробник: Microchip Technology
Description: IC REG LINEAR 5V 250MA SOT-223-3
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 5V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.65V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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MCP1703AT-3302E/DBVAO 20005122B.pdf
MCP1703AT-3302E/DBVAO
Виробник: Microchip Technology
Description: IC REG LIN 3.3V 250MA SOT-223-3
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 5 µA
Voltage - Input (Max): 16V
Number of Regulators: 1
Supplier Device Package: SOT-223-3
Voltage - Output (Min/Fixed): 3.3V
Part Status: Active
PSRR: 35dB (100Hz)
Voltage Dropout (Max): 0.725V @ 250mA
Protection Features: Over Current, Over Temperature, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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