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CD4739A CD4739A Microchip Technology 8368-cd4728a-cd4764a-datasheet Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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CD4746A CD4746A Microchip Technology 8368-cd4728a-cd4764a-datasheet Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 13.7 V
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CD4732A CD4732A Microchip Technology 8368-cd4728a-cd4764a-datasheet Description: DIODE ZENER 4.7V 1W DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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SY88022ALMG-TR SY88022ALMG-TR Microchip Technology SY88022AL.pdf Description: IC LASER DR 11.3125GB 3.6V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 11.3125Gbps
Current - Modulation: 85mA
Current - Bias: 80 mA
Supplier Device Package: 16-QFN (3x3)
Number of Channels: 1
Current - Supply: 65 mA
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SY88022ALMG-TR SY88022ALMG-TR Microchip Technology SY88022AL.pdf Description: IC LASER DR 11.3125GB 3.6V 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 11.3125Gbps
Current - Modulation: 85mA
Current - Bias: 80 mA
Supplier Device Package: 16-QFN (3x3)
Number of Channels: 1
Current - Supply: 65 mA
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
1+815.17 грн
25+653.48 грн
100+594.46 грн
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APTGLQ300A120G Microchip Technology 136243-aptglq300a120g-datasheet Description: IGBT MODULE 1200V 500A 1500W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1500 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V
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2280000-R 2280000-R Microchip Technology Description: ADAPTEC I-RA-HDMSAS-4SATA-SB-.8M
Packaging: Bulk
For Use With/Related Products: 7, 7H, 7He, 7Q Series
Accessory Type: Cable
Specifications: 800mm
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+1967.98 грн
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2301900-R 2301900-R Microchip Technology 00002925A.pdf Description: SMARTHBA 2100-8I8E SINGLE CABLE
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+48533.41 грн
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2302100-R Microchip Technology 00002925A.pdf Description: SMARTHBA 2100-16I SINGLE CABLE A
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
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2247100-R Microchip Technology Description: ADAPTEC I-MSASX4-4SATAX1-SB-1M R
Packaging: Bulk
For Use With/Related Products: ASR-6405, 6405E, 6805, 6805E, 6445
Accessory Type: Cable
Specifications: 1 Meter
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2299600-R Microchip Technology 00003032A.pdf Description: SMARTRAID 3162-8I /E SINGLE CABL
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 8
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24FC04HT-I/OT 24FC04HT-I/OT Microchip Technology 24AA04H-24LC04BH-24FC04H-4K-I2C-Serial-EEPROM-With-Half-Array-Write-Protect-20002119C.pdf Description: IC EEPROM 4KBIT I2C 1MHZ SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 256 x 8 x 2
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+13.75 грн
Мінімальне замовлення: 3000
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24FC04HT-I/OT 24FC04HT-I/OT Microchip Technology 24AA04H-24LC04BH-24FC04H-4K-I2C-Serial-EEPROM-With-Half-Array-Write-Protect-20002119C.pdf Description: IC EEPROM 4KBIT I2C 1MHZ SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 256 x 8 x 2
DigiKey Programmable: Not Verified
на замовлення 4850 шт:
термін постачання 21-31 дні (днів)
23+15.08 грн
100+13.24 грн
Мінімальне замовлення: 23
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24FC01T-E/MUY 24FC01T-E/MUY Microchip Technology 24AA01-24LC01B-24FC01-1K-I2C-Serial-EEPROM-20001711M.pdf Description: IC EEPROM 1KBIT I2C 1MHZ 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+16.80 грн
Мінімальне замовлення: 5000
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24FC01T-E/MUY 24FC01T-E/MUY Microchip Technology 24AA01-24LC01B-24FC01-1K-I2C-Serial-EEPROM-20001711M.pdf Description: IC EEPROM 1KBIT I2C 1MHZ 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
20+17.59 грн
100+16.18 грн
Мінімальне замовлення: 20
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24FC16HT-I/OT 24FC16HT-I/OT Microchip Technology 20002118B.pdf Description: IC EEPROM 16KBIT I2C SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+17.79 грн
Мінімальне замовлення: 3000
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24FC16HT-I/OT 24FC16HT-I/OT Microchip Technology 20002118B.pdf Description: IC EEPROM 16KBIT I2C SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
на замовлення 5813 шт:
термін постачання 21-31 дні (днів)
19+18.43 грн
100+17.14 грн
Мінімальне замовлення: 19
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PIC32MZ1024EFG100-I/GJX PIC32MZ1024EFG100-I/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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PIC32MZ1024EFG100T-I/GJX PIC32MZ1024EFG100T-I/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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PIC32MZ1024EFG100T-I/GJX PIC32MZ1024EFG100T-I/GJX Microchip Technology PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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AT24C08-10PI AT24C08-10PI Microchip Technology AT24C01A%2C02%2C04%2C08%2C16%20%282001%29.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-PDIP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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S30720 Microchip Technology 8548-coe-38-datasheet Description: RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 85A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 200 V
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R30720 Microchip Technology 8548-coe-38-datasheet Description: RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 85A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 200 V
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DSC1001CI2-003.0720T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1121BI2-131.0720T DSC1121BI2-131.0720T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1121BM2-131.0720T DSC1121BM2-131.0720T Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1001DI2-003.0720 DSC1001DI2-003.0720 Microchip Technology Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1001CI2-003.0720 DSC1001CI2-003.0720 Microchip Technology Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1121BI2-131.0720 DSC1121BI2-131.0720 Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1121BM2-131.0720 DSC1121BM2-131.0720 Microchip Technology MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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VT-802-EAE-2060-3M0720000 VT-802-EAE-2060-3M0720000 Microchip Technology Description: OSCILLATOR CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±2ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA
Height - Seated (Max): 0.047" (1.20mm)
Frequency: 3.072 MHz
Base Resonator: Crystal
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ATSAMC21E18A-MUT64 ATSAMC21E18A-MUT64 Microchip Technology Description: IC MCU 32BIT 256KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMC21E18A-AUT64 ATSAMC21E18A-AUT64 Microchip Technology Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MSMLJ36A MSMLJ36A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 36VWM 58.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 51.6A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 40V
Voltage - Clamping (Max) @ Ipp: 58.1V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ28Ae3 MSMLJ28Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 28VWM 45.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 66A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ58A MSMLJ58A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 58VWM 93.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ58Ae3 MSMLJ58Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 58VWM 93.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0A MSMLJ6.0A Microchip Technology msmlg5_j5_series_datasheet_revd.pdf Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0Ae3 MSMLJ6.0Ae3 Microchip Technology msmlg5_j5_series_datasheet_revd.pdf Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.5A MSMLJ6.5A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 6.5VWM 11.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 267.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.5Ae3 MSMLJ6.5Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 6.5VWM 11.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 267.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ60Ae3 MSMLJ60Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 60VWM 96.8VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ64A MSMLJ64A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 64VWM 103VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 29.2A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ7.5Ae3 MSMLJ7.5Ae3 Microchip Technology 10563-msml-datasheet Description: TVS DIODE 7.5VWM 12.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232.6A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ5.0A MSMLJ5.0A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 326A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0CAe3 MSMLJ6.0CAe3 Microchip Technology msmlg5_j5_series_datasheet_revd.pdf Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ75A MSMLJ75A Microchip Technology 10563-msml-datasheet Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 24.8A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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DSC1000BL5-PROGT DSC1000BL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+157.11 грн
Мінімальне замовлення: 1000
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DSC1000BL5-PROGT DSC1000BL5-PROGT Microchip Technology DSC1000_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
2+193.53 грн
25+154.25 грн
100+151.29 грн
Мінімальне замовлення: 2
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DSC1100DL3-PROGT DSC1100DL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100DL3-PROGT DSC1100DL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL3-PROGT DSC1100CL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL3-PROGT DSC1100CL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL3-PROGT DSC1100BL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+169.57 грн
Мінімальне замовлення: 1000
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DSC1100BL3-PROGT DSC1100BL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
2+211.12 грн
25+169.74 грн
100+163.29 грн
Мінімальне замовлення: 2
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DSC1100AL3-PROGT DSC1100AL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100AL3-PROGT DSC1100AL3-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL5-PROGT DSC1100CL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL5-PROGT DSC1100CL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL5-PROGT DSC1100BL5-PROGT Microchip Technology DSC1100_Web.pdf Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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CD4739A 8368-cd4728a-cd4764a-datasheet
CD4739A
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 5 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 7 V
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CD4746A 8368-cd4728a-cd4764a-datasheet
CD4746A
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 18 V
Impedance (Max) (Zzt): 20 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 13.7 V
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CD4732A 8368-cd4728a-cd4764a-datasheet
CD4732A
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V 1W DIE
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: Die
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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SY88022ALMG-TR SY88022AL.pdf
SY88022ALMG-TR
Виробник: Microchip Technology
Description: IC LASER DR 11.3125GB 3.6V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 11.3125Gbps
Current - Modulation: 85mA
Current - Bias: 80 mA
Supplier Device Package: 16-QFN (3x3)
Number of Channels: 1
Current - Supply: 65 mA
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SY88022ALMG-TR SY88022AL.pdf
SY88022ALMG-TR
Виробник: Microchip Technology
Description: IC LASER DR 11.3125GB 3.6V 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Laser Diode Driver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Data Rate: 11.3125Gbps
Current - Modulation: 85mA
Current - Bias: 80 mA
Supplier Device Package: 16-QFN (3x3)
Number of Channels: 1
Current - Supply: 65 mA
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+815.17 грн
25+653.48 грн
100+594.46 грн
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APTGLQ300A120G 136243-aptglq300a120g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 500A 1500W SP6
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.42V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: SP6
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 500 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1500 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 17.6 nF @ 25 V
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2280000-R
2280000-R
Виробник: Microchip Technology
Description: ADAPTEC I-RA-HDMSAS-4SATA-SB-.8M
Packaging: Bulk
For Use With/Related Products: 7, 7H, 7He, 7Q Series
Accessory Type: Cable
Specifications: 800mm
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1967.98 грн
В кошику  од. на суму  грн.
2301900-R 00002925A.pdf
2301900-R
Виробник: Microchip Technology
Description: SMARTHBA 2100-8I8E SINGLE CABLE
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+48533.41 грн
В кошику  од. на суму  грн.
2302100-R 00002925A.pdf
Виробник: Microchip Technology
Description: SMARTHBA 2100-16I SINGLE CABLE A
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 16
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2247100-R
Виробник: Microchip Technology
Description: ADAPTEC I-MSASX4-4SATAX1-SB-1M R
Packaging: Bulk
For Use With/Related Products: ASR-6405, 6405E, 6805, 6805E, 6445
Accessory Type: Cable
Specifications: 1 Meter
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2299600-R 00003032A.pdf
Виробник: Microchip Technology
Description: SMARTRAID 3162-8I /E SINGLE CABL
Packaging: Bulk
Interface: PCI Express
Type: SAS/SATA
Number of Ports: 8
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24FC04HT-I/OT 24AA04H-24LC04BH-24FC04H-4K-I2C-Serial-EEPROM-With-Half-Array-Write-Protect-20002119C.pdf
24FC04HT-I/OT
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT I2C 1MHZ SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 256 x 8 x 2
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+13.75 грн
Мінімальне замовлення: 3000
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24FC04HT-I/OT 24AA04H-24LC04BH-24FC04H-4K-I2C-Serial-EEPROM-With-Half-Array-Write-Protect-20002119C.pdf
24FC04HT-I/OT
Виробник: Microchip Technology
Description: IC EEPROM 4KBIT I2C 1MHZ SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 256 x 8 x 2
DigiKey Programmable: Not Verified
на замовлення 4850 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
23+15.08 грн
100+13.24 грн
Мінімальне замовлення: 23
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24FC01T-E/MUY 24AA01-24LC01B-24FC01-1K-I2C-Serial-EEPROM-20001711M.pdf
24FC01T-E/MUY
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT I2C 1MHZ 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+16.80 грн
Мінімальне замовлення: 5000
В кошику  од. на суму  грн.
24FC01T-E/MUY 24AA01-24LC01B-24FC01-1K-I2C-Serial-EEPROM-20001711M.pdf
24FC01T-E/MUY
Виробник: Microchip Technology
Description: IC EEPROM 1KBIT I2C 1MHZ 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 1Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I²C
Access Time: 450 ns
Memory Organization: 128 x 8
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
20+17.59 грн
100+16.18 грн
Мінімальне замовлення: 20
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24FC16HT-I/OT 20002118B.pdf
24FC16HT-I/OT
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT I2C SOT23-5
Packaging: Tape & Reel (TR)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+17.79 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
24FC16HT-I/OT 20002118B.pdf
24FC16HT-I/OT
Виробник: Microchip Technology
Description: IC EEPROM 16KBIT I2C SOT23-5
Packaging: Cut Tape (CT)
Package / Case: SC-74A, SOT-753
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 1 MHz
Memory Format: EEPROM
Supplier Device Package: SOT-23-5
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 450 ns
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
на замовлення 5813 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
19+18.43 грн
100+17.14 грн
Мінімальне замовлення: 19
В кошику  од. на суму  грн.
PIC32MZ1024EFG100-I/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ1024EFG100-I/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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PIC32MZ1024EFG100T-I/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ1024EFG100T-I/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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PIC32MZ1024EFG100T-I/GJX PIC32MZ-Embedded-Connectivity-with-Floating-Point-Unit-Family-Silicon-Errata-DS80000663.pdf
PIC32MZ1024EFG100T-I/GJX
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: MIPS32® M-Class
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.1V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, PMP, SPI, SQI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (7x7)
Number of I/O: 78
DigiKey Programmable: Not Verified
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AT24C08-10PI AT24C01A%2C02%2C04%2C08%2C16%20%282001%29.pdf
AT24C08-10PI
Виробник: Microchip Technology
Description: IC EEPROM 8KBIT I2C 400KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 8Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-PDIP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 1K x 8
DigiKey Programmable: Not Verified
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S30720 8548-coe-38-datasheet
Виробник: Microchip Technology
Description: RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 85A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 200 V
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R30720 8548-coe-38-datasheet
Виробник: Microchip Technology
Description: RECTIFIER
Packaging: Bulk
Package / Case: DO-203AB, DO-5, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 85A
Supplier Device Package: DO-203AB (DO-5)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 A
Current - Reverse Leakage @ Vr: 25 µA @ 200 V
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DSC1001CI2-003.0720T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
Виробник: Microchip Technology
Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1121BI2-131.0720T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121BI2-131.0720T
Виробник: Microchip Technology
Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1121BM2-131.0720T MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121BM2-131.0720T
Виробник: Microchip Technology
Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1001DI2-003.0720
DSC1001DI2-003.0720
Виробник: Microchip Technology
Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1001CI2-003.0720
DSC1001CI2-003.0720
Виробник: Microchip Technology
Description: MEMS OSC XO 3.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.072 MHz
Base Resonator: MEMS
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DSC1121BI2-131.0720 MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121BI2-131.0720
Виробник: Microchip Technology
Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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DSC1121BM2-131.0720 MCHP-S-A0003695894-1.pdf?t.download=true&u=5oefqw
DSC1121BM2-131.0720
Виробник: Microchip Technology
Description: MEMS OSC XO 131.0720MHZ CMOS SMD
Packaging: Tube
Package / Case: 6-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -55°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 131.072 MHz
Base Resonator: MEMS
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VT-802-EAE-2060-3M0720000
VT-802-EAE-2060-3M0720000
Виробник: Microchip Technology
Description: OSCILLATOR CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: TCXO
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±2ppm
Voltage - Supply: 3.3V
Current - Supply (Max): 3mA
Height - Seated (Max): 0.047" (1.20mm)
Frequency: 3.072 MHz
Base Resonator: Crystal
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ATSAMC21E18A-MUT64
ATSAMC21E18A-MUT64
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32VQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
DigiKey Programmable: Not Verified
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ATSAMC21E18A-AUT64
ATSAMC21E18A-AUT64
Виробник: Microchip Technology
Description: IC MCU 32BIT 256KB FLASH 32TQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b, 1x16b Sigma-Delta; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MSMLJ36A 10563-msml-datasheet
MSMLJ36A
Виробник: Microchip Technology
Description: TVS DIODE 36VWM 58.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 51.6A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 40V
Voltage - Clamping (Max) @ Ipp: 58.1V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ28Ae3 10563-msml-datasheet
MSMLJ28Ae3
Виробник: Microchip Technology
Description: TVS DIODE 28VWM 45.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 66A
Voltage - Reverse Standoff (Typ): 28V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 31.1V
Voltage - Clamping (Max) @ Ipp: 45.4V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ58A 10563-msml-datasheet
MSMLJ58A
Виробник: Microchip Technology
Description: TVS DIODE 58VWM 93.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ58Ae3 10563-msml-datasheet
MSMLJ58Ae3
Виробник: Microchip Technology
Description: TVS DIODE 58VWM 93.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 32A
Voltage - Reverse Standoff (Typ): 58V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 64.4V
Voltage - Clamping (Max) @ Ipp: 93.6V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0A msmlg5_j5_series_datasheet_revd.pdf
MSMLJ6.0A
Виробник: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0Ae3 msmlg5_j5_series_datasheet_revd.pdf
MSMLJ6.0Ae3
Виробник: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.5A 10563-msml-datasheet
MSMLJ6.5A
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 267.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.5Ae3 10563-msml-datasheet
MSMLJ6.5Ae3
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 267.9A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ60Ae3 10563-msml-datasheet
MSMLJ60Ae3
Виробник: Microchip Technology
Description: TVS DIODE 60VWM 96.8VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 31A
Voltage - Reverse Standoff (Typ): 60V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 66.7V
Voltage - Clamping (Max) @ Ipp: 96.8V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ64A 10563-msml-datasheet
MSMLJ64A
Виробник: Microchip Technology
Description: TVS DIODE 64VWM 103VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 29.2A
Voltage - Reverse Standoff (Typ): 64V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 71.1V
Voltage - Clamping (Max) @ Ipp: 103V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ7.5Ae3 10563-msml-datasheet
MSMLJ7.5Ae3
Виробник: Microchip Technology
Description: TVS DIODE 7.5VWM 12.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 232.6A
Voltage - Reverse Standoff (Typ): 7.5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 8.33V
Voltage - Clamping (Max) @ Ipp: 12.9V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ5.0A 10563-msml-datasheet
MSMLJ5.0A
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 9.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 326A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6.4V
Voltage - Clamping (Max) @ Ipp: 9.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ6.0CAe3 msmlg5_j5_series_datasheet_revd.pdf
MSMLJ6.0CAe3
Виробник: Microchip Technology
Description: TVS DIODE 6VWM 10.3VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 291.3A
Voltage - Reverse Standoff (Typ): 6V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 6.67V
Voltage - Clamping (Max) @ Ipp: 10.3V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMLJ75A 10563-msml-datasheet
MSMLJ75A
Виробник: Microchip Technology
Description: TVS DIODE 75VWM 121VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 24.8A
Voltage - Reverse Standoff (Typ): 75V
Supplier Device Package: DO-214AB
Unidirectional Channels: 1
Voltage - Breakdown (Min): 83.3V
Voltage - Clamping (Max) @ Ipp: 121V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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DSC1000BL5-PROGT DSC1000_Web.pdf
DSC1000BL5-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+157.11 грн
Мінімальне замовлення: 1000
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DSC1000BL5-PROGT DSC1000_Web.pdf
DSC1000BL5-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 4-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+193.53 грн
25+154.25 грн
100+151.29 грн
Мінімальне замовлення: 2
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DSC1100DL3-PROGT DSC1100_Web.pdf
DSC1100DL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100DL3-PROGT DSC1100_Web.pdf
DSC1100DL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL3-PROGT DSC1100_Web.pdf
DSC1100CL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL3-PROGT DSC1100_Web.pdf
DSC1100CL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL3-PROGT DSC1100_Web.pdf
DSC1100BL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+169.57 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
DSC1100BL3-PROGT DSC1100_Web.pdf
DSC1100BL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+211.12 грн
25+169.74 грн
100+163.29 грн
Мінімальне замовлення: 2
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DSC1100AL3-PROGT DSC1100_Web.pdf
DSC1100AL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100AL3-PROGT DSC1100_Web.pdf
DSC1100AL3-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL5-PROGT DSC1100_Web.pdf
DSC1100CL5-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100CL5-PROGT DSC1100_Web.pdf
DSC1100CL5-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Cut Tape (CT)
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
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DSC1100BL5-PROGT DSC1100_Web.pdf
DSC1100BL5-PROGT
Виробник: Microchip Technology
Description: MEMS CMOS OSC PROGRAMMABLE
Packaging: Tape & Reel (TR)
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Programmable Type: Blank (User Must Program)
Height - Seated (Max): 0.035" (0.90mm)
товару немає в наявності
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