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MPLAD18KP16CA MPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16CAE3 MPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16A MAPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16AE3 MAPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CA MAPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CAE3 MAPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16A MPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16A MXLPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16CA MXLPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16A MXPLAD18KP16A Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16CA MXPLAD18KP16CA Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16AE3 MXLPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16CAE3 MXLPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16AE3 MXPLAD18KP16AE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16CAE3 MXPLAD18KP16CAE3 Microchip Technology MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CD4107 CD4107 Microchip Technology 8362-cd4099-cd4135-datasheet Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.87 V
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JANTX1N4130DUR-1 JANTX1N4130DUR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 68V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Qualification: MIL-PRF-19500/435
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JAN1N4130DUR-1 JAN1N4130DUR-1 Microchip Technology 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf Description: DIODE ZENER 68V DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Qualification: MIL-PRF-19500/435
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MXLSMLJ11CA MXLSMLJ11CA Microchip Technology 10563-msml-datasheet Description: TVS DIODE 11VWM 18.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 164.8A
Voltage - Reverse Standoff (Typ): 11V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 12.2V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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UMX9989AP/TR Microchip Technology umx9989ap_datasheet.pdf Description: SI PPIN HERMETIC MELF
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
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UMX9989AP Microchip Technology umx9989ap_datasheet.pdf Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
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AT80C32X2-SLSUV AT80C32X2-SLSUV Microchip Technology AT80C32x2,AT87C52,TS80C32x2.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60/30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA128RFA1-ZUR ATMEGA128RFA1-ZUR Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
4000+564.26 грн
Мінімальне замовлення: 4000
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ATMEGA128RFA1-ZUR ATMEGA128RFA1-ZUR Microchip Technology Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
на замовлення 7700 шт:
термін постачання 21-31 дні (днів)
1+617.44 грн
25+543.70 грн
100+543.36 грн
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TC1072-3.3VCH713 TC1072-3.3VCH713 Microchip Technology filehandler.aspx?ddocname=en011421 Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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TC1072-3.3VCH713 TC1072-3.3VCH713 Microchip Technology filehandler.aspx?ddocname=en011421 Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
на замовлення 2999 шт:
термін постачання 21-31 дні (днів)
10+33.80 грн
25+26.29 грн
100+24.83 грн
Мінімальне замовлення: 10
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2N5339 2N5339 Microchip Technology 8813-lds-0011-datasheet Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -55°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.2V @ 500mA, 5A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Supplier Device Package: TO-39
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 1 W
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PD69210C-022319-TR PD69210C-022319-TR Microchip Technology Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 32-QFN (5x5)
Auxiliary Sense: Yes
Number of Channels: 8
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PD69210R-022320-TR PD69210R-022320-TR Microchip Technology Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 32-QFN (5x5)
Auxiliary Sense: Yes
Number of Channels: 8
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BM71BLES1FC2-0B05BA Microchip Technology Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v4.2
Current - Receiving: 10mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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1N4678UR-1/TR 1N4678UR-1/TR Microchip Technology 1N4678UR-1-1N4717UR-1.pdf Description: DIODE ZENER 1.8V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678UR-1/TR 1N4678UR-1/TR Microchip Technology 1N4678UR-1-1N4717UR-1.pdf Description: DIODE ZENER 1.8V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678/TR 1N4678/TR Microchip Technology 5827-1n4678-4717-datasheet Description: DIODE ZENER 1.8V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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DSC1001CI2-010.4858T Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 10.4858MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10.4858 MHz
Base Resonator: MEMS
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DSC1001CI2-010.4858 Microchip Technology MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw Description: MEMS OSC XO 10.4858MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10.4858 MHz
Base Resonator: MEMS
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1N5251BUR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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1N5251BUR-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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1N5251BUR/TR Microchip Technology Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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JANTXV1N6471US JANTXV1N6471US Microchip Technology 11067-sd51a-datasheet Description: TVS DIODE 12VWM 22.6VC GMELF
Packaging: Bulk
Package / Case: SQ-MELF, G
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 374A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: G-MELF (D-5C)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.6V
Voltage - Clamping (Max) @ Ipp: 22.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/552
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
1+1151.62 грн
100+1030.15 грн
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1N6001BUR-1/TR 1N6001BUR-1/TR Microchip Technology 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.4 V
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1N6001BUR-1/TR 1N6001BUR-1/TR Microchip Technology 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.4 V
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
1+341.28 грн
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MSAC26 MSAC26 Microchip Technology Description: TVS DIODE 26VWM 42.3VC DO41
Packaging: Bulk
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.1A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-41
Unidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.3V
Power - Peak Pulse: 500W
Power Line Protection: No
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1N5552 1N5552 Microchip Technology LDS-0230%2C+1N5550+thru+1N5554%2C+MIL-PRF-19500-420.pdf Description: DIODE STANDARD 600V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 600 V
на замовлення 498 шт:
термін постачання 21-31 дні (днів)
1+388.27 грн
100+346.92 грн
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1N5296UR-1/TR 1N5296UR-1/TR Microchip Technology 1N5283UR-1%20-%201N5314UR-1.pdf Description: DIODE CUR REG 100V 1.001MA 500MW
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
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1N5296UR-1/TR 1N5296UR-1/TR Microchip Technology 1N5283UR-1%20-%201N5314UR-1.pdf Description: DIODE CUR REG 100V 1.001MA 500MW
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
1+385.80 грн
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1N5296 1N5296 Microchip Technology SA5-47.PDF Description: DIODE CUR REG 100V 1.001MA 475MW
Packaging: Bulk
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-7
Power - Max: 475mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
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M5KP6.5CA M5KP6.5CA Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP6.5CAE3 M5KP6.5CAE3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP6.5CA MX5KP6.5CA Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP6.5CAe3 MX5KP6.5CAe3 Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CDS5524CUR-1 Microchip Technology Description: DIODE ZENER
Packaging: Bag
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CDS5524CUR-1/TR Microchip Technology Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
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ATSAMS70Q19B-AN ATSAMS70Q19B-AN Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
1+952.95 грн
25+833.74 грн
100+754.85 грн
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ATSAMV71Q21B-AABT ATSAMV71Q21B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Grade: Automotive
Number of I/O: 114
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
800+1151.30 грн
Мінімальне замовлення: 800
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ATSAMV71Q21B-AABT ATSAMV71Q21B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Grade: Automotive
Number of I/O: 114
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 2259 шт:
термін постачання 21-31 дні (днів)
1+1387.39 грн
25+1224.52 грн
100+1108.66 грн
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ATSAMV71J19B-AABT ATSAMV71J19B-AABT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 5x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CB ATSAMV71N20B-CB Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CBT ATSAMV71N20B-CBT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CBT ATSAMV71N20B-CBT Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-AAB ATSAMV71N20B-AAB Microchip Technology SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 75
DigiKey Programmable: Not Verified
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MPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16CA
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16CAE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16AE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16CA
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MAPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MAPLAD18KP16CAE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MPLAD18KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16CA
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16A MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16CA MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16CA
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16AE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXLPLAD18KP16CAE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16AE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16AE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXPLAD18KP16CAE3 MPLAD18KP7.0A_-_MPLAD18KP200CA.pdf
MXPLAD18KP16CAE3
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 693A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 18000W (18kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CD4107 8362-cd4099-cd4135-datasheet
CD4107
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 200 Ohms
Supplier Device Package: Die
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 50 nA @ 9.87 V
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JANTX1N4130DUR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
JANTX1N4130DUR-1
Виробник: Microchip Technology
Description: DIODE ZENER 68V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Qualification: MIL-PRF-19500/435
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JAN1N4130DUR-1 1N4614-1-1n4627e3-1N4099-1-1N4135-1.pdf
JAN1N4130DUR-1
Виробник: Microchip Technology
Description: DIODE ZENER 68V DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 68 V
Impedance (Max) (Zzt): 700 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 51.7 V
Qualification: MIL-PRF-19500/435
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MXLSMLJ11CA 10563-msml-datasheet
MXLSMLJ11CA
Виробник: Microchip Technology
Description: TVS DIODE 11VWM 18.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 164.8A
Voltage - Reverse Standoff (Typ): 11V
Supplier Device Package: DO-214AB
Bidirectional Channels: 1
Voltage - Breakdown (Min): 12.2V
Voltage - Clamping (Max) @ Ipp: 18.2V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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UMX9989AP/TR umx9989ap_datasheet.pdf
Виробник: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tray
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
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UMX9989AP umx9989ap_datasheet.pdf
Виробник: Microchip Technology
Description: SI PPIN HERMETIC MELF
Packaging: Tape & Reel (TR)
Package / Case: Module
Diode Type: PIN - Anti-Parallel
Operating Temperature: -65°C ~ 150°C
Capacitance @ Vr, F: 8pF @ 0V, 1MHz
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AT80C32X2-SLSUV AT80C32x2,AT87C52,TS80C32x2.pdf
AT80C32X2-SLSUV
Виробник: Microchip Technology
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 60/30MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: 80C51
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR
Supplier Device Package: 44-PLCC (16.6x16.6)
Number of I/O: 32
DigiKey Programmable: Not Verified
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ATMEGA128RFA1-ZUR Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZUR
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4000+564.26 грн
Мінімальне замовлення: 4000
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ATMEGA128RFA1-ZUR Atmel-8266-MCU_Wireless-ATmega128RFA1_Summary_Datasheet.pdf
ATMEGA128RFA1-ZUR
Виробник: Microchip Technology
Description: IC RF TXRX+MCU 802.15.4 64QFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Sensitivity: -100dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 4kB EEPROM, 16kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Power - Output: 3.5dBm
Protocol: 6LoWPAN, Zigbee®
Current - Receiving: 12mA ~ 12.5mA
Data Rate (Max): 2Mbps
Current - Transmitting: 8mA ~ 14.5mA
Supplier Device Package: 64-QFN (9x9)
GPIO: 38
Modulation: O-QPSK
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, USART
DigiKey Programmable: Not Verified
на замовлення 7700 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+617.44 грн
25+543.70 грн
100+543.36 грн
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TC1072-3.3VCH713 filehandler.aspx?ddocname=en011421
TC1072-3.3VCH713
Виробник: Microchip Technology
Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
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TC1072-3.3VCH713 filehandler.aspx?ddocname=en011421
TC1072-3.3VCH713
Виробник: Microchip Technology
Description: IC REG LINEAR 3.3V 50MA SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 80 µA
Voltage - Input (Max): 6V
Number of Regulators: 1
Supplier Device Package: SOT-23-6
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 64dB (1kHz)
Voltage Dropout (Max): 0.12V @ 50mA
Protection Features: Over Current, Over Temperature
на замовлення 2999 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+33.80 грн
25+26.29 грн
100+24.83 грн
Мінімальне замовлення: 10
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2N5339 8813-lds-0011-datasheet
2N5339
Виробник: Microchip Technology
Description: NPN TRANSISTOR
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -55°C ~ 200°C
Vce Saturation (Max) @ Ib, Ic: 1.2V @ 500mA, 5A
Current - Collector Cutoff (Max): 100µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 2A, 2V
Supplier Device Package: TO-39
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 100 V
Power - Max: 1 W
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PD69210C-022319-TR
PD69210C-022319-TR
Виробник: Microchip Technology
Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 32-QFN (5x5)
Auxiliary Sense: Yes
Number of Channels: 8
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PD69210R-022320-TR
PD69210R-022320-TR
Виробник: Microchip Technology
Description: MCU FOR PD692XX FAMILY, BASED PD
Packaging: Tube
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Controller (PSE)
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.63V
Internal Switch(s): Yes
Standards: 802.3at (PoE+), 802.3af (PoE), 802.3bt
Supplier Device Package: 32-QFN (5x5)
Auxiliary Sense: Yes
Number of Channels: 8
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BM71BLES1FC2-0B05BA
Виробник: Microchip Technology
Description: RF TXRX MODULE BT CHIP SMD
Packaging: Tray
Package / Case: 16-SMD Module
Sensitivity: -90dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 0dBm
Protocol: Bluetooth v4.2
Current - Receiving: 10mA
Current - Transmitting: 13mA
Antenna Type: Integrated, Chip
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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1N4678UR-1/TR 1N4678UR-1-1N4717UR-1.pdf
1N4678UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO213AA
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678UR-1/TR 1N4678UR-1-1N4717UR-1.pdf
1N4678UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO213AA
Packaging: Cut Tape (CT)
Tolerance: ±5%
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 100 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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1N4678/TR 5827-1n4678-4717-datasheet
1N4678/TR
Виробник: Microchip Technology
Description: DIODE ZENER 1.8V 500MW DO204AH
Packaging: Tape & Reel (TR)
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TA)
Voltage - Zener (Nom) (Vz): 1.8 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 7.5 µA @ 1 V
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DSC1001CI2-010.4858T MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
Виробник: Microchip Technology
Description: MEMS OSC XO 10.4858MHZ CMOS SMD
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10.4858 MHz
Base Resonator: MEMS
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DSC1001CI2-010.4858 MCHP-S-A0003587227-1.pdf?t.download=true&u=5oefqw
Виробник: Microchip Technology
Description: MEMS OSC XO 10.4858MHZ CMOS SMD
Packaging: Tube
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Ratings: AEC-Q100
Current - Supply (Max): 6.3mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 10.4858 MHz
Base Resonator: MEMS
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1N5251BUR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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1N5251BUR-1/TR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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1N5251BUR/TR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 29 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 17 V
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JANTXV1N6471US 11067-sd51a-datasheet
JANTXV1N6471US
Виробник: Microchip Technology
Description: TVS DIODE 12VWM 22.6VC GMELF
Packaging: Bulk
Package / Case: SQ-MELF, G
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 374A (8/20µs)
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: G-MELF (D-5C)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.6V
Voltage - Clamping (Max) @ Ipp: 22.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/552
на замовлення 143 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1151.62 грн
100+1030.15 грн
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1N6001BUR-1/TR 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf
1N6001BUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.4 V
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1N6001BUR-1/TR 1N5985BUR-%281%29-1N6031BUR-%281%29.pdf
1N6001BUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 500MW DO213AA
Tolerance: ±5%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 18 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 8.4 V
на замовлення 254 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+341.28 грн
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MSAC26
MSAC26
Виробник: Microchip Technology
Description: TVS DIODE 26VWM 42.3VC DO41
Packaging: Bulk
Package / Case: DO-204AL, DO041, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.1A
Voltage - Reverse Standoff (Typ): 26V
Supplier Device Package: DO-41
Unidirectional Channels: 1
Voltage - Breakdown (Min): 28.9V
Voltage - Clamping (Max) @ Ipp: 42.3V
Power - Peak Pulse: 500W
Power Line Protection: No
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1N5552 LDS-0230%2C+1N5550+thru+1N5554%2C+MIL-PRF-19500-420.pdf
1N5552
Виробник: Microchip Technology
Description: DIODE STANDARD 600V 3A B AXIAL
Packaging: Bulk
Package / Case: B, Axial
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 2 µs
Technology: Standard
Current - Average Rectified (Io): 3A
Supplier Device Package: B, Axial
Operating Temperature - Junction: -65°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 9 A
Current - Reverse Leakage @ Vr: 1 µA @ 600 V
на замовлення 498 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+388.27 грн
100+346.92 грн
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1N5296UR-1/TR 1N5283UR-1%20-%201N5314UR-1.pdf
1N5296UR-1/TR
Виробник: Microchip Technology
Description: DIODE CUR REG 100V 1.001MA 500MW
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
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1N5296UR-1/TR 1N5283UR-1%20-%201N5314UR-1.pdf
1N5296UR-1/TR
Виробник: Microchip Technology
Description: DIODE CUR REG 100V 1.001MA 500MW
Packaging: Cut Tape (CT)
Package / Case: DO-213AB, MELF (Glass)
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: DO-213AB (MELF, LL41)
Power - Max: 500mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
на замовлення 88 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+385.80 грн
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1N5296 SA5-47.PDF
1N5296
Виробник: Microchip Technology
Description: DIODE CUR REG 100V 1.001MA 475MW
Packaging: Bulk
Package / Case: DO-204AA, DO-7, Axial
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C
Supplier Device Package: DO-7
Power - Max: 475mW
Voltage - Anode - Cathode (Vak)(Max): 100V
Regulator Current (Max): 1.001mA
Voltage - Limiting (Max): 1.29V
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M5KP6.5CA 9461-m5kp-pdf
M5KP6.5CA
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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M5KP6.5CAE3 9461-m5kp-pdf
M5KP6.5CAE3
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-204AR
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP6.5CA 9461-m5kp-pdf
MX5KP6.5CA
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MX5KP6.5CAe3 9461-m5kp-pdf
MX5KP6.5CAe3
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2VC CASE 5A
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 447A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: Case 5A (DO-204AR)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CDS5524CUR-1
Виробник: Microchip Technology
Description: DIODE ZENER
Packaging: Bag
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CDS5524CUR-1/TR
Виробник: Microchip Technology
Description: VOLTAGE REGULATOR
Packaging: Tape & Reel (TR)
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ATSAMS70Q19B-AN SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMS70Q19B-AN
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 114
DigiKey Programmable: Not Verified
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+952.95 грн
25+833.74 грн
100+754.85 грн
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ATSAMV71Q21B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71Q21B-AABT
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Grade: Automotive
Number of I/O: 114
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
800+1151.30 грн
Мінімальне замовлення: 800
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ATSAMV71Q21B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71Q21B-AABT
Виробник: Microchip Technology
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Grade: Automotive
Number of I/O: 114
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
на замовлення 2259 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1387.39 грн
25+1224.52 грн
100+1108.66 грн
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ATSAMV71J19B-AABT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71J19B-AABT
Виробник: Microchip Technology
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 5x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CB SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N20B-CB
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CBT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N20B-CBT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-CBT SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N20B-CBT
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100TFBGA
Packaging: Cut Tape (CT)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 75
DigiKey Programmable: Not Verified
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ATSAMV71N20B-AAB SAM-E70-S70-V70-V71-Family-Data-Sheet-DS60001527.pdf
ATSAMV71N20B-AAB
Виробник: Microchip Technology
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 10x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 75
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
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