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DSC6011MI2A-000.0000T DSC6011MI2A-000.0000T Microchip Technology DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±25ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 988 шт:
термін постачання 21-31 дні (днів)
3+118.41 грн
25+95.88 грн
100+87.16 грн
Мінімальне замовлення: 3
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PD39210C-010019-TR PD39210C-010019-TR Microchip Technology Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tape & Reel (TR)
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SY88307BLEY SY88307BLEY Microchip Technology sy88307bl.pdf Description: IC LIMITING 1 CIRCUIT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 10-MSOP-EP
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MIC5282-5.0YMM-TR MIC5282-5.0YMM-TR Microchip Technology MIC5282.pdf Description: IC REG LINEAR 5V 50MA 8-MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 11 µA
Voltage - Input (Max): 120V
Number of Regulators: 1
Supplier Device Package: 8-MSOP
Voltage - Output (Min/Fixed): 5V
PSRR: 90dB ~ 65dB (40kHz ~ 1kHz)
Voltage Dropout (Max): 3V @ 50mA
Protection Features: Over Current, Over Temperature
на замовлення 1696 шт:
термін постачання 21-31 дні (днів)
3+122.61 грн
25+97.75 грн
100+89.95 грн
Мінімальне замовлення: 3
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MIC2225-G4YMT-TR MIC2225-G4YMT-TR Microchip Technology mic2225.pdf Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.2V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GFYMT-TR MIC2225-GFYMT-TR Microchip Technology mic2225.pdf Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GJYMT-TR MIC2225-GJYMT-TR Microchip Technology mic2225.pdf Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 2.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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EV12F76A EV12F76A Microchip Technology DS50002927a.pdf Description: DSPIC MOTOR CONTROL STARTERKIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: dsPIC33CK
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, DSC
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+22767.26 грн
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DSC1221CI3-24M57600 DSC1221CI3-24M57600 Microchip Technology Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24.576 MHz
Base Resonator: MEMS
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DSC1224DI1-100M0000 DSC1224DI1-100M0000 Microchip Technology Description: OSC MEMS HCSL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1222NI1-50M00000 DSC1222NI1-50M00000 Microchip Technology Description: OSC MEMS LVPECL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1223CI2-180M0000 DSC1223CI2-180M0000 Microchip Technology DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf Description: MEMS OSC SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 180 MHz
Base Resonator: MEMS
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DSC1223BI2-50M00000 DSC1223BI2-50M00000 Microchip Technology Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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ATA6625C-GAQW ATA6625C-GAQW Microchip Technology Atmel-4957-LIN-Networking-ATA6623C-ATA6625C_Datasheet.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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ATA6625C-GAQW ATA6625C-GAQW Microchip Technology Atmel-4957-LIN-Networking-ATA6623C-ATA6625C_Datasheet.pdf Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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1N1612 1N1612 Microchip Technology S,R20.pdf Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612A 1N1612A Microchip Technology S,R20.pdf Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612R 1N1612R Microchip Technology S,R20.pdf Description: DIODE GEN PURP 50V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1671 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
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1N1672 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
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1N1670 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
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1N1663 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 200V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 200 V
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1N1674 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 300V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 300 V
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1N1662 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
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1N1664 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 300V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 300 V
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1N1673 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 200V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 200 V
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1N1660 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
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1N1665 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 400V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 400 V
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1N1666 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 500V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
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1N1675 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 400V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 400 V
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1N1676 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 500V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
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1N1661 Microchip Technology 1N4044-1N4056.pdf Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
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EV16T60A EV16T60A Microchip Technology EVB-KSZ9131RNX-Users-Guide-50002950A.pdf Description: EVAL BOARD FOR 16T60A
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: 16T60A
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+14289.69 грн
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EV16E47A EV16E47A Microchip Technology Description: DSPIC33CK256MC506 GP PIM
Packaging: Bulk
For Use With/Related Products: dsPIC33CK256MC506
Accessory Type: Plug-In Module (PIM)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+2858.61 грн
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dsPIC33EP512GM304T-I/ML dsPIC33EP512GM304T-I/ML Microchip Technology 70000689d.pdf Description: IC MCU 16BIT 512KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 512KB (170K x 24)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 18x10b/12b
Core Size: 16-Bit
Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 35
DigiKey Programmable: Not Verified
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dsPIC33EP512GM304T-I/PT dsPIC33EP512GM304T-I/PT Microchip Technology 70000689d.pdf Description: IC MCU 16BIT 512KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 512KB (170K x 24)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 18x10b/12b
Core Size: 16-Bit
Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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DSC1123BI2-206.0000 DSC1123BI2-206.0000 Microchip Technology DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf Description: MEMS OSC XO 206.0000MHZ LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 206 MHz
Base Resonator: MEMS
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MIC2225-4KYMT-TR MIC2225-4KYMT-TR Microchip Technology mic2225.pdf Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.2V, 600mA
Voltage/Current - Output 2: 2.6V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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VCE1-B3B-45M0000000 Microchip Technology vce1.pdf Description: VCE1-B3B-45M0000000
Packaging: Tape & Reel (TR)
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VDUNLB-45M0000000 Microchip Technology v-type.pdf Description: VDUNLB-45M0000000
Packaging: Tape & Reel (TR)
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VV-701-EAE-KNAB-45M0000000 Microchip Technology VV-701-April-2020.pdf Description: LOW FREQUENCY CERAMIC VCXO +3.3
Packaging: Tape & Reel (TR)
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DSC8104AI2 Microchip Technology dsc8104-8124.pdf Description: MEMS OSC PROG BLANK 10MHZ-460MHZ
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 10 MHz ~ 460 MHz
Base Resonator: MEMS
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DLTS-19CA Microchip Technology 10882-sa4-35-datasheet Description: TVS DIODE 19VWM 38.1VC 16CDIP
Packaging: Tube
Package / Case: 16-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz (Max)
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 19V
Supplier Device Package: 16-CDIP
Bidirectional Channels: 15
Voltage - Breakdown (Min): 21.6V
Voltage - Clamping (Max) @ Ipp: 38.1V
Power - Peak Pulse: 500W
Power Line Protection: No
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DLTS-19C Microchip Technology 10882-sa4-35-datasheet Description: TVS DIODE 19VWM 42.1VC 16CDIP
Packaging: Tube
Package / Case: 16-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz (Max)
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 19V
Supplier Device Package: 16-CDIP
Bidirectional Channels: 15
Voltage - Breakdown (Min): 21.6V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 500W
Power Line Protection: No
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MCP48CVD02-E/MF MCP48CVD02-E/MF Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
3+125.97 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MCP47CVD02-E/MG MCP47CVD02-E/MG Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 16QFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 16-QFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02-E/MF MCP47CVD02-E/MF Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02-E/UN MCP47CVD02-E/UN Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/MF MCP48CVD02T-E/MF Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/MF MCP48CVD02T-E/MF Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/MF MCP47CVD02T-E/MF Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/MF MCP47CVD02T-E/MF Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/UN MCP47CVD02T-E/UN Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/UN MCP47CVD02T-E/UN Microchip Technology MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/UN MCP48CVD02T-E/UN Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/UN MCP48CVD02T-E/UN Microchip Technology MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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PIC18LF26K83-I/SO PIC18LF26K83-I/SO Microchip Technology PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
2+208.27 грн
25+183.86 грн
100+166.03 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
E5552C-DOW Microchip Technology Description: IC IDIC RF R/W 1KBIT
товару немає в наявності
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SY89546UMG SY89546UMG Microchip Technology sy89546u.pdf Description: IC MULTIPLEXER 1 X 4:1 32-QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 32-QFN (5x5)
на замовлення 2776 шт:
термін постачання 21-31 дні (днів)
43+519.04 грн
Мінімальне замовлення: 43
В кошику  од. на суму  грн.
AT91SAM7S32-AU-999 AT91SAM7S32-AU-999 Microchip Technology 6175s.pdf Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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DSC6011MI2A-000.0000T DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf
DSC6011MI2A-000.0000T
Виробник: Microchip Technology
Description: MEMS OSC PROG BLANK 1MHZ-80MHZ
Packaging: Cut Tape (CT)
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Height - Seated (Max): 0.035" (0.89mm)
Frequency Stability (Total): ±25ppm
Available Frequency Range: 1 MHz ~ 80 MHz
Base Resonator: MEMS
на замовлення 988 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+118.41 грн
25+95.88 грн
100+87.16 грн
Мінімальне замовлення: 3
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PD39210C-010019-TR
PD39210C-010019-TR
Виробник: Microchip Technology
Description: MCU FOR PD392XX FAMILY, BASED PD
Packaging: Tape & Reel (TR)
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SY88307BLEY sy88307bl.pdf
SY88307BLEY
Виробник: Microchip Technology
Description: IC LIMITING 1 CIRCUIT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 10-MSOP-EP
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MIC5282-5.0YMM-TR MIC5282.pdf
MIC5282-5.0YMM-TR
Виробник: Microchip Technology
Description: IC REG LINEAR 5V 50MA 8-MSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 50mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 11 µA
Voltage - Input (Max): 120V
Number of Regulators: 1
Supplier Device Package: 8-MSOP
Voltage - Output (Min/Fixed): 5V
PSRR: 90dB ~ 65dB (40kHz ~ 1kHz)
Voltage Dropout (Max): 3V @ 50mA
Protection Features: Over Current, Over Temperature
на замовлення 1696 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+122.61 грн
25+97.75 грн
100+89.95 грн
Мінімальне замовлення: 3
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MIC2225-G4YMT-TR mic2225.pdf
MIC2225-G4YMT-TR
Виробник: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.2V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GFYMT-TR mic2225.pdf
MIC2225-GFYMT-TR
Виробник: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 1.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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MIC2225-GJYMT-TR mic2225.pdf
MIC2225-GJYMT-TR
Виробник: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.8V, 600mA
Voltage/Current - Output 2: 2.5V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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EV12F76A DS50002927a.pdf
EV12F76A
Виробник: Microchip Technology
Description: DSPIC MOTOR CONTROL STARTERKIT
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Utilized IC / Part: dsPIC33CK
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC)
Embedded: Yes, DSC
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+22767.26 грн
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DSC1221CI3-24M57600
DSC1221CI3-24M57600
Виробник: Microchip Technology
Description: OSC MEMS LOW PWR LVCMOS
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 2.25V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 27mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24.576 MHz
Base Resonator: MEMS
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DSC1224DI1-100M0000
DSC1224DI1-100M0000
Виробник: Microchip Technology
Description: OSC MEMS HCSL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 40mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 100 MHz
Base Resonator: MEMS
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DSC1222NI1-50M00000
DSC1222NI1-50M00000
Виробник: Microchip Technology
Description: OSC MEMS LVPECL SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 50mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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DSC1223CI2-180M0000 DSC12x-3-4-High-Performance-Differential-MEMS-Oscillators-DS20006011A.pdf
DSC1223CI2-180M0000
Виробник: Microchip Technology
Description: MEMS OSC SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 180 MHz
Base Resonator: MEMS
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DSC1223BI2-50M00000
DSC1223BI2-50M00000
Виробник: Microchip Technology
Description: OSC MEMS LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 32mA (Typ)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 50 MHz
Base Resonator: MEMS
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ATA6625C-GAQW Atmel-4957-LIN-Networking-ATA6623C-ATA6625C_Datasheet.pdf
ATA6625C-GAQW
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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ATA6625C-GAQW Atmel-4957-LIN-Networking-ATA6623C-ATA6625C_Datasheet.pdf
ATA6625C-GAQW
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
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1N1612 S,R20.pdf
1N1612
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612A S,R20.pdf
1N1612A
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 5A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1612R S,R20.pdf
1N1612R
Виробник: Microchip Technology
Description: DIODE GEN PURP 50V 7A DO4
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 7A
Supplier Device Package: DO-4 (DO-203AA)
Operating Temperature - Junction: -65°C ~ 200°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 30 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
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1N1671 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
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1N1672 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
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1N1670 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
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1N1663 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 200V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 200 V
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1N1674 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 300V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 300 V
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1N1662 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 150V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 150 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 150 V
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1N1664 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 300V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 300 V
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1N1673 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 200V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 200 V
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1N1660 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 50V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 50 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 50 V
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1N1665 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 400V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 400 V
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1N1666 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 500V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
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1N1675 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 400V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 400 V
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1N1676 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 500V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 500 V
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1N1661 1N4044-1N4056.pdf
Виробник: Microchip Technology
Description: DIODE GP 100V 275A DO205AB DO9
Packaging: Bulk
Package / Case: DO-205AB, DO-9, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 275A
Supplier Device Package: DO-205AB (DO-9)
Operating Temperature - Junction: -65°C ~ 190°C
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 300 A
Current - Reverse Leakage @ Vr: 75 µA @ 100 V
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EV16T60A EVB-KSZ9131RNX-Users-Guide-50002950A.pdf
EV16T60A
Виробник: Microchip Technology
Description: EVAL BOARD FOR 16T60A
Packaging: Bulk
Function: Transceiver
Type: Interface
Utilized IC / Part: 16T60A
Supplied Contents: Board(s), Cable(s)
Contents: Board(s), Cable(s)
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14289.69 грн
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EV16E47A
EV16E47A
Виробник: Microchip Technology
Description: DSPIC33CK256MC506 GP PIM
Packaging: Bulk
For Use With/Related Products: dsPIC33CK256MC506
Accessory Type: Plug-In Module (PIM)
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2858.61 грн
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dsPIC33EP512GM304T-I/ML 70000689d.pdf
dsPIC33EP512GM304T-I/ML
Виробник: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 44QFN
Packaging: Tape & Reel (TR)
Package / Case: 44-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 512KB (170K x 24)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 18x10b/12b
Core Size: 16-Bit
Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 44-QFN (8x8)
Number of I/O: 35
DigiKey Programmable: Not Verified
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dsPIC33EP512GM304T-I/PT 70000689d.pdf
dsPIC33EP512GM304T-I/PT
Виробник: Microchip Technology
Description: IC MCU 16BIT 512KB FLASH 44TQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 70 MIPs
Program Memory Size: 512KB (170K x 24)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC
Data Converters: A/D 18x10b/12b
Core Size: 16-Bit
Connectivity: I2C, IrDA, LINbus, QEI, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
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DSC1123BI2-206.0000 DSC1103-23-Low-Jitter-Precision-LVDS-Oscillator-DS20005745C.pdf
DSC1123BI2-206.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 206.0000MHZ LVDS SMD
Packaging: Tube
Package / Case: 6-VDFN
Size / Dimension: 0.197" L x 0.126" W (5.00mm x 3.20mm)
Mounting Type: Surface Mount
Output: LVDS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 22mA
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 206 MHz
Base Resonator: MEMS
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MIC2225-4KYMT-TR mic2225.pdf
MIC2225-4KYMT-TR
Виробник: Microchip Technology
Description: IC REG DL BUCK/LNR 2MHZ 10TMLF
Packaging: Cut Tape (CT)
Package / Case: 10-UFDFN, 10-TMLF®
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 5.5V
Frequency - Switching: 2MHz
Topology: Step-Down (Buck) (1), Linear (LDO) (1)
Supplier Device Package: 10-TMLF® (2x2)
Voltage/Current - Output 1: 1.2V, 600mA
Voltage/Current - Output 2: 2.6V, 300mA
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 2
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VCE1-B3B-45M0000000 vce1.pdf
Виробник: Microchip Technology
Description: VCE1-B3B-45M0000000
Packaging: Tape & Reel (TR)
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VDUNLB-45M0000000 v-type.pdf
Виробник: Microchip Technology
Description: VDUNLB-45M0000000
Packaging: Tape & Reel (TR)
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VV-701-EAE-KNAB-45M0000000 VV-701-April-2020.pdf
Виробник: Microchip Technology
Description: LOW FREQUENCY CERAMIC VCXO +3.3
Packaging: Tape & Reel (TR)
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DSC8104AI2 dsc8104-8124.pdf
Виробник: Microchip Technology
Description: MEMS OSC PROG BLANK 10MHZ-460MHZ
Packaging: Tube
Package / Case: 4-SMD, No Lead Exposed Pad
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: HCSL
Function: Standby
Programmable Type: Blank (User Must Program)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 95µA
Height - Seated (Max): 0.035" (0.90mm)
Available Frequency Range: 10 MHz ~ 460 MHz
Base Resonator: MEMS
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DLTS-19CA 10882-sa4-35-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 19VWM 38.1VC 16CDIP
Packaging: Tube
Package / Case: 16-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz (Max)
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 19V
Supplier Device Package: 16-CDIP
Bidirectional Channels: 15
Voltage - Breakdown (Min): 21.6V
Voltage - Clamping (Max) @ Ipp: 38.1V
Power - Peak Pulse: 500W
Power Line Protection: No
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DLTS-19C 10882-sa4-35-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 19VWM 42.1VC 16CDIP
Packaging: Tube
Package / Case: 16-CDIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 275pF @ 1MHz (Max)
Current - Peak Pulse (10/1000µs): 10A (8/20µs)
Voltage - Reverse Standoff (Typ): 19V
Supplier Device Package: 16-CDIP
Bidirectional Channels: 15
Voltage - Breakdown (Min): 21.6V
Voltage - Clamping (Max) @ Ipp: 42.1V
Power - Peak Pulse: 500W
Power Line Protection: No
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MCP48CVD02-E/MF MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CVD02-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
на замовлення 360 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+125.97 грн
Мінімальне замовлення: 3
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MCP47CVD02-E/MG MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02-E/MG
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 16QFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 16-QFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02-E/MF MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tube
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02-E/UN MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02-E/UN
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tube
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/MF MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CVD02T-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/MF MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CVD02T-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/MF MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02T-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/MF MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02T-E/MF
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10DFN
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-DFN (3x3)
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/UN MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02T-E/UN
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP47CVD02T-E/UN MCP47CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-I2C-Interface-DS20006666.pdf
MCP47CVD02T-E/UN
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: I2C
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/UN MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CVD02T-E/UN
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Tape & Reel (TR)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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MCP48CVD02T-E/UN MCP48CXDX1-2-8-10-12-Bit-Digital-to-Analog-Converters-1-LSb-INL-Single-Dual-Voltage-Outputs-with-SPI-Interface-DS20006667.pdf
MCP48CVD02T-E/UN
Виробник: Microchip Technology
Description: IC DAC 8BIT V-OUT 10MSOP
Packaging: Cut Tape (CT)
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Output Type: Voltage - Buffered
Mounting Type: Surface Mount
Number of Bits: 8
Data Interface: SPI
Reference Type: External, Internal, Supply
Operating Temperature: -40°C ~ 125°C
Voltage - Supply, Analog: 1.8V ~ 5.5V
Voltage - Supply, Digital: 1.8V ~ 5.5V
Settling Time: 4µs
Supplier Device Package: 10-MSOP
Architecture: String DAC
Number of D/A Converters: 2
INL/DNL (LSB): ±0.1 (Max), ±0.1 (Max)
Differential Output: No
DigiKey Programmable: Not Verified
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PIC18LF26K83-I/SO PIC18(L)F2526K83-Data-Sheet-DS40001943C.pdf
PIC18LF26K83-I/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 64KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 24x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 25
DigiKey Programmable: Not Verified
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+208.27 грн
25+183.86 грн
100+166.03 грн
Мінімальне замовлення: 2
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E5552C-DOW
Виробник: Microchip Technology
Description: IC IDIC RF R/W 1KBIT
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SY89546UMG sy89546u.pdf
SY89546UMG
Виробник: Microchip Technology
Description: IC MULTIPLEXER 1 X 4:1 32-QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 4:1
Type: Multiplexer
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 32-QFN (5x5)
на замовлення 2776 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+519.04 грн
Мінімальне замовлення: 43
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AT91SAM7S32-AU-999 6175s.pdf
AT91SAM7S32-AU-999
Виробник: Microchip Technology
Description: IC MCU 16/32BIT 32KB FLSH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 55MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V
Connectivity: I2C, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Not Verified
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