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MSMCG40CAe3 MSMCG40CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CA Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CAe3 Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CA/TR Microchip Technology 10561-msmc-datasheet Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N5907AE3 1N5907AE3 Microchip Technology Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N5907/TR 1N5907/TR Microchip Technology Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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JAN1N5907 JAN1N5907 Microchip Technology 8921-lds-0095-datasheet Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTX1N5907/TR JANTX1N5907/TR Microchip Technology Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTXV1N5907/TR JANTXV1N5907/TR Microchip Technology Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTXV1N5907 JANTXV1N5907 Microchip Technology 8921-lds-0095-datasheet Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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M1.5KE47A Microchip Technology RF01008_rE.pdf Description: TVS DIODE 40.2VWM 64.8VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40.2V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CDLL4732A/TR CDLL4732A/TR Microchip Technology 8388-cdll4728-cdll4764a-datasheet Description: DIODE ZENER 4.7V DO213AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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M1.5KE16A Microchip Technology 9459-m1-5ke-datasheet Description: TVS DIODE 13.6VWM 22.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67A
Voltage - Reverse Standoff (Typ): 13.6V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N5519DUR-1 Microchip Technology 8860-lds-0037-datasheet Description: DIODE ZENER 3.6V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 24 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: MIL-PRF-19500/437
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2N5469 Microchip Technology Description: TRANS NPN 400V 3A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 400 V
Power - Max: 70 W
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PIC32CX1025SG41064-I/V2X PIC32CX1025SG41064-I/V2X Microchip Technology PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
на замовлення 258 шт:
термін постачання 21-31 дні (днів)
2+177.64 грн
25+156.84 грн
100+142.58 грн
Мінімальне замовлення: 2
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PIC32CX1025SG41064T-I/V2X PIC32CX1025SG41064T-I/V2X Microchip Technology PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
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PIC32CX1025SG41064T-E/V2X PIC32CX1025SG41064T-E/V2X Microchip Technology PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
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APT30DQ60BGVAO APT30DQ60BGVAO Microchip Technology Description: DIODE STANDARD 600V 30A TO247
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 55 ns
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
Current - Reverse Leakage @ Vr: 25 µA @ 600 V
Qualification: AEC-Q101
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MCP2221AT-I/ML MCP2221AT-I/ML Microchip Technology 20005565C.pdf Description: IC USB TO I2C/UART 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Function: Bridge, USB to I2C/UART
Interface: I2C, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Current - Supply: 13mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 16-QFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 6600 шт:
термін постачання 21-31 дні (днів)
3300+151.30 грн
Мінімальне замовлення: 3300
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MCP2221AT-I/ML MCP2221AT-I/ML Microchip Technology 20005565C.pdf Description: IC USB TO I2C/UART 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Function: Bridge, USB to I2C/UART
Interface: I2C, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Current - Supply: 13mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 16-QFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 8036 шт:
термін постачання 21-31 дні (днів)
2+199.02 грн
25+159.37 грн
100+145.70 грн
Мінімальне замовлення: 2
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1N6017B 1N6017B Microchip Technology 10923-sa5-60-datasheet Description: DIODE ZENER 51V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 180 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 39 V
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PD-9624GC/AC-EK PD-9624GC/AC-EK Microchip Technology PD-96xxGC_Family_Datasheet_DS00003231C.pdf Description: 24-PORT BT 90W NMS AC EU/UK CORD
Packaging: Bulk
Size / Dimension: 17.30" L x 10.80" W x 1.75" H (439.4mm x 274.3mm x 44.5mm)
Voltage - Output: 54V
Mounting Type: Rack Mount
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: 0°C ~ 40°C
Data Rate: 10/100/1000 Mbps
Power (Watts) - Per Port: 90W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Number of Ports: 24
Standard Number: 62368-1
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+139347.33 грн
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JANTX2N5153 JANTX2N5153 Microchip Technology 2N5151-2N5153-LDS-0131-MIL-PRF-19500-545.pdf Description: TRANS PNP 80V 2A TO-39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 2.5A, 5V
Supplier Device Package: TO-39
Grade: Military
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/545
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SY75603ATWL SY75603ATWL Microchip Technology SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
на замовлення 480 шт:
термін постачання 21-31 дні (днів)
3+139.81 грн
25+112.46 грн
100+108.27 грн
Мінімальне замовлення: 3
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LAN8872-I/PUA LAN8872-I/PUA Microchip Technology LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf Description: IC TRANSCEIVER FULL 1/1 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
2+300.18 грн
25+240.85 грн
100+232.69 грн
Мінімальне замовлення: 2
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LAN8871-I/PUA LAN8871-I/PUA Microchip Technology LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf Description: IC TRANSCEIVER FULL 1/1 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 259 шт:
термін постачання 21-31 дні (днів)
2+300.18 грн
25+240.85 грн
100+232.69 грн
Мінімальне замовлення: 2
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EV39G24A EV39G24A Microchip Technology Description: EVB-LAN8870-RGMII
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN8870
Secondary Attributes: On-Board LEDs
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+16900.60 грн
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EV75E52A EV75E52A Microchip Technology Description: EVB-LAN8870-MC
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN8870
Secondary Attributes: On-Board LEDs
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+20120.35 грн
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LAN8870-I/PUA LAN8870-I/PUA Microchip Technology Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 220 шт:
термін постачання 21-31 дні (днів)
2+314.16 грн
25+252.19 грн
100+233.76 грн
Мінімальне замовлення: 2
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LAN8870T-I/PUA Microchip Technology Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tape & Reel (TR)
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M5KP18A M5KP18A Microchip Technology 9461-m5kp-pdf Description: TVS DIODE 18VWM 29.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 172A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP18A/TR Microchip Technology Description: TVS DIODE 18VWM 29.2VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 171A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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AT29BV020-12JI AT29BV020-12JI Microchip Technology AT29BV020.pdf Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 20ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
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ECC204-TFLXAUTHU-CZ-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU ECC204-TFLXAUTHU Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXAUTHR-HV Microchip Technology Description: 40K MOQ RBH PROVISIONED CUSTOM D
Packaging: Bulk
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ECC204-TFLXWPCU-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU-HV Microchip Technology Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHS ECC204-TFLXAUTHS Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXWPCU ECC204-TFLXWPCU Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS ECC204-TFLXWPCS Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXAUTHS-CZ-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHU-CZ ECC204-TFLXAUTHU-CZ Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-HV Microchip Technology Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-CZ ECC204-TFLXAUTHS-CZ Microchip Technology ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-C ATECC608C-TNGTLSU-C Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-C ATECC608C-TNGTLSS-C Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TCSMU ATECC608C-TCSMU Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST CUSTOM, PROVISIONED, 8-UDF
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-B ATECC608C-TNGTLSS-B Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-B ATECC608C-TNGTLSU-B Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TCSMS ATECC608C-TCSMS Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST CUSTOM, PROVISIONED, 8-SOI
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TFLXTLSS ATECC608C-TFLXTLSS Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST FLEX TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSS-G ATECC608C-TNGTLSS-G Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-G ATECC608C-TNGTLSU-G Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU ATECC608C-TFLXTLSU Microchip Technology ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf Description: TRUST FLEX TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU-HV Microchip Technology Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TNGTLSU-HV Microchip Technology Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSU-PROTO Microchip Technology Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Bag
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MSMCG40CAe3 10561-msmc-datasheet
MSMCG40CAe3
Виробник: Microchip Technology
Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CA 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CAe3 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Bulk
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MASMCG40CA/TR 10561-msmc-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 40VWM 64.5VC DO214AB
Packaging: Tape & Reel (TR)
Package / Case: DO-215AB, SMC Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40V
Supplier Device Package: DO-214AB (SMCG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 44.4V
Voltage - Clamping (Max) @ Ipp: 64.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N5907AE3
1N5907AE3
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 60A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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1N5907/TR
1N5907/TR
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-13
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
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JAN1N5907 8921-lds-0095-datasheet
JAN1N5907
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTX1N5907/TR
JANTX1N5907/TR
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTXV1N5907/TR
JANTXV1N5907/TR
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Tape & Reel (TR)
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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JANTXV1N5907 8921-lds-0095-datasheet
JANTXV1N5907
Виробник: Microchip Technology
Description: TVS DIODE 5VWM 8.5VC DO13
Packaging: Bulk
Package / Case: DO-202AA, DO-13, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 120A
Voltage - Reverse Standoff (Typ): 5V
Supplier Device Package: DO-13 (DO-202AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 8.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/500
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M1.5KE47A RF01008_rE.pdf
Виробник: Microchip Technology
Description: TVS DIODE 40.2VWM 64.8VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 23.2A
Voltage - Reverse Standoff (Typ): 40.2V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 44.7V
Voltage - Clamping (Max) @ Ipp: 64.8V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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CDLL4732A/TR 8388-cdll4728-cdll4764a-datasheet
CDLL4732A/TR
Виробник: Microchip Technology
Description: DIODE ZENER 4.7V DO213AB
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 4.7 V
Impedance (Max) (Zzt): 8 Ohms
Supplier Device Package: DO-213AB
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 µA @ 1 V
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M1.5KE16A 9459-m1-5ke-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 13.6VWM 22.5VC CASE-1
Packaging: Bulk
Package / Case: DO-201AA, DO-27, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 67A
Voltage - Reverse Standoff (Typ): 13.6V
Supplier Device Package: CASE-1
Unidirectional Channels: 1
Voltage - Breakdown (Min): 15.2V
Voltage - Clamping (Max) @ Ipp: 22.5V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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JAN1N5519DUR-1 8860-lds-0037-datasheet
Виробник: Microchip Technology
Description: DIODE ZENER 3.6V 500MW DO213AA
Tolerance: ±1%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 3.6 V
Impedance (Max) (Zzt): 24 Ohms
Supplier Device Package: DO-213AA
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 3 µA @ 1 V
Qualification: MIL-PRF-19500/437
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2N5469
Виробник: Microchip Technology
Description: TRANS NPN 400V 3A TO66
Packaging: Bulk
Package / Case: TO-213AA, TO-66-2
Mounting Type: Through Hole
Transistor Type: NPN
Supplier Device Package: TO-66 (TO-213AA)
Current - Collector (Ic) (Max): 3 A
Voltage - Collector Emitter Breakdown (Max): 400 V
Power - Max: 70 W
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PIC32CX1025SG41064-I/V2X PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf
PIC32CX1025SG41064-I/V2X
Виробник: Microchip Technology
Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
на замовлення 258 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+177.64 грн
25+156.84 грн
100+142.58 грн
Мінімальне замовлення: 2
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PIC32CX1025SG41064T-I/V2X PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf
PIC32CX1025SG41064T-I/V2X
Виробник: Microchip Technology
Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
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PIC32CX1025SG41064T-E/V2X PIC32CX-SG41-SG60-SG61-Family-Data-Sheet-DS60001715.pdf
PIC32CX1025SG41064T-E/V2X
Виробник: Microchip Technology
Description: CM4, TQFP 64, 1 MFLASH, USB, ETH
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, IrDA, LINbus, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Crypto - AES, POR, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 51
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APT30DQ60BGVAO
APT30DQ60BGVAO
Виробник: Microchip Technology
Description: DIODE STANDARD 600V 30A TO247
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 55 ns
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Grade: Automotive
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
Current - Reverse Leakage @ Vr: 25 µA @ 600 V
Qualification: AEC-Q101
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MCP2221AT-I/ML 20005565C.pdf
MCP2221AT-I/ML
Виробник: Microchip Technology
Description: IC USB TO I2C/UART 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Function: Bridge, USB to I2C/UART
Interface: I2C, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Current - Supply: 13mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 16-QFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 6600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+151.30 грн
Мінімальне замовлення: 3300
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MCP2221AT-I/ML 20005565C.pdf
MCP2221AT-I/ML
Виробник: Microchip Technology
Description: IC USB TO I2C/UART 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-VQFN Exposed Pad
Function: Bridge, USB to I2C/UART
Interface: I2C, UART
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 5.5V
Current - Supply: 13mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 16-QFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 8036 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+199.02 грн
25+159.37 грн
100+145.70 грн
Мінімальне замовлення: 2
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1N6017B 10923-sa5-60-datasheet
1N6017B
Виробник: Microchip Technology
Description: DIODE ZENER 51V 500MW DO204AH
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 51 V
Impedance (Max) (Zzt): 180 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 39 V
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PD-9624GC/AC-EK PD-96xxGC_Family_Datasheet_DS00003231C.pdf
PD-9624GC/AC-EK
Виробник: Microchip Technology
Description: 24-PORT BT 90W NMS AC EU/UK CORD
Packaging: Bulk
Size / Dimension: 17.30" L x 10.80" W x 1.75" H (439.4mm x 274.3mm x 44.5mm)
Voltage - Output: 54V
Mounting Type: Rack Mount
Voltage - Input: 100 ~ 240 VAC
Type: Midspan Injector
Operating Temperature: 0°C ~ 40°C
Data Rate: 10/100/1000 Mbps
Power (Watts) - Per Port: 90W
Compliance: IEEE802.3af, IEEE802.3at, IEEE802.3bt
Number of Ports: 24
Standard Number: 62368-1
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+139347.33 грн
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JANTX2N5153 2N5151-2N5153-LDS-0131-MIL-PRF-19500-545.pdf
JANTX2N5153
Виробник: Microchip Technology
Description: TRANS PNP 80V 2A TO-39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: -65°C ~ 200°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 500mA, 5A
Current - Collector Cutoff (Max): 50µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 2.5A, 5V
Supplier Device Package: TO-39
Grade: Military
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 80 V
Power - Max: 1 W
Qualification: MIL-PRF-19500/545
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SY75603ATWL SY75602A-02B-03A-03B-04A-04B-2-4-Outputs-Ultra-Low-Additive-Jitter-PCIe-1-2-3-4-5-Clock-Buffer-DS20006508B.pdf
SY75603ATWL
Виробник: Microchip Technology
Description: IC CLK BUFFER 1:2 250MHZ 16VQFN
Packaging: Tube
Package / Case: 16-VFQFN Exposed Pad
Number of Circuits: 1
Mounting Type: Surface Mount, Wettable Flank
Output: HCSL
Type: Clock Buffer
Input: HCSL
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 2.25V ~ 2.75V, 2.97V ~ 3.63V
Ratio - Input:Output: 1:2
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-VQFN (3x3)
Frequency - Max: 250 MHz
на замовлення 480 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+139.81 грн
25+112.46 грн
100+108.27 грн
Мінімальне замовлення: 3
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LAN8872-I/PUA LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf
LAN8872-I/PUA
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+300.18 грн
25+240.85 грн
100+232.69 грн
Мінімальне замовлення: 2
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LAN8871-I/PUA LAN8870-LAN8871-LAN8872-Product-Brief-DS00004469.pdf
LAN8871-I/PUA
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 48VQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 259 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+300.18 грн
25+240.85 грн
100+232.69 грн
Мінімальне замовлення: 2
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EV39G24A
EV39G24A
Виробник: Microchip Technology
Description: EVB-LAN8870-RGMII
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN8870
Secondary Attributes: On-Board LEDs
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+16900.60 грн
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EV75E52A
EV75E52A
Виробник: Microchip Technology
Description: EVB-LAN8870-MC
Packaging: Bulk
Function: Ethernet
Type: Interface
Contents: Board(s)
Utilized IC / Part: LAN8870
Secondary Attributes: On-Board LEDs
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+20120.35 грн
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LAN8870-I/PUA
LAN8870-I/PUA
Виробник: Microchip Technology
Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps, 1Gbps
Protocol: Ethernet
Supplier Device Package: 48-VQFN (7x7)
Duplex: Full
на замовлення 220 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+314.16 грн
25+252.19 грн
100+233.76 грн
Мінімальне замовлення: 2
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LAN8870T-I/PUA
Виробник: Microchip Technology
Description: 100/1000BASE-T1 RGMII/SGMII PHY
Packaging: Tape & Reel (TR)
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M5KP18A 9461-m5kp-pdf
M5KP18A
Виробник: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC DO204AR
Packaging: Bulk
Package / Case: DO-204AR, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 172A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-204AR
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MA5KP18A/TR
Виробник: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC P600
Packaging: Tape & Reel (TR)
Package / Case: P600, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 171A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: P600
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 5000W (5kW)
Power Line Protection: No
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AT29BV020-12JI AT29BV020.pdf
AT29BV020-12JI
Виробник: Microchip Technology
Description: IC FLASH 2MBIT PARALLEL 32PLCC
Packaging: Tube
Package / Case: 32-LCC (J-Lead)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TC)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Memory Format: FLASH
Supplier Device Package: 32-PLCC (13.97x11.43)
Write Cycle Time - Word, Page: 20ms
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
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ECC204-TFLXAUTHU-CZ-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHU
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXAUTHR-HV
Виробник: Microchip Technology
Description: 40K MOQ RBH PROVISIONED CUSTOM D
Packaging: Bulk
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ECC204-TFLXWPCU-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHU-HV
Виробник: Microchip Technology
Description: 40K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ECC204-TFLXAUTHS ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHS
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXWPCU ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXWPCU
Виробник: Microchip Technology
Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXWPCS
Виробник: Microchip Technology
Description: TRUST FLEX WPC PROVISIONED ECC/H
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ECC204-TFLXAUTHS-CZ-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHU-CZ ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHU-CZ
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ECC204-TFLXWPCS-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-HV
Виробник: Microchip Technology
Description: 39600 SOIC PROVISIONED CUSTOM DE
Packaging: Tube
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ECC204-TFLXAUTHS-CZ ECC204-CryptoAuthentication-Summary-Data-Sheet-DS40002436.pdf
ECC204-TFLXAUTHS-CZ
Виробник: Microchip Technology
Description: TRUST FLEX AUTH PROVISIONED ECC/
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-C ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-C
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-C ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-C
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TCSMU ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TCSMU
Виробник: Microchip Technology
Description: TRUST CUSTOM, PROVISIONED, 8-UDF
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TNGTLSS-B ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-B
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TNGTLSU-B ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-B
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED PROT
Packaging: Bag
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TCSMS ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TCSMS
Виробник: Microchip Technology
Description: TRUST CUSTOM, PROVISIONED, 8-SOI
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
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ATECC608C-TFLXTLSS ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TFLXTLSS
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
товару немає в наявності
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ATECC608C-TNGTLSS-G ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSS-G
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-S
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-SOIC
товару немає в наявності
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ATECC608C-TNGTLSU-G ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TNGTLSU-G
Виробник: Microchip Technology
Description: TRUST & GO TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
товару немає в наявності
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ATECC608C-TFLXTLSU ATECC608C-CryptoAuthentication-Summary-Data-Sheet-DS40002513.pdf
ATECC608C-TFLXTLSU
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED, 8-U
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Type: Authentication Chip
Supplier Device Package: 8-UDFN (2x3)
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ATECC608C-TFLXTLSU-HV
Виробник: Microchip Technology
Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TNGTLSU-HV
Виробник: Microchip Technology
Description: 30K MOQ UDFN PROVISIONED CUSTOM
Packaging: Bag
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ATECC608C-TFLXTLSU-PROTO
Виробник: Microchip Technology
Description: TRUST FLEX TLS, PROVISIONED PROT
Packaging: Bag
товару немає в наявності
В кошику  од. на суму  грн.
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