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SST26VF064BT-104V/SM SST26VF064BT-104V/SM Microchip Technology SST26VF064B-SST26VF064BA-2-5V-3-0V-64-Mbit-Serial-Quad-IO--SQI--Flash-Memory-20005119K.pdf Description: IC FLASH 64MBIT SPI/QUAD 8SOIJ
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
DigiKey Programmable: Verified
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KSZ8061RNDW-TR KSZ8061RNDW-TR Microchip Technology KSZ8061RNB-RND-10BASE-T-100BASE-TX-PHY-00002197F.pdf Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
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KSZ8061RNDW-TR KSZ8061RNDW-TR Microchip Technology KSZ8061RNB-RND-10BASE-T-100BASE-TX-PHY-00002197F.pdf Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
на замовлення 263 шт:
термін постачання 21-31 дні (днів)
2+189.40 грн
25+151.71 грн
100+146.70 грн
Мінімальне замовлення: 2
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DSC1001DL2-011.2896 DSC1001DL2-011.2896 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 11.2896MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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MIC2561-0YM MIC2561-0YM Microchip Technology MCRLS03518-1.pdf?t.download=true&u=5oefqw Description: PCMCIA CARD SOCKET VCC AND VPP S
Packaging: Bulk
Features: Status Flag
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Logic
Switch Type: PCMCIA Switch
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Input Type: Non-Inverting
Voltage - Load: 3.3V, 5V, 12V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 200mA
Ratio - Input:Output: 3:2
Supplier Device Package: 14-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature
на замовлення 5876 шт:
термін постачання 21-31 дні (днів)
121+185.77 грн
Мінімальне замовлення: 121
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DSC1201NE2-24M00000 DSC1201NE2-24M00000 Microchip Technology DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-CDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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93LC56CT-I/MNY 93LC56CT-I/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8, 128 x 16
DigiKey Programmable: Not Verified
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
3300+24.60 грн
Мінімальне замовлення: 3300
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93LC56CT-I/MNY 93LC56CT-I/MNY Microchip Technology 21794G.pdf Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8, 128 x 16
DigiKey Programmable: Not Verified
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
12+27.17 грн
Мінімальне замовлення: 12
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ATWINC1500-MR210UB1977 Microchip Technology ATWINC1500_%20Datasheet.PDF Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 500kB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.5dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 264mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: ATWINC1500B
Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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ATWINC1500-MR210UB1977-T Microchip Technology ATWINC1500_%20Datasheet.PDF Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tape & Reel (TR)
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 500kB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.5dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 264mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: ATWINC1500B
Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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MAPLAD30KP120CA MAPLAD30KP120CA Microchip Technology 9523-mplad30kp-datasheet Description: TVS DIODE 120VWM 193VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 156A
Voltage - Reverse Standoff (Typ): 120V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 133V
Voltage - Clamping (Max) @ Ipp: 193V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MP4KE220CA MP4KE220CA Microchip Technology 9517-mp4ke-pdf Description: TVS DIODE 185VWM 328VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1A
Voltage - Reverse Standoff (Typ): 185V
Supplier Device Package: DO-204AL (DO-41)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 209V
Voltage - Clamping (Max) @ Ipp: 328V
Power - Peak Pulse: 400W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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WFI32E01UC-I WFI32E01UC-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: RF TXRX MODULE WIFI SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 216mA
Current - Transmitting: 340mA ~ 414mA
Antenna Type: Antenna Not Included
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
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WFI32E01PC-I WFI32E01PC-I Microchip Technology PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf Description: RF TXRX MOD WIFI PCB TRACE SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 216mA
Current - Transmitting: 340mA ~ 414mA
Antenna Type: PCB Trace
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
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DSC1122CL2-156.2500T DSC1122CL2-156.2500T Microchip Technology Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1122CL2-156.2500 DSC1122CL2-156.2500 Microchip Technology DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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JANTX1N6165 Microchip Technology 127853-1n6138-1n6173a-tvs-diode-series-datasheet Description: TVS DIODE 69.2VWM 131.36VC AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.4A
Voltage - Reverse Standoff (Typ): 69.2V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 82.18V
Voltage - Clamping (Max) @ Ipp: 131.36V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MDA3KP7.0A Microchip Technology MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MDA3KP7.0AE3 Microchip Technology MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MXLDA3KP7.0A Microchip Technology MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MXLDA3KP7.0AE3 Microchip Technology MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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24CS512T-I/ST 24CS512T-I/ST Microchip Technology 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-I/ST 24CS512T-I/ST Microchip Technology 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
на замовлення 2470 шт:
термін постачання 21-31 дні (днів)
4+91.60 грн
25+85.48 грн
100+81.81 грн
Мінімальне замовлення: 4
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24CS512T-E/ST 24CS512T-E/ST Microchip Technology 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/ST 24CS512T-E/ST Microchip Technology 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/Q6B66KVAO 24CS512T-E/Q6B66KVAO Microchip Technology 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf Description: IC EEPROM 512KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/MUY 24CS512T-E/MUY Microchip Technology Description: IC EEPROM 512KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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PIC16LF18425-E/SL PIC16LF18425-E/SL Microchip Technology 40001894B.pdf Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
DigiKey Programmable: Not Verified
на замовлення 570 шт:
термін постачання 21-31 дні (днів)
3+104.02 грн
25+91.70 грн
100+82.74 грн
Мінімальне замовлення: 3
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SY58023UMG-TR SY58023UMG-TR Microchip Technology sy58023u.pdf Description: IC CROSSPOINT SWITCH 1X2:2 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:2
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-MLF® (3x3)
на замовлення 975 шт:
термін постачання 21-31 дні (днів)
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SY58023UMG-TR SY58023UMG-TR Microchip Technology sy58023u.pdf Description: IC CROSSPOINT SWITCH 1X2:2 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:2
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-MLF® (3x3)
на замовлення 975 шт:
термін постачання 21-31 дні (днів)
1+1203.96 грн
25+966.10 грн
100+933.22 грн
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MCP2561FDT-E/MF MCP2561FDT-E/MF Microchip Technology 20005284A.pdf Description: IC TRANSCEIVER 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-DFN (3x3)
Receiver Hysteresis: 200 mV
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MCP2561FDT-E/MF MCP2561FDT-E/MF Microchip Technology 20005284A.pdf Description: IC TRANSCEIVER 1/1 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-DFN (3x3)
Receiver Hysteresis: 200 mV
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2N1714 2N1714 Microchip Technology Description: TRANS NPN 60V 0.75A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Frequency - Transition: 16MHz
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1714S 2N1714S Microchip Technology Description: TRANS NPN 60V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1716S 2N1716S Microchip Technology Description: TRANS NPN 60V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1716 2N1716 Microchip Technology Description: TRANS NPN 60V 0.75A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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MTCH1060-I/SS MTCH1060-I/SS Microchip Technology MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 1170 шт:
термін постачання 21-31 дні (днів)
5+74.52 грн
25+65.51 грн
100+59.30 грн
Мінімальне замовлення: 5
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681-2P Microchip Technology RF01151.pdf Description: DIODE MODULE GP 200V 15A ND
Packaging: Bulk
Package / Case: Nd
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 15A
Supplier Device Package: Nd
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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681-2 Microchip Technology RF01151.pdf Description: DIODE MODULE GP 200V 15A ND
Packaging: Bulk
Package / Case: Nd
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 15A
Supplier Device Package: Nd
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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SST39SF040-70-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4C-TU Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4C-TU Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4C-TU-T Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-55-4I-TU Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4I-TU Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4I-TU-T Microchip Technology Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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1N5533UR-1/TR 1N5533UR-1/TR Microchip Technology 1N5518BUR-1-1N5546BUR-1.pdf Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
на замовлення 146 шт:
термін постачання 21-31 дні (днів)
146+427.28 грн
Мінімальне замовлення: 146
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1N5533UR-1/TR 1N5533UR-1/TR Microchip Technology 1N5518BUR-1-1N5546BUR-1.pdf Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
на замовлення 146 шт:
термін постачання 21-31 дні (днів)
1+460.32 грн
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1N5533CUR-1/TR 1N5533CUR-1/TR Microchip Technology 1N5518BUR-1-1N5546BUR-1.pdf Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
100+844.17 грн
Мінімальне замовлення: 100
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1N5533CUR-1/TR 1N5533CUR-1/TR Microchip Technology 1N5518BUR-1-1N5546BUR-1.pdf Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
1+909.76 грн
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1N5533A 1N5533A Microchip Technology Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533 1N5533 Microchip Technology Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533A/TR 1N5533A/TR Microchip Technology Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533/TR 1N5533/TR Microchip Technology Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533UR-1 1N5533UR-1 Microchip Technology Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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JANTX1N5533B-1 JANTX1N5533B-1 Microchip Technology 123956-lds-0037-1-datasheet Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANTX1N5533B-1/TR JANTX1N5533B-1/TR Microchip Technology Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANHCA1N5533B JANHCA1N5533B Microchip Technology 14809-military-qualified-die-chip Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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1N5533BUR-1/TR 1N5533BUR-1/TR Microchip Technology Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
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SST26VF064BT-104V/SM SST26VF064B-SST26VF064BA-2-5V-3-0V-64-Mbit-Serial-Quad-IO--SQI--Flash-Memory-20005119K.pdf
SST26VF064BT-104V/SM
Виробник: Microchip Technology
Description: IC FLASH 64MBIT SPI/QUAD 8SOIJ
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIJ
Write Cycle Time - Word, Page: 1.5ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
DigiKey Programmable: Verified
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KSZ8061RNDW-TR KSZ8061RNB-RND-10BASE-T-100BASE-TX-PHY-00002197F.pdf
KSZ8061RNDW-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
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KSZ8061RNDW-TR KSZ8061RNB-RND-10BASE-T-100BASE-TX-PHY-00002197F.pdf
KSZ8061RNDW-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 1/1 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.8V, 2.5V, 3.3V
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: Ethernet
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
на замовлення 263 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+189.40 грн
25+151.71 грн
100+146.70 грн
Мінімальне замовлення: 2
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DSC1001DL2-011.2896 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DL2-011.2896
Виробник: Microchip Technology
Description: MEMS OSC XO 11.2896MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 11.2896 MHz
Base Resonator: MEMS
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MIC2561-0YM MCRLS03518-1.pdf?t.download=true&u=5oefqw
MIC2561-0YM
Виробник: Microchip Technology
Description: PCMCIA CARD SOCKET VCC AND VPP S
Packaging: Bulk
Features: Status Flag
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: Logic
Switch Type: PCMCIA Switch
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Low Side
Rds On (Typ): 550mOhm
Input Type: Non-Inverting
Voltage - Load: 3.3V, 5V, 12V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 200mA
Ratio - Input:Output: 3:2
Supplier Device Package: 14-SOIC
Fault Protection: Current Limiting (Fixed), Over Temperature
на замовлення 5876 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
121+185.77 грн
Мінімальне замовлення: 121
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DSC1201NE2-24M00000 DSC12x1-High-Performance-CMOS-MEMS-Oscillator-DS20006010A.pdf
DSC1201NE2-24M00000
Виробник: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 27mA (Typ)
Supplier Device Package: 6-CDFN (7x5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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93LC56CT-I/MNY 21794G.pdf
93LC56CT-I/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8, 128 x 16
DigiKey Programmable: Not Verified
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3300+24.60 грн
Мінімальне замовлення: 3300
В кошику  од. на суму  грн.
93LC56CT-I/MNY 21794G.pdf
93LC56CT-I/MNY
Виробник: Microchip Technology
Description: IC EEPROM 2KBIT MICROWIRE 8TDFN
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TDFN (2x3)
Write Cycle Time - Word, Page: 6ms
Memory Interface: Microwire
Memory Organization: 256 x 8, 128 x 16
DigiKey Programmable: Not Verified
на замовлення 3300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
12+27.17 грн
Мінімальне замовлення: 12
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ATWINC1500-MR210UB1977 ATWINC1500_%20Datasheet.PDF
Виробник: Microchip Technology
Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tray
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 500kB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.5dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 264mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: ATWINC1500B
Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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ATWINC1500-MR210UB1977-T ATWINC1500_%20Datasheet.PDF
Виробник: Microchip Technology
Description: SMARTCONNECT ATWINC1500 802.11B/
Packaging: Tape & Reel (TR)
Package / Case: 28-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 500kB Flash
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.5dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n
Current - Receiving: 61mA
Current - Transmitting: 264mA ~ 269mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: ATWINC1500B
Modulation: 16QAM, 64QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK
RF Family/Standard: WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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MAPLAD30KP120CA 9523-mplad30kp-datasheet
MAPLAD30KP120CA
Виробник: Microchip Technology
Description: TVS DIODE 120VWM 193VC PLAD
Packaging: Bulk
Package / Case: Nonstandard SMD
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 156A
Voltage - Reverse Standoff (Typ): 120V
Supplier Device Package: PLAD
Bidirectional Channels: 1
Voltage - Breakdown (Min): 133V
Voltage - Clamping (Max) @ Ipp: 193V
Power - Peak Pulse: 30000W (30kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MP4KE220CA 9517-mp4ke-pdf
MP4KE220CA
Виробник: Microchip Technology
Description: TVS DIODE 185VWM 328VC DO204AL
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 1A
Voltage - Reverse Standoff (Typ): 185V
Supplier Device Package: DO-204AL (DO-41)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 209V
Voltage - Clamping (Max) @ Ipp: 328V
Power - Peak Pulse: 400W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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WFI32E01UC-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E01UC-I
Виробник: Microchip Technology
Description: RF TXRX MODULE WIFI SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 216mA
Current - Transmitting: 340mA ~ 414mA
Antenna Type: Antenna Not Included
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
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WFI32E01PC-I PIC32MZ-W1-and-WFI32E01-Family-Data-Sheet-DS70005425.pdf
WFI32E01PC-I
Виробник: Microchip Technology
Description: RF TXRX MOD WIFI PCB TRACE SMD
Packaging: Tray
Package / Case: 54-SMD Module
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 1MB Flash, 256kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.97V ~ 3.63V
Power - Output: 20.5dBm
Data Rate: 54Mbps
Protocol: 802.11b/g/n
Current - Receiving: 216mA
Current - Transmitting: 340mA ~ 414mA
Antenna Type: PCB Trace
Utilized IC / Part: WFI32E01
RF Family/Standard: WiFi
Serial Interfaces: I2C, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
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DSC1122CL2-156.2500T
DSC1122CL2-156.2500T
Виробник: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.6V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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DSC1122CL2-156.2500 DSC1102-22-Low-Jitter-Precision-LVPECL-Oscillator-DS20006254A.pdf
DSC1122CL2-156.2500
Виробник: Microchip Technology
Description: MEMS OSC XO 156.2500MHZ LVPECL
Packaging: Strip
Package / Case: 6-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: LVPECL
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 2.25V ~ 3.63V
Current - Supply (Max): 58mA
Supplier Device Package: 6-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 156.25 MHz
Base Resonator: MEMS
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JANTX1N6165 127853-1n6138-1n6173a-tvs-diode-series-datasheet
Виробник: Microchip Technology
Description: TVS DIODE 69.2VWM 131.36VC AXIAL
Packaging: Bulk
Package / Case: Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -55°C ~ 175°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 11.4A
Voltage - Reverse Standoff (Typ): 69.2V
Supplier Device Package: C, Axial
Bidirectional Channels: 1
Voltage - Breakdown (Min): 82.18V
Voltage - Clamping (Max) @ Ipp: 131.36V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500/516
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MDA3KP7.0A MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf
Виробник: Microchip Technology
Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MDA3KP7.0AE3 MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf
Виробник: Microchip Technology
Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MXLDA3KP7.0A MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf
Виробник: Microchip Technology
Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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MXLDA3KP7.0AE3 MDA3KP6.0A%20to%20MDA3KP40A%20Datasheet.pdf
Виробник: Microchip Technology
Description: UNI-DIRECTIONAL TVS_16L DIP
Packaging: Tube
Package / Case: 16-SMD, Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 250A
Voltage - Reverse Standoff (Typ): 7V
Unidirectional Channels: 8
Voltage - Breakdown (Min): 7.78V
Voltage - Clamping (Max) @ Ipp: 12V
Power - Peak Pulse: 3000W (3kW)
Power Line Protection: No
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24CS512T-I/ST 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf
24CS512T-I/ST
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-I/ST 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf
24CS512T-I/ST
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
на замовлення 2470 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+91.60 грн
25+85.48 грн
100+81.81 грн
Мінімальне замовлення: 4
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24CS512T-E/ST 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf
24CS512T-E/ST
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/ST 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf
24CS512T-E/ST
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-TSSOP
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/Q6B66KVAO 24CS512-512-Kbit-3.4-MHz-I2C-Serial-EEPROM-with-128-Bit-Serial-Number-and-Enhanced-Software-Write-Protection.pdf
24CS512T-E/Q6B66KVAO
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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24CS512T-E/MUY
24CS512T-E/MUY
Виробник: Microchip Technology
Description: IC EEPROM 512KBIT I2C 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 5.5V
Technology: EEPROM
Clock Frequency: 3.4 MHz
Memory Format: EEPROM
Supplier Device Package: 8-UDFN (2x3)
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 400 ns
Memory Organization: 64K x 8
DigiKey Programmable: Not Verified
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PIC16LF18425-E/SL 40001894B.pdf
PIC16LF18425-E/SL
Виробник: Microchip Technology
Description: IC MCU 8BIT 14KB FLASH 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 14KB (8K x 14)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: PIC
Data Converters: A/D 11x12b; D/A 1x5b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EUSART, I2C, LINbus, MSSP, SMBus/PMBus, RS-232, RS-485, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 14-SOIC
Number of I/O: 11
DigiKey Programmable: Not Verified
на замовлення 570 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+104.02 грн
25+91.70 грн
100+82.74 грн
Мінімальне замовлення: 3
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SY58023UMG-TR sy58023u.pdf
SY58023UMG-TR
Виробник: Microchip Technology
Description: IC CROSSPOINT SWITCH 1X2:2 16MLF
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:2
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-MLF® (3x3)
на замовлення 975 шт:
термін постачання 21-31 дні (днів)
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SY58023UMG-TR sy58023u.pdf
SY58023UMG-TR
Виробник: Microchip Technology
Description: IC CROSSPOINT SWITCH 1X2:2 16MLF
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Circuit: 1 x 2:2
Type: Crosspoint Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V, 3V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 16-MLF® (3x3)
на замовлення 975 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1203.96 грн
25+966.10 грн
100+933.22 грн
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MCP2561FDT-E/MF 20005284A.pdf
MCP2561FDT-E/MF
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-DFN (3x3)
Receiver Hysteresis: 200 mV
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MCP2561FDT-E/MF 20005284A.pdf
MCP2561FDT-E/MF
Виробник: Microchip Technology
Description: IC TRANSCEIVER 1/1 8DFN
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-DFN (3x3)
Receiver Hysteresis: 200 mV
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2N1714
2N1714
Виробник: Microchip Technology
Description: TRANS NPN 60V 0.75A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Frequency - Transition: 16MHz
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1714S
2N1714S
Виробник: Microchip Technology
Description: TRANS NPN 60V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1716S
2N1716S
Виробник: Microchip Technology
Description: TRANS NPN 60V 0.75A TO39
Packaging: Bulk
Package / Case: TO-205AD, TO-39-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: -65°C ~ 175°C (TJ)
Supplier Device Package: TO-39 (TO-205AD)
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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2N1716
2N1716
Виробник: Microchip Technology
Description: TRANS NPN 60V 0.75A TO-5AA
Packaging: Bulk
Package / Case: TO-205AA, TO-5-3 Metal Can
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Supplier Device Package: TO-5AA
Current - Collector (Ic) (Max): 750 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
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MTCH1060-I/SS MTCH1060-Six-Channel-Capacitive-Touch-Controller-DS40002465.pdf
MTCH1060-I/SS
Виробник: Microchip Technology
Description: 6 CHANNEL TOUCH CONTROLLER, GPIO
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: Digital
Type: Buttons
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Number of Inputs: 6
Supplier Device Package: 20-SSOP
Proximity Detection: Yes
LED Driver Channels: Up to 6
на замовлення 1170 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+74.52 грн
25+65.51 грн
100+59.30 грн
Мінімальне замовлення: 5
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681-2P RF01151.pdf
Виробник: Microchip Technology
Description: DIODE MODULE GP 200V 15A ND
Packaging: Bulk
Package / Case: Nd
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 15A
Supplier Device Package: Nd
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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681-2 RF01151.pdf
Виробник: Microchip Technology
Description: DIODE MODULE GP 200V 15A ND
Packaging: Bulk
Package / Case: Nd
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 15A
Supplier Device Package: Nd
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 10 A
Current - Reverse Leakage @ Vr: 10 µA @ 200 V
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SST39SF040-70-4C-TU-T
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4C-TU
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4C-TU
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4C-TU-T
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-55-4I-TU
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4I-TU
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Bulk
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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SST39SF040-55-4I-TU-T
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 55 ns
Memory Organization: 512K x 8
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SST39SF040-70-4I-TU-T
Виробник: Microchip Technology
Description: 4.5V TO 5.5V 4MBIT MULTI-PURPOSE
Packaging: Tape & Reel (TR)
Package / Case: 32-TFSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FLASH - NOR (SLC)
Memory Format: FLASH
Supplier Device Package: 32-TSOP
Write Cycle Time - Word, Page: 10µs
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 512K x 8
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1N5533UR-1/TR 1N5518BUR-1-1N5546BUR-1.pdf
1N5533UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
на замовлення 146 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
146+427.28 грн
Мінімальне замовлення: 146
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1N5533UR-1/TR 1N5518BUR-1-1N5546BUR-1.pdf
1N5533UR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
на замовлення 146 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+460.32 грн
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1N5533CUR-1/TR 1N5518BUR-1-1N5546BUR-1.pdf
1N5533CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±2%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+844.17 грн
Мінімальне замовлення: 100
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1N5533CUR-1/TR 1N5518BUR-1-1N5546BUR-1.pdf
1N5533CUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±2%
Packaging: Cut Tape (CT)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
на замовлення 100 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+909.76 грн
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1N5533A
1N5533A
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±10%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533
1N5533
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533A/TR
1N5533A/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533/TR
1N5533/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±20%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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1N5533UR-1
1N5533UR-1
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±20%
Packaging: Bulk
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 10.5 V
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JANTX1N5533B-1 123956-lds-0037-1-datasheet
JANTX1N5533B-1
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANTX1N5533B-1/TR
JANTX1N5533B-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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JANHCA1N5533B 14809-military-qualified-die-chip
JANHCA1N5533B
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO204AH
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-204AH (DO-35)
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
Qualification: MIL-PRF-19500/437
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1N5533BUR-1/TR
1N5533BUR-1/TR
Виробник: Microchip Technology
Description: DIODE ZENER 13V 500MW DO213AA
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AA
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 13 V
Impedance (Max) (Zzt): 90 Ohms
Supplier Device Package: DO-213AA
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 10 nA @ 11.7 V
товару немає в наявності
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