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CDLL5529A/TR CDLL5529A/TR Microchip Technology Description: DIODE ZENER 9.1V 500MW DO213AB
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+69.00 грн
Мінімальне замовлення: 5000
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MCP22350T-1I/Q8X MCP22350T-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5350 шт:
термін постачання 21-31 дні (днів)
4+91.29 грн
25+73.24 грн
100+66.44 грн
Мінімальне замовлення: 4
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MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+69.78 грн
Мінімальне замовлення: 5000
В кошику  од. на суму  грн.
MCP22350T-2I/Q8X MCP22350T-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5347 шт:
термін постачання 21-31 дні (днів)
4+92.93 грн
25+74.00 грн
100+67.20 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
MCP22350-1I/Q8X MCP22350-1I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
4+91.29 грн
25+73.24 грн
100+66.44 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
MCP22350-2I/Q8X MCP22350-2I/Q8X Microchip Technology MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 230 шт:
термін постачання 21-31 дні (днів)
4+92.93 грн
25+74.00 грн
100+67.20 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
EV71V36A Microchip Technology Description: MCP22301 EPR SINK BOARD
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MCP22301
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+7100.72 грн
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1N758A 1N758A Microchip Technology 10928-sa5-7-datasheet Description: DIODE ZENER 10V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 8 V
на замовлення 127 шт:
термін постачання 21-31 дні (днів)
3+146.39 грн
100+131.60 грн
Мінімальне замовлення: 3
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1N1206AR 1N1206AR Microchip Technology 8545-coe-3-datasheet Description: DIODE STD REV 600V 12A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 38 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
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ATMEGA8-16PC ATMEGA8-16PC Microchip Technology ATmega8%28L%29%20Complete.pdf Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
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JAN1N4959D JAN1N4959D Microchip Technology 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959D JANTXV1N4959D Microchip Technology Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JAN1N4959DUS/TR JAN1N4959DUS/TR Microchip Technology 1N4460US-1N4496US.1N6485US-1NN6491US.pdf Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTX1N4959DUS/TR JANTX1N4959DUS/TR Microchip Technology 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959DUS JANTXV1N4959DUS Microchip Technology Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959DUS/TR JANTXV1N4959DUS/TR Microchip Technology 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959D JANS1N4959D Microchip Technology Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959DUS JANS1N4959DUS Microchip Technology 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf Description: DIODE ZENER 11V 5W D5B
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959DUS/TR JANS1N4959DUS/TR Microchip Technology Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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DSC6001HI2B-008.0000 DSC6001HI2B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001HI2B-008.0000T DSC6001HI2B-008.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001HI2B-020.0000 DSC6001HI2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001HI2B-016.0000 DSC6001HI2B-016.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC6001HI2B-020.0000T DSC6001HI2B-020.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001HI2B-016.0000T DSC6001HI2B-016.0000T Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0096 DSC6003JL3B-004.0096 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0096MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.0096 MHz
Base Resonator: MEMS
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DSC6011JI3B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6013JI2B-720K000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 720.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 720 kHz
Base Resonator: MEMS
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DSC6013JI2B-001.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6001JI2B-007.3728 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JL2B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JA1B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI2B-033.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 33.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33 MHz
Base Resonator: MEMS
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DSC6001JA3B-004.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6003JI2B-004.5000 DSC6003JI2B-004.5000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6001JE1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001JI3B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6003JI2B-012.0000 DSC6003JI2B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JA3B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI1B-080.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003JL3B-007.3728 DSC6003JL3B-007.3728 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6001MA2B-020.0000 DSC6001MA2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6013JI2B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI1B-035.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 35.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 35 MHz
Base Resonator: MEMS
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DSC6011JI1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6003JI1B-004.5000 DSC6003JI1B-004.5000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0960 DSC6003JL3B-004.0960 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC6011JI1B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JL2B-027.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-025.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-008.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001JI3B-003K200 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 3.2000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.2 kHz
Base Resonator: MEMS
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DSC6011JE3B-003K898 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 3.8980KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.898 kHz
Base Resonator: MEMS
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DSC6011JA2B-016K384 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 16.3840KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 kHz
Base Resonator: MEMS
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DSC6001JE2B-020.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001JA3B-024.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6003JI2B-001.0000 DSC6003JI2B-001.0000 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6003MA3B-032K768 DSC6003MA3B-032K768 Microchip Technology DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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CDLL5529A/TR
CDLL5529A/TR
Виробник: Microchip Technology
Description: DIODE ZENER 9.1V 500MW DO213AB
Tolerance: ±10%
Packaging: Tape & Reel (TR)
Package / Case: DO-213AB, MELF
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 45 Ohms
Supplier Device Package: DO-213AB
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 7 V
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+69.00 грн
Мінімальне замовлення: 5000
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MCP22350T-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-1I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+91.29 грн
25+73.24 грн
100+66.44 грн
Мінімальне замовлення: 4
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+69.78 грн
Мінімальне замовлення: 5000
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MCP22350T-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350T-2I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Cut Tape (CT)
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 5347 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.93 грн
25+74.00 грн
100+67.20 грн
Мінімальне замовлення: 4
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MCP22350-1I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350-1I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 350 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+91.29 грн
25+73.24 грн
100+66.44 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
MCP22350-2I/Q8X MCP22350-Integrated-Small-Form-Factor-USB-Type-C-Data-Sheet-DS20006885.pdf
MCP22350-2I/Q8X
Виробник: Microchip Technology
Description: HIGHLY INTEGRATED SMALL FORM FAC
Packaging: Tray
Package / Case: 28-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3.1V ~ 3.47V, 4.75V ~ 5.25V
Protocol: USB
Standards: USB 3.1
Supplier Device Package: 28-QFN (4x4)
на замовлення 230 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.93 грн
25+74.00 грн
100+67.20 грн
Мінімальне замовлення: 4
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EV71V36A
Виробник: Microchip Technology
Description: MCP22301 EPR SINK BOARD
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MCP22301
Embedded: No
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7100.72 грн
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1N758A 10928-sa5-7-datasheet
1N758A
Виробник: Microchip Technology
Description: DIODE ZENER 10V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 10 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Current - Reverse Leakage @ Vr: 1 µA @ 8 V
на замовлення 127 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+146.39 грн
100+131.60 грн
Мінімальне замовлення: 3
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1N1206AR 8545-coe-3-datasheet
1N1206AR
Виробник: Microchip Technology
Description: DIODE STD REV 600V 12A DO203AA
Packaging: Bulk
Package / Case: DO-203AA, DO-4, Stud
Mounting Type: Stud Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard, Reverse Polarity
Current - Average Rectified (Io): 12A
Supplier Device Package: DO-203AA (DO-4)
Operating Temperature - Junction: -65°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 38 A
Current - Reverse Leakage @ Vr: 5 µA @ 600 V
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ATMEGA8-16PC ATmega8%28L%29%20Complete.pdf
ATMEGA8-16PC
Виробник: Microchip Technology
Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 8KB (4K x 16)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: AVR
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PDIP
Number of I/O: 23
DigiKey Programmable: Not Verified
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JAN1N4959D 1N4954-1N4996%2C15968-1N5969%2C1N6632-1N6637.pdf
JAN1N4959D
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959D
JANTXV1N4959D
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JAN1N4959DUS/TR 1N4460US-1N4496US.1N6485US-1NN6491US.pdf
JAN1N4959DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTX1N4959DUS/TR 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf
JANTX1N4959DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959DUS
JANTXV1N4959DUS
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANTXV1N4959DUS/TR 1N4954US-1N4996US%2C%201N5968US-1N5969US%2C%201N6632US-1N6637US.pdf
JANTXV1N4959DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959D
JANS1N4959D
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-AXIAL
Tolerance: ±1%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959DUS 1N4954US-96US%2C1N5968US-69US%2C1N6632US-1N6637US.pdf
JANS1N4959DUS
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W D5B
Tolerance: ±1%
Packaging: Bulk
Package / Case: SQ-MELF, E
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: D-5B
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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JANS1N4959DUS/TR
JANS1N4959DUS/TR
Виробник: Microchip Technology
Description: DIODE ZENER 11V 5W E-MELF
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 11 V
Impedance (Max) (Zzt): 2.5 Ohms
Supplier Device Package: E-MELF
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 8.4 V
Qualification: MIL-PRF-19500/356
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DSC6001HI2B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-008.0000
Виробник: Microchip Technology
Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001HI2B-008.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133A.pdf
DSC6001HI2B-008.0000T
Виробник: Microchip Technology
Description: MEMS OSC ULP LVCMOS -40C-85C 25P
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Ratings: AEC-Q100
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001HI2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-020.0000
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001HI2B-016.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-016.0000
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Bag
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC6001HI2B-020.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-020.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001HI2B-016.0000T DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001HI2B-016.0000T
Виробник: Microchip Technology
Description: MEMS OSC., ULTRA LOW POWER, LVCM
Packaging: Tape & Reel (TR)
Package / Case: 4-VFLGA
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (1.6x1.2)
Height - Seated (Max): 0.035" (0.89mm)
Frequency: 16 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0096 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-004.0096
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0096MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.0096 MHz
Base Resonator: MEMS
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DSC6011JI3B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6013JI2B-720K000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 720.0000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 720 kHz
Base Resonator: MEMS
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DSC6013JI2B-001.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6001JI2B-007.3728 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6011JL2B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JA1B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI2B-033.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 33.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 33 MHz
Base Resonator: MEMS
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DSC6001JA3B-004.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4 MHz
Base Resonator: MEMS
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DSC6003JI2B-004.5000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-004.5000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6001JE1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6001JI3B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6003JI2B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-012.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6001JA3B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6011JI1B-080.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 80.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 80 MHz
Base Resonator: MEMS
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DSC6003JL3B-007.3728 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-007.3728
Виробник: Microchip Technology
Description: MEMS OSC XO 7.3728MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 7.3728 MHz
Base Resonator: MEMS
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DSC6001MA2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6001MA2B-020.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6013JI2B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JI1B-035.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 35.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 35 MHz
Base Resonator: MEMS
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DSC6011JI1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-012.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 12.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 12 MHz
Base Resonator: MEMS
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DSC6003JI1B-004.5000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI1B-004.5000
Виробник: Microchip Technology
Description: MEMS OSC XO 4.5000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.5 MHz
Base Resonator: MEMS
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DSC6003JL3B-004.0960 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JL3B-004.0960
Виробник: Microchip Technology
Description: MEMS OSC XO 4.0960MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 4.096 MHz
Base Resonator: MEMS
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DSC6011JI1B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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DSC6001JL2B-027.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 27.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 105°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 27 MHz
Base Resonator: MEMS
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DSC6001JI1B-025.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 25.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 25 MHz
Base Resonator: MEMS
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DSC6011JI1B-008.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 8.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 8 MHz
Base Resonator: MEMS
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DSC6001JI3B-003K200 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 3.2000KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.2 kHz
Base Resonator: MEMS
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DSC6011JE3B-003K898 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 3.8980KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 3.898 kHz
Base Resonator: MEMS
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DSC6011JA2B-016K384 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 16.3840KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 kHz
Base Resonator: MEMS
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DSC6001JE2B-020.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 20.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 20 MHz
Base Resonator: MEMS
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DSC6001JA3B-024.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
Виробник: Microchip Technology
Description: MEMS OSC XO 24.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 24 MHz
Base Resonator: MEMS
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DSC6003JI2B-001.0000 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003JI2B-001.0000
Виробник: Microchip Technology
Description: MEMS OSC XO 1.0000MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VLGA
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±25ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VLGA (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 1 MHz
Base Resonator: MEMS
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DSC6003MA3B-032K768 DSC60xxB-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20006133.pdf
DSC6003MA3B-032K768
Виробник: Microchip Technology
Description: MEMS OSC XO 32.7680KHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VFLGA
Size / Dimension: 0.079" L x 0.063" W (2.00mm x 1.60mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Enable/Disable
Type: XO (Standard)
Operating Temperature: -40°C ~ 125°C
Frequency Stability: ±20ppm
Voltage - Supply: 1.71V ~ 3.63V
Current - Supply (Max): 1.3mA (Typ)
Supplier Device Package: 4-VFLGA (2x1.6)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 32.768 kHz
Base Resonator: MEMS
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