Продукція > MICROCHIP TECHNOLOGY > Всі товари виробника MICROCHIP TECHNOLOGY (277032) > Сторінка 1957 з 4618
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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dsPIC33CK256MC505T-I/M7 | Microchip Technology |
Description: IC MCU 16BIT 256KB FLASH 48VQFNConnectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 20x12b SAR; D/A 2x12b Core Processor: dsPIC Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MIPs Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-VQFN (6x6) Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT |
товару немає в наявності |
Мінімальне замовлення: 3300 шт В кошику од. на суму грн. | ||||||
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dsPIC33CK256MC505-E/M7 | Microchip Technology |
Description: IC MCU 16BIT 256KB FLASH 48VQFNProgram Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 100MIPs Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-VQFN (6x6) Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 20x12b SAR; D/A 2x12b Core Processor: dsPIC |
товару немає в наявності |
Мінімальне замовлення: 427 шт В кошику од. на суму грн. | ||||||
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ATSAM3S1AA-MUR | Microchip Technology |
Description: IC MCU 32BIT 64KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 34 Supplier Device Package: 48-QFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 8x10/12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 3500 шт В кошику од. на суму грн. | ||||||
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PIC32CM2532LE00048-E/U5B | Microchip Technology |
Description: CM23, ULP, TOUCH, 256K FLASH, 48Number of I/O: 34 Supplier Device Package: 48-VQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V Core Size: 32-Bit Data Converters: A/D 14x12b; D/A 2x12b Core Processor: ARM® Cortex®-M23 EEPROM Size: 8K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 416 шт В кошику од. на суму грн. | ||||||
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PIC32CM2532LE00048T-E/U5B | Microchip Technology |
Description: CM23, ULP, TOUCH, 256K FLASH, 48Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) Number of I/O: 34 Supplier Device Package: 48-VQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V Core Size: 32-Bit Data Converters: A/D 14x12b; D/A 2x12b Core Processor: ARM® Cortex®-M23 EEPROM Size: 8K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||
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PIC32CM2532LS00048-E/U5B | Microchip Technology |
Description: CM23, ULP, TOUCH, SECURITY, 256KNumber of I/O: 34 Supplier Device Package: 48-VQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V Core Size: 32-Bit Data Converters: A/D 14x12b; D/A 2x12b Core Processor: ARM® Cortex®-M23 EEPROM Size: 8K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 416 шт В кошику од. на суму грн. | ||||||
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PIC32CM2532LS00048T-E/U5B | Microchip Technology |
Description: CM23, ULP, TOUCH, SECURITY, 256KNumber of I/O: 34 Supplier Device Package: 48-VQFN (7x7) Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V Core Size: 32-Bit Data Converters: A/D 14x12b; D/A 2x12b Core Processor: ARM® Cortex®-M23 EEPROM Size: 8K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||
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1N5246 | Microchip Technology |
Description: DIODE ZENER 16V 500MW DO204AHTolerance: ±5% Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 16 V Impedance (Max) (Zzt): 17 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V |
товару немає в наявності |
Мінімальне замовлення: 242 шт В кошику од. на суму грн. | ||||||
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1N759A | Microchip Technology |
Description: DIODE ZENER 12V 500MW DO204AHOperating Temperature: -65°C ~ 175°C Mounting Type: Through Hole Package / Case: DO-204AH, DO-35, Axial Tolerance: ±5% Packaging: Bulk Current - Reverse Leakage @ Vr: 1 µA @ 9 V Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA Power - Max: 500 mW Supplier Device Package: DO-204AH (DO-35) Impedance (Max) (Zzt): 30 Ohms Voltage - Zener (Nom) (Vz): 12 V |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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APTGX600SK120T6G | Microchip Technology |
Description: IGBT MODULE 1200V 805A 1.923KWPackaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Chopper Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A NTC Thermistor: Yes Current - Collector (Ic) (Max): 805 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 1923 W Current - Collector Cutoff (Max): 50 µA Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| MO-9150AE-6E-HS-133M000000 | Microchip Technology |
Description: MEMS BASED XO +2.5 VDC -40C TO + Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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PIC18F55Q43-I/6LX | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 48VQFNPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: PIC Data Converters: A/D 43x12b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Number of I/O: 44 DigiKey Programmable: Not Verified |
на замовлення 284 шт: термін постачання 21-31 дні (днів) |
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PIC18F55Q43-E/6LX | Microchip Technology |
Description: IC MCU 8BIT 32KB FLASH 48VQFNPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: PIC Data Converters: A/D 43x12b; D/A 1x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Number of I/O: 44 DigiKey Programmable: Not Verified |
на замовлення 181 шт: термін постачання 21-31 дні (днів) |
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1N5261B | Microchip Technology |
Description: DIODE ZENER 47V 500MW DO204AHTolerance: ±5% Packaging: Bulk Package / Case: DO-204AH, DO-35, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C (TJ) Voltage - Zener (Nom) (Vz): 47 V Impedance (Max) (Zzt): 105 Ohms Supplier Device Package: DO-204AH (DO-35) Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA Current - Reverse Leakage @ Vr: 100 nA @ 36 V |
товару немає в наявності |
Мінімальне замовлення: 447 шт В кошику од. на суму грн. | ||||||
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UPT17E3/TR7 | Microchip Technology |
Description: TVS DIODE 17VWM 29.2VC POWERMIT1Packaging: Tape & Reel (TR) Package / Case: DO-216AA Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 5.14A Voltage - Reverse Standoff (Typ): 17V Supplier Device Package: Powermite 1 (DO216-AA) Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 29.2V Power - Peak Pulse: 1000W (1kW) Power Line Protection: No |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | ||||||
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MAUPT17 | Microchip Technology |
Description: TVS DIODE 17VWM 29.2VC POWERMIT1 Packaging: Bulk Package / Case: DO-216AA Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 5.14A Voltage - Reverse Standoff (Typ): 17V Supplier Device Package: Powermite 1 (DO216-AA) Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 29.2V Power - Peak Pulse: 1000W (1kW) Power Line Protection: No |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||
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MAUPT17e3 | Microchip Technology |
Description: TVS DIODE 17VWM 29.2VC POWERMIT1 Packaging: Bulk Package / Case: DO-216AA Mounting Type: Surface Mount Type: Zener Operating Temperature: -65°C ~ 150°C (TJ) Applications: General Purpose Current - Peak Pulse (10/1000µs): 5.14A Voltage - Reverse Standoff (Typ): 17V Supplier Device Package: Powermite 1 (DO216-AA) Unidirectional Channels: 1 Voltage - Breakdown (Min): 19V Voltage - Clamping (Max) @ Ipp: 29.2V Power - Peak Pulse: 1000W (1kW) Power Line Protection: No |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||
| JANTX1N4957C | Microchip Technology |
Description: DIODE ZENER 9.1V 5W E-AXIALTolerance: ±2% Packaging: Bulk Package / Case: E, Axial Mounting Type: Through Hole Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 9.1 V Impedance (Max) (Zzt): 2 Ohms Supplier Device Package: E, Axial Grade: Military Power - Max: 5 W Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V Qualification: MIL-PRF-19500/435 |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | |||||||
| MCP1725-1802E/MCVAO | Microchip Technology |
Description: 500MA, LOW VOLTAGE LDOPackaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 600 шт В кошику од. на суму грн. | |||||||
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MCP1405T-E/SNVAO | Microchip Technology |
Description: IC GATE DRVR LOW-SIDE 8SOICPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 18V Input Type: Inverting, Non-Inverting Supplier Device Package: 8-SOIC Rise / Fall Time (Typ): 15ns, 18ns Channel Type: Independent Driven Configuration: Low-Side Number of Drivers: 2 Gate Type: IGBT, MOSFET (N-Channel, P-Channel) Logic Voltage - VIL, VIH: 0.8V, 2.4V Current - Peak Output (Source, Sink): 4.5A, 4.5A Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 3300 шт В кошику од. на суму грн. | ||||||
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MCP1405T-E/SNVAO | Microchip Technology |
Description: IC GATE DRVR LOW-SIDE 8SOICPackaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 18V Input Type: Inverting, Non-Inverting Supplier Device Package: 8-SOIC Rise / Fall Time (Typ): 15ns, 18ns Channel Type: Independent Driven Configuration: Low-Side Number of Drivers: 2 Gate Type: IGBT, MOSFET (N-Channel, P-Channel) Logic Voltage - VIL, VIH: 0.8V, 2.4V Current - Peak Output (Source, Sink): 4.5A, 4.5A Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| VCC1-1519-12M28800000 | Microchip Technology |
Description: CUSTOM CMOS XOPackaging: Tape & Reel (TR) Package / Case: 4-SMD, No Lead Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm) Mounting Type: Surface Mount Output: CMOS Type: XO (Standard) Height - Seated (Max): 0.075" (1.90mm) Frequency: 12.288 MHz Base Resonator: Crystal |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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MPFS-ICICLE-KIT | Microchip Technology |
Description: POLARFIRE SOC FPGA ICICLE KITPackaging: Bulk Type: FPGA + MCU/MPU SoC Contents: Board(s), Cable(s), Power Supply Utilized IC / Part: MPFS250 Platform: PolarFire SoC FPGA SiFive RISC-V Icicle |
на замовлення 150 шт: термін постачання 21-31 дні (днів) |
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EV25F14A | Microchip Technology |
Description: RNBD451 ADD ON BOARDPackaging: Box Function: Bluetooth Low Energy (BLE) Type: RF Contents: Board(s) Utilized IC / Part: RNBD451 Platform: mikroBUS™ Click™ |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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dsPIC33AK256MC505-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPLQualification: AEC-Q100 Number of I/O: 31 Grade: Automotive Supplier Device Package: 48-VQFN (6x6) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, QEI, SENT, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 18x12b Core Processor: dsPIC33A Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 200MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tube |
на замовлення 305 шт: термін постачання 21-31 дні (днів) |
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dsPIC33AK512MC205-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 555 шт: термін постачання 21-31 дні (днів) |
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dsPIC33AK512MC505-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 555 шт: термін постачання 21-31 дні (днів) |
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dsPIC33AK256MPS205-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 295 шт: термін постачання 21-31 дні (днів) |
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dsPIC33AK512MPS205-I/M7 | Microchip Technology |
Description: 200 MHZ, 512KB FLASH, FUSA-COMPLPackaging: Tube Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 200MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: dsPIC33A Data Converters: A/D 18x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: I2C, QEI, SENT, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 48-VQFN (6x6) Grade: Automotive Number of I/O: 31 Qualification: AEC-Q100 |
на замовлення 226 шт: термін постачання 21-31 дні (днів) |
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DSPIC33AK256MC205-I/M7 | Microchip Technology |
Description: 200 MHZ, 256KB FLASH, FUSA-COMPLQualification: AEC-Q100 Number of I/O: 31 Grade: Automotive Supplier Device Package: 48-VQFN (6x6) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, QEI, SENT, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 18x12b Core Processor: dsPIC33A Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 256KB (256K x 8) Speed: 200MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tube |
на замовлення 244 шт: термін постачання 21-31 дні (днів) |
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| MO9168 | Microchip Technology |
Description: CLOCK OSCILLATOR Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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DSC1001CE1-037.1250T | Microchip Technology |
Description: MEMS OSC XO 37.1250MHZ CMOS SMDPackaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 1.7V ~ 3.6V Current - Supply (Max): 10.5mA Supplier Device Package: 4-VDFN (3.2x2.5) Height - Seated (Max): 0.035" (0.90mm) Frequency: 37.125 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DSC1001CE1-037.1250 | Microchip Technology |
Description: MEMS OSC XO 37.1250MHZ CMOS SMDPackaging: Strip Package / Case: 4-VDFN Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm) Mounting Type: Surface Mount Output: CMOS Function: Standby (Power Down) Type: XO (Standard) Operating Temperature: -20°C ~ 70°C Frequency Stability: ±50ppm Voltage - Supply: 1.7V ~ 3.6V Current - Supply (Max): 10.5mA Supplier Device Package: 4-VDFN (3.2x2.5) Height - Seated (Max): 0.035" (0.90mm) Frequency: 37.125 MHz Base Resonator: MEMS |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MSC010SDA070S | Microchip Technology |
Description: DIODE SIL CARBIDE 700V 10A D3PAKPackaging: Bulk Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA Mounting Type: Surface Mount Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Current - Average Rectified (Io): 10A Supplier Device Package: D3Pak Voltage - DC Reverse (Vr) (Max): 700 V |
товару немає в наявності |
Мінімальне замовлення: 270 шт В кошику од. на суму грн. | ||||||
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EV18H47A | Microchip Technology |
Description: EVAL BOARD FOR ATSAME70N21Packaging: Box Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: ATSAME70N21 Secondary Attributes: On-Board LEDs Embedded: Yes, MCU |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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EV42J24A | Microchip Technology |
Description: CEC1736 EVALUATION BOARD Packaging: Bulk Mounting Type: Socket Type: MCU 32-Bit Contents: Board(s), Cable(s), Accessories Core Processor: ARM® Cortex®-M4 Utilized IC / Part: CEC1736 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| VX-805-ECE-KEXN-204M800000 | Microchip Technology |
Description: LOW NOISE CERAMIC VCXO +3.3 VDCPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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JANS1N6319CUS | Microchip Technology |
Description: DIODE ZENER 6.2V 500MW SQ-MELF Tolerance: ±2% Packaging: Bulk Package / Case: SQ-MELF, B Mounting Type: Surface Mount Operating Temperature: -65°C ~ 175°C Voltage - Zener (Nom) (Vz): 6.2 V Impedance (Max) (Zzt): 3 Ohms Supplier Device Package: B, SQ-MELF Grade: Military Power - Max: 500 mW Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V Qualification: MIL-PRF-19500/533 |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||
|
MIC2951-03BN | Microchip Technology |
Description: IC REG LIN POS ADJ 150MA 8-PDIPPackaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Output Type: Adjustable (Fixed) Mounting Type: Through Hole Current - Output: 150mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 300 µA Voltage - Input (Max): 30V Number of Regulators: 1 Supplier Device Package: 8-PDIP Voltage - Output (Max): 29V Voltage - Output (Min/Fixed): 1.24V (5V) Control Features: Enable Voltage Dropout (Max): 0.6V @ 150mA Protection Features: Over Current, Over Temperature, Reverse Polarity Current - Supply (Max): 8 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MCP41U83T-103E/ST | Microchip Technology |
Description: 10BIT I2C/SPI 1-CH DIGI POT WITHResistance (Ohms): 10k Packaging: Tape & Reel (TR) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Type: Non-Volatile Interface: SPI Configuration: Potentiometer, Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 1024 Voltage - Supply: 2.7V ~ 5.5V Taper: Linear Supplier Device Package: 14-TSSOP Resistance - Wiper (Ohms) (Typ): 19 Temperature Coefficient (Typ): 25ppm/°C Number of Circuits: 1 |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||
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MCP41U83T-103E/ST | Microchip Technology |
Description: 10BIT I2C/SPI 1-CH DIGI POT WITHResistance (Ohms): 10k Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Memory Type: Non-Volatile Interface: SPI Configuration: Potentiometer, Rheostat Operating Temperature: -40°C ~ 125°C Number of Taps: 1024 Voltage - Supply: 2.7V ~ 5.5V Taper: Linear Supplier Device Package: 14-TSSOP Resistance - Wiper (Ohms) (Typ): 19 Temperature Coefficient (Typ): 25ppm/°C Number of Circuits: 1 |
на замовлення 189 шт: термін постачання 21-31 дні (днів) |
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MSC400SMA330B4N | Microchip Technology |
Description: MOSFET SIC 3300V 400 MOHM TO-247Packaging: Tube Package / Case: TO-247-4 Mounting Type: Through Hole Operating Temperature: -55°C ~ 150°C (TJ) Technology: SiCFET (Silicon Carbide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 11A (Tc) Rds On (Max) @ Id, Vgs: 520mOhm @ 5A, 20V Power Dissipation (Max): 131W (Tc) Vgs(th) (Max) @ Id: 2.97V @ 1mA Supplier Device Package: TO-247-4 Drive Voltage (Max Rds On, Min Rds On): 20V Vgs (Max): +23V, -10V Drain to Source Voltage (Vdss): 3300 V Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 20 V Input Capacitance (Ciss) (Max) @ Vds: 579 pF @ 2400 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MSC035SMA070J | Microchip Technology |
Description: MOSFET SIC 700 V 35 MOHM SOT-227Packaging: Box Package / Case: SOT-227-4, miniBLOC Mounting Type: Chassis Mount Technology: SiCFET (Silicon Carbide) FET Type: N-Channel Supplier Device Package: SOT-227 (ISOTOP®) Drain to Source Voltage (Vdss): 700 V |
товару немає в наявності |
Мінімальне замовлення: 30 шт В кошику од. на суму грн. | ||||||
| VCC1-B3F-65M0000000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
|
VCC1-B3F-66M0000000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
| VCC1-B3F-66M6660000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| VCC1-B3F-66M6667000 | Microchip Technology |
Description: CMOS XO +3.3 VDC 15PF -40C TO +8Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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25CS640T-I/Q4B | Microchip Technology |
Description: IC EEPROM 64KBIT SPI 8UDFNMemory Organization: 8K x 8 Access Time: 20 ns Memory Interface: SPI Write Cycle Time - Word, Page: 4ms Supplier Device Package: 8-UDFN (2x3) Memory Format: EEPROM Clock Frequency: 20 MHz Technology: EEPROM Voltage - Supply: 1.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Memory Type: Non-Volatile Memory Size: 64Kbit Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Packaging: Tape & Reel (TR) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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25CS640T-I/Q4B | Microchip Technology |
Description: IC EEPROM 64KBIT SPI 8UDFNMemory Interface: SPI Write Cycle Time - Word, Page: 4ms Supplier Device Package: 8-UDFN (2x3) Memory Format: EEPROM Clock Frequency: 20 MHz Technology: EEPROM Voltage - Supply: 1.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Memory Type: Non-Volatile Memory Size: 64Kbit Mounting Type: Surface Mount Package / Case: 8-UFDFN Exposed Pad Packaging: Cut Tape (CT) Memory Organization: 8K x 8 Access Time: 20 ns |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MPF100TC-FCSG325I | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray Package / Case: 325-LFBGA, FC Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 109000 Supplier Device Package: 325-FCBGA (11x14.5) Number of LABs/CLBs: 27250 Total RAM Bits: 7969178 Number of I/O: 170 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MPF100TC-FCG484I | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray Package / Case: 484-BBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 109000 Supplier Device Package: 484-FCBGA (23x23) Number of LABs/CLBs: 27250 Total RAM Bits: 7969178 Number of I/O: 244 |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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| MPF100TC-FCVG484I | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray Package / Case: 484-BFBGA, FCBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 109000 Supplier Device Package: 484-FCBGA (19x19) Number of LABs/CLBs: 27250 Total RAM Bits: 7969178 Number of I/O: 284 |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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MPF100TC-FCSG325E | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 176 шт В кошику од. на суму грн. | ||||||
| MPF100TC-FCG484E | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||
| MPF100TC-FCVG484E | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLESPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | |||||||
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MPF100TC-FCSG325T2 | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLES Packaging: Tray Package / Case: 325-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 0.97V ~ 1.08V Number of Logic Elements/Cells: 109000 Supplier Device Package: 325-BGA (11x11) Number of LABs/CLBs: 27250 Total RAM Bits: 7969178 Grade: Automotive Number of I/O: 170 Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 176 шт В кошику од. на суму грн. | ||||||
| MPF100TC-FCVG484T2 | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLES Voltage - Supply: 0.97V ~ 1.08V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray Qualification: AEC-Q100 Number of I/O: 284 Grade: Automotive Total RAM Bits: 7969178 Number of LABs/CLBs: 27250 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 109000 |
товару немає в наявності |
Мінімальне замовлення: 84 шт В кошику од. на суму грн. | |||||||
| MPF100TS-FCVG484T2 | Microchip Technology |
Description: POLARFIRE MID-RANGE FPGA, 109KLEQualification: AEC-Q100 Number of I/O: 284 Grade: Automotive Total RAM Bits: 7969178 Number of LABs/CLBs: 27250 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 109000 Voltage - Supply: 0.97V ~ 1.08V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
| MPF100TS-1FCVG484T2 | Microchip Technology |
Description: POLARFIRE MID-RANGE FPGA, 109KLEQualification: AEC-Q100 Number of I/O: 284 Grade: Automotive Total RAM Bits: 7969178 Number of LABs/CLBs: 27250 Supplier Device Package: 484-FCBGA (19x19) Number of Logic Elements/Cells: 109000 Voltage - Supply: 0.97V ~ 1.08V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BFBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
|
MPF100TC-FCG484T2 | Microchip Technology |
Description: POLARFIRE CORE FPGA, 109KLES Supplier Device Package: 484-FCBGA (23x23) Number of Logic Elements/Cells: 109000 Voltage - Supply: 0.97V ~ 1.08V Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 484-BBGA, FCBGA Packaging: Tray Qualification: AEC-Q100 Number of I/O: 244 Grade: Automotive Total RAM Bits: 7969178 Number of LABs/CLBs: 27250 |
товару немає в наявності |
В кошику од. на суму грн. |
| dsPIC33CK256MC505T-I/M7 |
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Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
товару немає в наявності
Мінімальне замовлення: 3300 шт
В кошику
од. на суму грн.
| dsPIC33CK256MC505-E/M7 |
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Виробник: Microchip Technology
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
Description: IC MCU 16BIT 256KB FLASH 48VQFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MIPs
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, QEI, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SPI, Smart Card, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 20x12b SAR; D/A 2x12b
Core Processor: dsPIC
товару немає в наявності
Мінімальне замовлення: 427 шт
В кошику
од. на суму грн.
| ATSAM3S1AA-MUR |
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Виробник: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10/12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 64KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-QFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 8x10/12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 3500 шт
В кошику
од. на суму грн.
| PIC32CM2532LE00048-E/U5B |
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Виробник: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 416 шт
В кошику
од. на суму грн.
| PIC32CM2532LE00048T-E/U5B |
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Виробник: Microchip Technology
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Description: CM23, ULP, TOUCH, 256K FLASH, 48
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| PIC32CM2532LS00048-E/U5B |
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Виробник: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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Мінімальне замовлення: 416 шт
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| PIC32CM2532LS00048T-E/U5B |
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Виробник: Microchip Technology
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: CM23, ULP, TOUCH, SECURITY, 256K
Number of I/O: 34
Supplier Device Package: 48-VQFN (7x7)
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 14x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M23
EEPROM Size: 8K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 4000 шт
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| 1N5246 |
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Виробник: Microchip Technology
Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
Description: DIODE ZENER 16V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 16 V
Impedance (Max) (Zzt): 17 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 11.4 V
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Мінімальне замовлення: 242 шт
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| 1N759A |
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Виробник: Microchip Technology
Description: DIODE ZENER 12V 500MW DO204AH
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 12 V
Description: DIODE ZENER 12V 500MW DO204AH
Operating Temperature: -65°C ~ 175°C
Mounting Type: Through Hole
Package / Case: DO-204AH, DO-35, Axial
Tolerance: ±5%
Packaging: Bulk
Current - Reverse Leakage @ Vr: 1 µA @ 9 V
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 200 mA
Power - Max: 500 mW
Supplier Device Package: DO-204AH (DO-35)
Impedance (Max) (Zzt): 30 Ohms
Voltage - Zener (Nom) (Vz): 12 V
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 135.91 грн |
| APTGX600SK120T6G |
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Виробник: Microchip Technology
Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1923 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
Description: IGBT MODULE 1200V 805A 1.923KW
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 600A
NTC Thermistor: Yes
Current - Collector (Ic) (Max): 805 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1923 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 120000 pF @ 25 V
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 12291.00 грн |
| MO-9150AE-6E-HS-133M000000 |
Виробник: Microchip Technology
Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
Description: MEMS BASED XO +2.5 VDC -40C TO +
Packaging: Tape & Reel (TR)
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| PIC18F55Q43-I/6LX |
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Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 284 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 114.17 грн |
| 25+ | 100.75 грн |
| 100+ | 91.08 грн |
| PIC18F55Q43-E/6LX |
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Виробник: Microchip Technology
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48VQFN
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: PIC
Data Converters: A/D 43x12b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Number of I/O: 44
DigiKey Programmable: Not Verified
на замовлення 181 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 125.81 грн |
| 25+ | 110.45 грн |
| 100+ | 100.12 грн |
| 1N5261B |
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Виробник: Microchip Technology
Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
Description: DIODE ZENER 47V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 47 V
Impedance (Max) (Zzt): 105 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 36 V
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Мінімальне замовлення: 447 шт
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| UPT17E3/TR7 |
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Виробник: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Tape & Reel (TR)
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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Мінімальне замовлення: 3000 шт
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| MAUPT17 |
Виробник: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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Мінімальне замовлення: 100 шт
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| MAUPT17e3 |
Виробник: Microchip Technology
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
Description: TVS DIODE 17VWM 29.2VC POWERMIT1
Packaging: Bulk
Package / Case: DO-216AA
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.14A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: Powermite 1 (DO216-AA)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 19V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1000W (1kW)
Power Line Protection: No
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Мінімальне замовлення: 100 шт
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| JANTX1N4957C |
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Виробник: Microchip Technology
Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
Description: DIODE ZENER 9.1V 5W E-AXIAL
Tolerance: ±2%
Packaging: Bulk
Package / Case: E, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 9.1 V
Impedance (Max) (Zzt): 2 Ohms
Supplier Device Package: E, Axial
Grade: Military
Power - Max: 5 W
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 1 A
Current - Reverse Leakage @ Vr: 25 µA @ 6.9 V
Qualification: MIL-PRF-19500/435
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Мінімальне замовлення: 100 шт
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| MCP1725-1802E/MCVAO |
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товару немає в наявності
Мінімальне замовлення: 600 шт
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| MCP1405T-E/SNVAO |
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Виробник: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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Мінімальне замовлення: 3300 шт
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| MCP1405T-E/SNVAO |
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Виробник: Microchip Technology
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 18V
Input Type: Inverting, Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 18ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel, P-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.4V
Current - Peak Output (Source, Sink): 4.5A, 4.5A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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| VCC1-1519-12M28800000 |
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Виробник: Microchip Technology
Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
Description: CUSTOM CMOS XO
Packaging: Tape & Reel (TR)
Package / Case: 4-SMD, No Lead
Size / Dimension: 0.276" L x 0.197" W (7.00mm x 5.00mm)
Mounting Type: Surface Mount
Output: CMOS
Type: XO (Standard)
Height - Seated (Max): 0.075" (1.90mm)
Frequency: 12.288 MHz
Base Resonator: Crystal
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| MPFS-ICICLE-KIT |
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Виробник: Microchip Technology
Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
Description: POLARFIRE SOC FPGA ICICLE KIT
Packaging: Bulk
Type: FPGA + MCU/MPU SoC
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MPFS250
Platform: PolarFire SoC FPGA SiFive RISC-V Icicle
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 27923.86 грн |
| EV25F14A |
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Виробник: Microchip Technology
Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
Description: RNBD451 ADD ON BOARD
Packaging: Box
Function: Bluetooth Low Energy (BLE)
Type: RF
Contents: Board(s)
Utilized IC / Part: RNBD451
Platform: mikroBUS™ Click™
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1069.42 грн |
| dsPIC33AK256MC505-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
на замовлення 305 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 189.50 грн |
| 25+ | 165.37 грн |
| 100+ | 150.50 грн |
| dsPIC33AK512MC205-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 555 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 191.05 грн |
| 25+ | 167.28 грн |
| 100+ | 152.44 грн |
| dsPIC33AK512MC505-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 555 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 194.16 грн |
| 25+ | 169.23 грн |
| 100+ | 154.38 грн |
| dsPIC33AK256MPS205-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 295 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 202.70 грн |
| 25+ | 176.98 грн |
| 100+ | 160.84 грн |
| dsPIC33AK512MPS205-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
Description: 200 MHZ, 512KB FLASH, FUSA-COMPL
Packaging: Tube
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 200MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: dsPIC33A
Data Converters: A/D 18x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-VQFN (6x6)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
на замовлення 226 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 207.36 грн |
| 25+ | 181.49 грн |
| 100+ | 164.71 грн |
| DSPIC33AK256MC205-I/M7 |
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Виробник: Microchip Technology
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
Description: 200 MHZ, 256KB FLASH, FUSA-COMPL
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-VQFN (6x6)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, QEI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 18x12b
Core Processor: dsPIC33A
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 200MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tube
на замовлення 244 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 186.39 грн |
| 25+ | 162.77 грн |
| 100+ | 148.56 грн |
| DSC1001CE1-037.1250T |
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Виробник: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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| DSC1001CE1-037.1250 |
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Виробник: Microchip Technology
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
Description: MEMS OSC XO 37.1250MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.126" L x 0.098" W (3.20mm x 2.50mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -20°C ~ 70°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Current - Supply (Max): 10.5mA
Supplier Device Package: 4-VDFN (3.2x2.5)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 37.125 MHz
Base Resonator: MEMS
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| MSC010SDA070S |
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Виробник: Microchip Technology
Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
Description: DIODE SIL CARBIDE 700V 10A D3PAK
Packaging: Bulk
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Current - Average Rectified (Io): 10A
Supplier Device Package: D3Pak
Voltage - DC Reverse (Vr) (Max): 700 V
товару немає в наявності
Мінімальне замовлення: 270 шт
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| EV18H47A |
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Виробник: Microchip Technology
Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Description: EVAL BOARD FOR ATSAME70N21
Packaging: Box
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: ATSAME70N21
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 15736.15 грн |
| EV42J24A |
Виробник: Microchip Technology
Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
Description: CEC1736 EVALUATION BOARD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: CEC1736
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 33566.88 грн |
| VX-805-ECE-KEXN-204M800000 |
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Виробник: Microchip Technology
Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
Description: LOW NOISE CERAMIC VCXO +3.3 VDC
Packaging: Tape & Reel (TR)
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| JANS1N6319CUS |
Виробник: Microchip Technology
Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
Description: DIODE ZENER 6.2V 500MW SQ-MELF
Tolerance: ±2%
Packaging: Bulk
Package / Case: SQ-MELF, B
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 6.2 V
Impedance (Max) (Zzt): 3 Ohms
Supplier Device Package: B, SQ-MELF
Grade: Military
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 1 A
Current - Reverse Leakage @ Vr: 5 µA @ 3.5 V
Qualification: MIL-PRF-19500/533
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Мінімальне замовлення: 500 шт
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| MIC2951-03BN |
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Виробник: Microchip Technology
Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
Description: IC REG LIN POS ADJ 150MA 8-PDIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Output Type: Adjustable (Fixed)
Mounting Type: Through Hole
Current - Output: 150mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 300 µA
Voltage - Input (Max): 30V
Number of Regulators: 1
Supplier Device Package: 8-PDIP
Voltage - Output (Max): 29V
Voltage - Output (Min/Fixed): 1.24V (5V)
Control Features: Enable
Voltage Dropout (Max): 0.6V @ 150mA
Protection Features: Over Current, Over Temperature, Reverse Polarity
Current - Supply (Max): 8 mA
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| MCP41U83T-103E/ST |
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Виробник: Microchip Technology
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
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Мінімальне замовлення: 2500 шт
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| MCP41U83T-103E/ST |
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Виробник: Microchip Technology
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
Description: 10BIT I2C/SPI 1-CH DIGI POT WITH
Resistance (Ohms): 10k
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Memory Type: Non-Volatile
Interface: SPI
Configuration: Potentiometer, Rheostat
Operating Temperature: -40°C ~ 125°C
Number of Taps: 1024
Voltage - Supply: 2.7V ~ 5.5V
Taper: Linear
Supplier Device Package: 14-TSSOP
Resistance - Wiper (Ohms) (Typ): 19
Temperature Coefficient (Typ): 25ppm/°C
Number of Circuits: 1
на замовлення 189 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 140.57 грн |
| 25+ | 113.05 грн |
| 100+ | 102.70 грн |
| MSC400SMA330B4N |
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Виробник: Microchip Technology
Description: MOSFET SIC 3300V 400 MOHM TO-247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 5A, 20V
Power Dissipation (Max): 131W (Tc)
Vgs(th) (Max) @ Id: 2.97V @ 1mA
Supplier Device Package: TO-247-4
Drive Voltage (Max Rds On, Min Rds On): 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 3300 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 579 pF @ 2400 V
Description: MOSFET SIC 3300V 400 MOHM TO-247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 5A, 20V
Power Dissipation (Max): 131W (Tc)
Vgs(th) (Max) @ Id: 2.97V @ 1mA
Supplier Device Package: TO-247-4
Drive Voltage (Max Rds On, Min Rds On): 20V
Vgs (Max): +23V, -10V
Drain to Source Voltage (Vdss): 3300 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 20 V
Input Capacitance (Ciss) (Max) @ Vds: 579 pF @ 2400 V
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| MSC035SMA070J |
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Виробник: Microchip Technology
Description: MOSFET SIC 700 V 35 MOHM SOT-227
Packaging: Box
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Supplier Device Package: SOT-227 (ISOTOP®)
Drain to Source Voltage (Vdss): 700 V
Description: MOSFET SIC 700 V 35 MOHM SOT-227
Packaging: Box
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Supplier Device Package: SOT-227 (ISOTOP®)
Drain to Source Voltage (Vdss): 700 V
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Мінімальне замовлення: 30 шт
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| VCC1-B3F-65M0000000 |
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Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| VCC1-B3F-66M0000000 |
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Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| VCC1-B3F-66M6660000 |
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Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| VCC1-B3F-66M6667000 |
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Виробник: Microchip Technology
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
Description: CMOS XO +3.3 VDC 15PF -40C TO +8
Packaging: Tape & Reel (TR)
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| 25CS640T-I/Q4B |
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Виробник: Microchip Technology
Description: IC EEPROM 64KBIT SPI 8UDFN
Memory Organization: 8K x 8
Access Time: 20 ns
Memory Interface: SPI
Write Cycle Time - Word, Page: 4ms
Supplier Device Package: 8-UDFN (2x3)
Memory Format: EEPROM
Clock Frequency: 20 MHz
Technology: EEPROM
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC EEPROM 64KBIT SPI 8UDFN
Memory Organization: 8K x 8
Access Time: 20 ns
Memory Interface: SPI
Write Cycle Time - Word, Page: 4ms
Supplier Device Package: 8-UDFN (2x3)
Memory Format: EEPROM
Clock Frequency: 20 MHz
Technology: EEPROM
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Tape & Reel (TR)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5000+ | 36.22 грн |
| 25CS640T-I/Q4B |
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Виробник: Microchip Technology
Description: IC EEPROM 64KBIT SPI 8UDFN
Memory Interface: SPI
Write Cycle Time - Word, Page: 4ms
Supplier Device Package: 8-UDFN (2x3)
Memory Format: EEPROM
Clock Frequency: 20 MHz
Technology: EEPROM
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Memory Organization: 8K x 8
Access Time: 20 ns
Description: IC EEPROM 64KBIT SPI 8UDFN
Memory Interface: SPI
Write Cycle Time - Word, Page: 4ms
Supplier Device Package: 8-UDFN (2x3)
Memory Format: EEPROM
Clock Frequency: 20 MHz
Technology: EEPROM
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-UFDFN Exposed Pad
Packaging: Cut Tape (CT)
Memory Organization: 8K x 8
Access Time: 20 ns
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 8+ | 41.94 грн |
| MPF100TC-FCSG325I |
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Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-FCBGA (11x14.5)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 170
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-LFBGA, FC
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-FCBGA (11x14.5)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 170
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 7464.22 грн |
| MPF100TC-FCG484I |
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Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 244
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (23x23)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 244
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8202.80 грн |
| MPF100TC-FCVG484I |
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Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 284
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 484-BFBGA, FCBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 484-FCBGA (19x19)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Number of I/O: 284
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8772.85 грн |
| MPF100TC-FCSG325T2 |
Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-BGA (11x11)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Grade: Automotive
Number of I/O: 170
Qualification: AEC-Q100
Description: POLARFIRE CORE FPGA, 109KLES
Packaging: Tray
Package / Case: 325-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 0.97V ~ 1.08V
Number of Logic Elements/Cells: 109000
Supplier Device Package: 325-BGA (11x11)
Number of LABs/CLBs: 27250
Total RAM Bits: 7969178
Grade: Automotive
Number of I/O: 170
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 176 шт
В кошику
од. на суму грн.
| MPF100TC-FCVG484T2 |
Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
Description: POLARFIRE CORE FPGA, 109KLES
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
товару немає в наявності
Мінімальне замовлення: 84 шт
В кошику
од. на суму грн.
| MPF100TS-FCVG484T2 |
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Виробник: Microchip Technology
Description: POLARFIRE MID-RANGE FPGA, 109KLE
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Description: POLARFIRE MID-RANGE FPGA, 109KLE
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPF100TS-1FCVG484T2 |
![]() |
Виробник: Microchip Technology
Description: POLARFIRE MID-RANGE FPGA, 109KLE
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
Description: POLARFIRE MID-RANGE FPGA, 109KLE
Qualification: AEC-Q100
Number of I/O: 284
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Supplier Device Package: 484-FCBGA (19x19)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BFBGA, FCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MPF100TC-FCG484T2 |
Виробник: Microchip Technology
Description: POLARFIRE CORE FPGA, 109KLES
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 244
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
Description: POLARFIRE CORE FPGA, 109KLES
Supplier Device Package: 484-FCBGA (23x23)
Number of Logic Elements/Cells: 109000
Voltage - Supply: 0.97V ~ 1.08V
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 484-BBGA, FCBGA
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 244
Grade: Automotive
Total RAM Bits: 7969178
Number of LABs/CLBs: 27250
товару немає в наявності
В кошику
од. на суму грн.






















