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ATSAM3S1BA-MU ATSAM3S1BA-MU Microchip Technology SAM3S_Series.pdf Description: IC MCU 32BIT 64KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
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MSMBG6.5CAe3 MSMBG6.5CAe3 Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG6.5CA MXLSMBG6.5CA Microchip Technology RF01000+%283%29.pdf Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AVR32SD28-I/3LW Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 21
на замовлення 637 шт:
термін постачання 21-31 дні (днів)
4+92.35 грн
25+81.60 грн
100+73.42 грн
Мінімальне замовлення: 4
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AVR32SD28-I/SP AVR32SD28-I/SP Microchip Technology Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 21
на замовлення 328 шт:
термін постачання 21-31 дні (днів)
2+170.24 грн
25+150.26 грн
100+135.97 грн
Мінімальне замовлення: 2
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ATTINY202-SSZ-VAO ATTINY202-SSZ-VAO Microchip Technology Description: 16 MHZ, 2KB, SOIC8, AUTO 125C, G
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of I/O: 6
Qualification: AEC-Q100
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MCP1640CT-I/MCVAO MCP1640CT-I/MCVAO Microchip Technology Description: 500 KHZ, 300 MA SYN. BOOST, INPU
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 350mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 5.5V
Topology: Boost
Supplier Device Package: 8-DFN (2x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 0.35V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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ATWINC3400-MR210CA144 Microchip Technology IEEE-802.11-bgn-Network-Controller-with-Integrated-Bluetooth-Low-Energy-Module-Data-Sheet-70005350D.pdf Description: WI-FI + BLUETOOTH LE MODULE, CH
Packaging: Tray
Package / Case: 36-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.3dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n, Bluetooth v5.0
Current - Receiving: 51.36mA ~ 63.9mA
Current - Transmitting: 79.37mA ~ 275mA
Antenna Type: Integrated, Chip
Utilized IC / Part: ATWINC3400
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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APT15DQ120D Microchip Technology Description: FRED DQ 1200 V 15 A DIE
Packaging: Tube
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APT100DQ120D Microchip Technology Description: FRED DQ 1200 V 100 A DIE
Packaging: Bulk
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APT75DQ120D Microchip Technology Description: FRED DQ 1200 V 75 A DIE
Packaging: Bulk
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APT60DQ120D Microchip Technology Description: FRED DQ 1200 V 60 A DIE
Packaging: Bulk
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1N5232B 1N5232B Microchip Technology 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf Description: DIODE ZENER 5.6V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 3 V
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PIC32CM1602GV00032-I/RTB PIC32CM1602GV00032-I/RTB Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00032-I/T5X PIC32CM1602GV00032-I/T5X Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC32CM1602GV00048-I/Y8X PIC32CM1602GV00048-I/Y8X Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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PIC32CM1602GV00048-I/U5B PIC32CM1602GV00048-I/U5B Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM1602GV00064-I/V2X PIC32CM1602GV00064-I/V2X Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
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PIC32CM1602GV00064-I/5LX PIC32CM1602GV00064-I/5LX Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 52
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PIC32CM1602GV00032T-I/RTB PIC32CM1602GV00032T-I/RTB Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00032-E/RTB PIC32CM1602GV00032-E/RTB Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00048T-I/U5B PIC32CM1602GV00048T-I/U5B Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM1602GV00048T-I/Y8X PIC32CM1602GV00048T-I/Y8X Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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PIC32CM1602GV00032T-I/T5X PIC32CM1602GV00032T-I/T5X Microchip Technology Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC16F15256-E/SO PIC16F15256-E/SO Microchip Technology PIC16F15256-74-75-76-Microcontroller-Data-Sheet-40002305.pdf Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1026 шт:
термін постачання 21-31 дні (днів)
5+70.67 грн
25+62.30 грн
100+61.75 грн
Мінімальне замовлення: 5
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DSC1001DI1-016.3840 DSC1001DI1-016.3840 Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 MHz
Base Resonator: MEMS
на замовлення 394 шт:
термін постачання 21-31 дні (днів)
7+52.20 грн
10+49.10 грн
50+48.35 грн
Мінімальне замовлення: 7
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DSC1001DI1-016.3840T DSC1001DI1-016.3840T Microchip Technology DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 MHz
Base Resonator: MEMS
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MSMCJ12A MSMCJ12A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 12VWM 19.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 75.3A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ160A MSMCJ160A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 160VWM 259VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 160V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 178V
Voltage - Clamping (Max) @ Ipp: 259V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ16A MSMCJ16A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 16VWM 26VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57.7A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ17A MSMCJ17A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 17VWM 27.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.3A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ18A MSMCJ18A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 18VWM 29.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 51.4A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ20A MSMCJ20A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 20VWM 32.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 46.3A
Voltage - Reverse Standoff (Typ): 20V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 22.2V
Voltage - Clamping (Max) @ Ipp: 32.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ43A MSMCJ43A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 43VWM 69.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ45A MSMCJ45A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 45VWM 72.7VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.6A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 72.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ15A MSMCJ15A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ24A MSMCJ24A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 24VWM 38.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 38.6A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 38.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ36A MSMCJ36A Microchip Technology rf01001_rev_b_final-pd-000307351.pdf Description: TVS DIODE 36VWM 58.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.8A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 40V
Voltage - Clamping (Max) @ Ipp: 58.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N4744A 1N4744A Microchip Technology 10912-sa5-35-datasheet Description: DIODE ZENER 15V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 11.4 V
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1N4750A 1N4750A Microchip Technology 10912-sa5-35-pdf.pdf Description: DIODE ZENER 27V 1W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 35 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 20.6 V
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MP6KE56A MP6KE56A Microchip Technology rf01007_rb.pdf Description: TVS DIODE 47.8VWM 77VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.8A
Voltage - Reverse Standoff (Typ): 47.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 53.2V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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803-1 Microchip Technology RF01152-3445317.pdf Bridge Rectifiers Single Phase Bridge
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682-1 Microchip Technology RF01150-3445604.pdf Bridge Rectifiers 3 Phase Bridge
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800-2 800-2 Microchip Technology RF01152-3445317.pdf Bridge Rectifiers 3 Phase Bridge
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680-5 Microchip Technology RF01098-3445361.pdf Bridge Rectifiers Bridges
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803-4 Microchip Technology RF01152-3445317.pdf Bridge Rectifiers Single Phase Bridge
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682-2 Microchip Technology RF01150-3445604.pdf Bridge Rectifiers 3 Phase Bridge
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684-5 Microchip Technology RF01098-3445361.pdf Bridge Rectifiers Single Phase Bridge
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684-2 Microchip Technology RF01098-3445361.pdf Bridge Rectifiers Single Phase Bridge
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469-02 469-02 Microchip Technology 469-01_%7E_469-05.pdf Bridge Rectifiers Single Phase Bridge
на замовлення 90 шт:
термін постачання 21-30 дні (днів)
1+31464.29 грн
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682-3 Microchip Technology RF01150-3445604.pdf Bridge Rectifiers 3 Phase Bridge
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679-3 Microchip Technology 11556-wt3-24-datasheet Bridge Rectifiers Modules (MM)
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696-1 Microchip Technology RF01150-3445604.pdf Bridge Rectifiers Bridges
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683-4 Microchip Technology RF01150-3445604.pdf Bridge Rectifiers Single Phase Bridge
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683-5 Microchip Technology RF01098-3445361.pdf Bridge Rectifiers Single Phase Bridge
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JTXM19500/469-05 Microchip Technology Bridge Rectifiers Single Phase Bridge
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469-04 469-04 Microchip Technology 469-01_%7E_469-05.pdf Bridge Rectifiers Modules (MM)
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MMP4403-GM2 MMP4403-GM2 Microchip Technology MMP4400Series-3444378.pdf PIN Diodes 50MHz - 12 GHz PIN Diode 3 us
на замовлення 1597 шт:
термін постачання 21-30 дні (днів)
1+375.01 грн
500+369.65 грн
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UPP1001E3/TR7 Microchip Technology 129277-rf01104 PIN Diodes Schottky
на замовлення 2 шт:
термін постачання 21-30 дні (днів)
2+184.47 грн
Мінімальне замовлення: 2
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UM9415 UM9415 Microchip Technology UM9400_Series-1832068.pdf PIN Diodes PIN Diode - wtn
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ATSAM3S1BA-MU SAM3S_Series.pdf
ATSAM3S1BA-MU
Виробник: Microchip Technology
Description: IC MCU 32BIT 64KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 10x10/12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
Connectivity: I2C, MMC, SPI, SSC, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 47
DigiKey Programmable: Not Verified
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MSMBG6.5CAe3 RF01000+%283%29.pdf
MSMBG6.5CAe3
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MXLSMBG6.5CA RF01000+%283%29.pdf
MXLSMBG6.5CA
Виробник: Microchip Technology
Description: TVS DIODE 6.5VWM 11.2V DO214AA
Packaging: Bulk
Package / Case: DO-215AA, SMB Gull Wing
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.6A
Voltage - Reverse Standoff (Typ): 6.5V
Supplier Device Package: DO-214AA (SMBG)
Bidirectional Channels: 1
Voltage - Breakdown (Min): 7.22V
Voltage - Clamping (Max) @ Ipp: 11.2V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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AVR32SD28-I/3LW
Виробник: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-VQFN (4x4)
Number of I/O: 21
на замовлення 637 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.35 грн
25+81.60 грн
100+73.42 грн
Мінімальне замовлення: 4
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AVR32SD28-I/SP
AVR32SD28-I/SP
Виробник: Microchip Technology
Description: 32KB,ECC,2XCPU,20MHZ,ERRCTRL,MVI
Packaging: Tube
Package / Case: 28-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: AVR
Data Converters: A/D 19x10b; D/A 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IrDA, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SPDIP
Number of I/O: 21
на замовлення 328 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+170.24 грн
25+150.26 грн
100+135.97 грн
Мінімальне замовлення: 2
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ATTINY202-SSZ-VAO
ATTINY202-SSZ-VAO
Виробник: Microchip Technology
Description: 16 MHZ, 2KB, SOIC8, AUTO 125C, G
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64 x 8
Core Processor: AVR
Data Converters: A/D 6x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Grade: Automotive
Number of I/O: 6
Qualification: AEC-Q100
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MCP1640CT-I/MCVAO
MCP1640CT-I/MCVAO
Виробник: Microchip Technology
Description: 500 KHZ, 300 MA SYN. BOOST, INPU
Packaging: Tape & Reel (TR)
Package / Case: 8-VFDFN Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Up
Current - Output: 350mA
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 500kHz
Voltage - Input (Max): 5.5V
Topology: Boost
Supplier Device Package: 8-DFN (2x3)
Synchronous Rectifier: Yes
Voltage - Output (Max): 5.5V
Voltage - Input (Min): 0.35V
Voltage - Output (Min/Fixed): 2V
Grade: Automotive
Qualification: AEC-Q100
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ATWINC3400-MR210CA144 IEEE-802.11-bgn-Network-Controller-with-Integrated-Bluetooth-Low-Energy-Module-Data-Sheet-70005350D.pdf
Виробник: Microchip Technology
Description: WI-FI + BLUETOOTH LE MODULE, CH
Packaging: Tray
Package / Case: 36-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.2V
Power - Output: 18.3dBm
Data Rate: 72.2Mbps
Protocol: 802.11b/g/n, Bluetooth v5.0
Current - Receiving: 51.36mA ~ 63.9mA
Current - Transmitting: 79.37mA ~ 275mA
Antenna Type: Integrated, Chip
Utilized IC / Part: ATWINC3400
Modulation: 16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, I2C, SPI, UART
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APT15DQ120D
Виробник: Microchip Technology
Description: FRED DQ 1200 V 15 A DIE
Packaging: Tube
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APT100DQ120D
Виробник: Microchip Technology
Description: FRED DQ 1200 V 100 A DIE
Packaging: Bulk
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APT75DQ120D
Виробник: Microchip Technology
Description: FRED DQ 1200 V 75 A DIE
Packaging: Bulk
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APT60DQ120D
Виробник: Microchip Technology
Description: FRED DQ 1200 V 60 A DIE
Packaging: Bulk
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1N5232B 1N5221%20-%201N5281B%2C%20e3%20DO-35.pdf
1N5232B
Виробник: Microchip Technology
Description: DIODE ZENER 5.6V 500MW DO204AH
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C (TJ)
Voltage - Zener (Nom) (Vz): 5.6 V
Impedance (Max) (Zzt): 11 Ohms
Supplier Device Package: DO-204AH (DO-35)
Power - Max: 500 mW
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 3 V
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PIC32CM1602GV00032-I/RTB
PIC32CM1602GV00032-I/RTB
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00032-I/T5X
PIC32CM1602GV00032-I/T5X
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC32CM1602GV00048-I/Y8X
PIC32CM1602GV00048-I/Y8X
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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PIC32CM1602GV00048-I/U5B
PIC32CM1602GV00048-I/U5B
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM1602GV00064-I/V2X
PIC32CM1602GV00064-I/V2X
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 52
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PIC32CM1602GV00064-I/5LX
PIC32CM1602GV00064-I/5LX
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 20x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 64-VQFN (9x9)
Number of I/O: 52
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PIC32CM1602GV00032T-I/RTB
PIC32CM1602GV00032T-I/RTB
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00032-E/RTB
PIC32CM1602GV00032-E/RTB
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-VQFN (5x5)
Number of I/O: 26
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PIC32CM1602GV00048T-I/U5B
PIC32CM1602GV00048T-I/U5B
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-VQFN (7x7)
Number of I/O: 38
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PIC32CM1602GV00048T-I/Y8X
PIC32CM1602GV00048T-I/Y8X
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Number of I/O: 38
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PIC32CM1602GV00032T-I/T5X
PIC32CM1602GV00032T-I/T5X
Виробник: Microchip Technology
Description: CORTEX MO+ W/16K FLASH AND 2K SR
Packaging: Tape & Reel (TR)
Package / Case: 32-TQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
Connectivity: I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 32-TQFP (7x7)
Number of I/O: 26
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PIC16F15256-E/SO PIC16F15256-74-75-76-Microcontroller-Data-Sheet-40002305.pdf
PIC16F15256-E/SO
Виробник: Microchip Technology
Description: IC MCU 8BIT 28KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 28KB (28K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: PIC
Data Converters: A/D 19x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 24
на замовлення 1026 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+70.67 грн
25+62.30 грн
100+61.75 грн
Мінімальне замовлення: 5
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DSC1001DI1-016.3840 DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-016.3840
Виробник: Microchip Technology
Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.7V ~ 3.6V
Ratings: AEC-Q100
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 MHz
Base Resonator: MEMS
на замовлення 394 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+52.20 грн
10+49.10 грн
50+48.35 грн
Мінімальне замовлення: 7
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DSC1001DI1-016.3840T DSC1001-3-4-1.8V-3.3V-Low-Power-Precision-CMOS-Oscillators-DS20005529.pdf
DSC1001DI1-016.3840T
Виробник: Microchip Technology
Description: MEMS OSC XO 16.3840MHZ CMOS SMD
Packaging: Strip
Package / Case: 4-VDFN
Size / Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Mounting Type: Surface Mount
Output: CMOS
Function: Standby (Power Down)
Type: XO (Standard)
Operating Temperature: -40°C ~ 85°C
Frequency Stability: ±50ppm
Voltage - Supply: 1.8V ~ 3.3V
Current - Supply (Max): 8mA
Supplier Device Package: 4-CDFN (2.5x2)
Height - Seated (Max): 0.035" (0.90mm)
Frequency: 16.384 MHz
Base Resonator: MEMS
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MSMCJ12A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ12A
Виробник: Microchip Technology
Description: TVS DIODE 12VWM 19.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 75.3A
Voltage - Reverse Standoff (Typ): 12V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 13.3V
Voltage - Clamping (Max) @ Ipp: 19.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ160A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ160A
Виробник: Microchip Technology
Description: TVS DIODE 160VWM 259VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 5.8A
Voltage - Reverse Standoff (Typ): 160V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 178V
Voltage - Clamping (Max) @ Ipp: 259V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ16A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ16A
Виробник: Microchip Technology
Description: TVS DIODE 16VWM 26VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 57.7A
Voltage - Reverse Standoff (Typ): 16V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 17.8V
Voltage - Clamping (Max) @ Ipp: 26V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ17A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ17A
Виробник: Microchip Technology
Description: TVS DIODE 17VWM 27.6VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 53.3A
Voltage - Reverse Standoff (Typ): 17V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 18.9V
Voltage - Clamping (Max) @ Ipp: 27.6V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ18A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ18A
Виробник: Microchip Technology
Description: TVS DIODE 18VWM 29.2VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 51.4A
Voltage - Reverse Standoff (Typ): 18V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 29.2V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ20A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ20A
Виробник: Microchip Technology
Description: TVS DIODE 20VWM 32.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 46.3A
Voltage - Reverse Standoff (Typ): 20V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 22.2V
Voltage - Clamping (Max) @ Ipp: 32.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ43A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ43A
Виробник: Microchip Technology
Description: TVS DIODE 43VWM 69.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 21.6A
Voltage - Reverse Standoff (Typ): 43V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 47.8V
Voltage - Clamping (Max) @ Ipp: 69.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ45A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ45A
Виробник: Microchip Technology
Description: TVS DIODE 45VWM 72.7VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 20.6A
Voltage - Reverse Standoff (Typ): 45V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 50V
Voltage - Clamping (Max) @ Ipp: 72.7V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ15A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ15A
Виробник: Microchip Technology
Description: TVS DIODE 15VWM 24.4VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 61.5A
Voltage - Reverse Standoff (Typ): 15V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 16.7V
Voltage - Clamping (Max) @ Ipp: 24.4V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ24A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ24A
Виробник: Microchip Technology
Description: TVS DIODE 24VWM 38.9VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 38.6A
Voltage - Reverse Standoff (Typ): 24V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 26.7V
Voltage - Clamping (Max) @ Ipp: 38.9V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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MSMCJ36A rf01001_rev_b_final-pd-000307351.pdf
MSMCJ36A
Виробник: Microchip Technology
Description: TVS DIODE 36VWM 58.1VC DO214AB
Packaging: Bulk
Package / Case: DO-214AB, SMC
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 25.8A
Voltage - Reverse Standoff (Typ): 36V
Supplier Device Package: DO-214AB (SMCJ)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 40V
Voltage - Clamping (Max) @ Ipp: 58.1V
Power - Peak Pulse: 1500W (1.5kW)
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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1N4744A 10912-sa5-35-datasheet
1N4744A
Виробник: Microchip Technology
Description: DIODE ZENER 15V 1W DO204AL
Packaging: Bulk
Tolerance: ±5%
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 175°C
Voltage - Zener (Nom) (Vz): 15 V
Impedance (Max) (Zzt): 14 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 11.4 V
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1N4750A 10912-sa5-35-pdf.pdf
1N4750A
Виробник: Microchip Technology
Description: DIODE ZENER 27V 1W DO204AL
Tolerance: ±5%
Packaging: Bulk
Package / Case: DO-204AL, DO-41, Axial
Mounting Type: Through Hole
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 27 V
Impedance (Max) (Zzt): 35 Ohms
Supplier Device Package: DO-204AL (DO-41)
Power - Max: 1 W
Voltage - Forward (Vf) (Max) @ If: 1.2 V @ 200 mA
Current - Reverse Leakage @ Vr: 5 µA @ 20.6 V
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MP6KE56A rf01007_rb.pdf
MP6KE56A
Виробник: Microchip Technology
Description: TVS DIODE 47.8VWM 77VC T18
Packaging: Bulk
Package / Case: T-18, Axial
Mounting Type: Through Hole
Type: Zener
Operating Temperature: -65°C ~ 150°C (TJ)
Applications: General Purpose
Current - Peak Pulse (10/1000µs): 7.8A
Voltage - Reverse Standoff (Typ): 47.8V
Supplier Device Package: T-18
Unidirectional Channels: 1
Voltage - Breakdown (Min): 53.2V
Voltage - Clamping (Max) @ Ipp: 77V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Military
Qualification: MIL-PRF-19500
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803-1 RF01152-3445317.pdf
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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682-1 RF01150-3445604.pdf
Виробник: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
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800-2 RF01152-3445317.pdf
800-2
Виробник: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
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680-5 RF01098-3445361.pdf
Виробник: Microchip Technology
Bridge Rectifiers Bridges
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803-4 RF01152-3445317.pdf
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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682-2 RF01150-3445604.pdf
Виробник: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
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684-5 RF01098-3445361.pdf
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Bridge Rectifiers Single Phase Bridge
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684-2 RF01098-3445361.pdf
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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469-02 469-01_%7E_469-05.pdf
469-02
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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термін постачання 21-30 дні (днів)
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682-3 RF01150-3445604.pdf
Виробник: Microchip Technology
Bridge Rectifiers 3 Phase Bridge
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679-3 11556-wt3-24-datasheet
Виробник: Microchip Technology
Bridge Rectifiers Modules (MM)
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696-1 RF01150-3445604.pdf
Виробник: Microchip Technology
Bridge Rectifiers Bridges
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683-4 RF01150-3445604.pdf
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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683-5 RF01098-3445361.pdf
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Bridge Rectifiers Single Phase Bridge
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JTXM19500/469-05
Виробник: Microchip Technology
Bridge Rectifiers Single Phase Bridge
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469-04 469-01_%7E_469-05.pdf
469-04
Виробник: Microchip Technology
Bridge Rectifiers Modules (MM)
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MMP4403-GM2 MMP4400Series-3444378.pdf
MMP4403-GM2
Виробник: Microchip Technology
PIN Diodes 50MHz - 12 GHz PIN Diode 3 us
на замовлення 1597 шт:
термін постачання 21-30 дні (днів)
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UPP1001E3/TR7 129277-rf01104
Виробник: Microchip Technology
PIN Diodes Schottky
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UM9415 UM9400_Series-1832068.pdf
UM9415
Виробник: Microchip Technology
PIN Diodes PIN Diode - wtn
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