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480-10-248-00-001000 480-10-248-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 48POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-250-00-001000 480-10-250-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 50POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-252-00-001000 480-10-252-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 52POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-254-00-001000 480-10-254-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 54POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 54
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-256-00-001000 480-10-256-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 56POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 56
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-258-00-001000 480-10-258-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 58POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-260-00-001000 480-10-260-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 60POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-262-00-001000 480-10-262-00-001000 Mill-Max Manufacturing Corp. 2017-11%3A085.pdf Description: CONN HDR SOLDER 62POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 62
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
714-43-101-31-018000 714-43-101-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 1POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 1 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1003 шт:
термін постачання 21-31 дні (днів)
6+61.96 грн
10+45.82 грн
25+41.14 грн
50+35.64 грн
100+32.93 грн
250+29.72 грн
500+27.10 грн
1000+25.17 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
714-43-102-31-018000 714-43-102-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2016 шт:
термін постачання 21-31 дні (днів)
4+92.52 грн
10+67.86 грн
25+61.03 грн
50+52.90 грн
100+48.93 грн
250+44.21 грн
500+40.35 грн
1000+37.50 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
714-43-103-31-018000 714-43-103-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1322 шт:
термін постачання 21-31 дні (днів)
4+95.00 грн
10+77.80 грн
25+72.87 грн
50+65.14 грн
100+62.02 грн
250+58.13 грн
500+54.45 грн
1000+51.85 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
714-43-104-31-018000 714-43-104-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1196 шт:
термін постачання 21-31 дні (днів)
3+149.52 грн
10+109.86 грн
25+98.90 грн
50+85.78 грн
100+79.40 грн
250+71.84 грн
500+65.65 грн
1000+61.09 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
714-43-106-31-018000 714-43-106-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 6POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-107-31-018000 714-43-107-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-109-31-018000 714-43-109-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 9POS GOLD
Packaging: Tube
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-113-31-018000 714-43-113-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 13POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-115-31-018000 714-43-115-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-116-31-018000 714-43-116-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 16POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-117-31-018000 714-43-117-31-018000 Mill-Max Manufacturing Corp. 077.pdf Description: CONN SOCKET SIP 17POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-118-31-018000 714-43-118-31-018000 Mill-Max Manufacturing Corp. 077.pdf Description: CONN SOCKET SIP 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-119-31-018000 714-43-119-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 19POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-131-31-018000 714-43-131-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 31POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-132-31-018000 714-43-132-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-134-31-018000 714-43-134-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 34POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-135-31-018000 714-43-135-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 35POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-136-31-018000 714-43-136-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 36POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (1 x 36)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-137-31-018000 714-43-137-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 37POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-138-31-018000 714-43-138-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 38POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (1 x 38)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-139-31-018000 714-43-139-31-018000 Mill-Max Manufacturing Corp. 077.pdf Description: CONN SOCKET SIP 39POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-141-31-018000 714-43-141-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 41POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-142-31-018000 714-43-142-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 42POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (1 x 42)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-143-31-018000 714-43-143-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 43POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 43 (1 x 43)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-144-31-018000 714-43-144-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 44POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-146-31-018000 714-43-146-31-018000 Mill-Max Manufacturing Corp. 077.PDF Description: CONN SOCKET SIP 46POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-155-31-018000 714-43-155-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 55POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 55 (1 x 55)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-157-31-018000 714-43-157-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 57POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 57 (1 x 57)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-160-31-018000 714-43-160-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN SOCKET SIP 60POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 60 (1 x 60)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-204-31-018000 714-43-204-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 4POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1545 шт:
термін постачання 21-31 дні (днів)
2+213.96 грн
10+175.01 грн
25+164.06 грн
50+146.62 грн
100+139.61 грн
250+130.87 грн
500+122.58 грн
1000+116.73 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
714-43-206-31-018000 714-43-206-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-208-31-018000 714-43-208-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-210-31-018000 714-43-210-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-212-31-018000 714-43-212-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-214-31-018000 714-43-214-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-216-31-018000 714-43-216-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-218-31-018000 714-43-218-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-222-31-018000 714-43-222-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-224-31-018000 714-43-224-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-226-31-018000 714-43-226-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 26POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-228-31-018000 714-43-228-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-230-31-018000 714-43-230-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-232-31-018000 714-43-232-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-234-31-018000 714-43-234-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 34POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-236-31-018000 714-43-236-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-238-31-018000 714-43-238-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-240-31-018000 714-43-240-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-242-31-018000 714-43-242-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-244-31-018000 714-43-244-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 44POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-246-31-018000 714-43-246-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 46POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 46 (2 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-248-31-018000 714-43-248-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-250-31-018000 714-43-250-31-018000 Mill-Max Manufacturing Corp. 2017-11%3A077.pdf Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
480-10-248-00-001000 2017-11%3A085.pdf
480-10-248-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 48POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-250-00-001000 2017-11%3A085.pdf
480-10-250-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 50POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-252-00-001000 2017-11%3A085.pdf
480-10-252-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 52POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 52
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-254-00-001000 2017-11%3A085.pdf
480-10-254-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 54POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 54
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-256-00-001000 2017-11%3A085.pdf
480-10-256-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 56POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 56
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
480-10-258-00-001000 2017-11%3A085.pdf
480-10-258-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 58POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-260-00-001000 2017-11%3A085.pdf
480-10-260-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 60POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
480-10-262-00-001000 2017-11%3A085.pdf
480-10-262-00-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDER 62POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 62
Pitch: 0.100" (2.54mm)
Contact Type: Solder Cup
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 2
товару немає в наявності
В кошику  од. на суму  грн.
714-43-101-31-018000 2017-11%3A077.pdf
714-43-101-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 1POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 1 (1 x 1)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1003 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.96 грн
10+45.82 грн
25+41.14 грн
50+35.64 грн
100+32.93 грн
250+29.72 грн
500+27.10 грн
1000+25.17 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
714-43-102-31-018000 2017-11%3A077.pdf
714-43-102-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 2POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 2 (1 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2016 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+92.52 грн
10+67.86 грн
25+61.03 грн
50+52.90 грн
100+48.93 грн
250+44.21 грн
500+40.35 грн
1000+37.50 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
714-43-103-31-018000 2017-11%3A077.pdf
714-43-103-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 3POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 3 (1 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1322 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+95.00 грн
10+77.80 грн
25+72.87 грн
50+65.14 грн
100+62.02 грн
250+58.13 грн
500+54.45 грн
1000+51.85 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
714-43-104-31-018000 2017-11%3A077.pdf
714-43-104-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 4POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (1 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1196 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+149.52 грн
10+109.86 грн
25+98.90 грн
50+85.78 грн
100+79.40 грн
250+71.84 грн
500+65.65 грн
1000+61.09 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
714-43-106-31-018000 2017-11%3A077.pdf
714-43-106-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 6POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (1 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-107-31-018000 2017-11%3A077.pdf
714-43-107-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 7POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 7 (1 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-109-31-018000 2017-11%3A077.pdf
714-43-109-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 9POS GOLD
Packaging: Tube
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 9 (1 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-113-31-018000 2017-11%3A077.pdf
714-43-113-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 13POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 13 (1 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-115-31-018000 2017-11%3A077.pdf
714-43-115-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 15POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 15 (1 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-116-31-018000 2017-11%3A077.pdf
714-43-116-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 16POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (1 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-117-31-018000 077.pdf
714-43-117-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 17POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-118-31-018000 077.pdf
714-43-118-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 18POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-119-31-018000 077.PDF
714-43-119-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 19POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-131-31-018000 077.PDF
714-43-131-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 31POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-132-31-018000 077.PDF
714-43-132-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 32POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-134-31-018000 077.PDF
714-43-134-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 34POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-135-31-018000 2017-11%3A077.pdf
714-43-135-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 35POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 35 (1 x 35)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-136-31-018000 2017-11%3A077.pdf
714-43-136-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 36POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (1 x 36)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-137-31-018000 2017-11%3A077.pdf
714-43-137-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 37POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 37 (1 x 37)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-138-31-018000 2017-11%3A077.pdf
714-43-138-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 38POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (1 x 38)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-139-31-018000 077.pdf
714-43-139-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 39POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-141-31-018000 077.PDF
714-43-141-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 41POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-142-31-018000 2017-11%3A077.pdf
714-43-142-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 42POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (1 x 42)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-143-31-018000 2017-11%3A077.pdf
714-43-143-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 43POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 43 (1 x 43)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-144-31-018000 2017-11%3A077.pdf
714-43-144-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 44POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-146-31-018000 077.PDF
714-43-146-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 46POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
714-43-155-31-018000 2017-11%3A077.pdf
714-43-155-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 55POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 55 (1 x 55)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-157-31-018000 2017-11%3A077.pdf
714-43-157-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 57POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 57 (1 x 57)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-160-31-018000 2017-11%3A077.pdf
714-43-160-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 60POS GOLD
Packaging: Bulk
Features: Carrier
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 60 (1 x 60)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-204-31-018000 2017-11%3A077.pdf
714-43-204-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 4POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1545 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+213.96 грн
10+175.01 грн
25+164.06 грн
50+146.62 грн
100+139.61 грн
250+130.87 грн
500+122.58 грн
1000+116.73 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
714-43-206-31-018000 2017-11%3A077.pdf
714-43-206-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-208-31-018000 2017-11%3A077.pdf
714-43-208-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-210-31-018000 2017-11%3A077.pdf
714-43-210-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-212-31-018000 2017-11%3A077.pdf
714-43-212-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-214-31-018000 2017-11%3A077.pdf
714-43-214-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-216-31-018000 2017-11%3A077.pdf
714-43-216-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-218-31-018000 2017-11%3A077.pdf
714-43-218-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-222-31-018000 2017-11%3A077.pdf
714-43-222-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-224-31-018000 2017-11%3A077.pdf
714-43-224-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-226-31-018000 2017-11%3A077.pdf
714-43-226-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 26POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-228-31-018000 2017-11%3A077.pdf
714-43-228-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-230-31-018000 2017-11%3A077.pdf
714-43-230-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-232-31-018000 2017-11%3A077.pdf
714-43-232-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-234-31-018000 2017-11%3A077.pdf
714-43-234-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 34POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 34 (2 x 17)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-236-31-018000 2017-11%3A077.pdf
714-43-236-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-238-31-018000 2017-11%3A077.pdf
714-43-238-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 38POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 38 (2 x 19)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-240-31-018000 2017-11%3A077.pdf
714-43-240-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-242-31-018000 2017-11%3A077.pdf
714-43-242-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 42POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-244-31-018000 2017-11%3A077.pdf
714-43-244-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 44POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 44 (2 x 22)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
714-43-246-31-018000 2017-11%3A077.pdf
714-43-246-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 46POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 46 (2 x 23)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-248-31-018000 2017-11%3A077.pdf
714-43-248-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 48POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
714-43-250-31-018000 2017-11%3A077.pdf
714-43-250-31-018000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 50POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 50 (2 x 25)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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