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110-93-324-41-001000 110-93-324-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 137 шт:
термін постачання 21-31 дні (днів)
2+210.22 грн
16+184.07 грн
32+174.30 грн
64+159.79 грн
112+152.18 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-93-318-41-001000 110-93-318-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 629 шт:
термін постачання 21-31 дні (днів)
2+228.02 грн
22+176.76 грн
44+168.32 грн
66+153.50 грн
110+148.06 грн
264+139.19 грн
506+130.77 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-13-624-41-001000 110-13-624-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 165 шт:
термін постачання 21-31 дні (днів)
1+360.26 грн
16+314.88 грн
32+298.20 грн
64+273.36 грн
112+260.33 грн
В кошику  од. на суму  грн.
117-93-316-41-005000 117-93-316-41-005000 Mill-Max Manufacturing Corp. 2017-11%3A125.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-13-328-41-001000 110-13-328-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 203 шт:
термін постачання 21-31 дні (днів)
1+439.10 грн
14+350.88 грн
28+334.09 грн
56+298.58 грн
112+284.32 грн
В кошику  од. на суму  грн.
110-13-628-41-001000 110-13-628-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1087 шт:
термін постачання 21-31 дні (днів)
1+412.82 грн
14+330.01 грн
28+314.24 грн
56+280.81 грн
112+267.40 грн
252+252.54 грн
504+236.54 грн
1008+225.26 грн
В кошику  од. на суму  грн.
110-93-308-41-001000 110-93-308-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2575 шт:
термін постачання 21-31 дні (днів)
4+99.18 грн
10+80.81 грн
25+75.69 грн
50+67.66 грн
100+64.42 грн
250+60.38 грн
500+56.55 грн
1000+53.85 грн
2500+50.48 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
110-93-320-41-001000 110-93-320-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 719 шт:
термін постачання 21-31 дні (днів)
2+212.77 грн
20+165.83 грн
40+157.87 грн
60+143.98 грн
100+138.87 грн
260+129.82 грн
500+121.93 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-13-632-41-001000 110-13-632-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A090.pdf Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
1+420.45 грн
12+367.60 грн
36+348.14 грн
60+319.12 грн
108+303.93 грн
В кошику  од. на суму  грн.
110-93-314-41-001000 110-93-314-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1711 шт:
термін постачання 21-31 дні (днів)
2+181.40 грн
10+148.73 грн
28+138.30 грн
56+123.58 грн
112+117.68 грн
252+111.13 грн
504+104.09 грн
1008+99.13 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-316-01-670800 214-99-316-01-670800 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 16POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 365 шт:
термін постачання 21-31 дні (днів)
3+166.99 грн
10+136.81 грн
25+128.29 грн
50+114.62 грн
100+109.15 грн
250+102.31 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
214-99-640-01-670800 214-99-640-01-670800 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 40POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
2+329.75 грн
10+269.29 грн
30+249.18 грн
50+225.57 грн
100+214.78 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
117-93-664-41-005000 117-93-664-41-005000 Mill-Max Manufacturing Corp. 2017-11%3A125.pdf Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-316-41-001000 110-93-316-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 6235 шт:
термін постачання 21-31 дні (днів)
2+200.90 грн
10+164.73 грн
25+154.44 грн
50+138.00 грн
100+131.41 грн
250+123.17 грн
500+115.37 грн
1000+109.87 грн
2500+102.99 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
123-13-624-41-001000 123-13-624-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-13-316-41-001000 110-13-316-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 3526 шт:
термін постачання 21-31 дні (днів)
2+317.88 грн
10+259.98 грн
25+243.64 грн
50+217.73 грн
100+207.32 грн
250+194.34 грн
500+182.03 грн
1000+173.35 грн
2500+162.51 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
0355-0-15-01-02-01-10-0 0355-0-15-01-02-01-10-0 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN PIN RCPT .040-.050 SOLDER
Packaging: Bulk
Contact Finish: Tin-Lead
Flange Diameter: 0.118" (3.00mm)
Length - Overall: 0.290" (7.37mm)
Termination: Solder
Mounting Hole Diameter: 0.102" (2.59mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Beryllium Copper
Tail Type: No Tail
Accepts Pin Diameter: 0.040" ~ 0.050" (1.02mm ~ 1.27mm)
Pin Hole Diameter: 0.068" (1.73mm)
Socket Depth: 0.260" (6.60mm)
Part Status: Active
на замовлення 31706 шт:
термін постачання 21-31 дні (днів)
13+26.28 грн
16+21.55 грн
25+20.21 грн
50+18.05 грн
100+17.19 грн
250+16.11 грн
500+15.09 грн
1000+14.37 грн
2500+13.47 грн
Мінімальне замовлення: 13
В кошику  од. на суму  грн.
117-93-668-41-005000 117-93-668-41-005000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 68POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (2 x 34)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+2091.21 грн
В кошику  од. на суму  грн.
117-93-428-41-005000 117-93-428-41-005000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
1+506.91 грн
20+394.96 грн
40+376.10 грн
60+343.00 грн
100+330.84 грн
В кошику  од. на суму  грн.
110-13-320-41-001000 110-13-320-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 230 шт:
термін постачання 21-31 дні (днів)
2+322.96 грн
20+251.58 грн
40+239.56 грн
60+218.48 грн
100+210.73 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
123-13-628-41-001000 123-13-628-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
123-13-316-41-001000 123-13-316-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+584.90 грн
10+458.99 грн
25+423.09 грн
В кошику  од. на суму  грн.
123-13-324-41-001000 123-13-324-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
123-13-320-41-001000 123-13-320-41-001000 Mill-Max Manufacturing Corp. 2017-11%3A109.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-99-308-41-001000 110-99-308-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 8POS TIN-LEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2620 шт:
термін постачання 21-31 дні (днів)
7+54.25 грн
10+44.16 грн
25+41.37 грн
50+36.97 грн
100+35.20 грн
250+32.99 грн
500+30.90 грн
1000+29.42 грн
2500+27.58 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
110-93-314-41-801000 110-93-314-41-801000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 141 шт:
термін постачання 21-31 дні (днів)
1+452.66 грн
10+370.18 грн
28+344.24 грн
56+307.62 грн
112+292.93 грн
В кошику  од. на суму  грн.
110-93-316-41-801000 110-93-316-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+499.28 грн
10+434.26 грн
В кошику  од. на суму  грн.
110-93-318-41-801000 110-93-318-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-320-41-801000 110-93-320-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
1+542.51 грн
20+422.63 грн
40+402.43 грн
60+367.01 грн
100+354.01 грн
В кошику  од. на суму  грн.
110-93-624-41-801000 110-93-624-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
1+627.28 грн
10+546.01 грн
25+515.82 грн
В кошику  од. на суму  грн.
110-93-324-41-801000 110-93-324-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 83 шт:
термін постачання 21-31 дні (днів)
1+589.98 грн
10+513.44 грн
25+485.07 грн
50+444.11 грн
В кошику  од. на суму  грн.
110-93-628-41-801000 110-93-628-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
1+665.42 грн
14+576.70 грн
28+543.26 грн
56+496.75 грн
В кошику  од. на суму  грн.
110-93-640-41-801000 110-93-640-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-13-314-41-801000 110-13-314-41-801000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
1+556.07 грн
10+455.32 грн
28+423.39 грн
56+378.36 грн
В кошику  од. на суму  грн.
110-13-316-41-801000 110-13-316-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
1+691.70 грн
10+511.07 грн
В кошику  од. на суму  грн.
110-13-318-41-801000 110-13-318-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
1+660.34 грн
22+482.90 грн
44+454.11 грн
66+411.12 грн
В кошику  од. на суму  грн.
110-13-320-41-801000 110-13-320-41-801000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
1+647.62 грн
20+504.34 грн
40+480.26 грн
60+437.99 грн
100+422.48 грн
260+394.95 грн
В кошику  од. на суму  грн.
110-13-624-41-801000 110-13-624-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-13-324-41-801000 110-13-324-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)
1+1872.51 грн
16+1409.31 грн
32+1325.31 грн
В кошику  од. на суму  грн.
110-13-628-41-801000 110-13-628-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
1+506.91 грн
14+441.14 грн
28+416.80 грн
56+381.59 грн
112+362.50 грн
В кошику  од. на суму  грн.
110-13-640-41-801000 110-13-640-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
1+1157.08 грн
10+987.62 грн
30+949.66 грн
В кошику  од. на суму  грн.
123-93-314-41-801000 123-93-314-41-801000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
1+556.92 грн
10+455.81 грн
28+423.85 грн
56+378.76 грн
В кошику  од. на суму  грн.
123-93-316-41-801000 123-93-316-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
1+633.21 грн
10+517.77 грн
В кошику  од. на суму  грн.
123-93-318-41-801000 123-93-318-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+1663.14 грн
В кошику  од. на суму  грн.
123-93-320-41-801000 123-93-320-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
1+1792.83 грн
20+1323.11 грн
40+1244.25 грн
60+1126.46 грн
100+1076.62 грн
В кошику  од. на суму  грн.
123-93-624-41-801000 123-93-624-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+1750.45 грн
10+1476.00 грн
25+1412.23 грн
В кошику  од. на суму  грн.
123-93-628-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
123-93-640-41-801000 123-93-640-41-801000 Mill-Max Manufacturing Corp. 2017-11%3A098.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
1+435.70 грн
10+320.88 грн
30+283.63 грн
В кошику  од. на суму  грн.
0040-1-17-01-30-27-02-0 0040-1-17-01-30-27-02-0 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN PIN RCPT .015-.025 PRESSFIT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.460" (11.68mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.162" (4.12mm)
Part Status: Active
на замовлення 3699 шт:
термін постачання 21-31 дні (днів)
15+22.89 грн
18+18.69 грн
25+17.47 грн
50+15.61 грн
100+14.87 грн
250+13.93 грн
500+13.05 грн
1000+12.43 грн
2500+11.65 грн
Мінімальне замовлення: 15
В кошику  од. на суму  грн.
110-93-328-41-001000 110-93-328-41-001000 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 408 шт:
термін постачання 21-31 дні (днів)
2+322.12 грн
14+257.13 грн
28+244.85 грн
56+218.80 грн
112+208.36 грн
252+196.77 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
510-93-145-15-081001 510-93-145-15-081001 Mill-Max Manufacturing Corp. 138M.PDF Description: CONN SOCKET PGA 145POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
214-99-318-01-670800 214-99-318-01-670800 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 18POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 312 шт:
термін постачання 21-31 дні (днів)
2+181.40 грн
22+140.18 грн
44+133.48 грн
66+121.73 грн
110+117.42 грн
264+110.38 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-628-01-670800 214-99-628-01-670800 Mill-Max Manufacturing Corp. 2017-11%3A108.pdf Description: CONN IC DIP SOCKET 28POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 85 шт:
термін постачання 21-31 дні (днів)
2+251.76 грн
14+220.51 грн
28+208.88 грн
56+191.47 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-320-01-670800 214-99-320-01-670800 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 20POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
2+193.27 грн
20+150.60 грн
40+143.40 грн
60+130.78 грн
100+126.14 грн
260+117.91 грн
500+110.75 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-632-01-670800 214-99-632-01-670800 Mill-Max Manufacturing Corp. Mill%20Max%20catalog.pdf Description: CONN IC DIP SOCKET 32POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1398 шт:
термін постачання 21-31 дні (днів)
2+283.12 грн
12+229.03 грн
36+211.98 грн
60+191.87 грн
108+184.08 грн
252+173.39 грн
504+162.41 грн
1008+154.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-314-01-670800 214-99-314-01-670800 Mill-Max Manufacturing Corp. 2017-11%3A108.pdf Description: CONN IC DIP SOCKET 14POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
3+165.30 грн
10+135.58 грн
28+126.09 грн
56+112.66 грн
112+107.28 грн
252+101.31 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
214-99-308-01-670800 214-99-308-01-670800 Mill-Max Manufacturing Corp. 2017-11%3A108.pdf Description: CONN IC DIP SOCKET 8POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1015 шт:
термін постачання 21-31 дні (днів)
4+94.09 грн
10+76.81 грн
25+71.96 грн
50+64.32 грн
100+61.23 грн
250+57.39 грн
500+53.76 грн
1000+51.19 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
117-93-656-41-005000 117-93-656-41-005000 Mill-Max Manufacturing Corp. 2017-11%3A125.pdf Description: CONN IC DIP SOCKET 56POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
1+778.17 грн
10+674.16 грн
30+635.07 грн
50+580.69 грн
В кошику  од. на суму  грн.
117-93-652-41-005000 117-93-652-41-005000 Mill-Max Manufacturing Corp. 2017-11%3A125.pdf Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
1+1952.19 грн
11+1519.32 грн
В кошику  од. на суму  грн.
117-93-640-41-005000 117-93-640-41-005000 Mill-Max Manufacturing Corp. 2017-11%3A125.pdf Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-324-41-001000 2017-11%3A090.pdf
110-93-324-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 137 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+210.22 грн
16+184.07 грн
32+174.30 грн
64+159.79 грн
112+152.18 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-93-318-41-001000 Mill%20Max%20catalog.pdf
110-93-318-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 629 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+228.02 грн
22+176.76 грн
44+168.32 грн
66+153.50 грн
110+148.06 грн
264+139.19 грн
506+130.77 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-13-624-41-001000 2017-11%3A090.pdf
110-13-624-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 165 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+360.26 грн
16+314.88 грн
32+298.20 грн
64+273.36 грн
112+260.33 грн
В кошику  од. на суму  грн.
117-93-316-41-005000 2017-11%3A125.pdf
117-93-316-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-13-328-41-001000 Mill%20Max%20catalog.pdf
110-13-328-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 203 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+439.10 грн
14+350.88 грн
28+334.09 грн
56+298.58 грн
112+284.32 грн
В кошику  од. на суму  грн.
110-13-628-41-001000 2017-11%3A090.pdf
110-13-628-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1087 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+412.82 грн
14+330.01 грн
28+314.24 грн
56+280.81 грн
112+267.40 грн
252+252.54 грн
504+236.54 грн
1008+225.26 грн
В кошику  од. на суму  грн.
110-93-308-41-001000 2017-11%3A090.pdf
110-93-308-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2575 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+99.18 грн
10+80.81 грн
25+75.69 грн
50+67.66 грн
100+64.42 грн
250+60.38 грн
500+56.55 грн
1000+53.85 грн
2500+50.48 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
110-93-320-41-001000 2017-11%3A090.pdf
110-93-320-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 719 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+212.77 грн
20+165.83 грн
40+157.87 грн
60+143.98 грн
100+138.87 грн
260+129.82 грн
500+121.93 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
110-13-632-41-001000 2017-11%3A090.pdf
110-13-632-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+420.45 грн
12+367.60 грн
36+348.14 грн
60+319.12 грн
108+303.93 грн
В кошику  од. на суму  грн.
110-93-314-41-001000 Mill%20Max%20catalog.pdf
110-93-314-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1711 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+181.40 грн
10+148.73 грн
28+138.30 грн
56+123.58 грн
112+117.68 грн
252+111.13 грн
504+104.09 грн
1008+99.13 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-316-01-670800 Mill%20Max%20catalog.pdf
214-99-316-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 365 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+166.99 грн
10+136.81 грн
25+128.29 грн
50+114.62 грн
100+109.15 грн
250+102.31 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
214-99-640-01-670800 Mill%20Max%20catalog.pdf
214-99-640-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+329.75 грн
10+269.29 грн
30+249.18 грн
50+225.57 грн
100+214.78 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
117-93-664-41-005000 2017-11%3A125.pdf
117-93-664-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 64POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 64 (2 x 32)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-93-316-41-001000 Mill%20Max%20catalog.pdf
110-93-316-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 6235 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+200.90 грн
10+164.73 грн
25+154.44 грн
50+138.00 грн
100+131.41 грн
250+123.17 грн
500+115.37 грн
1000+109.87 грн
2500+102.99 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
123-13-624-41-001000 2017-11%3A109.pdf
123-13-624-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-13-316-41-001000 Mill%20Max%20catalog.pdf
110-13-316-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 3526 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+317.88 грн
10+259.98 грн
25+243.64 грн
50+217.73 грн
100+207.32 грн
250+194.34 грн
500+182.03 грн
1000+173.35 грн
2500+162.51 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
0355-0-15-01-02-01-10-0 Mill%20Max%20catalog.pdf
0355-0-15-01-02-01-10-0
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT .040-.050 SOLDER
Packaging: Bulk
Contact Finish: Tin-Lead
Flange Diameter: 0.118" (3.00mm)
Length - Overall: 0.290" (7.37mm)
Termination: Solder
Mounting Hole Diameter: 0.102" (2.59mm)
Contact Finish Thickness: 200.0µin (5.08µm)
Contact Material: Beryllium Copper
Tail Type: No Tail
Accepts Pin Diameter: 0.040" ~ 0.050" (1.02mm ~ 1.27mm)
Pin Hole Diameter: 0.068" (1.73mm)
Socket Depth: 0.260" (6.60mm)
Part Status: Active
на замовлення 31706 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13+26.28 грн
16+21.55 грн
25+20.21 грн
50+18.05 грн
100+17.19 грн
250+16.11 грн
500+15.09 грн
1000+14.37 грн
2500+13.47 грн
Мінімальне замовлення: 13
В кошику  од. на суму  грн.
117-93-668-41-005000 Mill%20Max%20catalog.pdf
117-93-668-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 68POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 68 (2 x 34)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2091.21 грн
В кошику  од. на суму  грн.
117-93-428-41-005000 Mill%20Max%20catalog.pdf
117-93-428-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 111 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+506.91 грн
20+394.96 грн
40+376.10 грн
60+343.00 грн
100+330.84 грн
В кошику  од. на суму  грн.
110-13-320-41-001000 Mill%20Max%20catalog.pdf
110-13-320-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 230 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+322.96 грн
20+251.58 грн
40+239.56 грн
60+218.48 грн
100+210.73 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
123-13-628-41-001000 2017-11%3A109.pdf
123-13-628-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
123-13-316-41-001000 2017-11%3A109.pdf
123-13-316-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+584.90 грн
10+458.99 грн
25+423.09 грн
В кошику  од. на суму  грн.
123-13-324-41-001000 2017-11%3A109.pdf
123-13-324-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
123-13-320-41-001000 2017-11%3A109.pdf
123-13-320-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-99-308-41-001000 Mill%20Max%20catalog.pdf
110-99-308-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS TIN-LEAD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2620 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+54.25 грн
10+44.16 грн
25+41.37 грн
50+36.97 грн
100+35.20 грн
250+32.99 грн
500+30.90 грн
1000+29.42 грн
2500+27.58 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
110-93-314-41-801000 Mill%20Max%20catalog.pdf
110-93-314-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 141 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+452.66 грн
10+370.18 грн
28+344.24 грн
56+307.62 грн
112+292.93 грн
В кошику  од. на суму  грн.
110-93-316-41-801000 2017-11%3A098.pdf
110-93-316-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+499.28 грн
10+434.26 грн
В кошику  од. на суму  грн.
110-93-318-41-801000 2017-11%3A098.pdf
110-93-318-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-93-320-41-801000 2017-11%3A098.pdf
110-93-320-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+542.51 грн
20+422.63 грн
40+402.43 грн
60+367.01 грн
100+354.01 грн
В кошику  од. на суму  грн.
110-93-624-41-801000 2017-11%3A098.pdf
110-93-624-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+627.28 грн
10+546.01 грн
25+515.82 грн
В кошику  од. на суму  грн.
110-93-324-41-801000 2017-11%3A098.pdf
110-93-324-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 83 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+589.98 грн
10+513.44 грн
25+485.07 грн
50+444.11 грн
В кошику  од. на суму  грн.
110-93-628-41-801000 2017-11%3A098.pdf
110-93-628-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+665.42 грн
14+576.70 грн
28+543.26 грн
56+496.75 грн
В кошику  од. на суму  грн.
110-93-640-41-801000 2017-11%3A098.pdf
110-93-640-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
110-13-314-41-801000 Mill%20Max%20catalog.pdf
110-13-314-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+556.07 грн
10+455.32 грн
28+423.39 грн
56+378.36 грн
В кошику  од. на суму  грн.
110-13-316-41-801000 2017-11%3A098.pdf
110-13-316-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+691.70 грн
10+511.07 грн
В кошику  од. на суму  грн.
110-13-318-41-801000 2017-11%3A098.pdf
110-13-318-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 80 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+660.34 грн
22+482.90 грн
44+454.11 грн
66+411.12 грн
В кошику  од. на суму  грн.
110-13-320-41-801000 Mill%20Max%20catalog.pdf
110-13-320-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+647.62 грн
20+504.34 грн
40+480.26 грн
60+437.99 грн
100+422.48 грн
260+394.95 грн
В кошику  од. на суму  грн.
110-13-624-41-801000 2017-11%3A098.pdf
110-13-624-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику  од. на суму  грн.
110-13-324-41-801000 2017-11%3A098.pdf
110-13-324-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1872.51 грн
16+1409.31 грн
32+1325.31 грн
В кошику  од. на суму  грн.
110-13-628-41-801000 2017-11%3A098.pdf
110-13-628-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 142 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+506.91 грн
14+441.14 грн
28+416.80 грн
56+381.59 грн
112+362.50 грн
В кошику  од. на суму  грн.
110-13-640-41-801000 2017-11%3A098.pdf
110-13-640-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1157.08 грн
10+987.62 грн
30+949.66 грн
В кошику  од. на суму  грн.
123-93-314-41-801000 Mill%20Max%20catalog.pdf
123-93-314-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+556.92 грн
10+455.81 грн
28+423.85 грн
56+378.76 грн
В кошику  од. на суму  грн.
123-93-316-41-801000 2017-11%3A098.pdf
123-93-316-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+633.21 грн
10+517.77 грн
В кошику  од. на суму  грн.
123-93-318-41-801000 2017-11%3A098.pdf
123-93-318-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1663.14 грн
В кошику  од. на суму  грн.
123-93-320-41-801000 2017-11%3A098.pdf
123-93-320-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 104 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1792.83 грн
20+1323.11 грн
40+1244.25 грн
60+1126.46 грн
100+1076.62 грн
В кошику  од. на суму  грн.
123-93-624-41-801000 2017-11%3A098.pdf
123-93-624-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1750.45 грн
10+1476.00 грн
25+1412.23 грн
В кошику  од. на суму  грн.
123-93-628-41-801000 2017-11%3A098.pdf
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
123-93-640-41-801000 2017-11%3A098.pdf
123-93-640-41-801000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Features: Open Frame, Decoupling Capacitor
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+435.70 грн
10+320.88 грн
30+283.63 грн
В кошику  од. на суму  грн.
0040-1-17-01-30-27-02-0 Mill%20Max%20catalog.pdf
0040-1-17-01-30-27-02-0
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT .015-.025 PRESSFIT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.072" (1.83mm)
Length - Overall: 0.460" (11.68mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Wire Wrap
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.025" (0.64mm) Square
Socket Depth: 0.162" (4.12mm)
Part Status: Active
на замовлення 3699 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
15+22.89 грн
18+18.69 грн
25+17.47 грн
50+15.61 грн
100+14.87 грн
250+13.93 грн
500+13.05 грн
1000+12.43 грн
2500+11.65 грн
Мінімальне замовлення: 15
В кошику  од. на суму  грн.
110-93-328-41-001000 Mill%20Max%20catalog.pdf
110-93-328-41-001000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 408 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+322.12 грн
14+257.13 грн
28+244.85 грн
56+218.80 грн
112+208.36 грн
252+196.77 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
510-93-145-15-081001 138M.PDF
510-93-145-15-081001
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PGA 145POS GOLD
товару немає в наявності
В кошику  од. на суму  грн.
214-99-318-01-670800 Mill%20Max%20catalog.pdf
214-99-318-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 312 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+181.40 грн
22+140.18 грн
44+133.48 грн
66+121.73 грн
110+117.42 грн
264+110.38 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-628-01-670800 2017-11%3A108.pdf
214-99-628-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 85 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+251.76 грн
14+220.51 грн
28+208.88 грн
56+191.47 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-320-01-670800 Mill%20Max%20catalog.pdf
214-99-320-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 603 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+193.27 грн
20+150.60 грн
40+143.40 грн
60+130.78 грн
100+126.14 грн
260+117.91 грн
500+110.75 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-632-01-670800 Mill%20Max%20catalog.pdf
214-99-632-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS TINLEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1398 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+283.12 грн
12+229.03 грн
36+211.98 грн
60+191.87 грн
108+184.08 грн
252+173.39 грн
504+162.41 грн
1008+154.66 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
214-99-314-01-670800 2017-11%3A108.pdf
214-99-314-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS TINLEAD
Features: Closed Frame
Packaging: Tube
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+165.30 грн
10+135.58 грн
28+126.09 грн
56+112.66 грн
112+107.28 грн
252+101.31 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
214-99-308-01-670800 2017-11%3A108.pdf
214-99-308-01-670800
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1015 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+94.09 грн
10+76.81 грн
25+71.96 грн
50+64.32 грн
100+61.23 грн
250+57.39 грн
500+53.76 грн
1000+51.19 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
117-93-656-41-005000 2017-11%3A125.pdf
117-93-656-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 56POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 56 (2 x 28)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 70 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+778.17 грн
10+674.16 грн
30+635.07 грн
50+580.69 грн
В кошику  од. на суму  грн.
117-93-652-41-005000 2017-11%3A125.pdf
117-93-652-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 52POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 52 (2 x 26)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1952.19 грн
11+1519.32 грн
В кошику  од. на суму  грн.
117-93-640-41-005000 2017-11%3A125.pdf
117-93-640-41-005000
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.070" (1.78mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.070" (1.78mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику  од. на суму  грн.
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