Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (42196) > Сторінка 349 з 704
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
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| 399-91-032-21-300000 | Mill-Max Manufacturing Corp. |
Description: STANDARD SOCKET HEADER Features: Block Terminals Packaging: Bulk Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 32 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Insulation Height: 0.118" (3.00mm) Number of Rows: 1 |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 399-41-032-21-300000 | Mill-Max Manufacturing Corp. |
Description: STANDARD SOCKET HEADERFeatures: Block Terminals Packaging: Bulk Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 32 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.118" (3.00mm) Number of Rows: 1 |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
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311-13-107-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 7POS 0.1 GOLD PCBPackaging: Tube Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 7 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Length - Post: 0.170" (4.32mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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311-13-107-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 7POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | ||||||||||||||||||
| 311-13-107-41-003000 | Mill-Max Manufacturing Corp. | Description: STANDRD SOLDER TAIL SIP SOCKET |
товару немає в наявності |
Мінімальне замовлення: 58 шт В кошику од. на суму грн. | |||||||||||||||||||
| 321-13-107-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 7POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 58 шт В кошику од. на суму грн. | |||||||||||||||||||
| 310-13-147-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 47POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
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116-43-420-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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| 116-43-422-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLTermination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLFeatures: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-420-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 20 (2 x 10) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-424-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 24 (2 x 12) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 64 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-422-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 22 (2 x 11) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 28 (2 x 14) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.4" (10.16mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-43-428-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Features: Elevated, Open Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 0464-0-15-80-10-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPTPackaging: Bulk Part Status: Active Socket Depth: 0.100" (2.54mm) Tail Diameter: 0.014" (0.36mm) Pin Hole Diameter: 0.028" (0.71mm) Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm) Tail Type: Standard Tail Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Mounting Hole Diameter: 0.016" (0.41mm) Termination: Solder Length - Overall: 0.250" (6.35mm) Flange Diameter: 0.037" (0.94mm) Contact Finish: Gold |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 0464-0-15-15-10-14-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPTPackaging: Bulk Part Status: Active Socket Depth: 0.100" (2.54mm) Tail Diameter: 0.014" (0.36mm) Pin Hole Diameter: 0.028" (0.71mm) Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm) Tail Type: Standard Tail Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Mounting Hole Diameter: 0.016" (0.41mm) Termination: Solder Length - Overall: 0.250" (6.35mm) Flange Diameter: 0.037" (0.94mm) Contact Finish: Gold |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
|
0945-0-15-20-09-14-11-0 | Mill-Max Manufacturing Corp. |
Description: STANDARD SPRING LOADED PINPackaging: Bulk Contact Finish: Gold Mounting Type: Surface Mount Contact Finish Thickness: 20.0µin (0.51µm) Contact Material: Brass Alloy Mating Cycles: 1000000 Part Status: Active Maximum Working Height: 0.266" (6.76mm) Minimum Working Height: 0.236" (6.00mm) Pad Layout Dimension: Circular - 0.118" (3mm) (TH) Plunger Size: 0.091" (2.31mm) Dia Operating Force - Initial: 30gf Operating Force - Mid Compression: 55gf Current Rating (Amps): 7.2A |
на замовлення 15960 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||||
| 111-41-304-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 111-41-308-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-062001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-062002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-114-13-062003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 510-41-114-13-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 510-41-114-13-062001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-114-13-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-114-13-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-114-13-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. |
| 399-91-032-21-300000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Features: Block Terminals
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.118" (3.00mm)
Number of Rows: 1
Description: STANDARD SOCKET HEADER
Features: Block Terminals
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Insulation Height: 0.118" (3.00mm)
Number of Rows: 1
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 399-41-032-21-300000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Features: Block Terminals
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.118" (3.00mm)
Number of Rows: 1
Description: STANDARD SOCKET HEADER
Features: Block Terminals
Packaging: Bulk
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 32
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin
Insulation Height: 0.118" (3.00mm)
Number of Rows: 1
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 311-13-107-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 7
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.170" (4.32mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 7POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 7
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.170" (4.32mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1075.19 грн |
| 29+ | 816.45 грн |
| 311-13-107-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.1 GOLD PCB
Description: CONN RCPT 7POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 311-13-107-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Description: STANDRD SOLDER TAIL SIP SOCKET
товару немає в наявності
Мінімальне замовлення: 58 шт
В кошику
од. на суму грн.
| 321-13-107-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.1 GOLD PCB
Description: CONN RCPT 7POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 58 шт
В кошику
од. на суму грн.
| 310-13-147-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 47POS 0.1 GOLD PCB
Description: CONN RCPT 47POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-43-420-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-420-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-422-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-420-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-422-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-424-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-420-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1318.87 грн |
| 20+ | 1027.41 грн |
| 40+ | 978.40 грн |
| 116-43-422-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-424-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-422-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-420-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-424-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-428-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-424-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-422-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-428-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Description: CONN IC SKT DBL
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-428-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Description: CONN IC SKT DBL
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-424-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-428-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-428-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-420-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-420-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Description: CONN IC SKT DBL
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-422-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Description: CONN IC SKT DBL
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-420-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Description: CONN IC SKT DBL
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-422-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-424-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-420-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-422-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-424-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: CONN IC SKT DBL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-422-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Description: CONN IC SKT DBL
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-420-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 20 (2 x 10)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 116-43-424-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN IC SKT DBL
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-428-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-424-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 24 (2 x 12)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 64 шт
В кошику
од. на суму грн.
| 116-43-422-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 22 (2 x 11)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 116-43-428-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 28 (2 x 14)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.4" (10.16mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-43-428-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Features: Elevated, Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 0464-0-15-80-10-14-04-0 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Part Status: Active
Socket Depth: 0.100" (2.54mm)
Tail Diameter: 0.014" (0.36mm)
Pin Hole Diameter: 0.028" (0.71mm)
Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.016" (0.41mm)
Termination: Solder
Length - Overall: 0.250" (6.35mm)
Flange Diameter: 0.037" (0.94mm)
Contact Finish: Gold
Description: CONN PIN RCPT
Packaging: Bulk
Part Status: Active
Socket Depth: 0.100" (2.54mm)
Tail Diameter: 0.014" (0.36mm)
Pin Hole Diameter: 0.028" (0.71mm)
Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.016" (0.41mm)
Termination: Solder
Length - Overall: 0.250" (6.35mm)
Flange Diameter: 0.037" (0.94mm)
Contact Finish: Gold
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 0464-0-15-15-10-14-04-0 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Part Status: Active
Socket Depth: 0.100" (2.54mm)
Tail Diameter: 0.014" (0.36mm)
Pin Hole Diameter: 0.028" (0.71mm)
Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.016" (0.41mm)
Termination: Solder
Length - Overall: 0.250" (6.35mm)
Flange Diameter: 0.037" (0.94mm)
Contact Finish: Gold
Description: CONN PIN RCPT
Packaging: Bulk
Part Status: Active
Socket Depth: 0.100" (2.54mm)
Tail Diameter: 0.014" (0.36mm)
Pin Hole Diameter: 0.028" (0.71mm)
Accepts Pin Diameter: 0.012" ~ 0.017" (0.30mm ~ 0.43mm)
Tail Type: Standard Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.016" (0.41mm)
Termination: Solder
Length - Overall: 0.250" (6.35mm)
Flange Diameter: 0.037" (0.94mm)
Contact Finish: Gold
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 0945-0-15-20-09-14-11-0 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SPRING LOADED PIN
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.266" (6.76mm)
Minimum Working Height: 0.236" (6.00mm)
Pad Layout Dimension: Circular - 0.118" (3mm) (TH)
Plunger Size: 0.091" (2.31mm) Dia
Operating Force - Initial: 30gf
Operating Force - Mid Compression: 55gf
Current Rating (Amps): 7.2A
Description: STANDARD SPRING LOADED PIN
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Surface Mount
Contact Finish Thickness: 20.0µin (0.51µm)
Contact Material: Brass Alloy
Mating Cycles: 1000000
Part Status: Active
Maximum Working Height: 0.266" (6.76mm)
Minimum Working Height: 0.236" (6.00mm)
Pad Layout Dimension: Circular - 0.118" (3mm) (TH)
Plunger Size: 0.091" (2.31mm) Dia
Operating Force - Initial: 30gf
Operating Force - Mid Compression: 55gf
Current Rating (Amps): 7.2A
на замовлення 15960 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 202.54 грн |
| 10+ | 166.01 грн |
| 25+ | 155.54 грн |
| 50+ | 139.01 грн |
| 100+ | 132.36 грн |
| 250+ | 124.07 грн |
| 500+ | 116.21 грн |
| 1000+ | 110.67 грн |
| 2500+ | 103.75 грн |
| 111-41-304-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 111-41-308-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Description: CONN IC SKT DBL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-061001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-061002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-061003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-062001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-062002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-114-13-062003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 510-41-114-13-061001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 510-41-114-13-062001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-93-114-13-061001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-93-114-13-061002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-93-114-13-061003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.




