Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (42034) > Сторінка 377 з 701
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||||
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3121-2-00-21-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC 0.017DIA GOLDPart Status: Active Length - Above Flange: 0.157" (3.99mm) Length - Below Flange: 0.075" (1.91mm) Pin Size - Below Flange: 0.019" (0.48mm) Dia Pin Size - Above Flange: 0.017" (0.43mm) Dia Terminal Style: Single End Contact Material: Brass Alloy Contact Finish Thickness: 20.0µin (0.51µm) Mounting Hole Diameter: 0.023" (0.58mm) Termination: Solder Length - Overall: 0.248" (6.30mm) Flange Diameter: 0.040" (1.02mm) Terminal Type: PC Pin Board Thickness: 0.040" (1.02mm) Insulation: Non-Insulated Mounting Type: Through Hole Contact Finish: Gold Packaging: Bulk |
на замовлення 4762 шт: термін постачання 21-31 дні (днів) |
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| 3121-2-00-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC |
на замовлення 311 шт: термін постачання 21-31 дні (днів) |
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346-43-116-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 16POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Press-Fit Number of Positions or Pins (Grid): 16 (1 x 16) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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346-43-117-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 17POS GOLDPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Press-Fit Number of Positions or Pins (Grid): 17 (1 x 17) Operating Temperature: -55°C ~ 125°C Type: SIP Mounting Type: Through Hole Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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346-43-118-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 18POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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346-43-119-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET SIP 19POS GOLD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 346-43-116-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||||||
| 346-43-117-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 17POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 346-43-119-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 614-43-422-31-012000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA |
товару немає в наявності |
Мінімальне замовлення: 54 шт В кошику од. на суму грн. | |||||||||||||||||||
| 3301-1-14-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRCLength - Below Flange: 0.051" (1.30mm) Pin Size - Above Flange: 0.040" (1.02mm) Dia Terminal Style: Single End Contact Material: Brass Contact Finish Thickness: 200.0µin (5.08µm) Mounting Hole Diameter: 0.043" (1.09mm) Termination: Swage Flange Diameter: 0.070" (1.78mm) Terminal Type: PC Pin Board Thickness: 0.031" (0.79mm) Insulation: Non-Insulated Mounting Type: Through Hole, Right Angle Contact Finish: Tin Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 3360-1-14-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CIRCUIT PIN JUMPERNumber of Positions or Pins (Grid): 2 (1 x 2) Height: 0.200" (5.08mm) Type: Non-Insulated Pitch: 0.200" (5.08mm) Contact Finish: Tin Gender: Male Pins Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||||
| 330-10-101-00-240000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 1POS SLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 324-91-155-41-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 55POS 0.1 GOLD PCB |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 329-43-158-41-540000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 58 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Cup Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.180" (4.57mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 329-43-159-41-540000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 59POS 0.1 GOLD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.180" (4.57mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Cup Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 59 Mounting Type: Through Hole Current Rating (Amps): 3A Connector Type: Receptacle Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 329-43-161-41-540000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 61POS 0.1 GOLD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.180" (4.57mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 61 Mounting Type: Through Hole Current Rating (Amps): 3A Connector Type: Receptacle Packaging: Bulk Material Flammability Rating: UL94 V-0 Termination: Solder Cup Number of Positions Loaded: All |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
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3140-1-00-80-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRCLength - Above Flange: 0.051" (1.30mm) Length - Below Flange: 0.780" (19.81mm) Pin Size - Below Flange: 0.040" (1.02mm) Dia Pin Size - Above Flange: 0.039" (0.99mm) Dia Terminal Style: Wire Contact Material: Brass Alloy Contact Finish Thickness: 200.0µin (5.08µm) Mounting Hole Diameter: 0.043" (1.09mm) Termination: Swage Length - Overall: 0.851" (21.62mm) Flange Diameter: 0.070" (1.78mm) Terminal Type: PC Pin Board Thickness: 0.031" (0.79mm) Insulation: Non-Insulated Mounting Type: Through Hole Contact Finish: Tin Packaging: Bulk |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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2316-2-00-80-00-00-07-0 | Mill-Max Manufacturing Corp. |
Description: TERM TURRET SINGLE L=3.84MM TINPart Status: Active Staking Side ID: 0.042" (1.07mm) Staking Side OD: 0.060" (1.52mm) Length - Below Flange: 0.094" (2.39mm) Number of Turrets: Single Diameter - Turret Head: 0.060" (1.52mm) Contact Material: Brass Alloy Contact Finish Thickness: 200.0µin (5.08µm) Mounting Hole Diameter: 0.064" (1.63mm) Length - Above Board: 0.151" (3.84mm) Termination: Swage Length - Overall: 0.245" (6.22mm) Flange Diameter: 0.094" (2.39mm) Terminal Type: Single End Board Thickness: 0.062" (1.57mm) Insulation: Non-Insulated Mounting Type: Through Hole Contact Finish: Tin Packaging: Bulk |
на замовлення 2211 шт: термін постачання 21-31 дні (днів) |
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| 511-13-076-11-041002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 511-13-076-11-041003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 511-13-081-09-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 511-13-081-09-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 511-13-081-09-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-310-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-310-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-316-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-314-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-310-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-314-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-316-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLNumber of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-316-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-314-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-314-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-310-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 10 (2 x 5) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 80 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-316-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-314-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 14 (2 x 7) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 56 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 16 (2 x 8) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-304-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-304-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-304-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-304-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-304-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 4 (2 x 2) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 102 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-308-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-308-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-308-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-308-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 116-91-308-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 8 (2 x 4) Operating Temperature: -55°C ~ 125°C Type: DIP, 0.3" (7.62mm) Row Spacing Mounting Type: Through Hole Features: Elevated, Open Frame Packaging: Tube |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 515-91-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Closed Frame Packaging: Bulk Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-169-13-000002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 515-93-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 614-93-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 614-93-169-13-000007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 614-93-169-13-000012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGA |
товару немає в наявності |
Мінімальне замовлення: 50 шт В кошику од. на суму грн. | |||||||||||||||||||
| 510-91-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 510-91-169-13-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| 511-91-169-13-000001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 169 (13 x 13) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Closed Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
| 3121-2-00-21-00-00-08-0 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC 0.017DIA GOLD
Part Status: Active
Length - Above Flange: 0.157" (3.99mm)
Length - Below Flange: 0.075" (1.91mm)
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Terminal Style: Single End
Contact Material: Brass Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Mounting Hole Diameter: 0.023" (0.58mm)
Termination: Solder
Length - Overall: 0.248" (6.30mm)
Flange Diameter: 0.040" (1.02mm)
Terminal Type: PC Pin
Board Thickness: 0.040" (1.02mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Gold
Packaging: Bulk
Description: CONN PC PIN CIRC 0.017DIA GOLD
Part Status: Active
Length - Above Flange: 0.157" (3.99mm)
Length - Below Flange: 0.075" (1.91mm)
Pin Size - Below Flange: 0.019" (0.48mm) Dia
Pin Size - Above Flange: 0.017" (0.43mm) Dia
Terminal Style: Single End
Contact Material: Brass Alloy
Contact Finish Thickness: 20.0µin (0.51µm)
Mounting Hole Diameter: 0.023" (0.58mm)
Termination: Solder
Length - Overall: 0.248" (6.30mm)
Flange Diameter: 0.040" (1.02mm)
Terminal Type: PC Pin
Board Thickness: 0.040" (1.02mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Gold
Packaging: Bulk
на замовлення 4762 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 53.80 грн |
| 10+ | 44.19 грн |
| 25+ | 41.45 грн |
| 50+ | 37.01 грн |
| 100+ | 35.24 грн |
| 250+ | 33.03 грн |
| 500+ | 30.94 грн |
| 1000+ | 29.46 грн |
| 3000+ | 27.26 грн |
| 3121-2-00-80-00-00-08-0 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Description: CONN PC PIN CIRC
на замовлення 311 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 55.38 грн |
| 10+ | 44.87 грн |
| 25+ | 43.03 грн |
| 50+ | 39.51 грн |
| 100+ | 37.79 грн |
| 250+ | 34.35 грн |
| 346-43-116-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 16POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Press-Fit
Number of Positions or Pins (Grid): 16 (1 x 16)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 16POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Press-Fit
Number of Positions or Pins (Grid): 16 (1 x 16)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 346-43-117-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 17POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Press-Fit
Number of Positions or Pins (Grid): 17 (1 x 17)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
Description: CONN SOCKET SIP 17POS GOLD
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Press-Fit
Number of Positions or Pins (Grid): 17 (1 x 17)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 346-43-118-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 18POS GOLD
Description: CONN SOCKET SIP 18POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 346-43-119-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET SIP 19POS GOLD
Description: CONN SOCKET SIP 19POS GOLD
товару немає в наявності
В кошику
од. на суму грн.
| 346-43-116-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.1 GOLD PCB
Description: CONN RCPT 16POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| 346-43-117-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 17POS 0.1 GOLD PCB
Description: CONN RCPT 17POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 346-43-119-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 GOLD PCB
Description: CONN RCPT 19POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 614-43-422-31-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
товару немає в наявності
Мінімальне замовлення: 54 шт
В кошику
од. на суму грн.
| 3301-1-14-80-00-00-08-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Length - Below Flange: 0.051" (1.30mm)
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Terminal Style: Single End
Contact Material: Brass
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.043" (1.09mm)
Termination: Swage
Flange Diameter: 0.070" (1.78mm)
Terminal Type: PC Pin
Board Thickness: 0.031" (0.79mm)
Insulation: Non-Insulated
Mounting Type: Through Hole, Right Angle
Contact Finish: Tin
Packaging: Bulk
Description: CONN PC PIN CIRC
Length - Below Flange: 0.051" (1.30mm)
Pin Size - Above Flange: 0.040" (1.02mm) Dia
Terminal Style: Single End
Contact Material: Brass
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.043" (1.09mm)
Termination: Swage
Flange Diameter: 0.070" (1.78mm)
Terminal Type: PC Pin
Board Thickness: 0.031" (0.79mm)
Insulation: Non-Insulated
Mounting Type: Through Hole, Right Angle
Contact Finish: Tin
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 3360-1-14-80-00-00-08-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CIRCUIT PIN JUMPER
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.200" (5.08mm)
Type: Non-Insulated
Pitch: 0.200" (5.08mm)
Contact Finish: Tin
Gender: Male Pins
Packaging: Bulk
Description: CIRCUIT PIN JUMPER
Number of Positions or Pins (Grid): 2 (1 x 2)
Height: 0.200" (5.08mm)
Type: Non-Insulated
Pitch: 0.200" (5.08mm)
Contact Finish: Tin
Gender: Male Pins
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| 330-10-101-00-240000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 1POS SLD PCB
Description: CONN SPRING TARGET 1POS SLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 324-91-155-41-002000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 55POS 0.1 GOLD PCB
Description: CONN RCPT 55POS 0.1 GOLD PCB
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 329-43-158-41-540000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 58POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 58
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.180" (4.57mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 329-43-159-41-540000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.1 GOLD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.180" (4.57mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder Cup
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 59POS 0.1 GOLD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.180" (4.57mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder Cup
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 329-43-161-41-540000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 61POS 0.1 GOLD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.180" (4.57mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 61
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Material Flammability Rating: UL94 V-0
Termination: Solder Cup
Number of Positions Loaded: All
Description: CONN RCPT 61POS 0.1 GOLD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.180" (4.57mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 61
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Material Flammability Rating: UL94 V-0
Termination: Solder Cup
Number of Positions Loaded: All
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 3140-1-00-80-00-00-08-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC
Length - Above Flange: 0.051" (1.30mm)
Length - Below Flange: 0.780" (19.81mm)
Pin Size - Below Flange: 0.040" (1.02mm) Dia
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Terminal Style: Wire
Contact Material: Brass Alloy
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.043" (1.09mm)
Termination: Swage
Length - Overall: 0.851" (21.62mm)
Flange Diameter: 0.070" (1.78mm)
Terminal Type: PC Pin
Board Thickness: 0.031" (0.79mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Tin
Packaging: Bulk
Description: CONN PC PIN CIRC
Length - Above Flange: 0.051" (1.30mm)
Length - Below Flange: 0.780" (19.81mm)
Pin Size - Below Flange: 0.040" (1.02mm) Dia
Pin Size - Above Flange: 0.039" (0.99mm) Dia
Terminal Style: Wire
Contact Material: Brass Alloy
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.043" (1.09mm)
Termination: Swage
Length - Overall: 0.851" (21.62mm)
Flange Diameter: 0.070" (1.78mm)
Terminal Type: PC Pin
Board Thickness: 0.031" (0.79mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Tin
Packaging: Bulk
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 67.25 грн |
| 10+ | 54.47 грн |
| 25+ | 52.26 грн |
| 50+ | 48.03 грн |
| 100+ | 45.94 грн |
| 250+ | 41.76 грн |
| 500+ | 36.97 грн |
| 1000+ | 32.86 грн |
| 2316-2-00-80-00-00-07-0 |
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Виробник: Mill-Max Manufacturing Corp.
Description: TERM TURRET SINGLE L=3.84MM TIN
Part Status: Active
Staking Side ID: 0.042" (1.07mm)
Staking Side OD: 0.060" (1.52mm)
Length - Below Flange: 0.094" (2.39mm)
Number of Turrets: Single
Diameter - Turret Head: 0.060" (1.52mm)
Contact Material: Brass Alloy
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.064" (1.63mm)
Length - Above Board: 0.151" (3.84mm)
Termination: Swage
Length - Overall: 0.245" (6.22mm)
Flange Diameter: 0.094" (2.39mm)
Terminal Type: Single End
Board Thickness: 0.062" (1.57mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Tin
Packaging: Bulk
Description: TERM TURRET SINGLE L=3.84MM TIN
Part Status: Active
Staking Side ID: 0.042" (1.07mm)
Staking Side OD: 0.060" (1.52mm)
Length - Below Flange: 0.094" (2.39mm)
Number of Turrets: Single
Diameter - Turret Head: 0.060" (1.52mm)
Contact Material: Brass Alloy
Contact Finish Thickness: 200.0µin (5.08µm)
Mounting Hole Diameter: 0.064" (1.63mm)
Length - Above Board: 0.151" (3.84mm)
Termination: Swage
Length - Overall: 0.245" (6.22mm)
Flange Diameter: 0.094" (2.39mm)
Terminal Type: Single End
Board Thickness: 0.062" (1.57mm)
Insulation: Non-Insulated
Mounting Type: Through Hole
Contact Finish: Tin
Packaging: Bulk
на замовлення 2211 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 50.63 грн |
| 10+ | 41.60 грн |
| 25+ | 39.01 грн |
| 50+ | 34.83 грн |
| 100+ | 33.17 грн |
| 250+ | 31.09 грн |
| 500+ | 29.12 грн |
| 1000+ | 27.73 грн |
| 511-13-076-11-041002 |
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Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 511-13-076-11-041003 |
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Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 511-13-081-09-000001 |
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Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 511-13-081-09-000002 |
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Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 511-13-081-09-000003 |
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Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Description: SKT PGA SOLDRTL
товару немає в наявності
В кошику
од. на суму грн.
| 116-91-310-41-006000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-91-310-41-007000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-91-316-41-003000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-314-41-008000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-91-310-41-008000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-91-314-41-006000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-91-316-41-007000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Description: CONN IC SKT DBL
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-316-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-314-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-91-314-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-91-310-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 10 (2 x 5)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 80 шт
В кошику
од. на суму грн.
| 116-91-316-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-314-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 14 (2 x 7)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 56 шт
В кошику
од. на суму грн.
| 116-91-316-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-304-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 116-91-304-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 116-91-304-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 116-91-304-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 116-91-304-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 4 (2 x 2)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 102 шт
В кошику
од. на суму грн.
| 116-91-308-41-006000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-308-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-308-41-007000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-308-41-008000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 116-91-308-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
Description: CONN IC SKT DBL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 8 (2 x 4)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Elevated, Open Frame
Packaging: Tube
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 515-91-169-13-000001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 515-91-169-13-000002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
товару немає в наявності
В кошику
од. на суму грн.
| 515-91-169-13-000003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 515-93-169-13-000001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Description: SKT PGA SOLDRTL
Features: Closed Frame
Packaging: Bulk
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| 515-93-169-13-000002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 515-93-169-13-000003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 614-93-169-13-000001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 614-93-169-13-000007 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 614-93-169-13-000012 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Description: SKT CARRIER PGA
товару немає в наявності
Мінімальне замовлення: 50 шт
В кошику
од. на суму грн.
| 510-91-169-13-000001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 510-91-169-13-000003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 511-91-169-13-000001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 169 (13 x 13)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Closed Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.




]-1xx-41-013000.jpg)

