Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41470) > Сторінка 402 з 692
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 170-40-642-00-001000 | Mill-Max Manufacturing Corp. |
 Description: CONN HDR DIP TURRET 42POS TINPackaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 42 Pitch: 0.100" (2.54mm) Contact Type: Turret Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
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| 170-40-648-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR DIP TURRET 48POS TIN Packaging: Tube Connector Type: DIP, DIL - Header Contact Finish: Tin Color: Black Mounting Type: Through Hole Number of Positions: 48 Pitch: 0.100" (2.54mm) Contact Type: Turret Row Spacing: 0.600" (15.24mm) Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 2 |
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| 1808-0-15-80-43-27-04-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Length - Overall: 0.265" (6.73mm) Termination: Press-Fit Mounting Hole Diameter: 0.057" (1.45mm) Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Standard Tail Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Pin Hole Diameter: 0.043" (1.09mm) Tail Diameter: 0.018" (0.46mm) Socket Depth: 0.145" (3.68mm) Part Status: Active |
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| 3601-1-07-15-00-00-08-0 | Mill-Max Manufacturing Corp. |
Description: CONN PC PIN CIRC .080DIA GOLD Packaging: Bulk Contact Finish: Gold Mounting Type: Free Hanging (In-Line) Insulation: Non-Insulated Terminal Type: PC Pin Flange Diameter: 0.102" (2.59mm) Length - Overall: 0.506" (12.85mm) Termination: Crimp Contact Finish Thickness: 10.0µin (0.25µm) Contact Material: Brass Alloy Terminal Style: Wire Pin Size - Above Flange: 0.080" (2.03mm) Dia Length - Below Flange: 0.275" (6.99mm) Length - Above Flange: 0.200" (5.08mm) |
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| 334-10-115-00-020000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 334-10-116-00-020000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 16POS GOLD |
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| 334-10-115-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 334-10-116-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 16POS GOLD Packaging: Bulk Connector Type: Header Contact Finish: Gold Color: Black Mounting Type: Through Hole Number of Positions: 16 Pitch: 0.100" (2.54mm) Contact Type: Post, Extended Termination: Solder Contact Finish Thickness: 10.0µin (0.25µm) Number of Rows: 1 |
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| 334-10-115-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 334-10-116-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 16POS GOLD |
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| 334-10-115-00-000000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 334-10-116-00-000000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 16POS GOLD |
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| 334-10-115-00-100000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 15POS GOLD |
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| 415-41-222-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 22POS 0.1 GOLD PCB |
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| 415-41-224-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 24POS 0.1 GOLD PCB |
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| 415-41-222-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 22POS 0.1 GOLD PCB |
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| 326-43-150-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 326-43-150-41-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 326-43-149-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 49 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.594" (15.09mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 326-43-150-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 50POS 0.1 GOLD PCB |
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| 511-13-155-16-003001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 511-13-155-16-003002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 511-13-155-16-003003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 155 (16 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 323-93-134-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 34POS 0.1 GOLD PCB |
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853-43-014-10-021000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.05 GOLD PCB |
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853-43-016-10-011000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 16POS 0.05 GOLD PCB |
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853-43-014-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14P 0.05 GOLD PCB R/A |
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| 853-43-018-10-003000 | Mill-Max Manufacturing Corp. |
Description: STANDARD SOCKET HEADER Packaging: Tube Connector Type: Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 18 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Cup Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Length - Post: 0.191" (4.85mm) Insulation Height: 0.149" (3.78mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
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| 310-44-162-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 62POS 0.1 TIN PCB |
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851-41-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.05 GOLD PCB R/A |
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851-91-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.05 GOLD PCB R/A |
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| 831-41-049-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 49P 0.079 GOLD PCB R/A |
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316-47-135-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 35POS 0.1 GOLD PCB |
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| 714-43-226-31-007000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 26POS 0.1 GOLD PCB |
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| 510-13-177-15-061001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-177-15-061002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-177-15-061003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 177 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-15-041003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (15 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-117001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 510-13-179-18-095001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Features: Open Frame Packaging: Tube Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 315-13-115-61-003000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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| 310-13-115-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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311-13-115-61-001000 | Mill-Max Manufacturing Corp. | Description: CONN RCPT 15POS 0.1 GOLD PCB |
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853-43-018-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18POS 0.05 GOLD SMD |
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853-43-018-10-011000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18POS 0.05 GOLD PCB |
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853-43-018-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 18P 0.05 GOLD PCB R/A |
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| 323-11-127-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 27POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 27 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.510" (12.95mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 323-11-128-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 28POS 0.1 GOLD PCB |
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| 323-11-130-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 30POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 30 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.510" (12.95mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 323-11-131-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 31POS 0.1 GOLD PCB |
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315-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET LOW PROFILE SIP 20POS Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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311-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET LONG SOLDERTAIL SIP 20POS Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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| 315-13-120-41-004000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDER TAIL SIP SOCKET Packaging: Bulk Connector Type: Socket Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Length - Post: 0.082" (2.08mm) Insulation Height: 0.050" (1.27mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 311-13-120-41-003000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDER TAIL SIP SOCKET Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 20 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Contact Length - Post: 0.217" (5.51mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 321-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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В кошику од. на суму грн. | |
| 322-13-120-41-001000 | Mill-Max Manufacturing Corp. |
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS Packaging: Tube Mounting Type: Through Hole Type: SIP Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (1 x 20) Termination: Wire Wrap Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy |
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В кошику од. на суму грн. |
| 170-40-642-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR DIP TURRET 42POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 42
Pitch: 0.100" (2.54mm)
Contact Type: Turret
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP TURRET 42POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 42
Pitch: 0.100" (2.54mm)
Contact Type: Turret
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
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| 170-40-648-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR DIP TURRET 48POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Turret
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
Description: CONN HDR DIP TURRET 48POS TIN
Packaging: Tube
Connector Type: DIP, DIL - Header
Contact Finish: Tin
Color: Black
Mounting Type: Through Hole
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Contact Type: Turret
Row Spacing: 0.600" (15.24mm)
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 2
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В кошику
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| 1808-0-15-80-43-27-04-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.265" (6.73mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.018" (0.46mm)
Socket Depth: 0.145" (3.68mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Length - Overall: 0.265" (6.73mm)
Termination: Press-Fit
Mounting Hole Diameter: 0.057" (1.45mm)
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Standard Tail
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Pin Hole Diameter: 0.043" (1.09mm)
Tail Diameter: 0.018" (0.46mm)
Socket Depth: 0.145" (3.68mm)
Part Status: Active
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| 3601-1-07-15-00-00-08-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PC PIN CIRC .080DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.102" (2.59mm)
Length - Overall: 0.506" (12.85mm)
Termination: Crimp
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.080" (2.03mm) Dia
Length - Below Flange: 0.275" (6.99mm)
Length - Above Flange: 0.200" (5.08mm)
Description: CONN PC PIN CIRC .080DIA GOLD
Packaging: Bulk
Contact Finish: Gold
Mounting Type: Free Hanging (In-Line)
Insulation: Non-Insulated
Terminal Type: PC Pin
Flange Diameter: 0.102" (2.59mm)
Length - Overall: 0.506" (12.85mm)
Termination: Crimp
Contact Finish Thickness: 10.0µin (0.25µm)
Contact Material: Brass Alloy
Terminal Style: Wire
Pin Size - Above Flange: 0.080" (2.03mm) Dia
Length - Below Flange: 0.275" (6.99mm)
Length - Above Flange: 0.200" (5.08mm)
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| 334-10-115-00-020000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
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| 334-10-116-00-020000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 16POS GOLD
Description: CONN HDR POST 16POS GOLD
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| 334-10-115-00-010000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
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В кошику
од. на суму грн.
| 334-10-116-00-010000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 16POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
Description: CONN HDR POST 16POS GOLD
Packaging: Bulk
Connector Type: Header
Contact Finish: Gold
Color: Black
Mounting Type: Through Hole
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 10.0µin (0.25µm)
Number of Rows: 1
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В кошику
од. на суму грн.
| 334-10-115-00-050000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
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В кошику
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| 334-10-116-00-050000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 16POS GOLD
Description: CONN HDR POST 16POS GOLD
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| 334-10-115-00-000000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
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| 334-10-116-00-000000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 16POS GOLD
Description: CONN HDR POST 16POS GOLD
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| 334-10-115-00-100000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 15POS GOLD
Description: CONN HDR POST 15POS GOLD
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| 415-41-222-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 22POS 0.1 GOLD PCB
Description: CONN RCPT 22POS 0.1 GOLD PCB
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| 415-41-224-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 24POS 0.1 GOLD PCB
Description: CONN RCPT 24POS 0.1 GOLD PCB
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| 415-41-222-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 22POS 0.1 GOLD PCB
Description: CONN RCPT 22POS 0.1 GOLD PCB
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В кошику
од. на суму грн.
| 326-43-150-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
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| 326-43-150-41-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
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В кошику
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| 326-43-149-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 49
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.594" (15.09mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 49POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 49
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.594" (15.09mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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В кошику
од. на суму грн.
| 326-43-150-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 50POS 0.1 GOLD PCB
Description: CONN RCPT 50POS 0.1 GOLD PCB
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В кошику
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| 511-13-155-16-003001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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В кошику
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| 511-13-155-16-003002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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В кошику
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| 511-13-155-16-003003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 155 (16 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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В кошику
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| 323-93-134-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 34POS 0.1 GOLD PCB
Description: CONN RCPT 34POS 0.1 GOLD PCB
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| 853-43-014-10-021000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.05 GOLD PCB
Description: CONN RCPT 14POS 0.05 GOLD PCB
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| 853-43-016-10-011000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 16POS 0.05 GOLD PCB
Description: CONN RCPT 16POS 0.05 GOLD PCB
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| 853-43-014-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14P 0.05 GOLD PCB R/A
Description: CONN RCPT 14P 0.05 GOLD PCB R/A
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В кошику
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| 853-43-018-10-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDARD SOCKET HEADER
Packaging: Tube
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: STANDARD SOCKET HEADER
Packaging: Tube
Connector Type: Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 18
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder Cup
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Length - Post: 0.191" (4.85mm)
Insulation Height: 0.149" (3.78mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
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| 310-44-162-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 62POS 0.1 TIN PCB
Description: CONN RCPT 62POS 0.1 TIN PCB
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| 851-41-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
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| 851-91-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
Description: CONN RCPT 49P 0.05 GOLD PCB R/A
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| 831-41-049-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 49P 0.079 GOLD PCB R/A
Description: CONN RCPT 49P 0.079 GOLD PCB R/A
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| 316-47-135-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 35POS 0.1 GOLD PCB
Description: CONN SOCKET 35POS 0.1 GOLD PCB
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| 714-43-226-31-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 26POS 0.1 GOLD PCB
Description: CONN RCPT 26POS 0.1 GOLD PCB
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| 510-13-177-15-061001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
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| 510-13-177-15-061002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 510-13-177-15-061003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 177 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 510-13-179-15-041001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 510-13-179-15-041002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 510-13-179-15-041003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (15 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 510-13-179-18-095002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 510-13-179-18-095003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 510-13-179-18-117001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 510-13-179-18-095001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Tube
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 315-13-115-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
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од. на суму грн.
| 310-13-115-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
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од. на суму грн.
| 311-13-115-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 15POS 0.1 GOLD PCB
Description: CONN RCPT 15POS 0.1 GOLD PCB
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од. на суму грн.
| 853-43-018-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18POS 0.05 GOLD SMD
Description: CONN RCPT 18POS 0.05 GOLD SMD
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од. на суму грн.
| 853-43-018-10-011000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18POS 0.05 GOLD PCB
Description: CONN RCPT 18POS 0.05 GOLD PCB
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В кошику
од. на суму грн.
| 853-43-018-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 18P 0.05 GOLD PCB R/A
Description: CONN RCPT 18P 0.05 GOLD PCB R/A
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В кошику
од. на суму грн.
| 323-11-127-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 27POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 27
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 27POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 27
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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од. на суму грн.
| 323-11-128-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 28POS 0.1 GOLD PCB
Description: CONN RCPT 28POS 0.1 GOLD PCB
товару немає в наявності
В кошику
од. на суму грн.
| 323-11-130-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 30POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 30
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.510" (12.95mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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од. на суму грн.
| 323-11-131-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 31POS 0.1 GOLD PCB
Description: CONN RCPT 31POS 0.1 GOLD PCB
товару немає в наявності
В кошику
од. на суму грн.
| 315-13-120-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET LOW PROFILE SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SOCKET LOW PROFILE SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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В кошику
од. на суму грн.
| 311-13-120-41-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET LONG SOLDERTAIL SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SOCKET LONG SOLDERTAIL SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
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В кошику
од. на суму грн.
| 315-13-120-41-004000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Socket
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.082" (2.08mm)
Insulation Height: 0.050" (1.27mm)
Number of Rows: 1
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Socket
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.082" (2.08mm)
Insulation Height: 0.050" (1.27mm)
Number of Rows: 1
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| 311-13-120-41-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.217" (5.51mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 20
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Contact Length - Post: 0.217" (5.51mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
товару немає в наявності
В кошику
од. на суму грн.
| 321-13-120-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SOCKET 1 LEVEL WRAPOST SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 322-13-120-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Description: SOCKET 2 LEVEL WRAPOST SIP 20POS
Packaging: Tube
Mounting Type: Through Hole
Type: SIP
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (1 x 20)
Termination: Wire Wrap
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.