Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41581) > Сторінка 430 з 694
| Фото | Назва | Виробник | Інформація |
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| 351-10-145-00-011000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER VERT 45POS 2.54MM |
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399-10-110-10-009000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER R/A 10POS 2.54MMPackaging: Bulk Shrouding: Unshrouded Insulation Height: 0.100" (2.54mm) Contact Length - Post: 0.126" (3.20mm) Contact Shape: Circular Part Status: Active Contact Finish - Post: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Contact Material: Brass Alloy Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Male Pin Style: Board to Board Number of Rows: 1 Number of Positions: 10 Mounting Type: Through Hole, Right Angle Connector Type: Header Contact Length - Mating: 0.157" (4.00mm) Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT) |
на замовлення 2859 шт: термін постачання 21-31 дні (днів) |
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| 346-99-110-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCBInsulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 10 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Tube Number of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.120" (3.05mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) |
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| 346-99-111-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCBContact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 11 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk Number of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.120" (3.05mm) Part Status: Active Contact Finish - Post: Tin-Lead |
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| 346-99-111-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 11 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
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| 346-99-112-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.120" (3.05mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Number of Positions: 12 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk Operating Temperature: -55°C ~ 125°C Style: Board to Board |
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| 346-99-112-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 12 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
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| 346-99-113-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.120" (3.05mm) Part Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 13 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||
| 346-99-113-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCBNumber of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 13 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk |
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| 346-99-119-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB |
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В кошику од. на суму грн. | |||||||||||||
| 346-99-119-41-013000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCBPart Status: Active Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Press-Fit Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 19 Mounting Type: Through Hole Current Rating (Amps): 3A Voltage Rating: 100V, 150VDC Connector Type: Receptacle Packaging: Bulk Number of Rows: 1 Insulation Height: 0.110" (2.79mm) Contact Length - Post: 0.175" (4.45mm) |
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| 346-99-114-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB |
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| 1401-0-15-15-30-14-10-0 | Mill-Max Manufacturing Corp. |
Description: PIN RECEPTACLE Socket Depth: 0.145" (3.68mm) Pin Hole Diameter: 0.043" (1.09mm) Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm) Tail Type: No Tail Contact Material: Beryllium Copper Contact Finish Thickness: 10.0µin (0.25µm) Mounting Hole Diameter: 0.055" (1.40mm) Termination: Solder Length - Overall: 0.165" (4.19mm) Flange Diameter: 0.072" (1.83mm) Contact Finish: Gold Packaging: Bulk |
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316-93-159-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.236" (6.00mm) Number of Rows: 1 |
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316-93-159-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCBPackaging: Bulk Connector Type: Elevated Socket Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 59 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.315" (8.00mm) Number of Rows: 1 |
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| 334-90-114-00-010000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEADPackaging: Bulk Connector Type: Header Contact Finish: Tin-Lead Color: Black Mounting Type: Through Hole Number of Positions: 14 Pitch: 0.100" (2.54mm) Contact Type: Post, Extended Termination: Solder Contact Finish Thickness: 200.0µin (5.08µm) Number of Rows: 1 |
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| 334-90-113-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
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| 334-90-114-00-050000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
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| 334-90-114-00-000000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 14POS TIN-LEAD |
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| 334-90-113-00-100000 | Mill-Max Manufacturing Corp. |
Description: CONN HDR POST 13POS TIN-LEAD |
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316-93-159-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET 59POS 0.1 GOLD PCB |
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110-47-328-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 458 шт: термін постачання 21-31 дні (днів) |
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| 712-43-102-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 2POS 0.1 GOLD PCB |
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| 712-41-258-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.1 GOLD PCB |
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В кошику од. на суму грн. | |||||||||||||
| 712-41-260-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 60POS 0.1 GOLD PCB |
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803-99-042-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB |
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В кошику од. на суму грн. | ||||||||||||
| 833-43-014-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
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| 833-43-014-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD PCB |
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| 833-43-014-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14POS 0.079 GOLD SMD |
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| 833-43-014-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 14P 0.079 GOLD PCB R/A |
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851-93-058-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 58POS 0.05 GOLD PCB |
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В кошику од. на суму грн. | ||||||||||||
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851-93-059-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 59POS 0.05 GOLD PCBContact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 59 Mounting Type: Through Hole Current Rating (Amps): 3A Connector Type: Receptacle Packaging: Bulk Number of Rows: 1 Insulation Height: 0.185" (4.70mm) Contact Length - Post: 0.115" (2.92mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.050" (1.27mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull |
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851-41-007-10-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 7POS 0.05 GOLD PCB |
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В кошику од. на суму грн. | ||||||||||||
| 515-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||
| 515-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||
| 515-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||
| 515-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||
| 515-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 515-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |||||||||||||
| 515-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPackaging: Bulk Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) |
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В кошику од. на суму грн. | |||||||||||||
| 515-13-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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| 515-13-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Finish - Post: Gold Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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| 510-91-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
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В кошику од. на суму грн. | |||||||||||||
| 510-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||
| 510-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 614-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPart Status: Active Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 614-93-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPackaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame |
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В кошику од. на суму грн. | |||||||||||||
| 614-93-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Carrier, Open Frame Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||
| 551-90-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTLPackaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Finish Thickness - Mating: 200.0µin (5.08µm) Contact Finish - Mating: Tin-Lead Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Type: PGA Mounting Type: Through Hole |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 511-91-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 511-91-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 511-91-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLHousing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Part Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||
| 510-93-225-18-091002 | Mill-Max Manufacturing Corp. | Description: SOCKET SOLDERTAIL 225-PGA |
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В кошику од. на суму грн. | |||||||||||||
| 510-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 510-93-225-18-091003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLFeatures: Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 614-13-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 614-13-225-18-091007 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 614-13-225-18-091012 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER PGAFeatures: Carrier, Open Frame Packaging: Bulk Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 225 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 511-93-225-18-091001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLContact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk Part Status: Active Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| 511-93-225-18-091002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTLPart Status: Active Contact Material - Post: Brass Alloy Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Finish - Post: Tin-Lead Pitch - Post: 0.100" (2.54mm) Contact Material - Mating: Beryllium Copper Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Mating: Gold Pitch - Mating: 0.100" (2.54mm) Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Termination: Solder Number of Positions or Pins (Grid): 225 (18 x 18) Operating Temperature: -55°C ~ 125°C Type: PGA Mounting Type: Through Hole Features: Open Frame Packaging: Bulk |
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В кошику од. на суму грн. |
| 351-10-145-00-011000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER VERT 45POS 2.54MM
Description: CONN HEADER VERT 45POS 2.54MM
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| 399-10-110-10-009000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Length - Post: 0.126" (3.20mm)
Contact Shape: Circular
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Brass Alloy
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 1
Number of Positions: 10
Mounting Type: Through Hole, Right Angle
Connector Type: Header
Contact Length - Mating: 0.157" (4.00mm)
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Description: CONN HEADER R/A 10POS 2.54MM
Packaging: Bulk
Shrouding: Unshrouded
Insulation Height: 0.100" (2.54mm)
Contact Length - Post: 0.126" (3.20mm)
Contact Shape: Circular
Part Status: Active
Contact Finish - Post: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Contact Material: Brass Alloy
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Male Pin
Style: Board to Board
Number of Rows: 1
Number of Positions: 10
Mounting Type: Through Hole, Right Angle
Connector Type: Header
Contact Length - Mating: 0.157" (4.00mm)
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
на замовлення 2859 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 198.75 грн |
| 10+ | 173.91 грн |
| 100+ | 153.20 грн |
| 500+ | 122.20 грн |
| 1000+ | 104.23 грн |
| 346-99-110-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCB
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 10
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Tube
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Description: CONN RCPT 10POS 0.1 TIN-LEAD PCB
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 10
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Tube
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
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В кошику
од. на суму грн.
| 346-99-111-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 11
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 11
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
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В кошику
од. на суму грн.
| 346-99-111-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 11
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 11POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 11
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
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В кошику
од. на суму грн.
| 346-99-112-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
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В кошику
од. на суму грн.
| 346-99-112-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 12POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 12
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
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од. на суму грн.
| 346-99-113-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.120" (3.05mm)
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
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| 346-99-113-41-013000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Description: CONN RCPT 13POS 0.1 TIN-LEAD PCB
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 13
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
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| 346-99-119-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
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| 346-99-119-41-013000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 19
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
Description: CONN RCPT 19POS 0.1 TIN-LEAD PCB
Part Status: Active
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Press-Fit
Number of Positions Loaded: All
Fastening Type: Push-Pull
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 19
Mounting Type: Through Hole
Current Rating (Amps): 3A
Voltage Rating: 100V, 150VDC
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.110" (2.79mm)
Contact Length - Post: 0.175" (4.45mm)
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| 346-99-114-41-012000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 14POS 0.1 TIN-LEAD PCB
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| 1401-0-15-15-30-14-10-0 |
Виробник: Mill-Max Manufacturing Corp.
Description: PIN RECEPTACLE
Socket Depth: 0.145" (3.68mm)
Pin Hole Diameter: 0.043" (1.09mm)
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Tail Type: No Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.055" (1.40mm)
Termination: Solder
Length - Overall: 0.165" (4.19mm)
Flange Diameter: 0.072" (1.83mm)
Contact Finish: Gold
Packaging: Bulk
Description: PIN RECEPTACLE
Socket Depth: 0.145" (3.68mm)
Pin Hole Diameter: 0.043" (1.09mm)
Accepts Pin Diameter: 0.015" ~ 0.025" (0.38mm ~ 0.64mm)
Tail Type: No Tail
Contact Material: Beryllium Copper
Contact Finish Thickness: 10.0µin (0.25µm)
Mounting Hole Diameter: 0.055" (1.40mm)
Termination: Solder
Length - Overall: 0.165" (4.19mm)
Flange Diameter: 0.072" (1.83mm)
Contact Finish: Gold
Packaging: Bulk
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| 316-93-159-41-006000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.236" (6.00mm)
Number of Rows: 1
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од. на суму грн.
| 316-93-159-41-003000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Elevated Socket
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 59
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.315" (8.00mm)
Number of Rows: 1
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| 334-90-114-00-010000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
Description: CONN HDR POST 14POS TIN-LEAD
Packaging: Bulk
Connector Type: Header
Contact Finish: Tin-Lead
Color: Black
Mounting Type: Through Hole
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Contact Type: Post, Extended
Termination: Solder
Contact Finish Thickness: 200.0µin (5.08µm)
Number of Rows: 1
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| 334-90-113-00-050000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
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| 334-90-114-00-050000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
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| 334-90-114-00-000000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 14POS TIN-LEAD
Description: CONN HDR POST 14POS TIN-LEAD
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| 334-90-113-00-100000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR POST 13POS TIN-LEAD
Description: CONN HDR POST 13POS TIN-LEAD
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| 316-93-159-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET 59POS 0.1 GOLD PCB
Description: CONN SOCKET 59POS 0.1 GOLD PCB
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| 110-47-328-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 458 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 162.61 грн |
| 14+ | 129.41 грн |
| 28+ | 123.25 грн |
| 56+ | 110.14 грн |
| 112+ | 104.87 грн |
| 252+ | 99.04 грн |
| 712-43-102-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 2POS 0.1 GOLD PCB
Description: CONN RCPT 2POS 0.1 GOLD PCB
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| 712-41-258-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.1 GOLD PCB
Description: CONN RCPT 58POS 0.1 GOLD PCB
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од. на суму грн.
| 712-41-260-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 60POS 0.1 GOLD PCB
Description: CONN RCPT 60POS 0.1 GOLD PCB
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од. на суму грн.
| 803-99-042-10-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
Description: CONN RCPT 42POS 0.1 TIN-LEAD PCB
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од. на суму грн.
| 833-43-014-10-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
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| 833-43-014-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD PCB
Description: CONN RCPT 14POS 0.079 GOLD PCB
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| 833-43-014-30-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14POS 0.079 GOLD SMD
Description: CONN RCPT 14POS 0.079 GOLD SMD
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| 833-43-014-20-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
Description: CONN RCPT 14P 0.079 GOLD PCB R/A
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| 851-93-058-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 58POS 0.05 GOLD PCB
Description: CONN RCPT 58POS 0.05 GOLD PCB
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од. на суму грн.
| 851-93-059-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 59POS 0.05 GOLD PCB
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.185" (4.70mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
Description: CONN RCPT 59POS 0.05 GOLD PCB
Contact Type: Female Socket
Operating Temperature: -55°C ~ 125°C
Style: Board to Board
Number of Positions: 59
Mounting Type: Through Hole
Current Rating (Amps): 3A
Connector Type: Receptacle
Packaging: Bulk
Number of Rows: 1
Insulation Height: 0.185" (4.70mm)
Contact Length - Post: 0.115" (2.92mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.050" (1.27mm)
Insulation Color: Black
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Push-Pull
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од. на суму грн.
| 851-41-007-10-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 7POS 0.05 GOLD PCB
Description: CONN RCPT 7POS 0.05 GOLD PCB
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од. на суму грн.
| 515-91-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 515-91-225-18-091002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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од. на суму грн.
| 515-91-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 515-93-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 515-93-225-18-091002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 515-93-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 515-13-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Description: SKT PGA SOLDRTL
Packaging: Bulk
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
товару немає в наявності
В кошику
од. на суму грн.
| 515-13-225-18-091002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 515-13-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 510-91-225-18-091002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
товару немає в наявності
В кошику
од. на суму грн.
| 510-91-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 510-91-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 614-93-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Part Status: Active
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Description: SKT CARRIER PGA
Part Status: Active
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 614-93-225-18-091007 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Description: SKT CARRIER PGA
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
товару немає в наявності
В кошику
од. на суму грн.
| 614-93-225-18-091012 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
Description: SKT CARRIER PGA
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 551-90-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
Description: CONN HDR SOLDRTL
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Finish - Mating: Tin-Lead
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Type: PGA
Mounting Type: Through Hole
товару немає в наявності
В кошику
од. на суму грн.
| 511-91-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 511-91-225-18-091002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 511-91-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 510-93-225-18-091002 |
Виробник: Mill-Max Manufacturing Corp.
Description: SOCKET SOLDERTAIL 225-PGA
Description: SOCKET SOLDERTAIL 225-PGA
товару немає в наявності
В кошику
од. на суму грн.
| 510-93-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 510-93-225-18-091003 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 614-13-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 614-13-225-18-091007 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 614-13-225-18-091012 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER PGA
Features: Carrier, Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 511-93-225-18-091001 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Description: SKT PGA SOLDRTL
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 511-93-225-18-091002 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Description: SKT PGA SOLDRTL
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 225 (18 x 18)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.





