Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41119) > Сторінка 581 з 686
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| 116-43-640-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 116-43-640-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-41-008000 | Mill-Max Manufacturing Corp. |
 Description: CONN IC SKT DBLPackaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-61-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-41-007000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-41-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-642-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 42 (2 x 21) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-41-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-41-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-648-61-003000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 48 (2 x 24) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-61-006000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |
| 116-43-640-61-008000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Elevated, Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 111-91-428-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC SKT DBL Packaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.4" (10.16mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 0712-0-33-21-08-35-10-0 | Mill-Max Manufacturing Corp. |
Description: CONN PIN RCPT Packaging: Bulk Contact Finish: Gold Flange Diameter: 0.180" (4.57mm) Length - Overall: 0.518" (13.16mm) Termination: Solder Contact Finish Thickness: 30.0µin (0.76µm) Contact Material: Beryllium Copper Tail Type: Crimp Accepts Pin Diameter: 0.084" ~ 0.102" (2.13mm ~ 2.59mm) Pin Hole Diameter: 0.122" (3.10mm) Socket Depth: 0.210" (5.33mm) Part Status: Active |
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 |
801-43-060-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 60POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole Number of Positions: 60 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.165" (4.20mm) Number of Rows: 1 |
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| 551-90-092-11-041003 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 92 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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| 551-90-092-11-041005 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 92 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 551-90-092-11-041004 | Mill-Max Manufacturing Corp. |
Description: CONN HDR SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Number of Positions or Pins (Grid): 92 (11 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 346-43-123-41-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 23POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 23 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.120" (3.05mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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| 315-13-123-41-004000 | Mill-Max Manufacturing Corp. |
Description: STANDRD SOLDER TAIL SIP SOCKET Packaging: Bulk Connector Type: Socket Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 23 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.082" (2.08mm) Insulation Height: 0.050" (1.27mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 322-93-123-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 23POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 23 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.370" (9.40mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
 |
315-47-123-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 23POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 23 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: FLASH Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.108" (2.75mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
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В кошику од. на суму грн. |
| 714-43-148-31-007000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 48POS 0.1 GOLD PCB Packaging: Bulk Features: Carrier Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 48 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.115" (2.92mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 714-43-148-31-012000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 48POS 0.1 GOLD PCB Packaging: Bulk Features: Carrier Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 48 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Part Status: Active Contact Length - Post: 0.118" (3.00mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 714-93-148-31-007000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 48POS 0.1 GOLD PCB Packaging: Bulk Features: Carrier Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 48 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.115" (2.92mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 714-93-148-31-018000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 48POS 0.1 GOLD PCB Packaging: Bulk Features: Carrier Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 48 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.152" (3.86mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
 |
349-10-150-00-560000 | Mill-Max Manufacturing Corp. |
Description: CONN HEADER SMD 50POS 2.54MM Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 50 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Insulation Height: 0.110" (2.79mm) Shrouding: Unshrouded Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT) Contact Length - Mating: 0.136" (3.45mm) |
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В кошику од. на суму грн. |
| 801-91-012-61-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 GOLD PCB Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Press-Fit, Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.104" (2.64mm) Insulation Height: 0.276" (7.00mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 831-91-012-30-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.079 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.228" (5.80mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 801-91-012-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 4.5A Mounting Type: Through Hole, Right Angle Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.126" (3.20mm) Insulation Height: 0.100" (2.54mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
 |
851-91-012-30-002000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.05 GOLD SMD Packaging: Bulk Connector Type: Receptacle Mounting Type: Surface Mount Number of Positions: 12 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.149" (3.78mm) Number of Rows: 1 |
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В кошику од. на суму грн. |
| 831-91-012-30-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12POS 0.079 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Insulation Height: 0.228" (5.80mm) Number of Rows: 1 |
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В кошику од. на суму грн. | |
 |
851-91-012-20-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 12P 0.05 GOLD PCB R/A Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 3A Mounting Type: Through Hole, Right Angle Number of Positions: 12 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.118" (3.00mm) Insulation Height: 0.087" (2.20mm) Number of Rows: 1 |
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| 319-10-123-00-006000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 23POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 23 Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 319-10-128-00-006000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 28POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 28 Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 319-10-126-00-001000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 26POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 26 Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 319-10-126-00-002000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 26POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 26 Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 319-10-127-00-002000 | Mill-Max Manufacturing Corp. |
Description: CONN SPRING TARGET 27POS PCB Packaging: Bulk Connector Type: Mating Target Contact Finish: Gold Mounting Type: Through Hole Material: Brass Alloy Pitch: 0.100" (2.54mm) Contact Finish Thickness: 10.0µin (0.25µm) Part Status: Active Number of Contacts: 27 Number of Rows: 1 |
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В кошику од. на суму грн. | |
| 510-93-084-12-051002 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 84 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 510-93-144-12-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 144 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 612-41-210-41-004000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER SOLDRTL Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 511-13-084-12-051001 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 84 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 612-41-210-41-001000 | Mill-Max Manufacturing Corp. |
Description: SKT CARRIER SOLDRTL Packaging: Tube Features: Carrier, Open Frame Mounting Type: Through Hole Type: DIP, 0.2" (5.08mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 511-13-144-12-000003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 144 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 10.0µin (0.25µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. | |
| 510-91-084-12-051003 | Mill-Max Manufacturing Corp. |
Description: SKT PGA SOLDRTL Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 84 (12 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
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В кошику од. на суму грн. |
| 116-43-640-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 116-43-640-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 116-43-642-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-61-007000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-41-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 116-43-642-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-41-008000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-642-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 42 (2 x 21)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-41-003000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-41-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-648-61-003000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 48 (2 x 24)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-61-006000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 116-43-640-61-008000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Elevated, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 111-91-428-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC SKT DBL
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.4" (10.16mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 0712-0-33-21-08-35-10-0 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.180" (4.57mm)
Length - Overall: 0.518" (13.16mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Crimp
Accepts Pin Diameter: 0.084" ~ 0.102" (2.13mm ~ 2.59mm)
Pin Hole Diameter: 0.122" (3.10mm)
Socket Depth: 0.210" (5.33mm)
Part Status: Active
Description: CONN PIN RCPT
Packaging: Bulk
Contact Finish: Gold
Flange Diameter: 0.180" (4.57mm)
Length - Overall: 0.518" (13.16mm)
Termination: Solder
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Material: Beryllium Copper
Tail Type: Crimp
Accepts Pin Diameter: 0.084" ~ 0.102" (2.13mm ~ 2.59mm)
Pin Hole Diameter: 0.122" (3.10mm)
Socket Depth: 0.210" (5.33mm)
Part Status: Active
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В кошику
од. на суму грн.
| 801-43-060-10-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 60POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 60
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.165" (4.20mm)
Number of Rows: 1
Description: CONN RCPT 60POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 60
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.165" (4.20mm)
Number of Rows: 1
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В кошику
од. на суму грн.
| 551-90-092-11-041003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 551-90-092-11-041005 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 551-90-092-11-041004 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HDR SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN HDR SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Number of Positions or Pins (Grid): 92 (11 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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| 346-43-123-41-012000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.120" (3.05mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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| 315-13-123-41-004000 |
Виробник: Mill-Max Manufacturing Corp.
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Socket
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.082" (2.08mm)
Insulation Height: 0.050" (1.27mm)
Number of Rows: 1
Description: STANDRD SOLDER TAIL SIP SOCKET
Packaging: Bulk
Connector Type: Socket
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.082" (2.08mm)
Insulation Height: 0.050" (1.27mm)
Number of Rows: 1
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| 322-93-123-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.370" (9.40mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.370" (9.40mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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| 315-47-123-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.108" (2.75mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 23POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 23
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.108" (2.75mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
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| 714-43-148-31-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.115" (2.92mm)
Number of Rows: 1
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.115" (2.92mm)
Number of Rows: 1
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| 714-43-148-31-012000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Number of Rows: 1
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Number of Rows: 1
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| 714-93-148-31-007000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.115" (2.92mm)
Number of Rows: 1
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.115" (2.92mm)
Number of Rows: 1
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| 714-93-148-31-018000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.152" (3.86mm)
Number of Rows: 1
Description: CONN RCPT 48POS 0.1 GOLD PCB
Packaging: Bulk
Features: Carrier
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 48
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.152" (3.86mm)
Number of Rows: 1
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| 349-10-150-00-560000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN HEADER SMD 50POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 50
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.110" (2.79mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.136" (3.45mm)
Description: CONN HEADER SMD 50POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 50
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Insulation Height: 0.110" (2.79mm)
Shrouding: Unshrouded
Insulation Material: Polycyclohexylenedimethylene Terephthalate (PCT)
Contact Length - Mating: 0.136" (3.45mm)
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| 801-91-012-61-001000 |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.276" (7.00mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.1 GOLD PCB
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Press-Fit, Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.104" (2.64mm)
Insulation Height: 0.276" (7.00mm)
Number of Rows: 1
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| 831-91-012-30-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.228" (5.80mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.228" (5.80mm)
Number of Rows: 1
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| 801-91-012-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.1 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 4.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.126" (3.20mm)
Insulation Height: 0.100" (2.54mm)
Number of Rows: 1
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| 851-91-012-30-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.149" (3.78mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.149" (3.78mm)
Number of Rows: 1
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| 831-91-012-30-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.228" (5.80mm)
Number of Rows: 1
Description: CONN RCPT 12POS 0.079 GOLD SMD
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Surface Mount
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Insulation Height: 0.228" (5.80mm)
Number of Rows: 1
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| 851-91-012-20-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 12P 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole, Right Angle
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.087" (2.20mm)
Number of Rows: 1
Description: CONN RCPT 12P 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Receptacle
Current Rating (Amps): 3A
Mounting Type: Through Hole, Right Angle
Number of Positions: 12
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Tin-Lead
Part Status: Active
Contact Length - Post: 0.118" (3.00mm)
Insulation Height: 0.087" (2.20mm)
Number of Rows: 1
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| 319-10-123-00-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 23POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 23
Number of Rows: 1
Description: CONN SPRING TARGET 23POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 23
Number of Rows: 1
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| 319-10-128-00-006000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 28POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 28
Number of Rows: 1
Description: CONN SPRING TARGET 28POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 28
Number of Rows: 1
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| 319-10-126-00-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 26POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 26
Number of Rows: 1
Description: CONN SPRING TARGET 26POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 26
Number of Rows: 1
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| 319-10-126-00-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 26POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 26
Number of Rows: 1
Description: CONN SPRING TARGET 26POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 26
Number of Rows: 1
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В кошику
од. на суму грн.
| 319-10-127-00-002000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SPRING TARGET 27POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 27
Number of Rows: 1
Description: CONN SPRING TARGET 27POS PCB
Packaging: Bulk
Connector Type: Mating Target
Contact Finish: Gold
Mounting Type: Through Hole
Material: Brass Alloy
Pitch: 0.100" (2.54mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Part Status: Active
Number of Contacts: 27
Number of Rows: 1
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В кошику
од. на суму грн.
| 510-93-084-12-051002 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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В кошику
од. на суму грн.
| 510-93-144-12-000003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
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од. на суму грн.
| 612-41-210-41-004000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 511-13-084-12-051001 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 612-41-210-41-001000 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT CARRIER SOLDRTL
Packaging: Tube
Features: Carrier, Open Frame
Mounting Type: Through Hole
Type: DIP, 0.2" (5.08mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 511-13-144-12-000003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 144 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
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од. на суму грн.
| 510-91-084-12-051003 |
|
Виробник: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: SKT PGA SOLDRTL
Packaging: Bulk
Features: Open Frame
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 84 (12 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.