Продукція > MILL-MAX MANUFACTURING CORP. > Всі товари виробника MILL-MAX MANUFACTURING CORP. (41248) > Сторінка 6 з 688
| Фото | Назва | Виробник | Інформація |
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299-93-614-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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299-93-616-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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299-93-618-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 97 шт: термін постачання 21-31 дні (днів) |
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299-93-620-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-622-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 22POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 22 (2 x 11) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
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299-93-624-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-626-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 26POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 26 (2 x 13) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-628-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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299-93-630-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 30POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 30 (2 x 15) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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299-93-632-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-636-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 36POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 36 (2 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 183 шт: термін постачання 21-31 дні (днів) |
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299-93-640-10-002000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-306-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 6POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 6 (2 x 3) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-308-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 153 шт: термін постачання 21-31 дні (днів) |
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299-93-310-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 10POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 10 (2 x 5) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 343 шт: термін постачання 21-31 дні (днів) |
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299-93-312-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 12POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 12 (2 x 6) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 138 шт: термін постачання 21-31 дні (днів) |
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299-93-314-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 172 шт: термін постачання 21-31 дні (днів) |
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299-93-316-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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299-93-318-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 18POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 18 (2 x 9) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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299-93-320-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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299-93-324-11-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole, Right Angle, Horizontal Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 157 шт: термін постачання 21-31 дні (днів) |
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210-93-308-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 1275 шт: термін постачання 21-31 дні (днів) |
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210-93-314-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 72 шт: термін постачання 21-31 дні (днів) |
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210-93-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 154 шт: термін постачання 21-31 дні (днів) |
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210-93-324-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
на замовлення 186 шт: термін постачання 21-31 дні (днів) |
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210-93-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 621 шт: термін постачання 21-31 дні (днів) |
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210-93-628-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 818 шт: термін постачання 21-31 дні (днів) |
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210-93-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
на замовлення 600 шт: термін постачання 21-31 дні (днів) |
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210-93-640-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLDPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy |
на замовлення 149 шт: термін постачання 21-31 дні (днів) |
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111-93-308-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 8POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 8 (2 x 4) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 2418 шт: термін постачання 21-31 дні (днів) |
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111-93-314-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 14POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 14 (2 x 7) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 278 шт: термін постачання 21-31 дні (днів) |
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111-93-316-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 16POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 226 шт: термін постачання 21-31 дні (днів) |
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111-93-320-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 20POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 20 (2 x 10) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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111-93-324-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 135 шт: термін постачання 21-31 дні (днів) |
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111-93-624-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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111-93-628-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 28POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 28 (2 x 14) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 196 шт: термін постачання 21-31 дні (днів) |
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111-93-632-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 32POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 32 (2 x 16) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 97 шт: термін постачання 21-31 дні (днів) |
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111-93-640-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN IC DIP SOCKET 40POS GOLDPackaging: Tube Features: Open Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 40 (2 x 20) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Contact Material - Post: Brass Alloy Part Status: Active |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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| 540-99-020-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 20POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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540-99-028-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 28POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-032-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 32POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-044-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 44POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-052-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 52POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-068-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 68POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-084-24-000000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 84POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Through Hole Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-020-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 20POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-028-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 28POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-032-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 32POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-044-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 44POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-052-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 52POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-068-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 68POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
540-99-084-17-400000 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 84POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 84 (4 x 21) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| 540-99-020-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 20POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-028-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 28POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 28 (4 x 7) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-032-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 32POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-044-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 44POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-052-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 52POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-068-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 68POS TIN-LEADPackaging: Tube Features: Closed Frame Mounting Type: Surface Mount Type: PLCC Number of Positions or Pins (Grid): 68 (4 x 17) Termination: Solder Housing Material: Polyphenylene Sulfide (PPS) Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 200.0µin (5.08µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin-Lead Contact Finish Thickness - Post: 200.0µin (5.08µm) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| 540-99-084-17-400200 | Mill-Max Manufacturing Corp. |
Description: CONN SOCKET PLCC 84POS TIN-LEAD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
310-13-164-41-001000 | Mill-Max Manufacturing Corp. |
Description: CONN RCPT 64POS 0.1 GOLD PCBPackaging: Tube Connector Type: Receptacle Voltage Rating: 100V, 150VDC Current Rating (Amps): 3A Mounting Type: Through Hole Number of Positions: 64 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.125" (3.18mm) Insulation Height: 0.110" (2.79mm) Number of Rows: 1 |
на замовлення 1165 шт: термін постачання 21-31 дні (днів) |
|
| 299-93-614-10-002000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1705.05 грн |
| 10+ | 1437.94 грн |
| 25+ | 1375.79 грн |
| 299-93-616-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1724.88 грн |
| 10+ | 1454.64 грн |
| 25+ | 1391.76 грн |
| 50+ | 1263.98 грн |
| 299-93-618-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 97 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 767.44 грн |
| 22+ | 594.09 грн |
| 44+ | 565.72 грн |
| 66+ | 515.93 грн |
| 299-93-620-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-622-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 22POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 22 (2 x 11)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 195 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1876.05 грн |
| 18+ | 1581.40 грн |
| 36+ | 1513.07 грн |
| 54+ | 1374.16 грн |
| 108+ | 1328.37 грн |
| 299-93-624-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-626-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 26POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 26POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 26 (2 x 13)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-628-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1067.31 грн |
| 14+ | 910.67 грн |
| 28+ | 875.64 грн |
| 56+ | 788.89 грн |
| 299-93-630-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 30POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 30 (2 x 15)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1139.18 грн |
| 10+ | 972.17 грн |
| 25+ | 934.80 грн |
| 299-93-632-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-636-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 36POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 36 (2 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 183 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2522.05 грн |
| 10+ | 2126.99 грн |
| 25+ | 2035.07 грн |
| 50+ | 1848.21 грн |
| 100+ | 1786.61 грн |
| 299-93-640-10-002000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-306-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 6POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 6 (2 x 3)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-308-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 153 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 394.87 грн |
| 10+ | 345.48 грн |
| 25+ | 327.17 грн |
| 50+ | 299.90 грн |
| 100+ | 285.61 грн |
| 299-93-310-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 10POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 10 (2 x 5)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 343 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 389.09 грн |
| 10+ | 305.47 грн |
| 40+ | 270.05 грн |
| 80+ | 238.33 грн |
| 120+ | 229.91 грн |
| 280+ | 213.28 грн |
| 299-93-312-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 12POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 12 (2 x 6)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 138 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 461.78 грн |
| 10+ | 404.19 грн |
| 33+ | 382.80 грн |
| 66+ | 350.90 грн |
| 132+ | 334.18 грн |
| 299-93-314-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 172 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 480.78 грн |
| 10+ | 418.51 грн |
| 25+ | 395.36 грн |
| 50+ | 361.98 грн |
| 100+ | 343.87 грн |
| 299-93-316-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| 299-93-318-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 18POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 18 (2 x 9)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1752.14 грн |
| 22+ | 1356.50 грн |
| 299-93-320-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 650.13 грн |
| 10+ | 566.47 грн |
| 25+ | 535.18 грн |
| 299-93-324-11-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 157 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1806.66 грн |
| 16+ | 1360.54 грн |
| 32+ | 1279.43 грн |
| 64+ | 1129.17 грн |
| 112+ | 1074.55 грн |
| 210-93-308-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 1275 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 96.65 грн |
| 10+ | 78.91 грн |
| 25+ | 75.64 грн |
| 50+ | 69.49 грн |
| 100+ | 66.46 грн |
| 250+ | 60.42 грн |
| 500+ | 53.49 грн |
| 1000+ | 47.54 грн |
| 210-93-314-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 72 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 157.78 грн |
| 10+ | 129.43 грн |
| 28+ | 120.40 грн |
| 56+ | 107.57 грн |
| 210-93-316-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 154 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 181.74 грн |
| 10+ | 148.60 грн |
| 25+ | 139.24 грн |
| 50+ | 124.42 грн |
| 100+ | 118.47 грн |
| 210-93-324-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 186 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 161.09 грн |
| 16+ | 140.75 грн |
| 32+ | 133.30 грн |
| 64+ | 122.19 грн |
| 112+ | 116.37 грн |
| 210-93-624-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 621 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 218.91 грн |
| 10+ | 191.16 грн |
| 25+ | 181.02 грн |
| 50+ | 165.94 грн |
| 100+ | 158.04 грн |
| 250+ | 138.28 грн |
| 500+ | 132.13 грн |
| 210-93-628-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 818 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 274.26 грн |
| 14+ | 219.39 грн |
| 28+ | 208.90 грн |
| 56+ | 186.68 грн |
| 112+ | 177.76 грн |
| 252+ | 167.87 грн |
| 504+ | 157.24 грн |
| 210-93-632-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 295.74 грн |
| 12+ | 259.13 грн |
| 36+ | 245.45 грн |
| 60+ | 224.99 грн |
| 108+ | 214.28 грн |
| 252+ | 187.50 грн |
| 504+ | 179.15 грн |
| 210-93-640-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
на замовлення 149 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 364.31 грн |
| 10+ | 318.28 грн |
| 25+ | 301.43 грн |
| 50+ | 276.31 грн |
| 100+ | 263.15 грн |
| 111-93-308-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 8POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 8 (2 x 4)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 2418 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 124.74 грн |
| 10+ | 105.08 грн |
| 25+ | 100.65 грн |
| 50+ | 92.35 грн |
| 100+ | 88.15 грн |
| 250+ | 79.75 грн |
| 500+ | 72.25 грн |
| 1000+ | 61.93 грн |
| 111-93-314-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 14POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 14 (2 x 7)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 278 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 194.96 грн |
| 10+ | 159.50 грн |
| 28+ | 148.27 грн |
| 56+ | 132.50 грн |
| 112+ | 126.17 грн |
| 252+ | 119.15 грн |
| 111-93-316-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 16POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 16 (2 x 8)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 226 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 227.17 грн |
| 10+ | 185.83 грн |
| 25+ | 174.12 грн |
| 50+ | 155.61 грн |
| 100+ | 148.17 грн |
| 111-93-320-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 20POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 170 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 261.04 грн |
| 20+ | 228.19 грн |
| 40+ | 211.08 грн |
| 100+ | 188.67 грн |
| 111-93-324-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 135 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 284.18 грн |
| 10+ | 248.43 грн |
| 25+ | 235.31 грн |
| 50+ | 215.68 грн |
| 100+ | 205.40 грн |
| 111-93-624-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 110 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 310.61 грн |
| 16+ | 271.26 грн |
| 32+ | 256.92 грн |
| 64+ | 235.50 грн |
| 111-93-628-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 28POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 28 (2 x 14)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 196 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 351.91 грн |
| 14+ | 281.38 грн |
| 28+ | 267.91 грн |
| 56+ | 239.41 грн |
| 112+ | 227.99 грн |
| 111-93-632-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 32POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 32 (2 x 16)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 97 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 408.09 грн |
| 12+ | 315.15 грн |
| 36+ | 285.89 грн |
| 60+ | 256.40 грн |
| 111-93-640-41-001000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
Description: CONN IC DIP SOCKET 40POS GOLD
Packaging: Tube
Features: Open Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 40 (2 x 20)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass Alloy
Part Status: Active
на замовлення 110 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 505.57 грн |
| 10+ | 442.14 грн |
| 25+ | 418.72 грн |
| 50+ | 383.83 грн |
| 100+ | 365.54 грн |
| 540-99-020-24-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 20POS TIN-LEAD
Description: CONN SOCKET PLCC 20POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-028-24-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 28POS TIN-LEAD
Description: CONN SOCKET PLCC 28POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-032-24-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-044-24-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 44POS TIN-LEAD
Description: CONN SOCKET PLCC 44POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-052-24-000000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 52POS TIN-LEAD
Description: CONN SOCKET PLCC 52POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-068-24-000000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-084-24-000000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 84POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 84POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Through Hole
Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-020-17-400000 |
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Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 20POS TIN-LEAD
Description: CONN SOCKET PLCC 20POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-028-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 28POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
Description: CONN SOCKET PLCC 28POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-032-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-044-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 44POS TIN-LEAD
Description: CONN SOCKET PLCC 44POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-052-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 52POS TIN-LEAD
Description: CONN SOCKET PLCC 52POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-068-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-084-17-400000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 84POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 84POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 84 (4 x 21)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-020-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 20POS TIN-LEAD
Description: CONN SOCKET PLCC 20POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-028-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 28POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
Description: CONN SOCKET PLCC 28POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 28 (4 x 7)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-032-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Description: CONN SOCKET PLCC 32POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-044-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 44POS TIN-LEAD
Description: CONN SOCKET PLCC 44POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-052-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 52POS TIN-LEAD
Description: CONN SOCKET PLCC 52POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-068-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
Description: CONN SOCKET PLCC 68POS TIN-LEAD
Packaging: Tube
Features: Closed Frame
Mounting Type: Surface Mount
Type: PLCC
Number of Positions or Pins (Grid): 68 (4 x 17)
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin-Lead
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin-Lead
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| 540-99-084-17-400200 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN SOCKET PLCC 84POS TIN-LEAD
Description: CONN SOCKET PLCC 84POS TIN-LEAD
товару немає в наявності
В кошику
од. на суму грн.
| 310-13-164-41-001000 |
![]() |
Виробник: Mill-Max Manufacturing Corp.
Description: CONN RCPT 64POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 64
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
Description: CONN RCPT 64POS 0.1 GOLD PCB
Packaging: Tube
Connector Type: Receptacle
Voltage Rating: 100V, 150VDC
Current Rating (Amps): 3A
Mounting Type: Through Hole
Number of Positions: 64
Style: Board to Board
Operating Temperature: -55°C ~ 125°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.125" (3.18mm)
Insulation Height: 0.110" (2.79mm)
Number of Rows: 1
на замовлення 1165 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 986.35 грн |
| 12+ | 796.62 грн |
| 102+ | 684.96 грн |
| 501+ | 574.58 грн |
| 1002+ | 547.19 грн |









































