Результат пошуку "133555" : 17
Вид перегляду :
Мінімальне замовлення: 37
Мінімальне замовлення: 8
Фото | Назва | Виробник | Інформація |
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NTC термістор 10 kOhm 1%, вив. (MF52 103F3470) Код товару: 133555 |
Bochen |
Пасивні компоненти > Термістори Опис: NTC термістор; THT; 3470K; -55...+125°C; 1% Опір: 10 kOhm Застосування: Вимірювальні Тип: NTC Розмір: 3,5x3 mm |
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1335550000 | Weidmüller |
Description: SLF 5.08HC/12/180B SN OR BX Packaging: Bulk Color: Orange Mounting Type: Free Hanging (In-Line) Number of Positions: 12 Pitch: 0.200" (5.08mm) Type: Plug, Male Pins Operating Temperature: -50°C ~ 100°C Termination Style: Screwless - Leg Spring, Push-In Spring Current - IEC: 25.9A Number of Levels: 1 Wire Gauge or Range - AWG: 12-26 AWG Wire Gauge or Range - mm²: 0.2-2.5mm² Positions Per Level: 12 Plug Wire Entry: 180° Contact Mating Finish: Tin Part Status: Active Current - UL: 14 A Voltage - IEC: 400 V Voltage - UL: 300 V |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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MC9S08DN32AMLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
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SPC5748GHK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Bulk Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
на замовлення 481 шт: термін постачання 21-31 дні (днів) |
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133555 | Brady Corporation |
Description: B853 5.75X3 BK/RD/WH L/O REV.B, Packaging: Bulk Color: Black and Red Legend, White Background For Use With/Related Products: Danger Material: Paper Label Type: Danger. Do Not Operate Production This Lock/Tag May Only Be Removed By. Name. Date. Label Size: 5.75" L x 3.00" W (146.0mm x 76.2mm) |
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1335550000 | Weidmuller | Pluggable Terminal Blocks SLF 5.08/12/180B SN OR BX |
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PHB1335550KRSD | Nichicon | Film Capacitors Boxed. radial 38 x 57.5 x 57.5 |
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PHB1335550KRST | Nichicon | Film Capacitors Boxed. radial 38 x 57.5 x 57.5 |
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335555-000 | TE Connectivity | Circular MIL Spec Backshells STXR40AB90-1616BI |
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929745-02-11-I | 3M |
Description: CONN HEADER R/A 22POS 2.54MM Packaging: Bulk Connector Type: Header Current Rating (Amps): 2.5A Mounting Type: Through Hole, Right Angle Number of Positions: 22 Number of Rows: 2 Style: Board to Board Operating Temperature: -40°C ~ 105°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Copper Alloy Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Contact Shape: Square Contact Length - Post: 0.405" (10.29mm) Insulation Height: 0.215" (5.45mm) Shrouding: Unshrouded Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.318" (8.08mm) |
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FP301-1/4-48"-GREEN-HDR-12 PCS | 3M |
Description: HEATSHRINK FP301 1/4-48" GREEN Packaging: Bulk Features: Flame Retardant, Header Label, Solvent Resistant Color: Green Material: Polyolefin (PO) Length: 4.00' (1.22m) Type: Tubing, Flexible Operating Temperature: -55°C ~ 135°C Shrinkage Ratio: 2 to 1 Inner Diameter - Supplied: 0.250" (6.35mm) Inner Diameter - Recovered: 0.125" (3.18mm) Recovered Wall Thickness: 0.025" (0.64mm) Shrink Temperature: 100°C Part Status: Active Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C) Shelf Life: 120 Months |
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MC9S08DN32AMLH | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
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MC9S08DN32AMLH | NXP Semiconductors | 8-bit Microcontrollers - MCU 32K FL, 1K RAM, LIN MSTR, EPROM |
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MEU1S0509ZC | Murata Power Solutions Inc. |
Description: DC DC CONVERTER 9V 1W Packaging: Tube Package / Case: 4-DIP Module Size / Dimension: 0.33" L x 0.24" W x 0.31" H (8.3mm x 6.1mm x 8.0mm) Mounting Type: Through Hole Type: Isolated Module Operating Temperature: -40°C ~ 85°C Applications: ITE (Commercial) Voltage - Input (Max): 5.5V Efficiency: 81% Current - Output (Max): 111mA Voltage - Input (Min): 4.5V Voltage - Output 1: 9V Power (Watts): 1 W Number of Outputs: 1 Voltage - Isolation: 1 kV |
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SPC5748GHK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 6MB (6M x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Part Status: Active Number of I/O: 178 DigiKey Programmable: Not Verified |
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SPC5748GHK0AMMJ6 | NXP Semiconductors | 32-bit Microcontrollers - MCU Ultra reliable MCU with vast peripherals, 3 cores, security module, 6MB Flash, 768k RAM, 256BGA |
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T1922101120-000 | TE Connectivity AMP Connectors |
Description: H10BPR-TGHC-M20 Packaging: Bulk Connector Type: Hood Size / Dimension: 4.331" L x 2.094" W x 2.756" H (110.00mm x 53.20mm x 70.00mm) Style: Top Entry Thread Size: M20 Operating Temperature: -40°C ~ 125°C Size: H10B Ingress Protection: IP68 - Dust Tight, Waterproof Lock Location: Screw Locks on Hood Housing Material: Aluminum Alloy, Die Cast Housing Color: Silver Housing Finish: Powder Coated |
товар відсутній |
NTC термістор 10 kOhm 1%, вив. (MF52 103F3470) Код товару: 133555 |
Виробник: Bochen
Пасивні компоненти > Термістори
Опис: NTC термістор; THT; 3470K; -55...+125°C; 1%
Опір: 10 kOhm
Застосування: Вимірювальні
Тип: NTC
Розмір: 3,5x3 mm
Пасивні компоненти > Термістори
Опис: NTC термістор; THT; 3470K; -55...+125°C; 1%
Опір: 10 kOhm
Застосування: Вимірювальні
Тип: NTC
Розмір: 3,5x3 mm
товар відсутній
Кількість | Ціна без ПДВ |
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1+ | 20 грн |
10+ | 3.9 грн |
100+ | 3.3 грн |
1335550000 |
Виробник: Weidmüller
Description: SLF 5.08HC/12/180B SN OR BX
Packaging: Bulk
Color: Orange
Mounting Type: Free Hanging (In-Line)
Number of Positions: 12
Pitch: 0.200" (5.08mm)
Type: Plug, Male Pins
Operating Temperature: -50°C ~ 100°C
Termination Style: Screwless - Leg Spring, Push-In Spring
Current - IEC: 25.9A
Number of Levels: 1
Wire Gauge or Range - AWG: 12-26 AWG
Wire Gauge or Range - mm²: 0.2-2.5mm²
Positions Per Level: 12
Plug Wire Entry: 180°
Contact Mating Finish: Tin
Part Status: Active
Current - UL: 14 A
Voltage - IEC: 400 V
Voltage - UL: 300 V
Description: SLF 5.08HC/12/180B SN OR BX
Packaging: Bulk
Color: Orange
Mounting Type: Free Hanging (In-Line)
Number of Positions: 12
Pitch: 0.200" (5.08mm)
Type: Plug, Male Pins
Operating Temperature: -50°C ~ 100°C
Termination Style: Screwless - Leg Spring, Push-In Spring
Current - IEC: 25.9A
Number of Levels: 1
Wire Gauge or Range - AWG: 12-26 AWG
Wire Gauge or Range - mm²: 0.2-2.5mm²
Positions Per Level: 12
Plug Wire Entry: 180°
Contact Mating Finish: Tin
Part Status: Active
Current - UL: 14 A
Voltage - IEC: 400 V
Voltage - UL: 300 V
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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1+ | 1005.49 грн |
MC9S08DN32AMLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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37+ | 580.09 грн |
SPC5748GHK0AMMJ6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Bulk
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 481 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
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8+ | 2828.04 грн |
133555 |
Виробник: Brady Corporation
Description: B853 5.75X3 BK/RD/WH L/O REV.B,
Packaging: Bulk
Color: Black and Red Legend, White Background
For Use With/Related Products: Danger
Material: Paper
Label Type: Danger. Do Not Operate Production This Lock/Tag May Only Be Removed By. Name. Date.
Label Size: 5.75" L x 3.00" W (146.0mm x 76.2mm)
Description: B853 5.75X3 BK/RD/WH L/O REV.B,
Packaging: Bulk
Color: Black and Red Legend, White Background
For Use With/Related Products: Danger
Material: Paper
Label Type: Danger. Do Not Operate Production This Lock/Tag May Only Be Removed By. Name. Date.
Label Size: 5.75" L x 3.00" W (146.0mm x 76.2mm)
товар відсутній
929745-02-11-I |
Виробник: 3M
Description: CONN HEADER R/A 22POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 22
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.405" (10.29mm)
Insulation Height: 0.215" (5.45mm)
Shrouding: Unshrouded
Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
Description: CONN HEADER R/A 22POS 2.54MM
Packaging: Bulk
Connector Type: Header
Current Rating (Amps): 2.5A
Mounting Type: Through Hole, Right Angle
Number of Positions: 22
Number of Rows: 2
Style: Board to Board
Operating Temperature: -40°C ~ 105°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Contact Material: Copper Alloy
Insulation Color: Black
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Contact Shape: Square
Contact Length - Post: 0.405" (10.29mm)
Insulation Height: 0.215" (5.45mm)
Shrouding: Unshrouded
Insulation Material: Polybutylene Terephthalate (PBT), Polyester, Glass Filled
Row Spacing - Mating: 0.100" (2.54mm)
Contact Length - Mating: 0.318" (8.08mm)
товар відсутній
FP301-1/4-48"-GREEN-HDR-12 PCS |
Виробник: 3M
Description: HEATSHRINK FP301 1/4-48" GREEN
Packaging: Bulk
Features: Flame Retardant, Header Label, Solvent Resistant
Color: Green
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Flexible
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 2 to 1
Inner Diameter - Supplied: 0.250" (6.35mm)
Inner Diameter - Recovered: 0.125" (3.18mm)
Recovered Wall Thickness: 0.025" (0.64mm)
Shrink Temperature: 100°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
Description: HEATSHRINK FP301 1/4-48" GREEN
Packaging: Bulk
Features: Flame Retardant, Header Label, Solvent Resistant
Color: Green
Material: Polyolefin (PO)
Length: 4.00' (1.22m)
Type: Tubing, Flexible
Operating Temperature: -55°C ~ 135°C
Shrinkage Ratio: 2 to 1
Inner Diameter - Supplied: 0.250" (6.35mm)
Inner Diameter - Recovered: 0.125" (3.18mm)
Recovered Wall Thickness: 0.025" (0.64mm)
Shrink Temperature: 100°C
Part Status: Active
Storage/Refrigeration Temperature: 50°F ~ 80°F (10°C ~ 27°C)
Shelf Life: 120 Months
товар відсутній
MC9S08DN32AMLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
товар відсутній
MC9S08DN32AMLH |
Виробник: NXP Semiconductors
8-bit Microcontrollers - MCU 32K FL, 1K RAM, LIN MSTR, EPROM
8-bit Microcontrollers - MCU 32K FL, 1K RAM, LIN MSTR, EPROM
товар відсутній
MEU1S0509ZC |
Виробник: Murata Power Solutions Inc.
Description: DC DC CONVERTER 9V 1W
Packaging: Tube
Package / Case: 4-DIP Module
Size / Dimension: 0.33" L x 0.24" W x 0.31" H (8.3mm x 6.1mm x 8.0mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 81%
Current - Output (Max): 111mA
Voltage - Input (Min): 4.5V
Voltage - Output 1: 9V
Power (Watts): 1 W
Number of Outputs: 1
Voltage - Isolation: 1 kV
Description: DC DC CONVERTER 9V 1W
Packaging: Tube
Package / Case: 4-DIP Module
Size / Dimension: 0.33" L x 0.24" W x 0.31" H (8.3mm x 6.1mm x 8.0mm)
Mounting Type: Through Hole
Type: Isolated Module
Operating Temperature: -40°C ~ 85°C
Applications: ITE (Commercial)
Voltage - Input (Max): 5.5V
Efficiency: 81%
Current - Output (Max): 111mA
Voltage - Input (Min): 4.5V
Voltage - Output 1: 9V
Power (Watts): 1 W
Number of Outputs: 1
Voltage - Isolation: 1 kV
товар відсутній
SPC5748GHK0AMMJ6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Part Status: Active
Number of I/O: 178
DigiKey Programmable: Not Verified
товар відсутній
SPC5748GHK0AMMJ6 |
Виробник: NXP Semiconductors
32-bit Microcontrollers - MCU Ultra reliable MCU with vast peripherals, 3 cores, security module, 6MB Flash, 768k RAM, 256BGA
32-bit Microcontrollers - MCU Ultra reliable MCU with vast peripherals, 3 cores, security module, 6MB Flash, 768k RAM, 256BGA
товар відсутній
T1922101120-000 |
Виробник: TE Connectivity AMP Connectors
Description: H10BPR-TGHC-M20
Packaging: Bulk
Connector Type: Hood
Size / Dimension: 4.331" L x 2.094" W x 2.756" H (110.00mm x 53.20mm x 70.00mm)
Style: Top Entry
Thread Size: M20
Operating Temperature: -40°C ~ 125°C
Size: H10B
Ingress Protection: IP68 - Dust Tight, Waterproof
Lock Location: Screw Locks on Hood
Housing Material: Aluminum Alloy, Die Cast
Housing Color: Silver
Housing Finish: Powder Coated
Description: H10BPR-TGHC-M20
Packaging: Bulk
Connector Type: Hood
Size / Dimension: 4.331" L x 2.094" W x 2.756" H (110.00mm x 53.20mm x 70.00mm)
Style: Top Entry
Thread Size: M20
Operating Temperature: -40°C ~ 125°C
Size: H10B
Ingress Protection: IP68 - Dust Tight, Waterproof
Lock Location: Screw Locks on Hood
Housing Material: Aluminum Alloy, Die Cast
Housing Color: Silver
Housing Finish: Powder Coated
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