Продукція > CLM
| Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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| CLM-1000 | Greenlee | LAN/Telecom/Cable Testing CABLE LENGTH METER for AWG,kcmil W/C | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-1000E | Greenlee | LAN/Telecom/Cable Testing CABLE LENGTH METER for METRIC WIRE/CBL | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-101-02-L-D | Samtec Inc. | Description: CONN RCPT 2POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 2 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 663 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-F-D | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 1781 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-F-D | SAMTEC | Description: SAMTEC - CLM-102-02-F-D - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 4 Kontakt(e), Oberflächenmontage, Tiger Claw CLM tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 4Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Produktpalette: Tiger Claw CLM productTraceability: No usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm | на замовлення 7 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-F-D | Samtec | Board to Board & Mezzanine Connectors 1.00 mm Tiger Claw Rugged Reliable Dual Wipe Micro Socket Strip | на замовлення 195 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 4 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Packaging: Tape & Reel (TR) Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black | на замовлення 1875 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-F-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 2028 шт: термін постачання 21-30 дні (днів) |
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| CLM-102-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Packaging: Cut Tape (CT) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 4 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 2201 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-FM-D | Samtec | Board to Board & Mezzanine Connectors 1.00 mm Tiger Claw Rugged Reliable Dual Wipe Micro Socket Strip | на замовлення 106 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-G-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1875 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-H-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 1442 шт: термін постачання 21-30 дні (днів) |
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| CLM-102-02-L-D | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 4 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Packaging: Bulk | на замовлення 608 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-L-D | SAMTEC | Description: SAMTEC - CLM-102-02-L-D - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 4 Kontakt(e), Oberflächenmontage, Tiger Claw CLM tariffCode: 85366930 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze Steckverbindermontage: Oberflächenmontage usEccn: EAR99 Anzahl der Kontakte: 4Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Produktpalette: Tiger Claw CLM productTraceability: No Kontaktanschluss: Oberflächenmontage Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm SVHC: No SVHC (27-Jun-2024) | на замовлення 3 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-L-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 351 шт: термін постачання 21-30 дні (днів) |
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| CLM-102-02-L-D-TR | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 4 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Connector Type: Receptacle Packaging: Cut Tape (CT) | на замовлення 1094 шт: термін постачання 21-31 дні (днів) |
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| CLM-102-02-L-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 2302 шт: термін постачання 21-30 дні (днів) |
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| CLM-102-02-L-D-TR | Samtec Inc. | Description: CONN RCPT 4POS 0.039 GOLD SMD Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 4 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Packaging: Tape & Reel (TR) Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull | товару немає в наявності | Мінімальне замовлення: 1875 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-102-02-LM-D | Samtec | Board to Board & Mezzanine Connectors 1.00 mm Tiger Claw Rugged Reliable Dual Wipe Micro Socket Strip | на замовлення 106 шт: термін постачання 21-30 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 6897 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-F-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 2581 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-F-D | SAMTEC | Description: SAMTEC - CLM-103-02-F-D - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 6 Kontakt(e), Oberflächenmontage, Tiger Claw CLM tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y Steckverbindermontage: Oberflächenmontage Anzahl der Kontakte: 6Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Board-to-Board Produktpalette: Tiger Claw CLM productTraceability: No Kontaktanschluss: Oberflächenmontage usEccn: EAR99 Anzahl der Reihen: 2Reihe(n) Rastermaß: 1mm | на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-F-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Board Guide, Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-A-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE | SAMTEC | Description: SAMTEC - CLM-103-02-F-D-BE - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 6 Kontakt(e), Oberflächenmontage, Tiger Claw CLM tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 1mm Anzahl der Kontakte: 6Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Oberflächenmontage Produktpalette: Tiger Claw CLM SVHC: No SVHC (17-Jan-2023) | на замовлення 1 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-BE-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tube Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 3 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket | на замовлення 3628 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-F-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-TR | SAMTEC | Description: SAMTEC - CLM-103-02-F-D-TR - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 6 Kontakt(e), Oberflächenmontage, Tiger Claw CLM tariffCode: 85366930 productTraceability: No Kontaktüberzug: Vergoldete Kontakte rohsCompliant: YES Rastermaß: 1mm Anzahl der Kontakte: 6Kontakt(e) euEccn: NLR Steckverbindersysteme: Board-to-Board Anzahl der Reihen: 2Reihe(n) Kontaktmaterial: Phosphorbronze hazardous: false rohsPhthalatesCompliant: YES usEccn: EAR99 Steckverbindermontage: Oberflächenmontage Produktpalette: Tiger Claw CLM SVHC: No SVHC (21-Jan-2025) | на замовлення 2 шт: термін постачання 21-31 дні (днів) | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-F-D-TR | Samtec | Headers & Wire Housings Low Profile Dual-Wipe Socket | на замовлення 4911 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Cut Tape (CT) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | на замовлення 2555 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-F-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-FM-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 6 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Connector Type: Receptacle Packaging: Bulk | на замовлення 414 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-FM-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 10 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-FM-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-FM-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-BE | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-BE-A-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-BE-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-G-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D-BE | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Gold Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-H-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 768 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-L-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Connector Type: Receptacle Packaging: Bulk Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Number of Positions: 6 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact | на замовлення 390 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-L-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 3 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-L-D-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-P | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-P-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-A-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 160 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-L-D-BE-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-A-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-A-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1150 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. | товару немає в наявності | Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-BE-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-K | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-K | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. | товару немає в наявності | Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-K-FR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-K-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 1759 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-K-TR | Samtec Inc. | Description: LOW PROFILE DUAL-WIPE SOCKET, 1. Features: Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Cut Tape (CT) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-L-D-TR | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | на замовлення 1695 шт: термін постачання 21-30 дні (днів) |
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| CLM-103-02-L-D-TR | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Tape & Reel (TR) Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | Мінімальне замовлення: 1750 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-LM-D | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Number of Positions: 6 Mounting Type: Surface Mount Current Rating (Amps): 2.8A per Contact Number of Rows: 2 Row Spacing - Mating: 0.039" (1.00mm) Insulation Height: 0.084" (2.14mm) Contact Finish - Post: Tin Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Mating: Gold Pitch - Mating: 0.039" (1.00mm) Insulation Color: Black Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Push-Pull Contact Type: Female Socket Operating Temperature: -55°C ~ 125°C Style: Board to Board Connector Type: Receptacle Packaging: Bulk | на замовлення 414 шт: термін постачання 21-31 дні (днів) |
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| CLM-103-02-LM-D | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-LM-D-A | Samtec | Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch | товару немає в наявності | Мінімальне замовлення: 2 шт В кошику од. на суму грн. | ||||||||||||||
| CLM-103-02-LM-D-A | Samtec Inc. | Description: CONN RCPT 6POS 0.039 GOLD SMD Features: Board Guide Packaging: Bulk Connector Type: Receptacle Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 10.0µin (0.25µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 | товару немає в наявності | В кошику од. на суму грн. |

