CLM-103-02-F-D-BE SAMTEC
Виробник: SAMTECDescription: SAMTEC - CLM-103-02-F-D-BE - Printbuchse, Board-to-Board, 1 mm, 2 Reihe(n), 6 Kontakt(e), Oberflächenmontage, Tiger Claw CLM
tariffCode: 85366930
productTraceability: No
Kontaktüberzug: Vergoldete Kontakte
rohsCompliant: YES
Rastermaß: 1mm
Anzahl der Kontakte: 6Kontakt(e)
euEccn: NLR
Steckverbindersysteme: Board-to-Board
Anzahl der Reihen: 2Reihe(n)
Kontaktmaterial: Phosphorbronze
hazardous: false
rohsPhthalatesCompliant: YES
usEccn: EAR99
Steckverbindermontage: Oberflächenmontage
Produktpalette: Tiger Claw CLM
SVHC: No SVHC (17-Jan-2023)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
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Технічний опис CLM-103-02-F-D-BE SAMTEC
Description: CONN RCPT 6POS 0.039 GOLD SMD, Packaging: Bulk, Connector Type: Receptacle, Bottom Entry, Current Rating (Amps): 2.8A per Contact, Mounting Type: Surface Mount, Number of Positions: 6, Style: Board to Board, Operating Temperature: -55°C ~ 125°C, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Black, Pitch - Mating: 0.039" (1.00mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.00µin (0.076µm), Contact Finish - Post: Tin, Insulation Height: 0.084" (2.14mm), Row Spacing - Mating: 0.039" (1.00mm), Number of Rows: 2.
Інші пропозиції CLM-103-02-F-D-BE
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
|---|---|---|---|---|---|
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CLM-103-02-F-D-BE | Виробник : Samtec |
Conn Micro Socket Strip SKT 6 POS 1mm Solder ST Bottom Entry SMD Layer |
товар відсутній |
|
 |
CLM-103-02-F-D-BE | Виробник : Samtec Inc. |
Description: CONN RCPT 6POS 0.039 GOLD SMD Packaging: Bulk Connector Type: Receptacle, Bottom Entry Current Rating (Amps): 2.8A per Contact Mounting Type: Surface Mount Number of Positions: 6 Style: Board to Board Operating Temperature: -55°C ~ 125°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 3.00µin (0.076µm) Contact Finish - Post: Tin Insulation Height: 0.084" (2.14mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
товар відсутній |
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CLM-103-02-F-D-BE | Виробник : Samtec |
Board to Board & Mezzanine Connectors Low Profile Dual-Wipe Socket, 1.00mm Pitch |
товар відсутній |