Продукція > XIA
| Назва | Виробник | Інформація | Доступність | Ціна | ||||||
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| XIAG-M3SP-4GSJXCN9 | Advantech | MEMORY MODULE, INNO M3SP-4GSJXCN9 4GB DDR3-1333 SODIMM | товару немає в наявності | В кошику од. на суму грн. | ||||||
| XIAMETER RTV-4230-E KIT,5.5KG-KIT | Dow Corning | 4107167 | товару немає в наявності | В кошику од. на суму грн. | ||||||
| XIAO ESP32C3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-C3; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-C3 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: RISC-V Operating temperature: -40...85°C Memory: 400kB SRAM; 4MB FLASH Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: prototype board; u.FL antenna | на замовлення 199 шт: термін постачання 21-30 дні (днів) |
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| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Kit contents: prototype board; u.FL antenna Interface: ADC; GPIO; I2C; I2S; SPI; UART Manufacturer series: XIAO Components: ESP32-S3R8 Type of development kit: evaluation Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Dimensions: 21x17.5mm Number of pins: 2x 7 Memory: 8MB FLASH; 8MB SRAM WiFi: 2,4GHz Bluetooth version: 5.0 | на замовлення 37 шт: термін постачання 21-30 дні (днів) |
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| XIAO ESP32S3 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Kit contents: prototype board; u.FL antenna Interface: ADC; GPIO; I2C; I2S; SPI; UART Manufacturer series: XIAO Components: ESP32-S3R8 Type of development kit: evaluation Kind of connector: solder pads; U.FL; USB C socket Communictions protocol: WIFI Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Dimensions: 21x17.5mm Number of pins: 2x 7 Memory: 8MB FLASH; 8MB SRAM WiFi: 2,4GHz Bluetooth version: 5.0 кількість в упаковці: 1 шт | на замовлення 37 шт: термін постачання 7-14 дні (днів) |
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| XIAO ESP32S3 (SEEED STUDIO) Код товару: 208715
Додати до обраних
Обраний товар
| Корпусні та встановлювальні вироби > Антени | товару немає в наявності | В кошику од. на суму грн. | |||||||
| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: camera; prototype board; u.FL antenna | товару немає в наявності | В кошику од. на суму грн. | ||||||
| XIAO ESP32S3 SENSE Код товару: 206081
Додати до обраних
Обраний товар
| Корпусні та встановлювальні вироби > Антени | товару немає в наявності | В кошику од. на суму грн. | |||||||
| XIAO ESP32S3 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: ESP32-S3R8; WIFI; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: ESP32-S3R8 Interface: ADC; GPIO; I2C; I2S; SPI; UART Kind of connector: SD; solder pads; U.FL; USB C socket Communictions protocol: WIFI Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Xtensa LX7 Operating temperature: -40...65°C Memory: 8MB FLASH; 8MB SRAM Dimensions: 21x17.5mm WiFi: 2,4GHz Kit contents: camera; prototype board; u.FL antenna кількість в упаковці: 1 шт | товару немає в наявності | В кошику од. на суму грн. | ||||||
| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kit contents: prototype board | на замовлення 29 шт: термін постачання 21-30 дні (днів) |
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| XIAO NRF52840 | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kit contents: prototype board кількість в упаковці: 1 шт | на замовлення 29 шт: термін постачання 7-14 дні (днів) |
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| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kind of sensor: accelerometer; gyroscope Kit contents: prototype board Programmers and development kits features: MEMS microphone | на замовлення 8 шт: термін постачання 21-30 дні (днів) |
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| XIAO NRF52840 SENSE | SEEED STUDIO | Category: Development kits for data transmission Description: Dev.kit: evaluation; Bluetooth: 5.0; Comp: nRF52840; NFC; XIAO Type of development kit: evaluation Bluetooth version: 5.0 Components: nRF52840 Interface: ADC; GPIO; I2C; NFC; SPI; SWD; UART Kind of connector: solder pads; USB C socket Communictions protocol: NFC Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M4 Memory: 256kB SRAM; 2MB FLASH Dimensions: 21x17.5mm Kind of sensor: accelerometer; gyroscope Kit contents: prototype board Programmers and development kits features: MEMS microphone кількість в упаковці: 1 шт | на замовлення 8 шт: термін постачання 7-14 дні (днів) |
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| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M0+ Memory: 264kB SRAM; 2MB FLASH Dimensions: 21x17.5mm | на замовлення 40 шт: термін постачання 21-30 дні (днів) |
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| XIAO RP2040 | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: evaluation; prototype board; Comp: RP2040; XIAO; PIN: 2x7 Type of development kit: evaluation Kit contents: prototype board Components: RP2040 Interface: GPIO; I2C; SPI; SWD; UART Kind of connector: solder pads; USB C socket Manufacturer series: XIAO Number of pins: 2x 7 Kind of architecture: Cortex M0+ Memory: 264kB SRAM; 2MB FLASH Dimensions: 21x17.5mm кількість в упаковці: 1 шт | на замовлення 40 шт: термін постачання 7-14 дні (днів) |
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| XIAO STARTER KIT | SEEED STUDIO | Category: Development kits - others Description: Dev.kit: XIAO Starter Kit; XIAO Manufacturer series: XIAO Kit contents: accelerometer module; ambient light sensor; infrared sensor module; LED strip (50xRGB); motion sensor (PIR) module; rotation sensor module; servo; set of diodes; temperature and humidity sensor module; USB cable; wire jumpers Type of development kit: XIAO Starter Kit | на замовлення 5 шт: термін постачання 21-30 дні (днів) |
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