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MPC9350AC MPC9350AC NXP USA Inc. MPC9350.pdf Description: IC PLL CLOCK DRIVER LV 32-LQFP
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MPC942CAC MPC942CAC NXP USA Inc. MPC942C.pdf Description: IC CLOCK DIST CHIP 1:18 32-TQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVTTL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MPC942PAC MPC942PAC NXP USA Inc. Description: IC CLOCK DIST CHIP 1:18 32-LQFP
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVPECL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
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MPC9447AC MPC9447AC NXP USA Inc. MPC9447.pdf Description: IC CLK BUFFER 2:9 350MHZ 32LQFP
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MPC9448AC MPC9448AC NXP USA Inc. MPC9448.pdf Description: IC CLK BUFFER 2:12 350MHZ 32LQFP
Frequency - Max: 350 MHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 2:12
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: LVCMOS
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Tray
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MPC962305D-1H MPC962305D-1H NXP USA Inc. MPC962305,962309.pdf Description: IC CLOCK BUFFER 1:5 8-SOIC
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MPC9653AFA MPC9653AFA NXP USA Inc. MPC9653A.pdf Description: IC PLL CLK GENERATOR 1:8 32-LQFP
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MPC9653AFAR2 MPC9653AFAR2 NXP USA Inc. MPC9653A.pdf Description: IC CLOCK GENERATOR 32LQFP
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:8
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVPECL
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Frequency - Max: 125MHz
Output: LVCMOS
Mounting Type: Surface Mount
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MPC9893FA MPC9893FA NXP USA Inc. MPC9893.pdf Description: IC PLL/IDCS CLK GENERATOR 48LQFP
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MC13191FCR2 MC13191FCR2 NXP USA Inc. MC13191.pdf Description: IC RF TXRX ISM>1GHZ 32VFQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI
RF Family/Standard: General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MC9S12C64MFA MC9S12C64MFA NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MCF5274LVM166 MCF5274LVM166 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+2857.68 грн
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MCF5271CVM100 MCF5271CVM100 NXP USA Inc. MCF5271EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
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MCF5232CVM100 MCF5232CVM100 NXP USA Inc. MCF5235EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5275LCVM166 MCF5275LCVM166 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
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MCF5274VM166 MCF5274VM166 NXP USA Inc. MCF5275EC.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MCF5234CVM100 MCF5234CVM100 NXP USA Inc. MCF5235EC.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5232CVM150 MCF5232CVM150 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5234CVM150 MCF5234CVM150 NXP USA Inc. MCF5235EC.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 397 шт:
термін постачання 21-31 дні (днів)
1+4545.23 грн
10+3620.74 грн
25+3431.88 грн
100+3025.90 грн
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MCF5233CVM150 MCF5233CVM150 NXP USA Inc. MCF5235EC.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 185 шт:
термін постачання 21-31 дні (днів)
1+3784.13 грн
10+3016.43 грн
25+2859.78 грн
100+2631.92 грн
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MCF5281CVF66 MCF5281CVF66 NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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MCF5235CVM150 MCF5235CVM150 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5281CVF80 MCF5281CVF80 NXP USA Inc. MCF5282UM.pdf Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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MCF5482CZP166 MCF5482CZP166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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MCF5474ZP266 MCF5474ZP266 NXP USA Inc. MCF5475EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
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MCF5484CZP200 MCF5484CZP200 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
1+6671.88 грн
10+5376.91 грн
25+5115.19 грн
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CWS-H08-STDED-CX NXP USA Inc. 950-00087.pdf Description: SOFTWARE CODEWARRIOR STD HC08
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CWP-STANDARD-NL CWP-STANDARD-NL NXP USA Inc. 950-00088.pdf Description: SOFTWARE CODE WARRIOR STD
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Edition: Standard
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
1+231544.86 грн
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CWS-H08-PROED-CX NXP USA Inc. 950-00087.pdf Description: SOFTWARE CODEWARRIOR PRO HC08
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CWS-H08-PROED-LX NXP USA Inc. 950-00087.pdf Description: SOFTWARE CODEWARRIOR PRO HC08
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CWS-H08-STDED-LX NXP USA Inc. 950-00087.pdf Description: SOFTWARE CODEWARRIOR STD HC08
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CWS-H08-STDED-UX NXP USA Inc. 950-00087.pdf Description: SOFTWARE CODEWARRIOR UPGRD HC08
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CWS-H12-STDED-LX NXP USA Inc. 950-00088.pdf Description: SOFTWARE CODEWARRIOR STD HC12
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MC13193FC MC13193FC NXP USA Inc. MC13192,13193_March2007.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13193FCR2 MC13193FCR2 NXP USA Inc. MC13192,13193_March2007.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13193FCR2 MC13193FCR2 NXP USA Inc. MC13192,13193_March2007.pdf Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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USBMULTILINKBDM NXP USA Inc. Description: PROGRAMMER MULTILINK HCS08/HCS12
Packaging: Bulk
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Utilized IC / Part: HC(S)08, H(S)12
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MPXH6250AC6T1 MPXH6250AC6T1 NXP USA Inc. MPXH6250A.pdf Description: SENSOR 36.26PSIA 0.13" 4.9V SSOP
Maximum Pressure: 145.04PSI (1000kPa)
Port Style: Barbless
Supplier Device Package: 8-SSOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube
Voltage - Supply: 4.74V ~ 5.46V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 36.26PSI (20kPa ~ 250kPa)
Output: 0.3 V ~ 4.9 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
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GTL2005PW,118 GTL2005PW,118 NXP USA Inc. GTL2005.pdf Description: IC TRANSLATOR BIDIR 14TSSOP
Number of Circuits: 1
Part Status: Last Time Buy
Input Signal: GTL
Channels per Circuit: 4
Translator Type: Mixed Signal
Output Signal: LVTTL, TTL
Channel Type: Bidirectional
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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KTY81/110,112 KTY81/110,112 NXP USA Inc. KTY82_SER.pdf Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
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P80C31SBPN,112 P80C31SBPN,112 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P80C32SBPN,112 P80C32SBPN,112 NXP USA Inc. 80C31_80C32.pdf Description: IC MCU 8BIT ROMLESS 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P82B715PN,112 P82B715PN,112 NXP USA Inc. P82B715.pdf Description: IC REDRIVER I2C 1CH 400KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Number of Channels: 1
Mounting Type: Through Hole
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 12V
Applications: I2C
Current - Supply: 22mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-DIP
Part Status: Obsolete
Capacitance - Input: 3000 pF
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P82B715TD,118 P82B715TD,118 NXP USA Inc. P82B715.pdf Description: IC REDRIVER I2C 1CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 12V
Applications: I2C
Current - Supply: 22mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Last Time Buy
Capacitance - Input: 3000 pF
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P82B96PN,112 P82B96PN,112 NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8DIP
Supplier Device Package: 8-DIP
Data Rate (Max): 400kHz
Current - Supply: 900µA
Applications: I2C
Voltage - Supply: 2V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Through Hole
Number of Channels: 2
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Capacitance - Input: 7 pF
Part Status: Obsolete
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P82B96TD,118 P82B96TD,118 NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 7 pF
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P87C51FB-4N,112 P87C51FB-4N,112 NXP USA Inc. 8XC54_51FX_51RX.pdf Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51SBPN,112 P87C51SBPN,112 NXP USA Inc. 8XC51_8XC52.pdf Description: IC MCU 8BIT 4KB OTP 40DIP
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P87C52SBPN,112 P87C52SBPN,112 NXP USA Inc. 8XC51_8XC52.pdf Description: IC MCU 8BIT 8KB OTP 40DIP
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 40-DIP
Peripherals: POR
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
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P87C52X2BN,112 P87C52X2BN,112 NXP USA Inc. P80C3XX2_8XC5XX2.pdf Description: IC MCU 8BIT 8KB OTP 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 33MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P87C54SBPN,112 P87C54SBPN,112 NXP USA Inc. 8XC54_51FX_51RX.pdf Description: IC MCU 8BIT 16KB OTP 40DIP
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P87LPC760BDH,112 P87LPC760BDH,112 NXP USA Inc. P87LPC760.pdf Description: IC MCU 8BIT 1KB OTP 14TSSOP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1KB (1K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Verified
Number of I/O: 12
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
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P87LPC762BN,112 P87LPC762BN,112 NXP USA Inc. 87LPC762.pdf Description: IC MCU 8BIT 2KB OTP 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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P87LPC764BN,112 P87LPC764BN,112 NXP USA Inc. P87LPC764.pdf Description: IC MCU 8BIT 4KB OTP 20DIP
DigiKey Programmable: Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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P87LPC767BN,112 P87LPC767BN,112 NXP USA Inc. P87LPC767.pdf Description: IC MCU 8BIT 4KB OTP 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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PCA82C250/N4,112 PCA82C250/N4,112 NXP USA Inc. PCA82C250.pdf Description: IC TRANSCEIVER HALF 1/1 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-DIP
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C250T/N4,118 PCA82C250T/N4,118 NXP USA Inc. PCA82C250.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C251/N3,112 PCA82C251/N3,112 NXP USA Inc. PCA82C251.pdf Description: IC TRANSCEIVER HALF 1/1 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-DIP
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C251T/N3,118 PCA82C251T/N3,118 NXP USA Inc. PCA82C251.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA9500D,112 PCA9500D,112 NXP USA Inc. PCA9500.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-SO
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Features: EEPROM, POR
Packaging: Tube
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MPC9350AC MPC9350.pdf
MPC9350AC
Виробник: NXP USA Inc.
Description: IC PLL CLOCK DRIVER LV 32-LQFP
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MPC942CAC MPC942C.pdf
MPC942CAC
Виробник: NXP USA Inc.
Description: IC CLOCK DIST CHIP 1:18 32-TQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
Differential - Input:Output: No/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVTTL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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MPC942PAC
MPC942PAC
Виробник: NXP USA Inc.
Description: IC CLOCK DIST CHIP 1:18 32-LQFP
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:18
Main Purpose: Intel CPU Servers
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVPECL
Frequency - Max: 250MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of Circuits: 1
PLL: No
Supplier Device Package: 32-TQFP (7x7)
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MPC9447AC MPC9447.pdf
MPC9447AC
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:9 350MHZ 32LQFP
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MPC9448AC MPC9448.pdf
MPC9448AC
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:12 350MHZ 32LQFP
Frequency - Max: 350 MHz
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 2:12
Voltage - Supply: 2.375V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: LVCMOS
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 32-LQFP
Packaging: Tray
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MPC962305D-1H MPC962305,962309.pdf
MPC962305D-1H
Виробник: NXP USA Inc.
Description: IC CLOCK BUFFER 1:5 8-SOIC
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MPC9653AFA MPC9653A.pdf
MPC9653AFA
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:8 32-LQFP
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MPC9653AFAR2 MPC9653A.pdf
MPC9653AFAR2
Виробник: NXP USA Inc.
Description: IC CLOCK GENERATOR 32LQFP
Package / Case: 32-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: Yes/No
Ratio - Input:Output: 1:8
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: LVCMOS, LVPECL
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Frequency - Max: 125MHz
Output: LVCMOS
Mounting Type: Surface Mount
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MPC9893FA MPC9893.pdf
MPC9893FA
Виробник: NXP USA Inc.
Description: IC PLL/IDCS CLK GENERATOR 48LQFP
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MC13191FCR2 MC13191.pdf
MC13191FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM>1GHZ 32VFQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI
RF Family/Standard: General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
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MC9S12C64MFA MC9S12C128V1.pdf
MC9S12C64MFA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MCF5274LVM166 MCF5275EC.pdf
MCF5274LVM166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2857.68 грн
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MCF5271CVM100 MCF5271EC.pdf
MCF5271CVM100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
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MCF5232CVM100 MCF5235EC.pdf
MCF5232CVM100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5275LCVM166 MCF5275EC.pdf
MCF5275LCVM166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
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MCF5274VM166 MCF5275EC.pdf
MCF5274VM166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MCF5234CVM100 MCF5235EC.pdf
MCF5234CVM100
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5232CVM150 MCF523x.pdf
MCF5232CVM150
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5234CVM150 MCF5235EC.pdf
MCF5234CVM150
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 397 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4545.23 грн
10+3620.74 грн
25+3431.88 грн
100+3025.90 грн
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MCF5233CVM150 MCF5235EC.pdf
MCF5233CVM150
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 185 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3784.13 грн
10+3016.43 грн
25+2859.78 грн
100+2631.92 грн
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MCF5281CVF66 MCF5282UM.pdf
MCF5281CVF66
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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MCF5235CVM150 MCF523x.pdf
MCF5235CVM150
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCF5281CVF80 MCF5282UM.pdf
MCF5281CVF80
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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MCF5482CZP166 MCF5485EC.pdf
MCF5482CZP166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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MCF5474ZP266 MCF5475EC.pdf
MCF5474ZP266
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
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MCF5484CZP200 MCF5485EC.pdf
MCF5484CZP200
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
на замовлення 620 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6671.88 грн
10+5376.91 грн
25+5115.19 грн
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CWS-H08-STDED-CX 950-00087.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR STD HC08
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CWP-STANDARD-NL 950-00088.pdf
CWP-STANDARD-NL
Виробник: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR STD
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Edition: Standard
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+231544.86 грн
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CWS-H08-PROED-CX 950-00087.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR PRO HC08
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CWS-H08-PROED-LX 950-00087.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR PRO HC08
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CWS-H08-STDED-LX 950-00087.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR STD HC08
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CWS-H08-STDED-UX 950-00087.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR UPGRD HC08
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CWS-H12-STDED-LX 950-00088.pdf
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR STD HC12
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MC13193FC MC13192,13193_March2007.pdf
MC13193FC
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13193FCR2 MC13192,13193_March2007.pdf
MC13193FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13193FCR2 MC13192,13193_March2007.pdf
MC13193FCR2
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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USBMULTILINKBDM
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HCS08/HCS12
Packaging: Bulk
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s), Cable(s)
Utilized IC / Part: HC(S)08, H(S)12
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MPXH6250AC6T1 MPXH6250A.pdf
MPXH6250AC6T1
Виробник: NXP USA Inc.
Description: SENSOR 36.26PSIA 0.13" 4.9V SSOP
Maximum Pressure: 145.04PSI (1000kPa)
Port Style: Barbless
Supplier Device Package: 8-SSOP
Applications: Board Mount
Port Size: Male - 0.13" (3.3mm) Tube
Voltage - Supply: 4.74V ~ 5.46V
Termination Style: Gull Wing
Operating Temperature: -40°C ~ 125°C
Accuracy: ±1.5%
Pressure Type: Absolute
Operating Pressure: 2.9PSI ~ 36.26PSI (20kPa ~ 250kPa)
Output: 0.3 V ~ 4.9 V
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 8-SOIC (0.335", 8.50mm Width), Top Port
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
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GTL2005PW,118 GTL2005.pdf
GTL2005PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 14TSSOP
Number of Circuits: 1
Part Status: Last Time Buy
Input Signal: GTL
Channels per Circuit: 4
Translator Type: Mixed Signal
Output Signal: LVTTL, TTL
Channel Type: Bidirectional
Supplier Device Package: 14-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Non-Inverted
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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KTY81/110,112 KTY82_SER.pdf
KTY81/110,112
Виробник: NXP USA Inc.
Description: SENSOR PTC 1KOHM PBCYT2
Packaging: Tube
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C
Supplier Device Package: PBCYT2
Part Status: Last Time Buy
Resistance @ 25°C: 1 kOhms
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P80C31SBPN,112 80C31_80C32.pdf
P80C31SBPN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P80C32SBPN,112 80C31_80C32.pdf
P80C32SBPN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P82B715PN,112 P82B715.pdf
P82B715PN,112
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 400KHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Number of Channels: 1
Mounting Type: Through Hole
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 12V
Applications: I2C
Current - Supply: 22mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-DIP
Part Status: Obsolete
Capacitance - Input: 3000 pF
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P82B715TD,118 P82B715.pdf
P82B715TD,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 12V
Applications: I2C
Current - Supply: 22mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Last Time Buy
Capacitance - Input: 3000 pF
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P82B96PN,112 P82B96.pdf
P82B96PN,112
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8DIP
Supplier Device Package: 8-DIP
Data Rate (Max): 400kHz
Current - Supply: 900µA
Applications: I2C
Voltage - Supply: 2V ~ 15V
Operating Temperature: -40°C ~ 85°C
Input: 2-Wire Bus
Type: Buffer, ReDriver
Output: 2-Wire Bus
Mounting Type: Through Hole
Number of Channels: 2
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Capacitance - Input: 7 pF
Part Status: Obsolete
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P82B96TD,118 P82B96.pdf
P82B96TD,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-SO
Part Status: Active
Capacitance - Input: 7 pF
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P87C51FB-4N,112 8XC54_51FX_51RX.pdf
P87C51FB-4N,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 16MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, UART/USART
Peripherals: POR, PWM
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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P87C51SBPN,112 8XC51_8XC52.pdf
P87C51SBPN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 40DIP
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P87C52SBPN,112 8XC51_8XC52.pdf
P87C52SBPN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 40-DIP
Peripherals: POR
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 16MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
DigiKey Programmable: Not Verified
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P87C52X2BN,112 P80C3XX2_8XC5XX2.pdf
P87C52X2BN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-DIP
Peripherals: POR
Connectivity: EBI/EMI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 33MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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P87C54SBPN,112 8XC54_51FX_51RX.pdf
P87C54SBPN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 40DIP
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P87LPC760BDH,112 P87LPC760.pdf
P87LPC760BDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1KB OTP 14TSSOP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1KB (1K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Verified
Number of I/O: 12
Supplier Device Package: 14-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
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P87LPC762BN,112 87LPC762.pdf
P87LPC762BN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB OTP 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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P87LPC764BN,112 P87LPC764.pdf
P87LPC764BN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20DIP
DigiKey Programmable: Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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P87LPC767BN,112 P87LPC767.pdf
P87LPC767BN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 20DIP
DigiKey Programmable: Not Verified
Number of I/O: 18
Supplier Device Package: 20-DIP
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: 8051
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 128 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 20MHz
Mounting Type: Through Hole
Package / Case: 20-DIP (0.300", 7.62mm)
Packaging: Tube
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PCA82C250/N4,112 PCA82C250.pdf
PCA82C250/N4,112
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-DIP
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C250T/N4,118 PCA82C250.pdf
PCA82C250T/N4,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C251/N3,112 PCA82C251.pdf
PCA82C251/N3,112
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-DIP
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA82C251T/N3,118 PCA82C251.pdf
PCA82C251T/N3,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 150 mV
Duplex: Half
Part Status: Obsolete
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PCA9500D,112 PCA9500.pdf
PCA9500D,112
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
DigiKey Programmable: Not Verified
Part Status: Obsolete
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 16-SO
Interrupt Output: No
Clock Frequency: 400 kHz
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Features: EEPROM, POR
Packaging: Tube
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