Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35748) > Сторінка 10 з 596
| Фото | Назва | Виробник | Інформація |
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MPC852TCZT80A | NXP USA Inc. |
 Description: IC MPU MPC8XX 80MHZ 256BGAPackaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC852TCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC859DSLCZP50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC859DSLZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC852TCZT100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC859DSLCZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC880CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC885ZP80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC859TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC885CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC859TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860DEZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860DTZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860ENZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860DPZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860TZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860DEZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC866TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860TZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC866TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC860ENZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC866PCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX10GP | NXP USA Inc. |
Description: SENSOR 1.45PSIG 0.19" .035V Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 35 mV (3V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Vented Gauge Accuracy: ±1% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 3V ~ 6V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 10.88PSI (75kPa) Part Status: Active |
на замовлення 701 шт: термін постачання 21-31 дні (днів) |
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MC100ES6011D | NXP USA Inc. |
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC100ES6130DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Multiplexer Input: HSTL, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.8V Ratio - Input:Output: 2:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-TSSOP Frequency - Max: 2.5 GHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
.jpg "MC100ES6139DT") |
MC100ES6139DT | NXP USA Inc. |
Description: IC CLOCK GENERATOR 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Output: ECL Frequency - Max: 1GHz Type: Clock Generator Input: ECL, HSTL, LVDS, PECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.8V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 20-TSSOP PLL: Yes Divider/Multiplier: Yes/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC100ES6535DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVTTL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.8V Ratio - Input:Output: 2:4 Differential - Input:Output: No/Yes Supplier Device Package: 20-TSSOP Part Status: Obsolete Frequency - Max: 1 GHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9229AC | NXP USA Inc. |
Description: IC CLK/FREQ SYNTH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Output: LVPECL Frequency - Max: 400MHz Type: Clock/Frequency Synthesizer, Clock Generator Input: Crystal Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3.135V ~ 3.465V Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Supplier Device Package: 32-LQFP (7x7) PLL: Yes with Bypass Divider/Multiplier: Yes/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9230AC | NXP USA Inc. |
Description: IC CLK/FREQ SYNTH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Output: LVPECL Frequency - Max: 750MHz Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer Input: Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Supplier Device Package: 32-LQFP (7x7) PLL: Yes with Bypass Divider/Multiplier: Yes/No Part Status: Obsolete Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9315AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR/DVR 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9330AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR 1:6 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9331AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR 1:6 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9350AC | NXP USA Inc. |
Description: IC PLL CLOCK DRIVER LV 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC942CAC | NXP USA Inc. |
Description: IC CLOCK DIST CHIP 1:18 32-TQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Output: LVCMOS Frequency - Max: 250MHz Input: LVCMOS, LVTTL Operating Temperature: 0°C ~ 70°C Voltage - Supply: 2.375V ~ 3.465V Main Purpose: Intel CPU Servers Ratio - Input:Output: 1:18 Differential - Input:Output: No/No Supplier Device Package: 32-TQFP (7x7) PLL: No Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC942PAC | NXP USA Inc. |
Description: IC CLOCK DIST CHIP 1:18 32-LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Output: LVCMOS Frequency - Max: 250MHz Input: LVPECL Operating Temperature: 0°C ~ 70°C Voltage - Supply: 2.375V ~ 3.465V Main Purpose: Intel CPU Servers Ratio - Input:Output: 1:18 Differential - Input:Output: Yes/No Supplier Device Package: 32-TQFP (7x7) PLL: No Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9447AC | NXP USA Inc. |
Description: IC CLK BUFFER 2:9 350MHZ 32LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9448AC | NXP USA Inc. |
Description: IC CLK BUFFER 2:12 350MHZ 32LQFP Packaging: Tray Package / Case: 32-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: LVCMOS Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 2:12 Differential - Input:Output: Yes/No Supplier Device Package: 32-LQFP (7x7) Frequency - Max: 350 MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC962305D-1H | NXP USA Inc. |
Description: IC CLOCK BUFFER 1:5 8-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9653AFA | NXP USA Inc. |
Description: IC PLL CLK GENERATOR 1:8 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9893FA | NXP USA Inc. |
Description: IC PLL/IDCS CLK GENERATOR 48LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC13191FCR2") |
MC13191FCR2 | NXP USA Inc. |
Description: IC RF TXRX ISM>1GHZ 32VFQFN Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 4dBm Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 32-HVQFN (5x5) GPIO: 7 Modulation: DSSS, O-QPSK RF Family/Standard: General ISM > 1GHz Serial Interfaces: SPI Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S12C64MFA | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Part Status: Obsolete Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5274LVM166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Part Status: Not For New Designs Number of I/O: 61 DigiKey Programmable: Not Verified |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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MCF5271CVM100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5232CVM100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 100MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 97 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5275LCVM166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5274VM166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 69 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5234CVM100 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 100MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Not For New Designs Number of I/O: 97 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5232CVM150 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 97 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5234CVM150 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Not For New Designs Number of I/O: 97 DigiKey Programmable: Not Verified |
на замовлення 581 шт: термін постачання 21-31 дні (днів) |
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MCF5233CVM150 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Not For New Designs Number of I/O: 97 DigiKey Programmable: Not Verified |
на замовлення 245 шт: термін постачання 21-31 дні (днів) |
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 |
MCF5281CVF66 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 66MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Obsolete Number of I/O: 142 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5235CVM150 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 256-MAPBGA (17x17) Number of I/O: 97 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5281CVF80 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 256MAPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 256-MAPBGA (17x17) Part Status: Obsolete Number of I/O: 142 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MCF5482CZP166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 99 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
MCF5474ZP266 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF5484CZP200 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 200MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4E Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 99 DigiKey Programmable: Not Verified |
на замовлення 680 шт: термін постачання 21-31 дні (днів) |
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| CWS-H08-STDED-CX | NXP USA Inc. |
Description: SOFTWARE CODEWARRIOR STD HC08 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
CWP-STANDARD-NL | NXP USA Inc. |
Description: SOFTWARE CODE WARRIOR STD Packaging: Box For Use With/Related Products: Code Warrior™ Software Type: Integrated Development Environment (IDE) Applications: Programming Edition: Standard License Length: Perpetual License - User Details: Fixed Node Media Delivery Type: Electronically Delivered Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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| CWS-H08-PROED-CX | NXP USA Inc. |
Description: SOFTWARE CODEWARRIOR PRO HC08 |
товару немає в наявності |
В кошику од. на суму грн. |
| MPC852TCZT80A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCVR100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLCZP50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCZT100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLCZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC880CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC885ZP80 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Description: IC MPU MPC8XX 80MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC859TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC885CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC859TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Description: IC MPU MPC8XX 100MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DEZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DTZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC860ENZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DPZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860TZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DEZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC866TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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| MPC860TZQ66D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC866TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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| MPC860ENZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC866PCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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| MPX10GP |
|
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.19" .035V
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
Description: SENSOR 1.45PSIG 0.19" .035V
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 10.88PSI (75kPa)
Part Status: Active
на замовлення 701 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1048.73 грн |
| 5+ | 917.69 грн |
| 10+ | 883.52 грн |
| 25+ | 790.85 грн |
| 50+ | 764.65 грн |
| 100+ | 740.63 грн |
| 500+ | 680.89 грн |
| MC100ES6011D |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
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| MC100ES6130DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: HSTL, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-TSSOP
Frequency - Max: 2.5 GHz
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: HSTL, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-TSSOP
Frequency - Max: 2.5 GHz
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| MC100ES6139DT |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GENERATOR 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: ECL
Frequency - Max: 1GHz
Type: Clock Generator
Input: ECL, HSTL, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK GENERATOR 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: ECL
Frequency - Max: 1GHz
Type: Clock Generator
Input: ECL, HSTL, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MC100ES6535DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
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| MPC9229AC |
|
Виробник: NXP USA Inc.
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 400MHz
Type: Clock/Frequency Synthesizer, Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 400MHz
Type: Clock/Frequency Synthesizer, Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MPC9230AC |
|
Виробник: NXP USA Inc.
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 750MHz
Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
Input: Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 750MHz
Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
Input: Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MPC9315AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR/DVR 32-LQFP
Description: IC PLL CLK GENERATOR/DVR 32-LQFP
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| MPC9330AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
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| MPC9331AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
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| MPC9350AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLOCK DRIVER LV 32-LQFP
Description: IC PLL CLOCK DRIVER LV 32-LQFP
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| MPC942CAC |
|
Виробник: NXP USA Inc.
Description: IC CLOCK DIST CHIP 1:18 32-TQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: No/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK DIST CHIP 1:18 32-TQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: No/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MPC942PAC |
Виробник: NXP USA Inc.
Description: IC CLOCK DIST CHIP 1:18 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK DIST CHIP 1:18 32-LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 250MHz
Input: LVPECL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 3.465V
Main Purpose: Intel CPU Servers
Ratio - Input:Output: 1:18
Differential - Input:Output: Yes/No
Supplier Device Package: 32-TQFP (7x7)
PLL: No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MPC9447AC |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:9 350MHZ 32LQFP
Description: IC CLK BUFFER 2:9 350MHZ 32LQFP
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| MPC9448AC |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:12 350MHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:12
Differential - Input:Output: Yes/No
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 350 MHz
Description: IC CLK BUFFER 2:12 350MHZ 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:12
Differential - Input:Output: Yes/No
Supplier Device Package: 32-LQFP (7x7)
Frequency - Max: 350 MHz
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| MPC962305D-1H |
|
Виробник: NXP USA Inc.
Description: IC CLOCK BUFFER 1:5 8-SOIC
Description: IC CLOCK BUFFER 1:5 8-SOIC
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| MPC9653AFA |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:8 32-LQFP
Description: IC PLL CLK GENERATOR 1:8 32-LQFP
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| MPC9893FA |
|
Виробник: NXP USA Inc.
Description: IC PLL/IDCS CLK GENERATOR 48LQFP
Description: IC PLL/IDCS CLK GENERATOR 48LQFP
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| MC13191FCR2 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MC9S12C64MFA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MCF5274LVM166 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2867.54 грн |
| MCF5271CVM100 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Description: IC MCU 32BIT ROMLESS 196MAPBGA
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| MCF5232CVM100 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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| MCF5275LCVM166 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Description: IC MCU 32BIT ROMLESS 196MAPBGA
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| MCF5274VM166 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 69
DigiKey Programmable: Not Verified
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| MCF5234CVM100 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MCF5232CVM150 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MCF5234CVM150 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 581 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4746.68 грн |
| 10+ | 3781.16 грн |
| 25+ | 3583.95 грн |
| 100+ | 3159.99 грн |
| MCF5233CVM150 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Not For New Designs
Number of I/O: 97
DigiKey Programmable: Not Verified
на замовлення 245 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3904.36 грн |
| 10+ | 3113.00 грн |
| 25+ | 3075.23 грн |
| MCF5281CVF66 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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В кошику
од. на суму грн.
| MCF5235CVM150 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| MCF5281CVF80 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
Description: IC MCU 32B 256KB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Part Status: Obsolete
Number of I/O: 142
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од. на суму грн.
| MCF5482CZP166 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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| MCF5474ZP266 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Description: IC MCU 32BIT ROMLESS 388PBGA
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| MCF5484CZP200 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
на замовлення 680 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7390.34 грн |
| 10+ | 5955.83 грн |
| 25+ | 5665.93 грн |
| CWS-H08-STDED-CX |
|
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR STD HC08
Description: SOFTWARE CODEWARRIOR STD HC08
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| CWP-STANDARD-NL |
|
Виробник: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR STD
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Edition: Standard
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
Description: SOFTWARE CODE WARRIOR STD
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Edition: Standard
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 232343.61 грн |
| CWS-H08-PROED-CX |
|
Виробник: NXP USA Inc.
Description: SOFTWARE CODEWARRIOR PRO HC08
Description: SOFTWARE CODEWARRIOR PRO HC08
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од. на суму грн.