Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36362) > Сторінка 9 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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MC14489BDWR2 | NXP USA Inc. |
 Description: IC DRVR 7 SEGMENT 20SOICCurrent - Supply: 5.5 mA Part Status: Obsolete Supplier Device Package: 20-SOIC Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 130°C Configuration: 7 Segment Interface: Serial Mounting Type: Surface Mount Display Type: LED Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC145483DWR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33287DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Applications: Contact Monitor Current - Supply: 55µA Supplier Device Package: 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33389DDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Cut Tape (CT) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33390DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33493DTBR2 | NXP USA Inc. |
Description: RF TX IC FSK 315-434MHZ 14TSSOP Operating Temperature: -40°C ~ 125°C Data Interface: PCB, Surface Mount Modulation or Protocol: FSK, OOK Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz Mounting Type: Surface Mount Package / Case: 14-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) Applications: General Data Transfer Power - Output: -3dBm Voltage - Supply: 1.9V ~ 3.6V DigiKey Programmable: Not Verified Part Status: Obsolete Supplier Device Package: 14-TSSOP Antenna Connector: PCB, Surface Mount Current - Transmitting: 11.6mA Data Rate (Max): 10kbps |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33793DR2 | NXP USA Inc. |
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC DigiKey Programmable: Not Verified Supplier Device Package: 16-SOIC Input Type: Logic Operating Temperature: -40°C ~ 150°C Type: Distributed Systems Interface Mounting Type: Surface Mount Output Type: Logic Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33989DWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC34129DR2 | NXP USA Inc. |
Description: IC CURRENT MODE CTRLR 14-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC88915FN55R2 | NXP USA Inc. |
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC908AZ60AVFUR2 | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Speed: 8.4MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Number of I/O: 52 Part Status: Obsolete Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, POR, PWM Connectivity: CANbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 15x8b Core Processor: HC08 EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 8 Program Memory Size: 60KB (60K x 8) |
товару немає в наявності |
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MC908GP32CFBR2 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC17511AEPR2 | NXP USA Inc. |
 Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC17531AEVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 20-VMFP Voltage - Load: 2V ~ 8.6V Technology: Power MOSFET Applications: Battery Powered Voltage - Supply: 2.7V ~ 3.6V Output Configuration: Half Bridge (4) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 700mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC9331FAR2 | NXP USA Inc. |
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
| DEMO9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||
| EVB9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
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MC9S12NE64VTU | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80TQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC9S12NE64CPV | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC17C724EPR2 | NXP USA Inc. |
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 16-QFN (3x3) Voltage - Load: 2.7V ~ 5.5V Technology: Power MOSFET Applications: Camera Voltage - Supply: 2.7V ~ 5.5V Output Configuration: Half Bridge (4) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 400mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC9S12C128MFA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP DigiKey Programmable: Not Verified Number of I/O: 31 Supplier Device Package: 48-LQFP (7x7) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 128KB (128K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC13191FCR2") |
MC13191FCR2 | NXP USA Inc. |
Description: IC RF TXRX ISM>1GHZ 32VFQFN DigiKey Programmable: Not Verified Part Status: Obsolete Serial Interfaces: SPI RF Family/Standard: General ISM > 1GHz Modulation: DSSS, O-QPSK GPIO: 7 Supplier Device Package: 32-HVQFN (5x5) Current - Transmitting: 30mA Data Rate (Max): 250kbps Current - Receiving: 37mA Power - Output: 4dBm Voltage - Supply: 2V ~ 3.4V Operating Temperature: -40°C ~ 85°C Type: TxRx Only Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -92dBm Package / Case: 32-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
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| 13192DSK-A00 | NXP USA Inc. |
Description: KIT DEV STARTERS FOR MC13191,192 |
товару немає в наявності |
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13192RFC-A00 | NXP USA Inc. |
Description: BOARD DAUGHTER FOR MC13192 |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC33897D | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Part Status: Obsolete Duplex: Half Receiver Hysteresis: 500 mV Supplier Device Package: 14-SOIC Protocol: CANbus Data Rate: 83.33Kbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC852TVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MPC852TCVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC852TCVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC870CZT66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC852TCZT80A | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC852TCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC859DSLCZP50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC859DSLZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC852TCZT100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC859DSLCZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC880CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC885ZP80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC859TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC885CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC859TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860DEZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860DTZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860ENZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860DPZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860TZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860DEZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC866TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860TZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC866TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC860ENZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: 0°C ~ 95°C (TA) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4) |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MPC866PCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4), 10/100Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 100°C (TA) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||
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MC100ES6011D | NXP USA Inc. |
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC |
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MC100ES6130DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP Frequency - Max: 2.5 GHz Supplier Device Package: 16-TSSOP Differential - Input:Output: Yes/Yes Ratio - Input:Output: 2:4 Voltage - Supply: 2.375V ~ 3.8V Operating Temperature: -40°C ~ 85°C Input: HSTL, LVPECL Type: Fanout Buffer (Distribution), Multiplexer Output: LVPECL Mounting Type: Surface Mount Number of Circuits: 1 Package / Case: 16-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
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.jpg "MC100ES6139DT") |
MC100ES6139DT | NXP USA Inc. |
Description: IC CLOCK GENERATOR 20TSSOP DigiKey Programmable: Not Verified Number of Circuits: 1 Divider/Multiplier: Yes/No PLL: Yes Supplier Device Package: 20-TSSOP Differential - Input:Output: Yes/Yes Ratio - Input:Output: 1:4 Voltage - Supply: 3.135V ~ 3.8V Operating Temperature: -40°C ~ 85°C Input: ECL, HSTL, LVDS, PECL Type: Clock Generator Frequency - Max: 1GHz Output: ECL Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
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MC100ES6535DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVTTL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.8V Ratio - Input:Output: 2:4 Differential - Input:Output: No/Yes Supplier Device Package: 20-TSSOP Part Status: Obsolete Frequency - Max: 1 GHz |
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MPC9229AC | NXP USA Inc. |
Description: IC CLK/FREQ SYNTH 32LQFP DigiKey Programmable: Not Verified Number of Circuits: 1 Divider/Multiplier: Yes/No PLL: Yes with Bypass Supplier Device Package: 32-LQFP (7x7) Differential - Input:Output: No/Yes Ratio - Input:Output: 1:1 Voltage - Supply: 3.135V ~ 3.465V Operating Temperature: 0°C ~ 70°C Input: Crystal Type: Clock/Frequency Synthesizer, Clock Generator Frequency - Max: 400MHz Output: LVPECL Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
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MPC9230AC | NXP USA Inc. |
Description: IC CLK/FREQ SYNTH 32LQFP DigiKey Programmable: Not Verified Number of Circuits: 1 Part Status: Obsolete Divider/Multiplier: Yes/No PLL: Yes with Bypass Supplier Device Package: 32-LQFP (7x7) Differential - Input:Output: No/Yes Ratio - Input:Output: 1:1 Voltage - Supply: 3.135V ~ 3.465V Operating Temperature: -40°C ~ 85°C Input: Crystal Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer Frequency - Max: 750MHz Output: LVPECL Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
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MPC9315AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR/DVR 32-LQFP |
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MPC9330AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR 1:6 32-LQFP |
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MPC9331AC | NXP USA Inc. |
Description: IC PLL CLK GENERATOR 1:6 32-LQFP |
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| MC14489BDWR2 |
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Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Current - Supply: 5.5 mA
Part Status: Obsolete
Supplier Device Package: 20-SOIC
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 130°C
Configuration: 7 Segment
Interface: Serial
Mounting Type: Surface Mount
Display Type: LED
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Description: IC DRVR 7 SEGMENT 20SOIC
Current - Supply: 5.5 mA
Part Status: Obsolete
Supplier Device Package: 20-SOIC
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 130°C
Configuration: 7 Segment
Interface: Serial
Mounting Type: Surface Mount
Display Type: LED
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
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| MC145483DWR2 |
|
Виробник: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SOIC
Description: IC CODEC-FILTER PCM 3V 20-SOIC
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| MC33287DWR2 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
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| MC33389DDWR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
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| MC33390DR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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| MC33493DTBR2 |
|
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
Data Rate (Max): 10kbps
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
Data Rate (Max): 10kbps
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| MC33793DR2 |
|
Виробник: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
DigiKey Programmable: Not Verified
Supplier Device Package: 16-SOIC
Input Type: Logic
Operating Temperature: -40°C ~ 150°C
Type: Distributed Systems Interface
Mounting Type: Surface Mount
Output Type: Logic
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
DigiKey Programmable: Not Verified
Supplier Device Package: 16-SOIC
Input Type: Logic
Operating Temperature: -40°C ~ 150°C
Type: Distributed Systems Interface
Mounting Type: Surface Mount
Output Type: Logic
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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| MC33989DWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
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| MC34129DR2 |
|
Виробник: NXP USA Inc.
Description: IC CURRENT MODE CTRLR 14-SOIC
Description: IC CURRENT MODE CTRLR 14-SOIC
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| MC88915FN55R2 |
|
Виробник: NXP USA Inc.
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
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| MC908AZ60AVFUR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Description: IC MCU 8BIT 60KB FLASH 64QFP
Speed: 8.4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 52
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: CANbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 15x8b
Core Processor: HC08
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
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| MC908GP32CFBR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Description: IC MCU 8BIT 32KB FLASH 44QFP
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| MPC17511AEPR2 | |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
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| MPC17531AEVEL |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 20-VMFP
Voltage - Load: 2V ~ 8.6V
Technology: Power MOSFET
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 3.6V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Cut Tape (CT)
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| MPC9331FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
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| DEMO9S12NE64 | |
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| EVB9S12NE64 |
|
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| MC9S12NE64VTU |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80TQFP
Description: IC MCU 16BIT 64KB FLASH 80TQFP
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| MC9S12NE64CPV | |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Description: IC MCU 16BIT 64KB FLASH 112LQFP
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| MPC17C724EPR2 |
|
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-QFN (3x3)
Voltage - Load: 2.7V ~ 5.5V
Technology: Power MOSFET
Applications: Camera
Voltage - Supply: 2.7V ~ 5.5V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 400mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-QFN (3x3)
Voltage - Load: 2.7V ~ 5.5V
Technology: Power MOSFET
Applications: Camera
Voltage - Supply: 2.7V ~ 5.5V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 400mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MC9S12C128MFA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 16BIT 128KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 31
Supplier Device Package: 48-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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| MC13191FCR2 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM>1GHZ 32VFQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI
RF Family/Standard: General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC RF TXRX ISM>1GHZ 32VFQFN
DigiKey Programmable: Not Verified
Part Status: Obsolete
Serial Interfaces: SPI
RF Family/Standard: General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| 13192DSK-A00 |
|
Виробник: NXP USA Inc.
Description: KIT DEV STARTERS FOR MC13191,192
Description: KIT DEV STARTERS FOR MC13191,192
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| 13192RFC-A00 |
|
Виробник: NXP USA Inc.
Description: BOARD DAUGHTER FOR MC13192
Description: BOARD DAUGHTER FOR MC13192
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| MC33897D |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Part Status: Obsolete
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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| MPC852TVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1896.34 грн |
| 10+ | 1472.76 грн |
| MPC852TCVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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| MPC852TCVR66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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| MPC870CZT66 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC852TCZT80A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
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В кошику
од. на суму грн.
| MPC852TCVR100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC859DSLCZP50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC859DSLZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
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В кошику
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| MPC852TCZT100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC859DSLCZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
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В кошику
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| MPC880CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
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В кошику
од. на суму грн.
| MPC885ZP80 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Description: IC MPU MPC8XX 80MHZ 357BGA
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В кошику
од. на суму грн.
| MPC859TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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В кошику
од. на суму грн.
| MPC885CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
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В кошику
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| MPC859TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Description: IC MPU MPC8XX 100MHZ 357BGA
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В кошику
од. на суму грн.
| MPC860DEZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC860DTZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
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В кошику
од. на суму грн.
| MPC860ENZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC860DPZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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В кошику
од. на суму грн.
| MPC860TZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC860DEZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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В кошику
од. на суму грн.
| MPC866TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC860TZQ66D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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В кошику
од. на суму грн.
| MPC866TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
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В кошику
од. на суму грн.
| MPC860ENZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Description: IC MPU MPC8XX 80MHZ 357BGA
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: 0°C ~ 95°C (TA)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
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В кошику
од. на суму грн.
| MPC866PCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU MPC8XX 100MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 100°C (TA)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC100ES6011D |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
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| MC100ES6130DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Frequency - Max: 2.5 GHz
Supplier Device Package: 16-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:4
Voltage - Supply: 2.375V ~ 3.8V
Operating Temperature: -40°C ~ 85°C
Input: HSTL, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: LVPECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Frequency - Max: 2.5 GHz
Supplier Device Package: 16-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 2:4
Voltage - Supply: 2.375V ~ 3.8V
Operating Temperature: -40°C ~ 85°C
Input: HSTL, LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Output: LVPECL
Mounting Type: Surface Mount
Number of Circuits: 1
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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| MC100ES6139DT |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GENERATOR 20TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 20-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 3.135V ~ 3.8V
Operating Temperature: -40°C ~ 85°C
Input: ECL, HSTL, LVDS, PECL
Type: Clock Generator
Frequency - Max: 1GHz
Output: ECL
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC CLOCK GENERATOR 20TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes
Supplier Device Package: 20-TSSOP
Differential - Input:Output: Yes/Yes
Ratio - Input:Output: 1:4
Voltage - Supply: 3.135V ~ 3.8V
Operating Temperature: -40°C ~ 85°C
Input: ECL, HSTL, LVDS, PECL
Type: Clock Generator
Frequency - Max: 1GHz
Output: ECL
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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| MC100ES6535DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
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| MPC9229AC |
|
Виробник: NXP USA Inc.
Description: IC CLK/FREQ SYNTH 32LQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:1
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: Crystal
Type: Clock/Frequency Synthesizer, Clock Generator
Frequency - Max: 400MHz
Output: LVPECL
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC CLK/FREQ SYNTH 32LQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:1
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: 0°C ~ 70°C
Input: Crystal
Type: Clock/Frequency Synthesizer, Clock Generator
Frequency - Max: 400MHz
Output: LVPECL
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MPC9230AC |
|
Виробник: NXP USA Inc.
Description: IC CLK/FREQ SYNTH 32LQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Obsolete
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:1
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: Crystal
Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
Frequency - Max: 750MHz
Output: LVPECL
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC CLK/FREQ SYNTH 32LQFP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Obsolete
Divider/Multiplier: Yes/No
PLL: Yes with Bypass
Supplier Device Package: 32-LQFP (7x7)
Differential - Input:Output: No/Yes
Ratio - Input:Output: 1:1
Voltage - Supply: 3.135V ~ 3.465V
Operating Temperature: -40°C ~ 85°C
Input: Crystal
Type: Clock/Frequency Synthesizer, Clock Generator, Multiplexer
Frequency - Max: 750MHz
Output: LVPECL
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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| MPC9315AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR/DVR 32-LQFP
Description: IC PLL CLK GENERATOR/DVR 32-LQFP
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| MPC9330AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
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| MPC9331AC |
|
Виробник: NXP USA Inc.
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
Description: IC PLL CLK GENERATOR 1:6 32-LQFP
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