Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35748) > Сторінка 9 з 596
| Фото | Назва | Виробник | Інформація |
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MPC603RZT200LC | NXP USA Inc. |
 Description: IC MPU MPC6XX 200MHZ 255BGAPackaging: Tray Package / Case: 255-BBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 255-PBGA (23x23) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC7410RX500LE | NXP USA Inc. |
Description: IC MPU MPC74XX 500MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MPC745BPX350LE | NXP USA Inc. |
Description: IC MPU MPC7XX 350MHZ 255FCBGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MPC755BPX300LE | NXP USA Inc. |
Description: IC MPU MPC7XX 300MHZ 360FCPBGA Packaging: Tray Package / Case: 360-BBGA, FCBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 360-FCPBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC755BRX300LE | NXP USA Inc. |
Description: IC MPU MPC7XX 300MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC755CRX400LE | NXP USA Inc. |
Description: IC MPU MPC7XX 400MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8241LZQ166D | NXP USA Inc. |
Description: IC MPU MPC82XX 166MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8245ARZU400D | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 85°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8245TZU266D | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 352TBGA Packaging: Tray Package / Case: 352-LBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC 603e Voltage - I/O: 3.3V Supplier Device Package: 352-TBGA (35x35) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Additional Interfaces: I2C, I²O, PCI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8250AZUMHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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mpc8250azupibc | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8255AZUMHBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8270ZUUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC866PZP133A | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC905DR2 | NXP USA Inc. |
Description: IC CLK BUFFER 1:6 100MHZ 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVCMOS Type: Fanout Buffer (Distribution) Input: TTL, Crystal Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3V ~ 3.6V Ratio - Input:Output: 1:6 Differential - Input:Output: Yes/No Supplier Device Package: 16-SOIC Part Status: Obsolete Frequency - Max: 100 MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9331FAR2 | NXP USA Inc. |
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9449FAR2 | NXP USA Inc. |
Description: IC CLK BUFFER 3:15 200MHZ 52TQFP Packaging: Tape & Reel (TR) Package / Case: 52-LQFP Number of Circuits: 1 Mounting Type: Surface Mount Output: LVCMOS Type: Fanout Buffer (Distribution), Divider, Multiplexer Input: LVCMOS, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.465V Ratio - Input:Output: 3:15 Differential - Input:Output: Yes/No Supplier Device Package: 52-TQFP (10x10) Frequency - Max: 200 MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9772FAR2 | NXP USA Inc. |
Description: IC CLOCK GENERATOR 52TQFP Packaging: Tape & Reel (TR) Package / Case: 52-LQFP Mounting Type: Surface Mount Output: LVCMOS Frequency - Max: 240MHz Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer Input: LVCMOS, Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.465V Ratio - Input:Output: 3:12 Differential - Input:Output: No/No Supplier Device Package: 52-TQFP (10x10) PLL: Yes with Bypass Divider/Multiplier: Yes/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX12DP | NXP USA Inc. |
Description: SENSOR DIFF PRESS 1.45 PSI MAX |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX2100DP | NXP USA Inc. |
Description: SENSOR 14.5PSID 0.19" .04V Packaging: Tray Features: Temperature Compensated Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 14.5PSI (100kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube, Dual Applications: Board Mount Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Last Time Buy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX2100GP | NXP USA Inc. |
Description: SENSOR 14.5PSIG 0.19" .04V Packaging: Tray Features: Temperature Compensated Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 14.5PSI (100kPa) Pressure Type: Vented Gauge Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX2200D | NXP USA Inc. |
Description: SENSOR 29.01PSID .04V Features: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Differential Accuracy: ±0.25% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 116.03PSI (800kPa) Part Status: Active |
на замовлення 70 шт: термін постачання 21-31 дні (днів) |
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MPX4100A | NXP USA Inc. |
Description: SENSOR 15.23PSIA 4.9V Features: Temperature Compensated Packaging: Tray Package / Case: 6-SIP Module Output Type: Analog Voltage Mounting Type: Through Hole Output: 0.3 V ~ 4.9 V Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa) Pressure Type: Absolute Accuracy: ±1.8% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 4.85V ~ 5.35V Applications: Board Mount Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPX53GP | NXP USA Inc. |
Description: SENSOR 7.25PSIG 0.19" .06V Packaging: Bulk Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 60 mV (3V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: -0.6% ~ 0.4% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 3V ~ 6V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 25.38PSI (175kPa) |
на замовлення 1100 шт: термін постачання 21-31 дні (днів) |
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MPXH6115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.7V 8SSOP Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| USBMULTILINK08 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HC08 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| USBMULTILINK12 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HC(S)12 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| USBMULTILINKS08 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HCS08 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC14489BDWR2 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Obsolete Current - Supply: 5.5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC145483DWR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33287DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Applications: Contact Monitor Current - Supply: 55µA Supplier Device Package: 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33289DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL H-SIDE 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33290DR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 8SOIC Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 8V ~ 18V Supplier Device Package: 8-SOIC Part Status: Obsolete Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33389DDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Cut Tape (CT) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33390DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33493DTBR2 | NXP USA Inc. |
Description: RF TX IC FSK 315-434MHZ 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: -3dBm Applications: General Data Transfer Data Rate (Max): 10kbps Current - Transmitting: 11.6mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 14-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33793DR2 | NXP USA Inc. |
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33989DWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC34129DR2 | NXP USA Inc. |
Description: IC CURRENT MODE CTRLR 14-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC88915FN55R2 | NXP USA Inc. |
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908AZ60AVFUR2 | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Cut Tape (CT) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908GP32CFBR2 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC17511AEPR2 | NXP USA Inc. |
 Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC17531AEVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP Packaging: Cut Tape (CT) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 3.6V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 2V ~ 8.6V Supplier Device Package: 20-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC9331FAR2 | NXP USA Inc. |
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPXH6115A6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSIA 4.7V 8SSOP Packaging: Cut Tape (CT) Features: Temperature Compensated Package / Case: 8-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.7 V Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa) Pressure Type: Absolute Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SSOP Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) Part Status: Active |
на замовлення 1090 шт: термін постачання 21-31 дні (днів) |
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| DEMO9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| EVB9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC9S12NE64VTU | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80TQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S12NE64CPV | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC17C724EPR2 | NXP USA Inc. |
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 400mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.5V Applications: Camera Technology: Power MOSFET Voltage - Load: 2.7V ~ 5.5V Supplier Device Package: 16-QFN (3x3) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S12C128MFA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC13191FCR2") |
MC13191FCR2 | NXP USA Inc. |
Description: IC RF TXRX ISM>1GHZ 32VFQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 4dBm Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 32-HVQFN (5x5) GPIO: 7 Modulation: DSSS, O-QPSK RF Family/Standard: General ISM > 1GHz Serial Interfaces: SPI Part Status: Obsolete DigiKey Programmable: Not Verified |
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| 13192DSK-A00 | NXP USA Inc. |
Description: KIT DEV STARTERS FOR MC13191,192 |
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В кошику од. на суму грн. | |||||||||||||||
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13192RFC-A00 | NXP USA Inc. |
Description: BOARD DAUGHTER FOR MC13192 |
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В кошику од. на суму грн. | ||||||||||||||
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MC33897D | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Obsolete |
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В кошику од. на суму грн. | ||||||||||||||
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MPC852TVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MPC852TCVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
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В кошику од. на суму грн. | ||||||||||||||
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MPC852TCVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
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В кошику од. на суму грн. | ||||||||||||||
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MPC870CZT66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
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В кошику од. на суму грн. |
| MPC603RZT200LC |
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Виробник: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255BGA
Packaging: Tray
Package / Case: 255-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-PBGA (23x23)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC6XX 200MHZ 255BGA
Packaging: Tray
Package / Case: 255-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 255-PBGA (23x23)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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| MPC7410RX500LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
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В кошику
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| MPC745BPX350LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC7XX 350MHZ 255FCBGA
Description: IC MPU MPC7XX 350MHZ 255FCBGA
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| MPC755BPX300LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC7XX 300MHZ 360FCPBGA
Packaging: Tray
Package / Case: 360-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-FCPBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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| MPC755BRX300LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC7XX 300MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC7XX 300MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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| MPC755CRX400LE |
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Виробник: NXP USA Inc.
Description: IC MPU MPC7XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU MPC7XX 400MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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В кошику
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| MPC8241LZQ166D |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Description: IC MPU MPC82XX 166MHZ 357BGA
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В кошику
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| MPC8245ARZU400D |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 400MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 85°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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| MPC8245TZU266D |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
Description: IC MPU MPC82XX 266MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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В кошику
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| MPC8250AZUMHBC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
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| mpc8250azupibc |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
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В кошику
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| MPC8255AZUMHBB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| MPC8270ZUUPEA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Description: IC MPU MPC82XX 450MHZ 480TBGA
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В кошику
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| MPC866PZP133A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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| MPC905DR2 |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 1:6 100MHZ 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution)
Input: TTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:6
Differential - Input:Output: Yes/No
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Frequency - Max: 100 MHz
Description: IC CLK BUFFER 1:6 100MHZ 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution)
Input: TTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:6
Differential - Input:Output: Yes/No
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Frequency - Max: 100 MHz
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| MPC9331FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
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| MPC9449FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 3:15 200MHZ 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 3:15
Differential - Input:Output: Yes/No
Supplier Device Package: 52-TQFP (10x10)
Frequency - Max: 200 MHz
Description: IC CLK BUFFER 3:15 200MHZ 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVCMOS
Type: Fanout Buffer (Distribution), Divider, Multiplexer
Input: LVCMOS, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 3:15
Differential - Input:Output: Yes/No
Supplier Device Package: 52-TQFP (10x10)
Frequency - Max: 200 MHz
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| MPC9772FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GENERATOR 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 240MHz
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 3:12
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK GENERATOR 52TQFP
Packaging: Tape & Reel (TR)
Package / Case: 52-LQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 240MHz
Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 3:12
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MPX12DP |
|
Виробник: NXP USA Inc.
Description: SENSOR DIFF PRESS 1.45 PSI MAX
Description: SENSOR DIFF PRESS 1.45 PSI MAX
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| MPX2100DP |
|
Виробник: NXP USA Inc.
Description: SENSOR 14.5PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Last Time Buy
Description: SENSOR 14.5PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Last Time Buy
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| MPX2100GP |
|
Виробник: NXP USA Inc.
Description: SENSOR 14.5PSIG 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
Description: SENSOR 14.5PSIG 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 14.5PSI (100kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Obsolete
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| MPX2200D |
|
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSID .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Accuracy: ±0.25%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 116.03PSI (800kPa)
Part Status: Active
Description: SENSOR 29.01PSID .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Differential
Accuracy: ±0.25%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 116.03PSI (800kPa)
Part Status: Active
на замовлення 70 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1034.44 грн |
| 5+ | 962.03 грн |
| MPX4100A |
|
Виробник: NXP USA Inc.
Description: SENSOR 15.23PSIA 4.9V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 15.23PSIA 4.9V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 6-SIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.9 V
Operating Pressure: 2.9PSI ~ 15.23PSI (20kPa ~ 105kPa)
Pressure Type: Absolute
Accuracy: ±1.8%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 4.85V ~ 5.35V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
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| MPX53GP |
|
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
на замовлення 1100 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1143.20 грн |
| 10+ | 871.13 грн |
| 25+ | 825.28 грн |
| 100+ | 666.91 грн |
| 500+ | 623.88 грн |
| 1000+ | 591.61 грн |
| MPXH6115A6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
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| USBMULTILINK08 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC08 USB
Description: PROGRAMMER MULTILINK HC08 USB
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| USBMULTILINK12 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC(S)12 USB
Description: PROGRAMMER MULTILINK HC(S)12 USB
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| USBMULTILINKS08 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HCS08 USB
Description: PROGRAMMER MULTILINK HCS08 USB
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| MC14489BDWR2 |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
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| MC145483DWR2 |
|
Виробник: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SOIC
Description: IC CODEC-FILTER PCM 3V 20-SOIC
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| MC33287DWR2 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
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| MC33289DWR2 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH DUAL H-SIDE 20-SOIC
Description: IC SWITCH DUAL H-SIDE 20-SOIC
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| MC33290DR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Part Status: Obsolete
Grade: Automotive
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| MC33389DDWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
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| MC33390DR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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| MC33493DTBR2 |
|
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MC33793DR2 |
|
Виробник: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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| MC33989DWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
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| MC34129DR2 |
|
Виробник: NXP USA Inc.
Description: IC CURRENT MODE CTRLR 14-SOIC
Description: IC CURRENT MODE CTRLR 14-SOIC
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| MC88915FN55R2 |
|
Виробник: NXP USA Inc.
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
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| MC908AZ60AVFUR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
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| MC908GP32CFBR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Description: IC MCU 8BIT 32KB FLASH 44QFP
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| MPC17511AEPR2 | |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
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| MPC17531AEVEL |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MPC9331FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
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| MPXH6115A6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
Description: SENSOR 16.68PSIA 4.7V 8SSOP
Packaging: Cut Tape (CT)
Features: Temperature Compensated
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.7 V
Operating Pressure: 2.18PSI ~ 16.68PSI (15kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SSOP
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Part Status: Active
на замовлення 1090 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1070.17 грн |
| 5+ | 936.96 грн |
| 10+ | 902.02 грн |
| 25+ | 807.38 грн |
| 50+ | 780.59 грн |
| 100+ | 756.03 грн |
| 500+ | 694.97 грн |
| DEMO9S12NE64 | |
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| EVB9S12NE64 |
|
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| MC9S12NE64VTU |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80TQFP
Description: IC MCU 16BIT 64KB FLASH 80TQFP
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| MC9S12NE64CPV | |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Description: IC MCU 16BIT 64KB FLASH 112LQFP
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| MPC17C724EPR2 |
|
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MC9S12C128MFA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MC13191FCR2 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| 13192DSK-A00 |
|
Виробник: NXP USA Inc.
Description: KIT DEV STARTERS FOR MC13191,192
Description: KIT DEV STARTERS FOR MC13191,192
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| 13192RFC-A00 |
|
Виробник: NXP USA Inc.
Description: BOARD DAUGHTER FOR MC13192
Description: BOARD DAUGHTER FOR MC13192
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| MC33897D |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
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| MPC852TVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2046.65 грн |
| 10+ | 1589.52 грн |
| MPC852TCVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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од. на суму грн.
| MPC852TCVR66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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| MPC870CZT66 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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