Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36200) > Сторінка 9 з 604
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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MPX53GP | NXP USA Inc. |
 Description: SENSOR 7.25PSIG 0.19" .06VPackaging: Bulk Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 60 mV (3V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Vented Gauge Accuracy: -0.6% ~ 0.4% Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 3V ~ 6V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 25.38PSI (175kPa) |
на замовлення 1100 шт: термін постачання 21-31 дні (днів) |
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| USBMULTILINK08 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HC08 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| USBMULTILINK12 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HC(S)12 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| USBMULTILINKS08 | NXP USA Inc. | Description: PROGRAMMER MULTILINK HCS08 USB |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC14489BDWR2 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Obsolete Current - Supply: 5.5 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC145483DWR2 | NXP USA Inc. |
Description: IC CODEC-FILTER PCM 3V 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33287DWR2 | NXP USA Inc. |
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC Packaging: Cut Tape (CT) Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 7V ~ 18V Applications: Contact Monitor Current - Supply: 55µA Supplier Device Package: 20-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33389DDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Cut Tape (CT) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Applications: Automotive Supplier Device Package: 28-SOIC Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33390DR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33493DTBR2 | NXP USA Inc. |
Description: RF TX IC FSK 315-434MHZ 14TSSOP Packaging: Cut Tape (CT) Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: -3dBm Applications: General Data Transfer Data Rate (Max): 10kbps Current - Transmitting: 11.6mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 14-TSSOP Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33793DR2 | NXP USA Inc. |
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Logic Mounting Type: Surface Mount Type: Distributed Systems Interface Operating Temperature: -40°C ~ 150°C Input Type: Logic Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33989DWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC34129DR2 | NXP USA Inc. |
Description: IC CURRENT MODE CTRLR 14-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC88915FN55R2 | NXP USA Inc. |
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC908AZ60AVFUR2 | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Cut Tape (CT) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC908GP32CFBR2 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC17511AEPR2 | NXP USA Inc. |
 Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC17531AEVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP Packaging: Cut Tape (CT) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 3.6V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 2V ~ 8.6V Supplier Device Package: 20-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC9331FAR2 | NXP USA Inc. |
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| DEMO9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| EVB9S12NE64 | NXP USA Inc. |
Description: MC9S12NE64 EVAL BRD |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC9S12NE64VTU | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80TQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S12NE64CPV | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 112LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC17C724EPR2 | NXP USA Inc. |
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 400mA Interface: Parallel Operating Temperature: -20°C ~ 150°C (TJ) Output Configuration: Half Bridge (4) Voltage - Supply: 2.7V ~ 5.5V Applications: Camera Technology: Power MOSFET Voltage - Load: 2.7V ~ 5.5V Supplier Device Package: 16-QFN (3x3) Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC9S12C128MFA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 128KB (128K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HCS12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
%20Renders/768_32-VQFN%20Exposed%20Pad.jpg "MC13191FCR2") |
MC13191FCR2 | NXP USA Inc. |
Description: IC RF TXRX ISM>1GHZ 32VFQFN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -92dBm Mounting Type: Surface Mount Frequency: 2.4GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2V ~ 3.4V Power - Output: 4dBm Current - Receiving: 37mA Data Rate (Max): 250kbps Current - Transmitting: 30mA Supplier Device Package: 32-HVQFN (5x5) GPIO: 7 Modulation: DSSS, O-QPSK RF Family/Standard: General ISM > 1GHz Serial Interfaces: SPI Part Status: Obsolete DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| 13192DSK-A00 | NXP USA Inc. |
Description: KIT DEV STARTERS FOR MC13191,192 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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13192RFC-A00 | NXP USA Inc. |
Description: BOARD DAUGHTER FOR MC13192 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33897D | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC852TVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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MPC852TCVR50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC852TCVR66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC870CZT66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC852TCZT80A | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC852TCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC859DSLCZP50A | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC859DSLZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC852TCZT100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC859DSLCZP66A | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC880CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC885ZP80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC859TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC885CZP133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC859TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860DEZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860DTZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860ENZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860DPZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860TZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860DEZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC866TZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC860TZQ66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC866TCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
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MPC860ENZQ80D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
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В кошику од. на суму грн. | ||||||||||||
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MPC866PCZP100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
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MC100ES6011D | NXP USA Inc. |
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC |
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 |
MC100ES6130DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Multiplexer Input: HSTL, LVPECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.375V ~ 3.8V Ratio - Input:Output: 2:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 16-TSSOP Frequency - Max: 2.5 GHz |
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.jpg "MC100ES6139DT") |
MC100ES6139DT | NXP USA Inc. |
Description: IC CLOCK GENERATOR 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Output: ECL Frequency - Max: 1GHz Type: Clock Generator Input: ECL, HSTL, LVDS, PECL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.8V Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/Yes Supplier Device Package: 20-TSSOP PLL: Yes Divider/Multiplier: Yes/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
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 |
MC100ES6535DT | NXP USA Inc. |
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP Packaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Number of Circuits: 1 Mounting Type: Surface Mount Output: LVPECL Type: Fanout Buffer (Distribution), Multiplexer Input: LVCMOS, LVTTL Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3.135V ~ 3.8V Ratio - Input:Output: 2:4 Differential - Input:Output: No/Yes Supplier Device Package: 20-TSSOP Part Status: Obsolete Frequency - Max: 1 GHz |
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MPC9229AC | NXP USA Inc. |
Description: IC CLK/FREQ SYNTH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Output: LVPECL Frequency - Max: 400MHz Type: Clock/Frequency Synthesizer, Clock Generator Input: Crystal Operating Temperature: 0°C ~ 70°C Voltage - Supply: 3.135V ~ 3.465V Ratio - Input:Output: 1:1 Differential - Input:Output: No/Yes Supplier Device Package: 32-LQFP (7x7) PLL: Yes with Bypass Divider/Multiplier: Yes/No Number of Circuits: 1 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. |
| MPX53GP |
|
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
Description: SENSOR 7.25PSIG 0.19" .06V
Packaging: Bulk
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 60 mV (3V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Vented Gauge
Accuracy: -0.6% ~ 0.4%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 25.38PSI (175kPa)
на замовлення 1100 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1132.09 грн |
| 10+ | 862.67 грн |
| 25+ | 817.26 грн |
| 100+ | 660.43 грн |
| 500+ | 617.82 грн |
| 1000+ | 585.86 грн |
| USBMULTILINK08 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC08 USB
Description: PROGRAMMER MULTILINK HC08 USB
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| USBMULTILINK12 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HC(S)12 USB
Description: PROGRAMMER MULTILINK HC(S)12 USB
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| USBMULTILINKS08 |
Виробник: NXP USA Inc.
Description: PROGRAMMER MULTILINK HCS08 USB
Description: PROGRAMMER MULTILINK HCS08 USB
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| MC14489BDWR2 |
|
Виробник: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Current - Supply: 5.5 mA
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| MC145483DWR2 |
|
Виробник: NXP USA Inc.
Description: IC CODEC-FILTER PCM 3V 20-SOIC
Description: IC CODEC-FILTER PCM 3V 20-SOIC
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| MC33287DWR2 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
Description: IC SWITCH DUAL LOW-SIDE 20-SOIC
Packaging: Cut Tape (CT)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 7V ~ 18V
Applications: Contact Monitor
Current - Supply: 55µA
Supplier Device Package: 20-SOIC
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| MC33389DDWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Cut Tape (CT)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Applications: Automotive
Supplier Device Package: 28-SOIC
Part Status: Obsolete
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| MC33390DR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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| MC33493DTBR2 |
|
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MC33793DR2 |
|
Виробник: NXP USA Inc.
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC DSI SLAVE FOR R-SENSE 16-SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Distributed Systems Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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| MC33989DWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Description: IC INTERFACE SPECIALIZED 28SOIC
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| MC34129DR2 |
|
Виробник: NXP USA Inc.
Description: IC CURRENT MODE CTRLR 14-SOIC
Description: IC CURRENT MODE CTRLR 14-SOIC
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| MC88915FN55R2 |
|
Виробник: NXP USA Inc.
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
Description: IC DRIVER CLK PLL 55MHZ 28-PLCC
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| MC908AZ60AVFUR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
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| MC908GP32CFBR2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Description: IC MCU 8BIT 32KB FLASH 44QFP
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| MPC17511AEPR2 | |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
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| MPC17531AEVEL |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.7-3.6V 20VMFP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 2V ~ 8.6V
Supplier Device Package: 20-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MPC9331FAR2 |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
Description: IC CLOCK GEN 1:6 PLL LV 32-LQFP
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| DEMO9S12NE64 | |
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| EVB9S12NE64 |
|
Виробник: NXP USA Inc.
Description: MC9S12NE64 EVAL BRD
Description: MC9S12NE64 EVAL BRD
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| MC9S12NE64VTU |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80TQFP
Description: IC MCU 16BIT 64KB FLASH 80TQFP
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| MC9S12NE64CPV | |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Description: IC MCU 16BIT 64KB FLASH 112LQFP
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| MPC17C724EPR2 |
|
Виробник: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 400mA
Interface: Parallel
Operating Temperature: -20°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Camera
Technology: Power MOSFET
Voltage - Load: 2.7V ~ 5.5V
Supplier Device Package: 16-QFN (3x3)
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| MC9S12C128MFA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
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| MC13191FCR2 |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC RF TXRX ISM>1GHZ 32VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| 13192DSK-A00 |
|
Виробник: NXP USA Inc.
Description: KIT DEV STARTERS FOR MC13191,192
Description: KIT DEV STARTERS FOR MC13191,192
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| 13192RFC-A00 |
|
Виробник: NXP USA Inc.
Description: BOARD DAUGHTER FOR MC13192
Description: BOARD DAUGHTER FOR MC13192
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| MC33897D |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
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| MPC852TVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1897.83 грн |
| 10+ | 1473.92 грн |
| MPC852TCVR50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCVR66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC870CZT66 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCZT80A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCVR100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLCZP50A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC852TCZT100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC859DSLCZP66A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC880CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC885ZP80 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Description: IC MPU MPC8XX 80MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC859TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC885CZP133 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC859TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Description: IC MPU MPC8XX 100MHZ 357BGA
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DEZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DTZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| MPC860ENZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DPZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860TZQ50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860DEZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC866TZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC860TZQ66D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| MPC866TCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC860ENZQ80D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC866PCZP100A |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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| MC100ES6011D |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
Description: IC CLK BUFFER 1:2 3GHZ 8SOIC
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| MC100ES6130DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: HSTL, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-TSSOP
Frequency - Max: 2.5 GHz
Description: IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: HSTL, LVPECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 16-TSSOP
Frequency - Max: 2.5 GHz
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| MC100ES6139DT |
|
Виробник: NXP USA Inc.
Description: IC CLOCK GENERATOR 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: ECL
Frequency - Max: 1GHz
Type: Clock Generator
Input: ECL, HSTL, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLOCK GENERATOR 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: ECL
Frequency - Max: 1GHz
Type: Clock Generator
Input: ECL, HSTL, LVDS, PECL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 20-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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| MC100ES6535DT |
|
Виробник: NXP USA Inc.
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
Description: IC CLK BUFFER 2:4 1GHZ 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Number of Circuits: 1
Mounting Type: Surface Mount
Output: LVPECL
Type: Fanout Buffer (Distribution), Multiplexer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.135V ~ 3.8V
Ratio - Input:Output: 2:4
Differential - Input:Output: No/Yes
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Frequency - Max: 1 GHz
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| MPC9229AC |
|
Виробник: NXP USA Inc.
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 400MHz
Type: Clock/Frequency Synthesizer, Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC CLK/FREQ SYNTH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Output: LVPECL
Frequency - Max: 400MHz
Type: Clock/Frequency Synthesizer, Clock Generator
Input: Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/Yes
Supplier Device Package: 32-LQFP (7x7)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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