Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36393) > Сторінка 110 з 607
| Фото | Назва | Виробник | Інформація |
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MC7448VS1000LD | NXP USA Inc. |
 Description: IC MPU MPC74XX 1.0GHZ 360FCCLGAPackaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
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MC7448THX1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray |
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MC7448THX1267ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.267GHZ 360BGA Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 1.267GHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray |
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MC7448HX600ND | NXP USA Inc. |
Description: IC MPU MPC74XX 600MHZ 360FCCBGA Speed: 600MHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) |
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MC7448VS1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
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MC7448VU1250ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
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MC7448VU1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
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MC7448VS600ND | NXP USA Inc. |
Description: IC MPU MPC74XX 600MHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
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MCZ33198EFR2 | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOIC DigiKey Programmable: Not Verified Part Status: Obsolete Logic Voltage - VIL, VIH: 1.5V, 3.5V Gate Type: MOSFET (N-Channel) Number of Drivers: 1 Driven Configuration: High-Side Channel Type: Single Rise / Fall Time (Typ): 10µs, 280µs Supplier Device Package: 8-SOIC Input Type: Non-Inverting Voltage - Supply: 7V ~ 20V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
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MCZ33198EF | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOIC DigiKey Programmable: Not Verified Part Status: Obsolete Logic Voltage - VIL, VIH: 1.5V, 3.5V Gate Type: MOSFET (N-Channel) Number of Drivers: 1 Driven Configuration: High-Side Channel Type: Single Rise / Fall Time (Typ): 10µs, 280µs Supplier Device Package: 8-SOIC Input Type: Non-Inverting Voltage - Supply: 7V ~ 20V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tube |
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| 13192DSK-BDM-A0E | NXP USA Inc. |
Description: KIT DEV STARTER |
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MCZ145012EGR2 | NXP USA Inc. |
Description: IC SMOKE DETECT PHOTOELEC 16SOIC |
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MCZ3334EFR2 | NXP USA Inc. |
Description: IC IGNITION HI ENERGY 8-SOIC Grade: Automotive Supplier Device Package: 8-SOIC Voltage - Supply: 4V ~ 24V Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
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MCZ33897AEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Duplex: Half Receiver Hysteresis: 500 mV Supplier Device Package: 14-SOIC Protocol: CANbus Data Rate: 83.33Kbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
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MCZ79076EG | NXP USA Inc. |
Description: IC ELEC IGNITION CTL CIRC 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Electrical Ignition Control Circuit Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
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MCZ79076EGR2 | NXP USA Inc. |
Description: IC ELEC IGNITION CTL CIRC 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Electrical Ignition Control Circuit Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
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MCZ33897EFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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MCZ33897BEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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MCZ33897CEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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MCZ33897CEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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MCZ33897BEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Duplex: Half Receiver Hysteresis: 500 mV Supplier Device Package: 8-SOIC Protocol: CANbus Data Rate: 83.33Kbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
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MCIMX31VKN5B | NXP USA Inc. |
Description: IC MPU I.MX31 532MHZ 457MAPBGA |
товару немає в наявності |
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MC9RS08KA2CSCR | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOIC DigiKey Programmable: Verified Number of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, WDT Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V Core Size: 8-Bit Core Processor: RS08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 63 x 8 Program Memory Size: 2KB (2K x 8) Speed: 10MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
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MC9S08QD4MSC | NXP USA Inc. |
 Description: IC MCU 8BIT 4KB FLASH 8SOICNumber of I/O: 4 Part Status: Active Supplier Device Package: 8-SOIC Peripherals: LVD, POR, PWM, WDT Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 256 x 8 Program Memory Size: 4KB (4K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) DigiKey Programmable: Verified Packaging: Tube |
на замовлення 158 шт: термін постачання 21-31 дні (днів) |
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MC9S08QG4CFFER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16QFN Packaging: Tape & Reel (TR) Package / Case: 16-VQFN Exposed Pad Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-QFN-EP (5x5) Part Status: Active Number of I/O: 12 DigiKey Programmable: Not Verified |
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MC9S08QG4CDTER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Verified |
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MC9S08QD4CSCR | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Part Status: Active Number of I/O: 4 DigiKey Programmable: Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MC9S08GB60ACFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Part Status: Not For New Designs Number of I/O: 56 DigiKey Programmable: Not Verified |
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MC9S08AW60CFGER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 44LQFP Packaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Part Status: Active Number of I/O: 34 DigiKey Programmable: Not Verified |
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MC9S12B256CPVE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 112LQFP |
товару немає в наявності |
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MCHC908QT2MDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MCHC908QT1CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO Mounting Type: Surface Mount Package / Case: 8-SOIC (0.209", 5.30mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 5 Supplier Device Package: 8-SO Peripherals: LVD, POR, PWM Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 128 x 8 Program Memory Size: 1.5KB (1.5K x 8) Speed: 8MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MCF5270CVM150R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGA DigiKey Programmable: Not Verified Number of I/O: 97 Supplier Device Package: 196-LBGA (15x15) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V2 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Speed: 150MHz Mounting Type: Surface Mount Package / Case: 196-LBGA Packaging: Tape & Reel (TR) |
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MC9S12C32VFUE25 | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 80QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MC9S12DT256VFUE | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MC7448HX1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Operating Temperature: 0°C ~ 105°C (TA) Speed: 1.4GHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray Graphics Acceleration: No Co-Processors/DSP: Multimedia; SIMD Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-FCCBGA (25x25) Voltage - I/O: 1.5V, 1.8V, 2.5V Core Processor: PowerPC G4 |
товару немає в наявності |
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MC33887DWBR2 | NXP USA Inc. |
Description: IC MOTOR DRIVER 5V-28V 54SOIC Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tape & Reel (TR) Part Status: Obsolete Motor Type - AC, DC: Brushed DC Supplier Device Package: 54-SOIC Voltage - Load: 5V ~ 28V Technology: Power MOSFET Applications: General Purpose Voltage - Supply: 5V ~ 28V Output Configuration: Half Bridge (2) Operating Temperature: -40°C ~ 150°C (TJ) Interface: Parallel Current - Output: 5A |
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MC68EN360ZQ25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Additional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
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MC68EN360ZQ25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA |
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MC68HC11D0CFBE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 44QFP DigiKey Programmable: Not Verified Number of I/O: 26 Supplier Device Package: 44-QFP (10x10) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Core Processor: HC11 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Speed: 3MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
товару немає в наявності |
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MC68711E20VFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
товару немає в наявності |
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MC68711E20MFNE3R | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
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MC68711E20MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
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MC68HC705SR3PE | NXP USA Inc. |
Description: IC MCU 8BIT 3.75KB OTP 40DIP DigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 40-PDIP Peripherals: LED, POR Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC05 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) RAM Size: 192 x 8 Program Memory Size: 3.75KB (3.75K x 8) Speed: 4MHz Mounting Type: Through Hole Package / Case: 40-DIP (0.600", 15.24mm) Packaging: Tube |
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MC68HC916P1VAA16 | NXP USA Inc. | Description: IC MCU 16BIT 32KB FLASH 80QFP |
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MC68HC916P1CAA16 | NXP USA Inc. | Description: IC MCU 16BIT 32KB FLASH 80QFP |
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MC68HC705SR3CPE | NXP USA Inc. |
Description: IC MCU 8BIT 3.75KB OTP 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 3.75KB (3.75K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: LED, POR Supplier Device Package: 40-PDIP Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||
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MC68HC705C8AVFNE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 24 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||
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MC68HC705C9AFNE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 16KB (16K x 8) RAM Size: 352 x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||
 |
MC68HC705C9ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB OTP 44QFP DigiKey Programmable: Not Verified Number of I/O: 24 Supplier Device Package: 44-QFP (10x10) Peripherals: POR, WDT Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 8-Bit Core Processor: HC05 Program Memory Type: OTP Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 352 x 8 Program Memory Size: 16KB (16K x 8) Speed: 2.1MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
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В кошику од. на суму грн. | ||||||
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MC68711E20MFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 52PLCC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC68711E20CFUE4 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 64QFP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC33993DWBR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC33972DWB | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 3.1V ~ 5.25V Applications: Switch Monitoring Supplier Device Package: 32-SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC44BC380EFR2 | NXP USA Inc. |
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC Frequency: 40 MHz ~ 880 MHz Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC33889BDWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: CAN Voltage - Supply: 5.5V ~ 18V Supplier Device Package: 28-SOIC Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
|
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MC33889BDW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Grade: Automotive Supplier Device Package: 28-SOIC Voltage - Supply: 5.5V ~ 18V Interface: CAN Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
MC33888FBR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHANNEL 64PQFP Features: Watchdog Timer Packaging: Tape & Reel (TR) Package / Case: 64-PowerBQFP Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 12 (4 High Side, 8 Low Side) Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: High Side or Low Side Rds On (Typ): 10mOhm, 40mOhm, 600mOhm Voltage - Load: 6V ~ 27V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Supplier Device Package: 64-PQFP (14x14) Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MC44BC380EF | NXP USA Inc. |
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Frequency: 40 MHz ~ 880 MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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MC68711E20CFUE3 | NXP USA Inc. |
Description: IC MCU 8BIT 20KB OTP 64QFP |
товару немає в наявності |
В кошику од. на суму грн. |
| MC7448VS1000LD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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В кошику
од. на суму грн.
| MC7448THX1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MC7448THX1267ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.267GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.267GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
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В кошику
од. на суму грн.
| MC7448HX600ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
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В кошику
од. на суму грн.
| MC7448VS1000ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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В кошику
од. на суму грн.
| MC7448VU1250ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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В кошику
од. на суму грн.
| MC7448VU1000ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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В кошику
од. на суму грн.
| MC7448VS600ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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В кошику
од. на суму грн.
| MCZ33198EFR2 |
|
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Gate Type: MOSFET (N-Channel)
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Rise / Fall Time (Typ): 10µs, 280µs
Supplier Device Package: 8-SOIC
Input Type: Non-Inverting
Voltage - Supply: 7V ~ 20V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC GATE DRVR HIGH-SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Gate Type: MOSFET (N-Channel)
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Rise / Fall Time (Typ): 10µs, 280µs
Supplier Device Package: 8-SOIC
Input Type: Non-Inverting
Voltage - Supply: 7V ~ 20V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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В кошику
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| MCZ33198EF |
|
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Gate Type: MOSFET (N-Channel)
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Rise / Fall Time (Typ): 10µs, 280µs
Supplier Device Package: 8-SOIC
Input Type: Non-Inverting
Voltage - Supply: 7V ~ 20V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC GATE DRVR HIGH-SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Obsolete
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Gate Type: MOSFET (N-Channel)
Number of Drivers: 1
Driven Configuration: High-Side
Channel Type: Single
Rise / Fall Time (Typ): 10µs, 280µs
Supplier Device Package: 8-SOIC
Input Type: Non-Inverting
Voltage - Supply: 7V ~ 20V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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В кошику
од. на суму грн.
| 13192DSK-BDM-A0E |
|
Виробник: NXP USA Inc.
Description: KIT DEV STARTER
Description: KIT DEV STARTER
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В кошику
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| MCZ145012EGR2 |
|
Виробник: NXP USA Inc.
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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В кошику
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| MCZ3334EFR2 |
Виробник: NXP USA Inc.
Description: IC IGNITION HI ENERGY 8-SOIC
Grade: Automotive
Supplier Device Package: 8-SOIC
Voltage - Supply: 4V ~ 24V
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC IGNITION HI ENERGY 8-SOIC
Grade: Automotive
Supplier Device Package: 8-SOIC
Voltage - Supply: 4V ~ 24V
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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В кошику
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| MCZ33897AEFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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В кошику
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| MCZ79076EG |
|
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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| MCZ79076EGR2 |
|
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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В кошику
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| MCZ33897EFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897BEF |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897CEFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897CEF |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897BEFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 8-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 8-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| MCIMX31VKN5B |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457MAPBGA
Description: IC MPU I.MX31 532MHZ 457MAPBGA
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| MC9RS08KA2CSCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 63 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 2KB FLASH 8SOIC
DigiKey Programmable: Verified
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, WDT
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 8-Bit
Core Processor: RS08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 63 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| MC9S08QD4MSC |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
DigiKey Programmable: Verified
Packaging: Tube
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Number of I/O: 4
Part Status: Active
Supplier Device Package: 8-SOIC
Peripherals: LVD, POR, PWM, WDT
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
DigiKey Programmable: Verified
Packaging: Tube
на замовлення 158 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 231.81 грн |
| 10+ | 167.76 грн |
| 98+ | 138.89 грн |
| MC9S08QG4CFFER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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| MC9S08QG4CDTER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
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| MC9S08QD4CSCR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 124.32 грн |
| 5000+ | 117.38 грн |
| MC9S08GB60ACFUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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| MC9S08AW60CFGER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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| MC9S12B256CPVE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Description: IC MCU 16BIT 256KB FLASH 112LQFP
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| MCHC908QT2MDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Description: IC MCU 8BIT 1.5KB FLASH 8SO
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| MCHC908QT1CDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SO
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 5
Supplier Device Package: 8-SO
Peripherals: LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
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| MCF5270CVM150R2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 97
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 97
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tape & Reel (TR)
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| MC9S12C32VFUE25 |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Description: IC MCU 16BIT 32KB FLASH 80QFP
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| MC9S12DT256VFUE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Description: IC MCU 16BIT 256KB FLASH 80QFP
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| MC7448HX1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
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| MC33887DWBR2 |
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 54SOIC
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 54-SOIC
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
Description: IC MOTOR DRIVER 5V-28V 54SOIC
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Motor Type - AC, DC: Brushed DC
Supplier Device Package: 54-SOIC
Voltage - Load: 5V ~ 28V
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 5V ~ 28V
Output Configuration: Half Bridge (2)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 5A
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| MC68EN360ZQ25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MC68EN360ZQ25L |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Description: IC MPU M683XX 25MHZ 357BGA
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| MC68HC11D0CFBE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT ROMLESS 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 26
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC11
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
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| MC68711E20VFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
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| MC68711E20MFNE3R |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
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| MC68711E20MFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
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| MC68HC705SR3PE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 3.75KB OTP 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-PDIP
Peripherals: LED, POR
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 192 x 8
Program Memory Size: 3.75KB (3.75K x 8)
Speed: 4MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
Description: IC MCU 8BIT 3.75KB OTP 40DIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 40-PDIP
Peripherals: LED, POR
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 192 x 8
Program Memory Size: 3.75KB (3.75K x 8)
Speed: 4MHz
Mounting Type: Through Hole
Package / Case: 40-DIP (0.600", 15.24mm)
Packaging: Tube
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| MC68HC916P1VAA16 |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Description: IC MCU 16BIT 32KB FLASH 80QFP
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| MC68HC916P1CAA16 |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
Description: IC MCU 16BIT 32KB FLASH 80QFP
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| MC68HC705SR3CPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 3.75KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 3.75KB (3.75K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LED, POR
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 3.75KB OTP 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 3.75KB (3.75K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: LED, POR
Supplier Device Package: 40-PDIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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| MC68HC705C8AVFNE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC68HC705C9AFNE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC68HC705C9ACFBE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT 16KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
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| MC68711E20MFNE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Description: IC MCU 8BIT 20KB OTP 52PLCC
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| MC68711E20CFUE4 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 64QFP
Description: IC MCU 8BIT 20KB OTP 64QFP
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| MC33993DWBR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
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| MC33972DWB |
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 3.1V ~ 5.25V
Applications: Switch Monitoring
Supplier Device Package: 32-SOIC
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| MC44BC380EFR2 |
|
Виробник: NXP USA Inc.
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC
Frequency: 40 MHz ~ 880 MHz
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC
Frequency: 40 MHz ~ 880 MHz
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| MC33889BDWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: CAN
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
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| MC33889BDW |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Grade: Automotive
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 28SOIC
Grade: Automotive
Supplier Device Package: 28-SOIC
Voltage - Supply: 5.5V ~ 18V
Interface: CAN
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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| MC33888FBR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHANNEL 64PQFP
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 64-PowerBQFP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 12 (4 High Side, 8 Low Side)
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 10mOhm, 40mOhm, 600mOhm
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Supplier Device Package: 64-PQFP (14x14)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
Description: IC PWR SWITCH N-CHANNEL 64PQFP
Features: Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 64-PowerBQFP
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 12 (4 High Side, 8 Low Side)
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side or Low Side
Rds On (Typ): 10mOhm, 40mOhm, 600mOhm
Voltage - Load: 6V ~ 27V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Supplier Device Package: 64-PQFP (14x14)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Voltage
Part Status: Obsolete
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| MC44BC380EF |
|
Виробник: NXP USA Inc.
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Frequency: 40 MHz ~ 880 MHz
Description: RF POWER DVDR 40MHZ-880MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Frequency: 40 MHz ~ 880 MHz
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| MC68711E20CFUE3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 64QFP
Description: IC MCU 8BIT 20KB OTP 64QFP
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