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MC68711E20CFUE2 MC68711E20CFUE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT 20KB OTP 64QFP
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MC68711E20CFNE3 NXP USA Inc. Description: IC MCU 8BIT 20KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68360ZQ25VLR2 MC68360ZQ25VLR2 NXP USA Inc. MC68360_Man.pdf Description: IC MPU M683XX 25MHZ 357BGA
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MC68360CZQ25LR2 MC68360CZQ25LR2 NXP USA Inc. MC68360_Man.pdf Description: IC MPU M683XX 25MHZ 357BGA
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MC68360ZQ25LR2 MC68360ZQ25LR2 NXP USA Inc. MC68360_Man.pdf Description: IC MPU M683XX 25MHZ 357BGA
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MC68360ZQ25L MC68360ZQ25L NXP USA Inc. MC68360_Man.pdf Description: IC MPU M683XX 25MHZ 357BGA
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MC68HCP11E1CFNE2 MC68HCP11E1CFNE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
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MC7448HX1267ND MC7448HX1267ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC705P6ACDWER MC705P6ACDWER NXP USA Inc. MC68HC705P6A.pdf Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
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MC711K4CFNE2 MC711K4CFNE2 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC711K4CFNE3 MC711K4CFNE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC705C8ACBE MC705C8ACBE NXP USA Inc. MC68HC705C8.pdf Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC7448HX1000LD MC7448HX1000LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC711K4VFUE4R MC711K4VFUE4R NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4CFUE4 MC711K4CFUE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4VFUE4 MC711K4VFUE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4VFNE4 MC711K4VFNE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC711K4VFNE3 MC711K4VFNE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC68MH360ZQ33LR2 MC68MH360ZQ33LR2 NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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MC68MH360ZQ33L MC68MH360ZQ33L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC68MH360ZQ25LR2 MC68MH360ZQ25LR2 NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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MC68MH360ZQ25L MC68MH360ZQ25L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
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MC68MH360CZQ25L MC68MH360CZQ25L NXP USA Inc. MC68MH360UM.pdf Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC68SZ328AVM66 NXP USA Inc. Description: IC MPU M683XX 66MHZ 196BGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 196-BGA
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-PBGA
Packaging: Tray
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MC705B16NCBE MC705B16NCBE NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 56PSDIP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Through Hole
Package / Case: 56-SDIP (0.600", 15.24mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 56-PSDIP
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
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MC68VZ328CVPR2 MC68VZ328CVPR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tape & Reel (TR)
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MC705B16NBE MC705B16NBE NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 56PSDIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 56-PSDIP
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Through Hole
Package / Case: 56-SDIP (0.600", 15.24mm)
Packaging: Tube
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MC68VZ328VP MC68VZ328VP NXP USA Inc. Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
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MC68VZ328AG MC68VZ328AG NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MC68VZ328CAGR2 MC68VZ328CAGR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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MC68VZ328CAG MC68VZ328CAG NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AGR2 MC68VZ328AGR2 NXP USA Inc. Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MCZ145012EG MCZ145012EG NXP USA Inc. MC145012.pdf Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ33287EG MCZ33287EG NXP USA Inc. MC33287.pdf Description: IC INTERFACE SPECIALIZED 20SOIC
Grade: Automotive
Supplier Device Package: 20-SOIC
Voltage - Supply: 5V, 12V
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33290EF MCZ33290EF NXP USA Inc. MC33290.pdf description Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33291EG MCZ33291EG NXP USA Inc. MC33291.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-SOIC
Ratio - Input:Output: 1:8
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 9V ~ 26.5V
Rds On (Typ): 550mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33298EG MCZ33298EG NXP USA Inc. MC33298.pdf Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-SOIC
Ratio - Input:Output: 1:8
Current - Output (Max): 3A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 5.5V ~ 26.5V
Rds On (Typ): 350mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33390EF MCZ33390EF NXP USA Inc. MC33390.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33793EF MCZ33793EF NXP USA Inc. MC33793.pdf Description: IC DSI SLAVE REMOTE SENS 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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MCZ33883EG MCZ33883EG NXP USA Inc. MC33883.pdf Description: IC GATE DRVR HALF-BRIDGE 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 55V
Input Type: Non-Inverting
Supplier Device Package: 20-SOIC
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 4
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 1A, 1A
DigiKey Programmable: Not Verified
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MCZ33897AEF MCZ33897AEF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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MCZ33897EF MCZ33897EF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PBSS2515E,115 PBSS2515E,115 NXP USA Inc. PBSS2515E.pdf Description: TRANS NPN 15V 0.5A SC-75
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 15 V
Current - Collector (Ic) (Max): 500 mA
Supplier Device Package: SC-75
Frequency - Transition: 420MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
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DEMOQE128 DEMOQE128 NXP USA Inc. DEMOQE128_QSG.pdf Description: MC9S08QE128/MCF51QE128 EVAL BRD
Part Status: Active
Utilized IC / Part: MC9S08QE128, MCF51QE128
Board Type: Evaluation Platform
Contents: Board(s), Cable(s), Accessories
Type: MCU
Mounting Type: Socket
Packaging: Bulk
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LPC2292FET144/G,55 LPC2292FET144/G,55 NXP USA Inc. LPC2292_2294.pdf Description: IC MCU 16/32BIT 256KB 144TFBGA
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DEMO1985MC34940E DEMO1985MC34940E NXP USA Inc. MC34940.pdf Description: KIT DEMO FOR MC34940E FAMILY
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: MC34940
Sensor Type: Touch, Capacitive
Voltage - Supply: 9V ~ 18V
Interface: Analog
Packaging: Box
Contents: Board(s)
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DEMO9S08RG60E NXP USA Inc. DEMO9S08RG60UM.pdf Description: MC9S08RG60 EVAL BRD
Utilized IC / Part: MC9S08RG60
Core Processor: HCS08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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EVBQE128 EVBQE128 NXP USA Inc. MCF51QE128FS.pdf description Description: MC9S08QE128/MCF51QE128 EVAL BRD
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M5253EVBE NXP USA Inc. Description: MCF5253 EVAL BRD
Utilized IC / Part: MCF5253
Core Processor: Coldfire V2
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
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MC33493ADTBE MC33493ADTBE NXP USA Inc. MC33493A.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
Data Rate (Max): 10kbps
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC33493ADTBER2 MC33493ADTBER2 NXP USA Inc. MC33493A.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493DTBE MC33493DTBE NXP USA Inc. MC33493.pdf Description: RF TX IC FSK 315-434MHZ 14TSSOP
Data Rate (Max): 10kbps
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
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MC33596FJE MC33596FJE NXP USA Inc. mc33596.pdf Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Obsolete
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MC33696FCE MC33696FCE NXP USA Inc. MC33696.pdf Description: IC RF TXRX ISM<1GHZ 32VFQFN
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MC33696FJE MC33696FJE NXP USA Inc. MC33696.pdf Description: IC RF TXRX ISM<1GHZ 32LQFP
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MC33696MOD434EV NXP USA Inc. MC33696.pdf Description: KIT RF MODULE 434MHZ MC33696
Supplied Contents: Board(s)
Type: Transceiver, ISM
Frequency: 433.92MHz
For Use With/Related Products: MC33696 434MHz RF Module
Packaging: Box
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MC33972TEW MC33972TEW NXP USA Inc. MC33972%28A%2CT%29.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MC34712EP MC34712EP NXP USA Inc. MC34712.pdf Description: IC REG CONV DDR 1OUT 24QFN
Supplier Device Package: 24-QFN-EP (4x4)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 1.35V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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MC34713EP MC34713EP NXP USA Inc. MC34713.pdf Description: IC REG CONV DDR 1OUT 24QFN
Supplier Device Package: 24-QFN-EP (4x4)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 3.6V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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MC34716EP MC34716EP NXP USA Inc. MC34716.pdf Description: IC REG CONV DDR 2OUT 26QFN
Supplier Device Package: 26-QFN (5x5)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 3.6V
Package / Case: 26-VFQFN Exposed Pad
Packaging: Tray
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MC68711E20CFUE2 M68HC11E.pdf
MC68711E20CFUE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 64QFP
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MC68711E20CFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68360ZQ25VLR2 MC68360_Man.pdf
MC68360ZQ25VLR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
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MC68360CZQ25LR2 MC68360_Man.pdf
MC68360CZQ25LR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
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MC68360ZQ25LR2 MC68360_Man.pdf
MC68360ZQ25LR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
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MC68360ZQ25L MC68360_Man.pdf
MC68360ZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
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MC68HCP11E1CFNE2 M68HC11E.pdf
MC68HCP11E1CFNE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
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MC7448HX1267ND MPC7448ECS01AD.pdf
MC7448HX1267ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC705P6ACDWER MC68HC705P6A.pdf
MC705P6ACDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Number of I/O: 21
DigiKey Programmable: Not Verified
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MC711K4CFNE2 M68HC11K.pdf
MC711K4CFNE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC711K4CFNE3 M68HC11K.pdf
MC711K4CFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC705C8ACBE MC68HC705C8.pdf
MC705C8ACBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 42-PDIP
Number of I/O: 24
DigiKey Programmable: Not Verified
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MC7448HX1000LD MPC7448EC.pdf
MC7448HX1000LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC711K4VFUE4R M68HC11K.pdf
MC711K4VFUE4R
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4CFUE4 M68HC11K.pdf
MC711K4CFUE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4VFUE4 M68HC11K.pdf
MC711K4VFUE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
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MC711K4VFNE4 M68HC11K.pdf
MC711K4VFNE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC711K4VFNE3 M68HC11K.pdf
MC711K4VFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 84PLCC
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MC68MH360ZQ33LR2 MC68MH360UM.pdf
MC68MH360ZQ33LR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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MC68MH360ZQ33L MC68MH360UM.pdf
MC68MH360ZQ33L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC68MH360ZQ25LR2 MC68MH360UM.pdf
MC68MH360ZQ25LR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tape & Reel (TR)
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MC68MH360ZQ25L MC68MH360UM.pdf
MC68MH360ZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
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MC68MH360CZQ25L MC68MH360UM.pdf
MC68MH360CZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 5.0V
Core Processor: CPU32+
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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MC68SZ328AVM66
Виробник: NXP USA Inc.
Description: IC MPU M683XX 66MHZ 196BGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 196-BGA
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 196-PBGA
Packaging: Tray
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MC705B16NCBE MC68HC05B6.pdf
MC705B16NCBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 56PSDIP
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Through Hole
Package / Case: 56-SDIP (0.600", 15.24mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 56-PSDIP
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
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MC68VZ328CVPR2
MC68VZ328CVPR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tape & Reel (TR)
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MC705B16NBE MC68HC05B6.pdf
MC705B16NBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 56PSDIP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 56-PSDIP
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Through Hole
Package / Case: 56-SDIP (0.600", 15.24mm)
Packaging: Tube
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MC68VZ328VP
MC68VZ328VP
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144MAPBGA
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-MAPBGA (13x13)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LBGA
Packaging: Tray
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MC68VZ328AG
MC68VZ328AG
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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MC68VZ328CAGR2
MC68VZ328CAGR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Additional Interfaces: SPI, UART
Display & Interface Controllers: LCD, Touch Panel
Graphics Acceleration: No
RAM Controllers: DRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.0V
Core Processor: FLX68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 33MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
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MC68VZ328CAG
MC68VZ328CAG
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MC68VZ328AGR2
MC68VZ328AGR2
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: FLX68000
Voltage - I/O: 3.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Additional Interfaces: SPI, UART
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MCZ145012EG MC145012.pdf
MCZ145012EG
Виробник: NXP USA Inc.
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ33287EG MC33287.pdf
MCZ33287EG
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SOIC
Grade: Automotive
Supplier Device Package: 20-SOIC
Voltage - Supply: 5V, 12V
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33290EF description MC33290.pdf
MCZ33290EF
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 8V ~ 18V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33291EG MC33291.pdf
MCZ33291EG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-SOIC
Ratio - Input:Output: 1:8
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 9V ~ 26.5V
Rds On (Typ): 550mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33298EG MC33298.pdf
MCZ33298EG
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 24SOIC
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: 24-SOIC
Ratio - Input:Output: 1:8
Current - Output (Max): 3A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 5.5V ~ 26.5V
Rds On (Typ): 350mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MCZ33390EF MC33390.pdf
MCZ33390EF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
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MCZ33793EF MC33793.pdf
MCZ33793EF
Виробник: NXP USA Inc.
Description: IC DSI SLAVE REMOTE SENS 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 150°C
Input Type: Logic
Supplier Device Package: 16-SOIC
Current - Supply: 250 mA
DigiKey Programmable: Not Verified
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MCZ33883EG MC33883.pdf
MCZ33883EG
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5.5V ~ 55V
Input Type: Non-Inverting
Supplier Device Package: 20-SOIC
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 4
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 1A, 1A
DigiKey Programmable: Not Verified
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MCZ33897AEF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897AEF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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MCZ33897EF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897EF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
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PBSS2515E,115 PBSS2515E.pdf
PBSS2515E,115
Виробник: NXP USA Inc.
Description: TRANS NPN 15V 0.5A SC-75
Power - Max: 250 mW
Voltage - Collector Emitter Breakdown (Max): 15 V
Current - Collector (Ic) (Max): 500 mA
Supplier Device Package: SC-75
Frequency - Transition: 420MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Packaging: Cut Tape (CT)
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DEMOQE128 DEMOQE128_QSG.pdf
DEMOQE128
Виробник: NXP USA Inc.
Description: MC9S08QE128/MCF51QE128 EVAL BRD
Part Status: Active
Utilized IC / Part: MC9S08QE128, MCF51QE128
Board Type: Evaluation Platform
Contents: Board(s), Cable(s), Accessories
Type: MCU
Mounting Type: Socket
Packaging: Bulk
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LPC2292FET144/G,55 LPC2292_2294.pdf
LPC2292FET144/G,55
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 256KB 144TFBGA
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DEMO1985MC34940E MC34940.pdf
DEMO1985MC34940E
Виробник: NXP USA Inc.
Description: KIT DEMO FOR MC34940E FAMILY
Embedded: No
Supplied Contents: Board(s)
Utilized IC / Part: MC34940
Sensor Type: Touch, Capacitive
Voltage - Supply: 9V ~ 18V
Interface: Analog
Packaging: Box
Contents: Board(s)
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DEMO9S08RG60E DEMO9S08RG60UM.pdf
Виробник: NXP USA Inc.
Description: MC9S08RG60 EVAL BRD
Utilized IC / Part: MC9S08RG60
Core Processor: HCS08
Contents: Board(s), Cable(s)
Type: MCU 8-Bit
Mounting Type: Fixed
Packaging: Box
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EVBQE128 description MCF51QE128FS.pdf
EVBQE128
Виробник: NXP USA Inc.
Description: MC9S08QE128/MCF51QE128 EVAL BRD
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M5253EVBE
Виробник: NXP USA Inc.
Description: MCF5253 EVAL BRD
Utilized IC / Part: MCF5253
Core Processor: Coldfire V2
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Box
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MC33493ADTBE MC33493A.pdf
MC33493ADTBE
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
Data Rate (Max): 10kbps
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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MC33493ADTBER2 MC33493A.pdf
MC33493ADTBER2
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: -3dBm
Applications: General Data Transfer
Data Rate (Max): 10kbps
Current - Transmitting: 11.6mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 14-TSSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC33493DTBE MC33493.pdf
MC33493DTBE
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315-434MHZ 14TSSOP
Data Rate (Max): 10kbps
Applications: General Data Transfer
Power - Output: -3dBm
Voltage - Supply: 1.9V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Data Interface: PCB, Surface Mount
Modulation or Protocol: FSK, OOK
Frequency: 315MHz ~ 434MHz, 868MHz ~ 928MHz
Mounting Type: Surface Mount
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
DigiKey Programmable: Not Verified
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Antenna Connector: PCB, Surface Mount
Current - Transmitting: 11.6mA
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MC33596FJE mc33596.pdf
MC33596FJE
Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-LQFP (5x5)
Part Status: Obsolete
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MC33696FCE MC33696.pdf
MC33696FCE
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32VFQFN
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MC33696FJE MC33696.pdf
MC33696FJE
Виробник: NXP USA Inc.
Description: IC RF TXRX ISM<1GHZ 32LQFP
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MC33696MOD434EV MC33696.pdf
Виробник: NXP USA Inc.
Description: KIT RF MODULE 434MHZ MC33696
Supplied Contents: Board(s)
Type: Transceiver, ISM
Frequency: 433.92MHz
For Use With/Related Products: MC33696 434MHz RF Module
Packaging: Box
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MC33972TEW MC33972%28A%2CT%29.pdf
MC33972TEW
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 3.1V ~ 5.25V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tube
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MC34712EP MC34712.pdf
MC34712EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Supplier Device Package: 24-QFN-EP (4x4)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 1.35V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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MC34713EP MC34713.pdf
MC34713EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 1OUT 24QFN
Supplier Device Package: 24-QFN-EP (4x4)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 1
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 3.6V
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
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MC34716EP MC34716.pdf
MC34716EP
Виробник: NXP USA Inc.
Description: IC REG CONV DDR 2OUT 26QFN
Supplier Device Package: 26-QFN (5x5)
Applications: Converter, DDR
Operating Temperature: -40°C ~ 85°C
Voltage - Input: 3V ~ 6V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.7V ~ 3.6V
Package / Case: 26-VFQFN Exposed Pad
Packaging: Tray
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