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KMPC8321ECVRADDC KMPC8321ECVRADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ 516BGA
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KMC68MH360ZQ25VL KMC68MH360ZQ25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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KMC7448HX1400ND KMC7448HX1400ND NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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13192EVB-A0E NXP USA Inc. ZigBee%20Technology%20Products%20Summary.pdf Description: EVAL BOARD HARDWARE DEV
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KMC7448HX1267ND KMC7448HX1267ND NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMC7448HX1700LD KMC7448HX1700LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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KMPC8241TVR200D KMPC8241TVR200D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 200MHZ 357BGA
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KMPC8241TVR166D KMPC8241TVR166D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 166MHZ 357BGA
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KMC7448VU1400ND KMC7448VU1400ND NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMPC8349ECVVAJDB KMPC8349ECVVAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MC33794DWBR2 MC33794DWBR2 NXP USA Inc. MC33794.pdf Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC33880DWR2 MC33880DWR2 NXP USA Inc. MC33880.pdf Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
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MM908E621ACDWB MM908E621ACDWB NXP USA Inc. MM908E621.pdf Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MC908GR16AVFAE MC908GR16AVFAE NXP USA Inc. MC68HC908GR16A.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
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MC7448VU1600PD MC7448VU1600PD NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
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MC908GZ32VFAER MC908GZ32VFAER NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
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MC908QY4CDWER MC908QY4CDWER NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+337.01 грн
Мінімальне замовлення: 1000
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MC908QC16CDZER MC908QC16CDZER NXP USA Inc. 68HC908QCFS.pdf Description: IC MCU 8BIT 16KB FLASH 28SOIC
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MC7448THX1000ND MC7448THX1000ND NXP USA Inc. MPC7448ECS02AD.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS1000LD MC7448VS1000LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MC7448THX1400ND MC7448THX1400ND NXP USA Inc. MPC7448ECS02AD.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448THX1267ND MC7448THX1267ND NXP USA Inc. MPC7448ECS02AD.pdf Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448HX600ND MC7448HX600ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS1000ND MC7448VS1000ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MC7448VU1250ND MC7448VU1250ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU1000ND MC7448VU1000ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS600ND MC7448VS600ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MCZ33198EFR2 MCZ33198EFR2 NXP USA Inc. MC33198.pdf Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MCZ33198EF MCZ33198EF NXP USA Inc. MC33198.pdf Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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13192DSK-BDM-A0E NXP USA Inc. ZigBee%20Technology%20Products%20Summary.pdf Description: KIT DEV STARTER
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MCZ145012EGR2 MCZ145012EGR2 NXP USA Inc. MC145012.pdf Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ3334EFR2 MCZ3334EFR2 NXP USA Inc. Description: IC IGNITION HI ENERGY 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 4V ~ 24V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33897AEFR2 MCZ33897AEFR2 NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ79076EG MCZ79076EG NXP USA Inc. MC79076.pdf Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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MCZ79076EGR2 MCZ79076EGR2 NXP USA Inc. MC79076.pdf Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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MCZ33897EFR2 MCZ33897EFR2 NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897BEF MCZ33897BEF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897CEFR2 MCZ33897CEFR2 NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897CEF MCZ33897CEF NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897BEFR2 MCZ33897BEFR2 NXP USA Inc. 33897%28A%2CB%2CC%2CD%2CT%29.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCIMX31VKN5B MCIMX31VKN5B NXP USA Inc. MCIMX31.pdf Description: IC MPU I.MX31 532MHZ 457MAPBGA
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MC9RS08KA2CSCR MC9RS08KA2CSCR NXP USA Inc. MC9RS08KA2.pdf Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
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MC9S08QD4MSC MC9S08QD4MSC NXP USA Inc. MC9S08QD4.pdf description Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 2653 шт:
термін постачання 21-31 дні (днів)
2+259.37 грн
10+187.98 грн
98+155.62 грн
196+140.05 грн
294+137.04 грн
588+132.64 грн
1078+127.31 грн
2548+123.67 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MC9S08QG4CFFER MC9S08QG4CFFER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MC9S08QG4CDTER MC9S08QG4CDTER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
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MC9S08QD4CSCR MC9S08QD4CSCR NXP USA Inc. MC9S08QD4_Fact_Sheet.pdf Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
2500+126.18 грн
5000+119.13 грн
Мінімальне замовлення: 2500
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MC9S08GB60ACFUER MC9S08GB60ACFUER NXP USA Inc. MC9S08GB60A.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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MC9S08AW60CFGER MC9S08AW60CFGER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S12B256CPVE MC9S12B256CPVE NXP USA Inc. MC9S12B.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
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MCHC908QT2MDWER MCHC908QT2MDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
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MCHC908QT1CDWER MCHC908QT1CDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCF5270CVM150R2 MCF5270CVM150R2 NXP USA Inc. MCF5271EC.pdf Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MC9S12C32VFUE25 MC9S12C32VFUE25 NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 32KB FLASH 80QFP
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В кошику  од. на суму  грн.
MC9S12DT256VFUE MC9S12DT256VFUE NXP USA Inc. 9S12DT256DGV3.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
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В кошику  од. на суму  грн.
MC7448HX1400ND MC7448HX1400ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC33887DWBR2 MC33887DWBR2 NXP USA Inc. Description: IC MOTOR DRIVER 5V-28V 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 54-SOIC
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MC68EN360ZQ25VL MC68EN360ZQ25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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MC68EN360ZQ25L MC68EN360ZQ25L NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
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MC68HC11D0CFBE3 MC68HC11D0CFBE3 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68711E20VFNE2 MC68711E20VFNE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT 20KB OTP 52PLCC
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KMPC8321ECVRADDC MPC8323EEC.pdf
KMPC8321ECVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 516BGA
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KMC68MH360ZQ25VL MC68360.pdf
KMC68MH360ZQ25VL
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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KMC7448HX1400ND MPC7448EC.pdf
KMC7448HX1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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13192EVB-A0E ZigBee%20Technology%20Products%20Summary.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD HARDWARE DEV
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KMC7448HX1267ND MPC7448EC.pdf
KMC7448HX1267ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMC7448HX1700LD MPC7448EC.pdf
KMC7448HX1700LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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KMPC8241TVR200D MPC8241.pdf
KMPC8241TVR200D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 357BGA
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KMPC8241TVR166D MPC8241.pdf
KMPC8241TVR166D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
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KMC7448VU1400ND MPC7448EC.pdf
KMC7448VU1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMPC8349ECVVAJDB MPC8349EAEC.pdf
KMPC8349ECVVAJDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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MC33794DWBR2 MC33794.pdf
MC33794DWBR2
Виробник: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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MC33880DWR2 MC33880.pdf
MC33880DWR2
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
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MM908E621ACDWB MM908E621.pdf
MM908E621ACDWB
Виробник: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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MC908GR16AVFAE MC68HC908GR16A.pdf
MC908GR16AVFAE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
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MC7448VU1600PD MPC7448ECS01AD.pdf
MC7448VU1600PD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
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MC908GZ32VFAER MC68HC908GZ60.pdf
MC908GZ32VFAER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
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MC908QY4CDWER MC68HC908QY4A.pdf
MC908QY4CDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+337.01 грн
Мінімальне замовлення: 1000
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MC908QC16CDZER 68HC908QCFS.pdf
MC908QC16CDZER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
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MC7448THX1000ND MPC7448ECS02AD.pdf
MC7448THX1000ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS1000LD MPC7448EC.pdf
MC7448VS1000LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MC7448THX1400ND MPC7448ECS02AD.pdf
MC7448THX1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448THX1267ND MPC7448ECS02AD.pdf
MC7448THX1267ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448HX600ND MPC7448ECS01AD.pdf
MC7448HX600ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS1000ND MPC7448ECS01AD.pdf
MC7448VS1000ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MC7448VU1250ND MPC7448ECS01AD.pdf
MC7448VU1250ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU1000ND MPC7448ECS01AD.pdf
MC7448VU1000ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VS600ND MPC7448ECS01AD.pdf
MC7448VS600ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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MCZ33198EFR2 MC33198.pdf
MCZ33198EFR2
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MCZ33198EF MC33198.pdf
MCZ33198EF
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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13192DSK-BDM-A0E ZigBee%20Technology%20Products%20Summary.pdf
Виробник: NXP USA Inc.
Description: KIT DEV STARTER
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MCZ145012EGR2 MC145012.pdf
MCZ145012EGR2
Виробник: NXP USA Inc.
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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MCZ3334EFR2
MCZ3334EFR2
Виробник: NXP USA Inc.
Description: IC IGNITION HI ENERGY 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 4V ~ 24V
Supplier Device Package: 8-SOIC
Grade: Automotive
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MCZ33897AEFR2 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897AEFR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ79076EG MC79076.pdf
MCZ79076EG
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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MCZ79076EGR2 MC79076.pdf
MCZ79076EGR2
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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MCZ33897EFR2 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897EFR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897BEF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897BEF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897CEFR2 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897CEFR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897CEF 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897CEF
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCZ33897BEFR2 33897%28A%2CB%2CC%2CD%2CT%29.pdf
MCZ33897BEFR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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MCIMX31VKN5B MCIMX31.pdf
MCIMX31VKN5B
Виробник: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457MAPBGA
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MC9RS08KA2CSCR MC9RS08KA2.pdf
MC9RS08KA2CSCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 63 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Peripherals: LVD, POR, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
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MC9S08QD4MSC description MC9S08QD4.pdf
MC9S08QD4MSC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 2653 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+259.37 грн
10+187.98 грн
98+155.62 грн
196+140.05 грн
294+137.04 грн
588+132.64 грн
1078+127.31 грн
2548+123.67 грн
Мінімальне замовлення: 2
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MC9S08QG4CFFER MC9S08QG8.pdf
MC9S08QG4CFFER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN-EP (5x5)
Part Status: Active
Number of I/O: 12
DigiKey Programmable: Not Verified
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MC9S08QG4CDTER MC9S08QG8.pdf
MC9S08QG4CDTER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Verified
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MC9S08QD4CSCR MC9S08QD4_Fact_Sheet.pdf
MC9S08QD4CSCR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Part Status: Active
Number of I/O: 4
DigiKey Programmable: Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+126.18 грн
5000+119.13 грн
Мінімальне замовлення: 2500
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MC9S08GB60ACFUER MC9S08GB60A.pdf
MC9S08GB60ACFUER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Not For New Designs
Number of I/O: 56
DigiKey Programmable: Not Verified
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MC9S08AW60CFGER MC9S08AW60.pdf
MC9S08AW60CFGER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S12B256CPVE MC9S12B.pdf
MC9S12B256CPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
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MCHC908QT2MDWER MC68HC908QY4.pdf
MCHC908QT2MDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
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MCHC908QT1CDWER MC68HC908QY4.pdf
MCHC908QT1CDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCF5270CVM150R2 MCF5271EC.pdf
MCF5270CVM150R2
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MC9S12C32VFUE25 MC9S12C128V1.pdf
MC9S12C32VFUE25
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 80QFP
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MC9S12DT256VFUE 9S12DT256DGV3.pdf
MC9S12DT256VFUE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
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MC7448HX1400ND MPC7448ECS01AD.pdf
MC7448HX1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC33887DWBR2
MC33887DWBR2
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 5V-28V 54SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 5A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 5V ~ 28V
Supplier Device Package: 54-SOIC
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
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MC68EN360ZQ25VL MC68360.pdf
MC68EN360ZQ25VL
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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MC68EN360ZQ25L MC68360.pdf
MC68EN360ZQ25L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
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MC68HC11D0CFBE3 MC68HC711D3.pdf
MC68HC11D0CFBE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68711E20VFNE2 M68HC11E.pdf
MC68711E20VFNE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 20KB OTP 52PLCC
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