Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35738) > Сторінка 112 з 596
| Фото | Назва | Виробник | Інформація |
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Ціна |
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MC33742DWR2 | NXP USA Inc. |
 Description: IC INTERFACE SPECIALIZED 28SOICPackaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Supplier Device Package: 28-SOIC Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33742DW | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 28SOIC Packaging: Tray Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Supplier Device Package: 28-SOIC Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33689DWBR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SPI Serial Voltage - Supply: 5.5V ~ 18V Applications: Mirror Control Supplier Device Package: 32-SOIC Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33186DH2 | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 5A 20HSOP Packaging: Tube Features: Status Flag Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8548EVUAQG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8548EVUATG | NXP USA Inc. |
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCBGA (29x29) Ethernet: 10/100/1000Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMSC7116VM1000 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 400kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 266MHz Supplier Device Package: 400-LFBGA (17x17) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33186DH1R2 | NXP USA Inc. |
Description: IC HALF BRIDGE DRIVER 5A 20HSOP Packaging: Tape & Reel (TR) Features: Status Flag Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Mounting Type: Surface Mount Interface: Logic Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Half Bridge (2) Voltage - Supply: 5V ~ 28V Rds On (Typ): 150mOhm Applications: DC Motors, General Purpose, Solenoids Current - Output / Channel: 5A Technology: Bi-CMOS Voltage - Load: 5V ~ 28V Supplier Device Package: 20-HSOP Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO Load Type: Inductive Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC13821FCR2 | NXP USA Inc. |
Description: IC RF AMP ISM 1GHZ-2.4GHZ 12QFN Packaging: Tape & Reel (TR) Package / Case: 12-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 1GHz ~ 2.4GHz RF Type: ISM, GPS Voltage - Supply: 2.75V Gain: 16.5dB Current - Supply: 2.8mA Noise Figure: 1.45dB P1dB: -10dBm Test Frequency: 1.575GHz Supplier Device Package: 12-QFN (3x3) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMSC7118VF1200 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 300MHz Supplier Device Package: 400-LFBGA (17x17) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMSC7119VM1200 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 300MHz Supplier Device Package: 400-LFBGA (17x17) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMSC7119VF1200 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 300MHz Supplier Device Package: 400-LFBGA (17x17) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMSC7118VM1200 | NXP USA Inc. |
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Interface: Host Interface, I²C, UART Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (8kB) On-Chip RAM: 464kB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 300MHz Supplier Device Package: 400-LFBGA (17x17) |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33880DWBR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8323ECVRAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516 Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8321EVRAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ PBGA516 Packaging: Bulk Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8321ECVRAFDC | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 516BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8343VRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8343EVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8343CVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8343ECVRAGDB | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8321EVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 516BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8321ECVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 516BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMC68MH360ZQ25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMC7448HX1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
| 13192EVB-A0E | NXP USA Inc. |
Description: EVAL BOARD HARDWARE DEV |
товару немає в наявності |
В кошику од. на суму грн. | |||
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KMC7448HX1267ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.267GHZ 360BGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.267GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMC7448HX1700LD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.7GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8241TVR200D | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8241TVR166D | NXP USA Inc. |
Description: IC MPU MPC82XX 166MHZ 357BGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMC7448VU1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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KMPC8349ECVVAJDB | NXP USA Inc. |
Description: IC MPU MPC83XX 533MHZ 672LBGA Packaging: Tray Package / Case: 672-LBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 672-LBGA (35x35) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33794DWBR2 | NXP USA Inc. |
Description: IC SENSOR ELECTRIC FIELD 54-SOIC Packaging: Tape & Reel (TR) Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Output Type: Logic Mounting Type: Surface Mount Type: Sensor Interface Operating Temperature: -40°C ~ 85°C Input Type: Logic Supplier Device Package: 54-SOIC Current - Supply: 7 mA DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC33880DWR2 | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MM908E621ACDWB | NXP USA Inc. |
Description: IC QUAD HALF BRDG TRPL SW 54SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC908GR16AVFAE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 48LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448VU1600PD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC908GZ32VFAER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC908QY4CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Part Status: Not For New Designs Number of I/O: 13 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MC908QC16CDZER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28SOIC |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448THX1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448VS1000LD | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448THX1400ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448THX1267ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.267GHZ 360BGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.267GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448HX600ND | NXP USA Inc. |
Description: IC MPU MPC74XX 600MHZ 360FCCBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448VS1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448VU1250ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||
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MC7448VU1000ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA Packaging: Tray Package / Case: 360-CBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
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В кошику од. на суму грн. | ||
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MC7448VS600ND | NXP USA Inc. |
Description: IC MPU MPC74XX 600MHZ 360FCCLGA Packaging: Tray Package / Case: 360-CLGA, FCCLGA Mounting Type: Surface Mount Speed: 600MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCLGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Part Status: Obsolete |
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MCZ33198EFR2 | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 7V ~ 20V Input Type: Non-Inverting Supplier Device Package: 8-SOIC Rise / Fall Time (Typ): 10µs, 280µs Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: N-Channel MOSFET Logic Voltage - VIL, VIH: 1.5V, 3.5V Part Status: Obsolete DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||
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MCZ33198EF | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 7V ~ 20V Input Type: Non-Inverting Supplier Device Package: 8-SOIC Rise / Fall Time (Typ): 10µs, 280µs Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: N-Channel MOSFET Logic Voltage - VIL, VIH: 1.5V, 3.5V Part Status: Obsolete DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||
| 13192DSK-BDM-A0E | NXP USA Inc. |
Description: KIT DEV STARTER |
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В кошику од. на суму грн. | |||
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MCZ145012EGR2 | NXP USA Inc. |
Description: IC SMOKE DETECT PHOTOELEC 16SOIC |
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В кошику од. на суму грн. | ||
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MCZ3334EFR2 | NXP USA Inc. |
Description: IC IGNITION HI ENERGY 8-SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Voltage - Supply: 4V ~ 24V Supplier Device Package: 8-SOIC Grade: Automotive |
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В кошику од. на суму грн. | ||
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MCZ33897AEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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В кошику од. на суму грн. | ||
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MCZ79076EG | NXP USA Inc. |
Description: IC ELEC IGNITION CTL CIRC 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Electrical Ignition Control Circuit Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||
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MCZ79076EGR2 | NXP USA Inc. |
Description: IC ELEC IGNITION CTL CIRC 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Type: Electrical Ignition Control Circuit Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||
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MCZ33897EFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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В кошику од. на суму грн. | ||
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MCZ33897BEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8SOIC Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 8-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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В кошику од. на суму грн. | ||
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MCZ33897CEFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
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В кошику од. на суму грн. |
| MC33742DWR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
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| MC33742DW |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 28SOIC
Packaging: Tray
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Supplier Device Package: 28-SOIC
Grade: Automotive
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| MC33689DWBR2 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI Serial
Voltage - Supply: 5.5V ~ 18V
Applications: Mirror Control
Supplier Device Package: 32-SOIC
Grade: Automotive
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| MC33186DH2 |
Виробник: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Packaging: Tube
Features: Status Flag
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
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| KMPC8548EVUAQG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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| KMPC8548EVUATG |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Description: IC MPU MPC85XX 1.2GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
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| KMSC7116VM1000 |
|
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
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| MC33186DH1R2 |
|
Виробник: NXP USA Inc.
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Packaging: Tape & Reel (TR)
Features: Status Flag
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
Description: IC HALF BRIDGE DRIVER 5A 20HSOP
Packaging: Tape & Reel (TR)
Features: Status Flag
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (2)
Voltage - Supply: 5V ~ 28V
Rds On (Typ): 150mOhm
Applications: DC Motors, General Purpose, Solenoids
Current - Output / Channel: 5A
Technology: Bi-CMOS
Voltage - Load: 5V ~ 28V
Supplier Device Package: 20-HSOP
Fault Protection: Current Limiting, Over Temperature, Over Voltage, Short Circuit, UVLO
Load Type: Inductive
Part Status: Obsolete
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| MC13821FCR2 |
|
Виробник: NXP USA Inc.
Description: IC RF AMP ISM 1GHZ-2.4GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1GHz ~ 2.4GHz
RF Type: ISM, GPS
Voltage - Supply: 2.75V
Gain: 16.5dB
Current - Supply: 2.8mA
Noise Figure: 1.45dB
P1dB: -10dBm
Test Frequency: 1.575GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
Description: IC RF AMP ISM 1GHZ-2.4GHZ 12QFN
Packaging: Tape & Reel (TR)
Package / Case: 12-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 1GHz ~ 2.4GHz
RF Type: ISM, GPS
Voltage - Supply: 2.75V
Gain: 16.5dB
Current - Supply: 2.8mA
Noise Figure: 1.45dB
P1dB: -10dBm
Test Frequency: 1.575GHz
Supplier Device Package: 12-QFN (3x3)
Part Status: Obsolete
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| KMSC7118VF1200 |
|
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
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| KMSC7119VM1200 |
|
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
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| KMSC7119VF1200 |
|
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
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| KMSC7118VM1200 |
|
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I²C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 464kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 300MHz
Supplier Device Package: 400-LFBGA (17x17)
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| MC33880DWBR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
Description: IC PWR SWITCH N-CHAN 1:8 32SOIC
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| KMPC8323ECVRAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8321EVRAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 333MHZ PBGA516
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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| KMPC8321ECVRAFDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516BGA
Description: IC MPU MPC83XX 333MHZ 516BGA
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| KMPC8343VRAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| KMPC8343EVRAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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| KMPC8343CVRAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| KMPC8343ECVRAGDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 400MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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| KMPC8321EVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 516BGA
Description: IC MPU MPC83XX 266MHZ 516BGA
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| KMPC8321ECVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 516BGA
Description: IC MPU MPC83XX 266MHZ 516BGA
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| KMC68MH360ZQ25VL |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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| KMC7448HX1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| 13192EVB-A0E |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD HARDWARE DEV
Description: EVAL BOARD HARDWARE DEV
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| KMC7448HX1267ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| KMC7448HX1700LD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.7GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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| KMPC8241TVR200D |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 357BGA
Description: IC MPU MPC82XX 200MHZ 357BGA
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| KMPC8241TVR166D |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Description: IC MPU MPC82XX 166MHZ 357BGA
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| KMC7448VU1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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од. на суму грн.
| KMPC8349ECVVAJDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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| MC33794DWBR2 |
|
Виробник: NXP USA Inc.
Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
Description: IC SENSOR ELECTRIC FIELD 54-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: Logic
Mounting Type: Surface Mount
Type: Sensor Interface
Operating Temperature: -40°C ~ 85°C
Input Type: Logic
Supplier Device Package: 54-SOIC
Current - Supply: 7 mA
DigiKey Programmable: Not Verified
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| MC33880DWR2 |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
Description: IC PWR SWITCH N-CHAN 1:8 28SOIC
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| MM908E621ACDWB |
|
Виробник: NXP USA Inc.
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
Description: IC QUAD HALF BRDG TRPL SW 54SOIC
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| MC908GR16AVFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Description: IC MCU 8BIT 16KB FLASH 48LQFP
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| MC7448VU1600PD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
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| MC908GZ32VFAER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Description: IC MCU 8BIT 32KB FLASH 48LQFP
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| MC908QY4CDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 333.18 грн |
| MC908QC16CDZER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28SOIC
Description: IC MCU 8BIT 16KB FLASH 28SOIC
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| MC7448THX1000ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448VS1000LD |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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| MC7448THX1400ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448THX1267ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448HX600ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 600MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448VS1000ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 1.0GHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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| MC7448VU1250ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448VU1000ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| MC7448VS600ND |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 600MHZ 360FCCLGA
Packaging: Tray
Package / Case: 360-CLGA, FCCLGA
Mounting Type: Surface Mount
Speed: 600MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCLGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Part Status: Obsolete
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| MCZ33198EFR2 |
|
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| MCZ33198EF |
|
Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 7V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 10µs, 280µs
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.5V, 3.5V
Part Status: Obsolete
DigiKey Programmable: Not Verified
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| 13192DSK-BDM-A0E |
|
Виробник: NXP USA Inc.
Description: KIT DEV STARTER
Description: KIT DEV STARTER
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| MCZ145012EGR2 |
|
Виробник: NXP USA Inc.
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
Description: IC SMOKE DETECT PHOTOELEC 16SOIC
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| MCZ3334EFR2 |
Виробник: NXP USA Inc.
Description: IC IGNITION HI ENERGY 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 4V ~ 24V
Supplier Device Package: 8-SOIC
Grade: Automotive
Description: IC IGNITION HI ENERGY 8-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Voltage - Supply: 4V ~ 24V
Supplier Device Package: 8-SOIC
Grade: Automotive
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| MCZ33897AEFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ79076EG |
|
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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| MCZ79076EGR2 |
|
Виробник: NXP USA Inc.
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC ELEC IGNITION CTL CIRC 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: Electrical Ignition Control Circuit
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
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| MCZ33897EFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897BEF |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| MCZ33897CEFR2 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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