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ADC1004S030TS/C1:1 ADC1004S030TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 30M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of A/D Converters: 1
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ADC1004S040TS/C1:1 ADC1004S040TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 40M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1004S050TS/C1:1 ADC1004S050TS/C1:1 NXP USA Inc. ADC1004S050TS-C1-1-2752d47e94cf5451.pdf Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Part Status: Obsolete
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 50M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1005S060TS/C1:1 ADC1005S060TS/C1:1 NXP USA Inc. ADC1005S060.pdf Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 60M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1207S080HW/C1:5 ADC1207S080HW/C1:5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Part Status: Obsolete
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tray
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74ABT273AD,118 74ABT273AD,118 NXP USA Inc. 74ABT273A.pdf Description: IC FF D-TYPE SNGL 8BIT 20SO
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GTL2010PW,118 GTL2010PW,118 NXP USA Inc. GTL2010.pdf Description: IC TRANSLATOR BIDIR 24TSSOP
Supplier Device Package: 24-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Number of Circuits: 1
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 10
Translator Type: Voltage Level
Channel Type: Bidirectional
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PCA9554ADB,118 PCA9554ADB,118 NXP USA Inc. PCA9554_9554A.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Part Status: Active
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 16-SSOP
DigiKey Programmable: Not Verified
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
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PCF8563TS/4,118 PCF8563TS/4,118 NXP USA Inc. PCF8563.pdf Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 811 шт:
термін постачання 21-31 дні (днів)
3+114.72 грн
10+80.91 грн
25+73.44 грн
100+61.29 грн
250+57.65 грн
500+55.46 грн
Мінімальне замовлення: 3 шт
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MF1FCP2S50/DH,118 MF1FCP2S50/DH,118 NXP USA Inc. MF1FCP2S50.pdf Description: IC RFID TRANSP 13.56MHZ 2FCP
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MPC5567EVBE MPC5567EVBE NXP USA Inc. MPC5567.pdf Description: MPC5567 EVAL BRD
Utilized IC / Part: MPC5567
Core Processor: e200
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC2157FBD100,551 LPC2157FBD100,551 NXP USA Inc. LPC2157_2158.pdf Description: IC MCU 16/32B 512KB FLSH 100LQFP
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LPC2361FBD100,551 LPC2361FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
1+998.45 грн
10+768.72 грн
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LPC2362FBD100,551 LPC2362FBD100,551 NXP USA Inc. LPC2361_62.pdf Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FBD208,551 LPC2420FBD208,551 NXP USA Inc. LPC2420_60.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC3220FET296,551 LPC3220FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
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LPC3230FET296,551 LPC3230FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
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LPC3240FET296,551 LPC3240FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296,551 LPC3250FET296,551 NXP USA Inc. LPC3220_30_40_50.pdf Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Tray
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Obsolete
Supplier Device Package: 296-TFBGA (15x15)
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BGY588C,112 BGY588C,112 NXP USA Inc. BGY588C.pdf Description: IC AMP CATV SOT115J
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
Current - Supply: 325 mA
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
2500+49.10 грн
5000+46.20 грн
7500+45.66 грн
12500+42.29 грн
Мінімальне замовлення: 2500 шт
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PCF2123TS/1,118 PCF2123TS/1,118 NXP USA Inc. PCF2123.pdf Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
4+99.69 грн
10+69.94 грн
25+63.42 грн
100+52.78 грн
250+49.58 грн
500+47.64 грн
1000+45.41 грн
Мінімальне замовлення: 4 шт
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74HCT640D,653 74HCT640D,653 NXP USA Inc. 74HC(T)640.pdf Description: IC TRANSCEIVER INVERT 5.5V 20SO
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74LVCH162244ADGG:5 74LVCH162244ADGG:5 NXP USA Inc. 74LVC(H)162244A_Rev6_2017.pdf Description: IC BUF NON-INVERT 3.6V 48TSSOP
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
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74LVT574PW,118 74LVT574PW,118 NXP USA Inc. 74LVT%28H%29574.pdf Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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N74F138D,623 N74F138D,623 NXP USA Inc. DS_568_74F138.pdf Description: IC DECODER/DEMUX 1 X 3:8 16SO
Current - Output High, Low: 1mA, 20mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
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MC44CC375AVEFEVK NXP USA Inc. MC44CC375AV.pdf Description: CCEVK NEJA EVAL KIT
Utilized IC / Part: MC44CC375AV
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Modulator
For Use With/Related Products: MC44CC375AV
Packaging: Bulk
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2N7002T,215 2N7002T,215 NXP USA Inc. 2N7002T_1.pdf Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
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74AUP1G32GW/DG,125 74AUP1G32GW/DG,125 NXP USA Inc. 74AUP1G32.pdf Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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74HCT423BQ,115 74HCT423BQ,115 NXP USA Inc. 74HC_HCT423_Rev_6.pdf Description: IC MMV 2-CIR 22-NS 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
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74LV259BQ,115 74LV259BQ,115 NXP USA Inc. 74LV259.pdf Description: IC D-TYPE ADDR 1:8 16-DHVQFN
Part Status: Obsolete
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Delay Time - Propagation: 36ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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74LV32BQ,115 74LV32BQ,115 NXP USA Inc. 74LV32.pdf Description: IC GATE OR 4CH 2-INP 14DHVQFN
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
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74LV86BQ,115 74LV86BQ,115 NXP USA Inc. 74LV86_Rev3_2017.pdf Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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74LVC126APW/DG,118 74LVC126APW/DG,118 NXP USA Inc. Description: IC BUF NON-INVERT 3.6V 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 1
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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74LVC1G07GW/DG,125 74LVC1G07GW/DG,125 NXP USA Inc. 74LVC1G07.pdf Description: IC BUFF 1.65V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
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74LVC1G08GW/DG,125 NXP USA Inc. Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVC1G125GW/DG,12 74LVC1G125GW/DG,12 NXP USA Inc. PHGLS28878-1.pdf?t.download=true&u=5oefqw Description: IC BUFF 1.65V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
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74LVC1G32GW/DG,125 NXP USA Inc. Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVCH32244AEC/G;5 74LVCH32244AEC/G;5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
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74LVCH32244AEC/G:5 74LVCH32244AEC/G:5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Package / Case: 96-LFBGA
Packaging: Tray
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
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74LVCH32244AEC/G,5 74LVCH32244AEC/G,5 NXP USA Inc. 74LVCH32244A.pdf Description: IC BUF NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tape & Reel (TR)
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74LVCH32245AEC/G;5 74LVCH32245AEC/G;5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32245AEC/G:5 74LVCH32245AEC/G:5 NXP USA Inc. 74LVCH32245A.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32374AEC/G,5 74LVCH32374AEC/G,5 NXP USA Inc. 74LVCH32374A.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT32374EC/G,518 74LVT32374EC/G,518 NXP USA Inc. 74LVT32374.pdf Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT574BQ,115 74LVT574BQ,115 NXP USA Inc. 74LVT(H)574.pdf Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
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74LVTH322245EC,557 74LVTH322245EC,557 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
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74LVTH322245EC,518 74LVTH322245EC,518 NXP USA Inc. 74LVTH322245.pdf Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tape & Reel (TR)
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74LVU04BQ,115 74LVU04BQ,115 NXP USA Inc. 74LVU04.pdf Description: IC INVERTER 6CH 6-INP 14DHVQFN
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ADC1207S080HW/C1,1 ADC1207S080HW/C1,1 NXP USA Inc. ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
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BAP1321LX,315 BAP1321LX,315 NXP USA Inc. BAP1321LX.pdf Description: RF DIODE PIN 60V 130MW 2DFN
Power Dissipation (Max): 130 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP142LX,315 BAP142LX,315 NXP USA Inc. BAP142LX.pdf Description: RF DIODE PIN 50V 130MW SOD2
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Power Dissipation (Max): 130 mW
Current - Max: 100 mA
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BAP50LX,315 BAP50LX,315 NXP USA Inc. BAP50LX.pdf Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
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BAP51LX,315 BAP51LX,315 NXP USA Inc. BAP51LX.pdf Description: RF DIODE PIN 60V 140MW SOD2
Power Dissipation (Max): 140 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP55LX,315 BAP55LX,315 NXP USA Inc. BAP55LX.pdf Description: RF DIODE PIN 50V 135MW DFN1006D2
Power Dissipation (Max): 135 mW
Current - Max: 100 mA
Part Status: Active
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP63LX,315 BAP63LX,315 NXP USA Inc. BAP63LX_Rev2.pdf Description: RF DIODE PIN 50V 135MW SOD2
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BAP65LX,315 BAP65LX,315 NXP USA Inc. BAP65LX.pdf Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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BB202LX,315 BB202LX,315 NXP USA Inc. BB202LX_Rev2.pdf Description: DIODE VARACTOR 6V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD2
Part Status: Obsolete
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
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BF1207,115 BF1207,115 NXP USA Inc. BF1207.pdf Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BF1208D,115 BF1208D,115 NXP USA Inc. BF1208D_Rev1.pdf Description: RF MOSFET 5V SOT666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 32dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-666
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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ADC1004S030TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S030TS/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 30M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Number of A/D Converters: 1
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ADC1004S040TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S040TS/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 40M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1004S050TS/C1:1 ADC1004S050TS-C1-1-2752d47e94cf5451.pdf
ADC1004S050TS/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Part Status: Obsolete
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 50M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1005S060TS/C1:1 ADC1005S060.pdf
ADC1005S060TS/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 10BIT 28SSOP
Number of A/D Converters: 1
Supplier Device Package: 28-SSOP
Number of Inputs: 1
Input Type: Single Ended
Sampling Rate (Per Second): 60M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: External
Data Interface: Parallel
Configuration: ADC
Number of Bits: 10
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
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ADC1207S080HW/C1:5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:5
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Number of A/D Converters: 1
Part Status: Obsolete
Ratio - S/H:ADC: 1:1
Supplier Device Package: 48-HTQFP (7x7)
Number of Inputs: 1
Input Type: Differential
Sampling Rate (Per Second): 80M
Voltage - Supply, Digital: 5V
Voltage - Supply, Analog: 5V
Operating Temperature: -40°C ~ 85°C
Reference Type: Internal
Data Interface: Parallel
Configuration: S/H-ADC
Number of Bits: 12
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tray
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74ABT273AD,118 74ABT273A.pdf
74ABT273AD,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SO
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GTL2010PW,118 GTL2010.pdf
GTL2010PW,118
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 24TSSOP
Supplier Device Package: 24-TSSOP
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Number of Circuits: 1
Voltage - VCCB: 1 V ~ 5.5 V
Voltage - VCCA: 1 V ~ 5.5 V
Channels per Circuit: 10
Translator Type: Voltage Level
Channel Type: Bidirectional
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PCA9554ADB,118 PCA9554_9554A.pdf
PCA9554ADB,118
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SSOP
Part Status: Active
Current - Output Source/Sink: 10mA, 25mA
Supplier Device Package: 16-SSOP
DigiKey Programmable: Not Verified
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 8
Interface: I2C, SMBus
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
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PCF8563TS/4,118 PCF8563.pdf
PCF8563TS/4,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR I2C 8TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Watchdog Timer
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1V ~ 5.5V
Time Format: HH:MM:SS (24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-TSSOP
Current - Timekeeping (Max): 0.6µA ~ 0.75µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 811 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+114.72 грн
10+80.91 грн
25+73.44 грн
100+61.29 грн
250+57.65 грн
500+55.46 грн
Мінімальне замовлення: 3 шт
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MF1FCP2S50/DH,118 MF1FCP2S50.pdf
MF1FCP2S50/DH,118
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ 2FCP
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MPC5567EVBE MPC5567.pdf
MPC5567EVBE
Виробник: NXP USA Inc.
Description: MPC5567 EVAL BRD
Utilized IC / Part: MPC5567
Core Processor: e200
Contents: Board(s), Cable(s), Power Supply, USB Multilink Programmer
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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LPC2157FBD100,551 LPC2157_2158.pdf
LPC2157FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 100LQFP
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LPC2361FBD100,551 LPC2361_62.pdf
LPC2361FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 64KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Not For New Designs
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+998.45 грн
10+768.72 грн
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LPC2362FBD100,551 LPC2361_62.pdf
LPC2362FBD100,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 70
DigiKey Programmable: Not Verified
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LPC2420FBD208,551 LPC2420_60.pdf
LPC2420FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC3220FET296,551 LPC3220_30_40_50.pdf
LPC3220FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
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LPC3230FET296,551 LPC3220_30_40_50.pdf
LPC3230FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Part Status: Obsolete
Number of I/O: 51
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LPC3240FET296,551 LPC3220_30_40_50.pdf
LPC3240FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Packaging: Tray
Package / Case: 296-TFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM926EJ-S
Data Converters: A/D 3x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: DMA, I2S, Motor Control PWM, PWM, WDT
Supplier Device Package: 296-TFBGA (15x15)
Number of I/O: 51
DigiKey Programmable: Not Verified
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LPC3250FET296,551 LPC3220_30_40_50.pdf
LPC3250FET296,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 296TFBGA
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 296-TFBGA
Packaging: Tray
Peripherals: DMA, I2S, LCD, Motor Control PWM, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Voltage - Supply (Vcc/Vdd): 0.9V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 3x10b
Core Processor: ARM926EJ-S
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256K x 8
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Obsolete
Supplier Device Package: 296-TFBGA (15x15)
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BGY588C,112 BGY588C.pdf
BGY588C,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Number of Circuits: 1
Part Status: Obsolete
Supplier Device Package: SOT115J
Applications: CATV
Mounting Type: Chassis Mount
Output Type: Push-Pull
Package / Case: SOT-115J
Packaging: Tube
Current - Supply: 325 mA
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Tape & Reel (TR)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+49.10 грн
5000+46.20 грн
7500+45.66 грн
12500+42.29 грн
Мінімальне замовлення: 2500 шт
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PCF2123TS/1,118 PCF2123.pdf
PCF2123TS/1,118
Виробник: NXP USA Inc.
Description: IC RTC CLK/CALENDAR SPI 14TSSOP
Packaging: Cut Tape (CT)
Features: Alarm, Leap Year, Square Wave Output, Watchdog Timer
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: SPI
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.6V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 14-TSSOP
Current - Timekeeping (Max): 0.33µA ~ 0.38µA @ 2V ~ 5V
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 30000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+99.69 грн
10+69.94 грн
25+63.42 грн
100+52.78 грн
250+49.58 грн
500+47.64 грн
1000+45.41 грн
Мінімальне замовлення: 4 шт
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74HCT640D,653 74HC(T)640.pdf
74HCT640D,653
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER INVERT 5.5V 20SO
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74LVCH162244ADGG:5 74LVC(H)162244A_Rev6_2017.pdf
74LVCH162244ADGG:5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 48TSSOP
Supplier Device Package: 48-TSSOP
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Packaging: Cut Tape (CT)
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74LVT574PW,118 74LVT%28H%29574.pdf
74LVT574PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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N74F138D,623 DS_568_74F138.pdf
N74F138D,623
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16SO
Current - Output High, Low: 1mA, 20mA
Independent Circuits: 1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Type: Decoder/Demultiplexer
Circuit: 1 x 3:8
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 16-SO
Voltage Supply Source: Single Supply
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MC44CC375AVEFEVK MC44CC375AV.pdf
Виробник: NXP USA Inc.
Description: CCEVK NEJA EVAL KIT
Utilized IC / Part: MC44CC375AV
Contents: Board(s)
Part Status: Obsolete
Supplied Contents: Board(s)
Type: Modulator
For Use With/Related Products: MC44CC375AV
Packaging: Bulk
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2N7002T,215 2N7002T_1.pdf
2N7002T,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 60V 300MA TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 300mA (Ta)
Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
Power Dissipation (Max): 830mW (Ta)
Vgs(th) (Max) @ Id: 2.5V @ 1mA
Supplier Device Package: SOT-23 (TO-236AB)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Input Capacitance (Ciss) (Max) @ Vds: 40 pF @ 10 V
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74AUP1G32GW/DG,125 74AUP1G32.pdf
74AUP1G32GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 6.4ns @ 3.3V, 30pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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74HCT423BQ,115 74HC_HCT423_Rev_6.pdf
74HCT423BQ,115
Виробник: NXP USA Inc.
Description: IC MMV 2-CIR 22-NS 16-DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Monostable
Operating Temperature: -40°C ~ 125°C
Propagation Delay: 22 ns
Independent Circuits: 2
Current - Output High, Low: 4mA, 4mA
Schmitt Trigger Input: No
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
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74LV259BQ,115 74LV259.pdf
74LV259BQ,115
Виробник: NXP USA Inc.
Description: IC D-TYPE ADDR 1:8 16-DHVQFN
Part Status: Obsolete
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Delay Time - Propagation: 36ns
Current - Output High, Low: 6mA, 6mA
Independent Circuits: 1
Voltage - Supply: 1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: D-Type, Addressable
Circuit: 1:8
Mounting Type: Surface Mount
Output Type: Standard
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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74LV32BQ,115 74LV32.pdf
74LV32BQ,115
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DHVQFN
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Max Propagation Delay @ V, Max CL: 8ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: OR Gate
Mounting Type: Surface Mount
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74LV86BQ,115 74LV86_Rev3_2017.pdf
74LV86BQ,115
Виробник: NXP USA Inc.
Description: IC GATE XOR 4CH 2-INP 14DHVQFN
Current - Quiescent (Max): 40 µA
Number of Circuits: 4
Part Status: Obsolete
Max Propagation Delay @ V, Max CL: 13ns @ 3.3V, 50pF
Input Logic Level - Low: 0.3V ~ 0.8V
Input Logic Level - High: 0.9V ~ 2V
Supplier Device Package: 14-DHVQFN (2.5x3)
Number of Inputs: 2
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 1V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Logic Type: XOR (Exclusive OR)
Mounting Type: Surface Mount
Package / Case: 14-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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74LVC126APW/DG,118
74LVC126APW/DG,118
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 14TSSOP
Part Status: Obsolete
Supplier Device Package: 14-TSSOP
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 1
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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74LVC1G07GW/DG,125 74LVC1G07.pdf
74LVC1G07GW/DG,125
Виробник: NXP USA Inc.
Description: IC BUFF 1.65V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: -, 32mA
Supplier Device Package: 5-TSSOP
Part Status: Obsolete
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74LVC1G08GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE AND 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: AND Gate
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Part Status: Obsolete
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVC1G125GW/DG,12 PHGLS28878-1.pdf?t.download=true&u=5oefqw
74LVC1G125GW/DG,12
Виробник: NXP USA Inc.
Description: IC BUFF 1.65V 5-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 5-TSSOP
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74LVC1G32GW/DG,125
Виробник: NXP USA Inc.
Description: IC GATE OR 1CH 2-INP 5TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 5-TSSOP
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 1.7ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 200 µA
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74LVCH32244AEC/G;5 74LVCH32244A.pdf
74LVCH32244AEC/G;5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
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74LVCH32244AEC/G:5 74LVCH32244A.pdf
74LVCH32244AEC/G:5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Package / Case: 96-LFBGA
Packaging: Tray
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
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74LVCH32244AEC/G,5 74LVCH32244A.pdf
74LVCH32244AEC/G,5
Виробник: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 4
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 8
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tape & Reel (TR)
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74LVCH32245AEC/G;5 74LVCH32245A.pdf
74LVCH32245AEC/G;5
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32245AEC/G:5 74LVCH32245A.pdf
74LVCH32245AEC/G:5
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
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74LVCH32374AEC/G,5 74LVCH32374A.pdf
74LVCH32374AEC/G,5
Виробник: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT32374EC/G,518 74LVT32374.pdf
74LVT32374EC/G,518
Виробник: NXP USA Inc.
Description: IC FF D-TYPE QUAD 8BIT 96LFBGA
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74LVT574BQ,115 74LVT(H)574.pdf
74LVT574BQ,115
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20DHVQFN
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74LVTH322245EC,557 74LVTH322245.pdf
74LVTH322245EC,557
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tray
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74LVTH322245EC,518 74LVTH322245.pdf
74LVTH322245EC,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)
Current - Output High, Low: 12mA, 12mA
Number of Bits per Element: 8
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 4
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 96-LFBGA
Packaging: Tape & Reel (TR)
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74LVU04BQ,115 74LVU04.pdf
74LVU04BQ,115
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 6-INP 14DHVQFN
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ADC1207S080HW/C1,1 ADC1207S080.pdf
ADC1207S080HW/C1,1
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
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BAP1321LX,315 BAP1321LX.pdf
BAP1321LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 130MW 2DFN
Power Dissipation (Max): 130 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP142LX,315 BAP142LX.pdf
BAP142LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 130MW SOD2
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.26pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Power Dissipation (Max): 130 mW
Current - Max: 100 mA
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BAP50LX,315 BAP50LX.pdf
BAP50LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 150MW SOD2
Power Dissipation (Max): 150 mW
Current - Max: 50 mA
Supplier Device Package: SOD2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 3Ohm @ 10mA, 100MHz
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
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BAP51LX,315 BAP51LX.pdf
BAP51LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 140MW SOD2
Power Dissipation (Max): 140 mW
Current - Max: 100 mA
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.3pF @ 5V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP55LX,315 BAP55LX.pdf
BAP55LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 135MW DFN1006D2
Power Dissipation (Max): 135 mW
Current - Max: 100 mA
Part Status: Active
Supplier Device Package: DFN1006D-2
Voltage - Peak Reverse (Max): 50V
Resistance @ If, F: 800mOhm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.28pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: 2-XDFN
Packaging: Tape & Reel (TR)
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BAP63LX,315 BAP63LX_Rev2.pdf
BAP63LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 135MW SOD2
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BAP65LX,315 BAP65LX.pdf
BAP65LX,315
Виробник: NXP USA Inc.
Description: RF DIODE PIN 30V 135MW SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.37pF @ 20V, 1MHz
Resistance @ If, F: 350mOhm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 30V
Supplier Device Package: SOD2
Current - Max: 100 mA
Power Dissipation (Max): 135 mW
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BB202LX,315 BB202LX_Rev2.pdf
BB202LX,315
Виробник: NXP USA Inc.
Description: DIODE VARACTOR 6V SINGLE SOD2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 85°C (TJ)
Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio Condition: C0.2/C2.3
Supplier Device Package: SOD2
Part Status: Obsolete
Voltage - Peak Reverse (Max): 6 V
Capacitance Ratio: 2.5
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BF1207,115 BF1207.pdf
BF1207,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V 6TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 6-TSSOP, SC-88, SOT-363
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 30dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.3dB
Supplier Device Package: 6-TSSOP
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 18 mA
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BF1208D,115 BF1208D_Rev1.pdf
BF1208D,115
Виробник: NXP USA Inc.
Description: RF MOSFET 5V SOT666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 400MHz
Configuration: N-Channel Dual Gate
Gain: 32dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 0.9dB
Supplier Device Package: SOT-666
Voltage - Rated: 6 V
Voltage - Test: 5 V
Current - Test: 19 mA
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