Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35364) > Сторінка 127 з 590

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MXC9ATLAS-PMB NXP USA Inc. Description: BOARD ATLAS PM
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USBMLPPCBDM NXP USA Inc. Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MPC5xx / 55xx
Part Status: Active
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USBMLPPCNEXUS USBMLPPCNEXUS NXP USA Inc. Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
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TJA1041T/N1,512 TJA1041T/N1,512 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/N1,518 TJA1041T/N1,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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LH79520N0Q000B1;55 LH79520N0Q000B1;55 NXP USA Inc. LH79520.pdf Description: IC MCU 32BIT ROMLESS 176LQFP
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LH79524N0F100A1;55 LH79524N0F100A1;55 NXP USA Inc. LH79524_525_N.pdf Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
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LH79525N0Q100A1;55 LH79525N0Q100A1;55 NXP USA Inc. LH79524_525_N.pdf Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
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LH7A404N0F000B3;55 LH7A404N0F000B3;55 NXP USA Inc. LH7A404_N.pdf Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LH7A404N0F092B3;55 LH7A404N0F092B3;55 NXP USA Inc. LH7A404_N.pdf Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LH75411N0Q100C0;55 LH75411N0Q100C0;55 NXP USA Inc. LH75%28401%2C411%29.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
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LH7A400N0G000B5;55 LH7A400N0G000B5;55 NXP USA Inc. LH7A400_N.pdf Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
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3806620 3806620 NXP USA Inc. Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
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3806684 3806684 NXP USA Inc. Description: KIT SCHOTTKY DIODE 17 VALUES
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BLF6G20-230P BLF6G20-230P NXP USA Inc. Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
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MCF51JM128EVLK MCF51JM128EVLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 842 шт:
термін постачання 21-31 дні (днів)
1+1331.50 грн
10+1017.59 грн
25+951.54 грн
80+834.19 грн
230+795.11 грн
450+775.67 грн
В кошику  од. на суму  грн.
MCF51JM128VLK MCF51JM128VLK NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 492 шт:
термін постачання 21-31 дні (днів)
1+1181.91 грн
10+815.45 грн
25+732.46 грн
80+612.30 грн
230+561.68 грн
450+536.23 грн
В кошику  од. на суму  грн.
MCF51JM128VQH MCF51JM128VQH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 934 шт:
термін постачання 21-31 дні (днів)
1+1057.80 грн
10+802.79 грн
25+748.86 грн
80+654.66 грн
420+608.31 грн
840+594.49 грн
В кошику  од. на суму  грн.
MCF51JM128VLH MCF51JM128VLH NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
на замовлення 1231 шт:
термін постачання 21-31 дні (днів)
1+1065.20 грн
10+810.78 грн
25+757.03 грн
100+654.98 грн
250+628.55 грн
800+603.45 грн
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MCF51JM128VLD MCF51JM128VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MCF51JM64VLD MCF51JM64VLD NXP USA Inc. MCF51JM128.pdf Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
1+1006.02 грн
10+773.98 грн
80+653.72 грн
800+609.73 грн
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DEMOJM DEMOJM NXP USA Inc. DEMOJMUM.pdf Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
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SL3ICS1002FUG/V7AF NXP USA Inc. Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
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SA58637BS,118 SA58637BS,118 NXP USA Inc. SA58637.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
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SA58670ABS,115 SA58670ABS,115 NXP USA Inc. SA58670A.pdf Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
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SA58671UK,027 SA58671UK,027 NXP USA Inc. SA58671.pdf Description: IC AMP CLASS D STER 1.3W 16WLCSP
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CWP-PRO-NL CWP-PRO-NL NXP USA Inc. 950-00088.pdf Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+444681.39 грн
В кошику  од. на суму  грн.
TJA1080TS,118 TJA1080TS,118 NXP USA Inc. TJA1080.pdf Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
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OM11005 OM11005 NXP USA Inc. Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
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OM11013,598 OM11013,598 NXP USA Inc. Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
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MC34671AEPR2 MC34671AEPR2 NXP USA Inc. MC34671.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 5643 шт:
термін постачання 21-31 дні (днів)
3+149.59 грн
10+106.22 грн
25+96.78 грн
100+81.18 грн
250+76.57 грн
500+73.79 грн
1000+70.33 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC34673AEPR2 MC34673AEPR2 NXP USA Inc. MC34673.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 5605 шт:
термін постачання 21-31 дні (днів)
3+147.94 грн
10+105.42 грн
25+96.12 грн
100+80.60 грн
250+76.03 грн
500+73.27 грн
1000+69.84 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC34674AEPR2 MC34674AEPR2 NXP USA Inc. MC34674.pdf Description: IC BATT CHG LI-ION 1CELL 8UDFN
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MC9S08QE128CFT MC9S08QE128CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
1+948.49 грн
10+717.39 грн
80+593.94 грн
1300+486.15 грн
В кошику  од. на суму  грн.
MC9S08QE96CLH MC9S08QE96CLH NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 96KB FLASH 64LQFP
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MC9S08QE128CLD MC9S08QE128CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
1+870.40 грн
10+658.27 грн
80+545.00 грн
В кошику  од. на суму  грн.
MC9S08QE64CFT MC9S08QE64CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC9S08QE64CLD MC9S08QE64CLD NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 64KB FLASH 44LQFP
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DEMOACKIT DEMOACKIT NXP USA Inc. DEMOACKIT_QSG.pdf Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
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MC9S08AC128CFGE MC9S08AC128CFGE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 665 шт:
термін постачання 21-31 дні (днів)
1+770.13 грн
10+580.23 грн
25+539.94 грн
100+465.19 грн
250+445.38 грн
В кошику  од. на суму  грн.
MC9S08AC128CLKE MC9S08AC128CLKE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
1+826.02 грн
10+623.68 грн
25+580.81 грн
100+500.90 грн
В кошику  од. на суму  грн.
LPC2470FBD208,551 LPC2470FBD208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC2470FET208,551 LPC2470FET208,551 NXP USA Inc. LPC2470.pdf Description: IC MCU 16/32BIT ROMLESS 208TFBGA
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LPC2478FBD208,551 LPC2478FBD208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32B 512KB FLSH 208LQFP
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LPC2478FET208,551 LPC2478FET208,551 NXP USA Inc. LPC2478.pdf Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
1+2254.50 грн
10+1754.85 грн
25+1650.75 грн
В кошику  од. на суму  грн.
LPC2104FBD48/01,15 LPC2104FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2105FBD48/01,15 LPC2105FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2106FBD48/01,15 LPC2106FBD48/01,15 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 190 шт:
термін постачання 21-31 дні (днів)
1+1948.75 грн
10+1508.15 грн
25+1416.04 грн
80+1246.80 грн
В кошику  од. на суму  грн.
LPC2106FHN48/01,55 LPC2106FHN48/01,55 NXP USA Inc. LPC2104_2105_2106.pdf Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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OM11015 OM11015 NXP USA Inc. LPC2478_Rev3.1.pdf Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
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TJA1055T/3,518 TJA1055T/3,518 NXP USA Inc. TJA1055.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
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UJA1065TW/3V0,518 UJA1065TW/3V0,518 NXP USA Inc. UJA1065.pdf Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
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DEMO9S08QE8 DEMO9S08QE8 NXP USA Inc. QE8QE4QSG.pdf description Description: MC9S08QE8 EVAL BRD
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MC34700EP MC34700EP NXP USA Inc. MC34700FS.pdf Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
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MC9S08AC32CFDE MC9S08AC32CFDE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
на замовлення 1678 шт:
термін постачання 21-31 дні (днів)
1+565.48 грн
10+421.54 грн
25+390.89 грн
100+335.19 грн
250+320.11 грн
500+311.02 грн
1300+296.13 грн
В кошику  од. на суму  грн.
MC9S08AC32CFGE MC9S08AC32CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 860 шт:
термін постачання 21-31 дні (днів)
1+587.67 грн
10+437.29 грн
25+405.14 грн
80+351.51 грн
230+332.47 грн
800+316.18 грн
В кошику  од. на суму  грн.
MC9S08AC32CPUE MC9S08AC32CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
на замовлення 210 шт:
термін постачання 21-31 дні (днів)
1+757.80 грн
10+507.97 грн
25+450.57 грн
80+370.86 грн
В кошику  од. на суму  грн.
MC9S08AC48CFGE MC9S08AC48CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MXC9ATLAS-PMB
Виробник: NXP USA Inc.
Description: BOARD ATLAS PM
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USBMLPPCBDM
Виробник: NXP USA Inc.
Description: MULTILINK P&E POWERPC USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MPC5xx / 55xx
Part Status: Active
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USBMLPPCNEXUS
USBMLPPCNEXUS
Виробник: NXP USA Inc.
Description: MULTILINK P&E POWERPC NEXUS USB
Packaging: Bulk
For Use With/Related Products: MPC5xx / 55xx
Type: Debugger (In-Circuit/In-System)
Contents: Board(s)
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TJA1041T/N1,512 TJA1041.pdf
TJA1041T/N1,512
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/N1,518 TJA1041.pdf
TJA1041T/N1,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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LH79520N0Q000B1;55 LH79520.pdf
LH79520N0Q000B1;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
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LH79524N0F100A1;55 LH79524_525_N.pdf
LH79524N0F100A1;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208LFBGA
Packaging: Tray
Package / Case: 208-LFBGA
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LFBGA (14x14)
Number of I/O: 108
DigiKey Programmable: Not Verified
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LH79525N0Q100A1;55 LH79524_525_N.pdf
LH79525N0Q100A1;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 76.2MHz
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 10x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, Ethernet, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 86
DigiKey Programmable: Not Verified
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LH7A404N0F000B3;55 LH7A404_N.pdf
LH7A404N0F000B3;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LH7A404N0F092B3;55 LH7A404_N.pdf
LH7A404N0F092B3;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 324LFBGA
Packaging: Tray
Package / Case: 324-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Data Converters: A/D 9x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, PS/2, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 324-LFBGA (17x17)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LH75411N0Q100C0;55 LH75%28401%2C411%29.pdf
LH75411N0Q100C0;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 84MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 76
DigiKey Programmable: Not Verified
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LH7A400N0G000B5;55 LH7A400_N.pdf
LH7A400N0G000B5;55
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256BGA
Packaging: Tray
Package / Case: 256-BGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: ARM9®
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, IrDA, Microwire, Memory Card, SmartCard, SPI, SSI, SSP, UART/USART, USB
Peripherals: AC'97, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 256-BGA (17x17)
Number of I/O: 60
DigiKey Programmable: Not Verified
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3806620
3806620
Виробник: NXP USA Inc.
Description: KIT BISS TRANSISTORS 17 VALUES
Packaging: Case
Mounting Type: Surface Mount
Quantity: 425 Pieces (17 Values - 25 Each)
Kit Type: Transistors
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3806684
3806684
Виробник: NXP USA Inc.
Description: KIT SCHOTTKY DIODE 17 VALUES
товару немає в наявності
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BLF6G20-230P
BLF6G20-230P
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V LDMOST
Packaging: Bag
Package / Case: SOT-502A
Current Rating (Amps): 5µA
Mounting Type: Chassis Mount
Frequency: 1.8GHz
Power - Output: 50W
Gain: 16.5dB
Technology: LDMOS
Supplier Device Package: LDMOST
Part Status: Obsolete
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 2 A
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MCF51JM128EVLK MCF51JM128.pdf
MCF51JM128EVLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 842 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1331.50 грн
10+1017.59 грн
25+951.54 грн
80+834.19 грн
230+795.11 грн
450+775.67 грн
В кошику  од. на суму  грн.
MCF51JM128VLK MCF51JM128.pdf
MCF51JM128VLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 492 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1181.91 грн
10+815.45 грн
25+732.46 грн
80+612.30 грн
230+561.68 грн
450+536.23 грн
В кошику  од. на суму  грн.
MCF51JM128VQH MCF51JM128.pdf
MCF51JM128VQH
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Not Verified
на замовлення 934 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1057.80 грн
10+802.79 грн
25+748.86 грн
80+654.66 грн
420+608.31 грн
840+594.49 грн
В кошику  од. на суму  грн.
MCF51JM128VLH MCF51JM128.pdf
MCF51JM128VLH
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 51
DigiKey Programmable: Verified
на замовлення 1231 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1065.20 грн
10+810.78 грн
25+757.03 грн
100+654.98 грн
250+628.55 грн
800+603.45 грн
В кошику  од. на суму  грн.
MCF51JM128VLD MCF51JM128.pdf
MCF51JM128VLD
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
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MCF51JM64VLD MCF51JM128.pdf
MCF51JM64VLD
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 33
DigiKey Programmable: Not Verified
на замовлення 1600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1006.02 грн
10+773.98 грн
80+653.72 грн
800+609.73 грн
В кошику  од. на суму  грн.
DEMOJM DEMOJMUM.pdf
DEMOJM
Виробник: NXP USA Inc.
Description: MCF51JM128/MC9S08JM60 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s), Accessories
Board Type: Evaluation Platform
Utilized IC / Part: MCF51JM128, MC9S08JM60
Part Status: Obsolete
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SL3ICS1002FUG/V7AF
Виробник: NXP USA Inc.
Description: IC UCODE G2XM FFC
Packaging: Tube
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C
Standards: ISO 15962, ISO 15963, ISO 18000-1, ISO 18000-6, ISO 19762
Supplier Device Package: Wafer
Part Status: Active
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
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SA58637BS,118 SA58637.pdf
SA58637BS,118
Виробник: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
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SA58670ABS,115 SA58670A.pdf
SA58670ABS,115
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 2.1W 20HVQFN
Features: Differential Inputs, Short-Circuit and Thermal Protection, Shutdown
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Max Output Power x Channels @ Load: 2.1W x 2 @ 4Ohm
Supplier Device Package: 20-HVQFN (4x4)
Part Status: Obsolete
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SA58671UK,027 SA58671.pdf
SA58671UK,027
Виробник: NXP USA Inc.
Description: IC AMP CLASS D STER 1.3W 16WLCSP
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CWP-PRO-NL 950-00088.pdf
CWP-PRO-NL
Виробник: NXP USA Inc.
Description: SOFTWARE CODE WARRIOR
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Operating System: Windows XP, 7
Edition: Professional
License Length: Perpetual
License - User Details: Fixed Node
Media Delivery Type: Electronically Delivered
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+444681.39 грн
В кошику  од. на суму  грн.
TJA1080TS,118 TJA1080.pdf
TJA1080TS,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 20SSOP
Packaging: Cut Tape (CT)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Interface: FlexRay
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 20-SSOP
Grade: Automotive
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OM11005
OM11005
Виробник: NXP USA Inc.
Description: DISPLAY QVGA TFT FOR OM10100
Packaging: Box
For Use With/Related Products: OM10100
Accessory Type: LCD Display
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OM11013,598
OM11013,598
Виробник: NXP USA Inc.
Description: LPC2387 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM7
Utilized IC / Part: LPC2387
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MC34671AEPR2 MC34671.pdf
MC34671AEPR2
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 600mA
Fault Protection: Over Temperature, Over Voltage
Voltage - Supply (Max): 10V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 5643 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+149.59 грн
10+106.22 грн
25+96.78 грн
100+81.18 грн
250+76.57 грн
500+73.79 грн
1000+70.33 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC34673AEPR2 MC34673.pdf
MC34673AEPR2
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN Exposed Pad
Number of Cells: 1
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Battery Chemistry: Lithium Ion/Polymer
Supplier Device Package: 8-UDFN (3x2)
Charge Current - Max: 1.2A
Fault Protection: Over Voltage
Voltage - Supply (Max): 6.6V
Battery Pack Voltage: 4.2V
Current - Charging: Constant - Programmable
на замовлення 5605 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+147.94 грн
10+105.42 грн
25+96.12 грн
100+80.60 грн
250+76.03 грн
500+73.27 грн
1000+69.84 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC34674AEPR2 MC34674.pdf
MC34674AEPR2
Виробник: NXP USA Inc.
Description: IC BATT CHG LI-ION 1CELL 8UDFN
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MC9S08QE128CFT MC9S08QE128.pdf
MC9S08QE128CFT
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+948.49 грн
10+717.39 грн
80+593.94 грн
1300+486.15 грн
В кошику  од. на суму  грн.
MC9S08QE96CLH MC9S08QE128.pdf
MC9S08QE96CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 64LQFP
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MC9S08QE128CLD MC9S08QE128.pdf
MC9S08QE128CLD
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 3200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+870.40 грн
10+658.27 грн
80+545.00 грн
В кошику  од. на суму  грн.
MC9S08QE64CFT MC9S08QE128.pdf
MC9S08QE64CFT
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC9S08QE64CLD MC9S08QE128.pdf
MC9S08QE64CLD
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44LQFP
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DEMOACKIT DEMOACKIT_QSG.pdf
DEMOACKIT
Виробник: NXP USA Inc.
Description: MC9S08AC128/MCF51AC256 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08AC128, MCF51AC256
Part Status: Active
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MC9S08AC128CFGE MC9S08AC60AD.pdf
MC9S08AC128CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
на замовлення 665 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+770.13 грн
10+580.23 грн
25+539.94 грн
100+465.19 грн
250+445.38 грн
В кошику  од. на суму  грн.
MC9S08AC128CLKE MC9S08AC60AD.pdf
MC9S08AC128CLKE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 69
DigiKey Programmable: Not Verified
на замовлення 256 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+826.02 грн
10+623.68 грн
25+580.81 грн
100+500.90 грн
В кошику  од. на суму  грн.
LPC2470FBD208,551 LPC2470.pdf
LPC2470FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
RAM Size: 98K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 160
DigiKey Programmable: Not Verified
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LPC2470FET208,551 LPC2470.pdf
LPC2470FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208TFBGA
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LPC2478FBD208,551 LPC2478.pdf
LPC2478FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 512KB FLSH 208LQFP
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LPC2478FET208,551 LPC2478.pdf
LPC2478FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 208TFBGA
Packaging: Tray
Package / Case: 208-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 208-TFBGA (15x15)
Part Status: Not For New Designs
Number of I/O: 160
DigiKey Programmable: Not Verified
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2254.50 грн
10+1754.85 грн
25+1650.75 грн
В кошику  од. на суму  грн.
LPC2104FBD48/01,15 LPC2104_2105_2106.pdf
LPC2104FBD48/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2105FBD48/01,15 LPC2104_2105_2106.pdf
LPC2105FBD48/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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LPC2106FBD48/01,15 LPC2104_2105_2106.pdf
LPC2106FBD48/01,15
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Not For New Designs
Number of I/O: 32
DigiKey Programmable: Not Verified
на замовлення 190 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1948.75 грн
10+1508.15 грн
25+1416.04 грн
80+1246.80 грн
В кошику  од. на суму  грн.
LPC2106FHN48/01,55 LPC2104_2105_2106.pdf
LPC2106FHN48/01,55
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 128KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
DigiKey Programmable: Not Verified
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OM11015 LPC2478_Rev3.1.pdf
OM11015
Виробник: NXP USA Inc.
Description: LPC2478 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2478
Part Status: Obsolete
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TJA1055T/3,518 TJA1055.pdf
TJA1055T/3,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Duplex: Half
Part Status: Obsolete
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UJA1065TW/3V0,518 UJA1065.pdf
UJA1065TW/3V0,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Cut Tape (CT)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 52V
Applications: Networking
Supplier Device Package: 32-HTSSOP
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DEMO9S08QE8 description QE8QE4QSG.pdf
DEMO9S08QE8
Виробник: NXP USA Inc.
Description: MC9S08QE8 EVAL BRD
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MC34700EP MC34700FS.pdf
MC34700EP
Виробник: NXP USA Inc.
Description: IC REG QUAD BUCK/LNR SYNC 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 9V ~ 18V
Frequency - Switching: 800kHz
Topology: Step-Down (Buck) Synchronous (3), Linear (LDO) (1)
Supplier Device Package: 32-QFN-EP (5x5)
Voltage/Current - Output 1: 2V ~ 5.25V, 1.5A
Voltage/Current - Output 2: 0.7V ~ 3.6V, 1.25A
Voltage/Current - Output 3: 0.7V ~ 3.6V, 1.25A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Number of Outputs: 4
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MC9S08AC32CFDE MC9S08AC60AD.pdf
MC9S08AC32CFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Verified
на замовлення 1678 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+565.48 грн
10+421.54 грн
25+390.89 грн
100+335.19 грн
250+320.11 грн
500+311.02 грн
1300+296.13 грн
В кошику  од. на суму  грн.
MC9S08AC32CFGE MC9S08AC60.pdf
MC9S08AC32CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 860 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+587.67 грн
10+437.29 грн
25+405.14 грн
80+351.51 грн
230+332.47 грн
800+316.18 грн
В кошику  од. на суму  грн.
MC9S08AC32CPUE MC9S08AC60.pdf
MC9S08AC32CPUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
на замовлення 210 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+757.80 грн
10+507.97 грн
25+450.57 грн
80+370.86 грн
В кошику  од. на суму  грн.
MC9S08AC48CFGE MC9S08AC60.pdf
MC9S08AC48CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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