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TJA1041AT/VM,518 TJA1041AT/VM,518 NXP USA Inc. TJA1041A.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1040T/VM,118 TJA1040T/VM,118 NXP USA Inc. TJA1040.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/VM,518 TJA1041T/VM,518 NXP USA Inc. TJA1041.pdf Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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PN5331B3HN/C270,55 PN5331B3HN/C270,55 NXP USA Inc. PN5331B3HN.pdf Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4396 шт:
термін постачання 21-31 дні (днів)
1+1063.82 грн
10+890.94 грн
25+844.64 грн
80+742.16 грн
230+700.47 грн
490+672.87 грн
980+638.48 грн
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1N4148,133 1N4148,133 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4148,143 1N4148,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4448,143 1N4448,143 NXP USA Inc. 1N4148_1N4448_DS_Rev_Feb2017.pdf Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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ADC1207S080HW/C1,5 ADC1207S080HW/C1,5 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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ADC1207S080HW/C1:1 ADC1207S080HW/C1:1 NXP USA Inc. DS_568_ADC1207S080.pdf Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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BAW62,133 BAW62,133 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BAW62,143 BAW62,143 NXP USA Inc. BAW62_Rev_Feb2017.pdf Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BT136-600E/02,127 BT136-600E/02,127 NXP USA Inc. BT136-600E.pdf Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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BUK7510-55AL,127 BUK7510-55AL,127 NXP USA Inc. BUK7510-55AL.pdf Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
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BUK752R3-40C,127 BUK752R3-40C,127 NXP USA Inc. BUK752R3-40C.pdf Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B,127 NXP USA Inc. BUK753R4-30B.pdf Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C,127 NXP USA Inc. BUK754R3-75C.pdf Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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BUK7609-55A,118 BUK7609-55A,118 NXP USA Inc. Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
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BUK7619-100B,118 BUK7619-100B,118 NXP USA Inc. BUK7619-100B.pdf Description: MOSFET N-CH 100V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Qualification: AEC-Q101
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BUK761R8-30C,118 BUK761R8-30C,118 NXP USA Inc. BUK761R8-30C.pdf Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7880-55A,115 BUK7880-55A,115 NXP USA Inc. BUK7880-55A.pdf Description: MOSFET N-CH 55V 7A SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Qualification: AEC-Q101
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BUK7E07-55B,127 BUK7E07-55B,127 NXP USA Inc. BUK7E07-55B.pdf Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Power Dissipation (Max): 203W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Qualification: AEC-Q101
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BUK7E4R3-75C,127 BUK7E4R3-75C,127 NXP USA Inc. Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A,118 NXP USA Inc. BUK9213-30A.pdf Description: MOSFET N-CH 30V 55A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
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BY329-1000,127 BY329-1000,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
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BY329-1200,127 BY329-1200,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1.2KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
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CGY888C,112 CGY888C,112 NXP USA Inc. CGY888C.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
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CX24123-11Z,518 CX24123-11Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-11Z,557 CX24123-11Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-21Z,518 CX24123-21Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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CX24123-21Z,557 CX24123-21Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tray
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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LPC2930FET208,551 LPC2930FET208,551 NXP USA Inc. Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FBD208,551 LPC2939FBD208,551 NXP USA Inc. LPC2939.pdf Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FET208,551 LPC2939FET208,551 NXP USA Inc. Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MFRC52201HN1,151 MFRC52201HN1,151 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC52301HN1,157 NXP USA Inc. MFRC523.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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MFRC53001T/0FE,518 MFRC53001T/0FE,518 NXP USA Inc. Description: IC RFID READER 13.56MHZ 32SO
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V ~ 5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-SO
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P89LPC9201FDH,112 P89LPC9201FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9211FDH,112 P89LPC9211FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
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P89LPC922A1FDH,112 P89LPC922A1FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC922A1FN,112 P89LPC922A1FN,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9241FDH,112 P89LPC9241FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9251FDH,112 P89LPC9251FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9301FDH,512 P89LPC9301FDH,512 NXP USA Inc. P89LPC9301_931A1.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC931A1FDH,512 P89LPC931A1FDH,512 NXP USA Inc. P89LPC9301_931A1.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9321FA,529 P89LPC9321FA,529 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9331FDH,512 P89LPC9331FDH,512 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC9341FDH,512 P89LPC9341FDH,512 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9351FA,529 P89LPC9351FA,529 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9401FBD,557 P89LPC9401FBD,557 NXP USA Inc. P89LPC9401.pdf Description: IC MCU 8BIT 8KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 23
DigiKey Programmable: Not Verified
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P89LPC9402FBD,557 P89LPC9402FBD,557 NXP USA Inc. P89LPC9402.pdf Description: IC MCU 8BIT 8KB FLASH 64LQFP
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PBSS5140V,315 PBSS5140V,315 NXP USA Inc. PBSS5140V.pdf Description: TRANS PNP 40V 1A SOT666
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PCA24S08D/DG,118 PCA24S08D/DG,118 NXP USA Inc. PCA24S08.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
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PCA9557D/DG,118 PCA9557D/DG,118 NXP USA Inc. PCA9557.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9575PW2,118 PCA9575PW2,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 28TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 28-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+87.63 грн
Мінімальне замовлення: 2500
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PDTA143ZK,135 PDTA143ZK,135 NXP USA Inc. PDTA143Z_Series_Rev2009.pdf Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PESD3V3L1UA,115 PESD3V3L1UA,115 NXP USA Inc. PESD3V3L1UA_UB_UL.pdf Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PHP165NQ08T,127 PHP165NQ08T,127 NXP USA Inc. PHP165NQ08T.pdf Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8250 pF @ 25 V
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PMN38EN,135 PMN38EN,135 NXP USA Inc. PMN38EN.pdf Description: MOSFET N-CH 30V 5.4A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 3A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 6.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 495 pF @ 25 V
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PMN49EN,135 PMN49EN,135 NXP USA Inc. PMN49EN.pdf Description: MOSFET N-CH 30V 4.6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 47mOhm @ 2A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V
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PMN49EN,165 PMN49EN,165 NXP USA Inc. PMN49EN.pdf Description: MOSFET N-CH 30V 4.6A 6TSOP
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TJA1041AT/VM,518 TJA1041A.pdf
TJA1041AT/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 80°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1040T/VM,118 TJA1040.pdf
TJA1040T/VM,118
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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TJA1041T/VM,518 TJA1041.pdf
TJA1041T/VM,518
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete
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PN5331B3HN/C270,55 PN5331B3HN.pdf
PN5331B3HN/C270,55
Виробник: NXP USA Inc.
Description: IC RFID RDR/TRAN 13.56MZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Active
на замовлення 4396 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1063.82 грн
10+890.94 грн
25+844.64 грн
80+742.16 грн
230+700.47 грн
490+672.87 грн
980+638.48 грн
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1N4148,133 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4148,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4148,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 10 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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1N4448,143 1N4148_1N4448_DS_Rev_Feb2017.pdf
1N4448,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 100V 200MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 4pF @ 0V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 25 nA @ 20 V
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ADC1207S080HW/C1,5 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1,5
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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ADC1207S080HW/C1:1 DS_568_ADC1207S080.pdf
ADC1207S080HW/C1:1
Виробник: NXP USA Inc.
Description: IC ADC 12BIT 48HTQFP
Packaging: Tray
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Number of Bits: 12
Configuration: S/H-ADC
Data Interface: Parallel
Reference Type: Internal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 5V
Voltage - Supply, Digital: 5V
Sampling Rate (Per Second): 80M
Input Type: Differential
Number of Inputs: 1
Supplier Device Package: 48-HTQFP (7x7)
Ratio - S/H:ADC: 1:1
Number of A/D Converters: 1
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BAW62,133 BAW62_Rev_Feb2017.pdf
BAW62,133
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BAW62,143 BAW62_Rev_Feb2017.pdf
BAW62,143
Виробник: NXP USA Inc.
Description: DIODE STANDARD 75V 250MA ALF2
Packaging: Tape & Box (TB)
Package / Case: DO-204AH, DO-35, Axial
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Capacitance @ Vr, F: 2pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: ALF2
Operating Temperature - Junction: 200°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 75 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 100 mA
Current - Reverse Leakage @ Vr: 5 µA @ 75 V
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BT136-600E/02,127 BT136-600E.pdf
BT136-600E/02,127
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 4A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 15 mA
Current - Gate Trigger (Igt) (Max): 10 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 25A, 27A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 600 V
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BUK7510-55AL,127 BUK7510-55AL.pdf
BUK7510-55AL,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6280 pF @ 25 V
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BUK752R3-40C,127 BUK752R3-40C.pdf
BUK752R3-40C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 175 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11323 pF @ 25 V
Qualification: AEC-Q101
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BUK753R4-30B,127 BUK753R4-30B.pdf
BUK753R4-30B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 25A, 10V
Power Dissipation (Max): 255W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 75 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4951 pF @ 25 V
Qualification: AEC-Q101
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BUK754R3-75C,127 BUK754R3-75C.pdf
BUK754R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.3mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 142 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11659 pF @ 25 V
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BUK7609-55A,118
BUK7609-55A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 25A, 10V
Power Dissipation (Max): 211W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 0 V
Input Capacitance (Ciss) (Max) @ Vds: 3271 pF @ 25 V
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BUK7619-100B,118 BUK7619-100B.pdf
BUK7619-100B,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Qualification: AEC-Q101
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BUK761R8-30C,118 BUK761R8-30C.pdf
BUK761R8-30C,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7880-55A,115 BUK7880-55A.pdf
BUK7880-55A,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 7A SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Qualification: AEC-Q101
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BUK7E07-55B,127 BUK7E07-55B.pdf
BUK7E07-55B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Power Dissipation (Max): 203W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Grade: Automotive
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Qualification: AEC-Q101
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BUK7E4R3-75C,127
BUK7E4R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A.pdf
BUK9213-30A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 55A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
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BY329-1000,127 BY329_SERIES.pdf
BY329-1000,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
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BY329-1200,127 BY329_SERIES.pdf
BY329-1200,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.2KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
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CGY888C,112 CGY888C.pdf
CGY888C,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
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CX24123-11Z,518
CX24123-11Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-11Z,557
CX24123-11Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-21Z,518
CX24123-21Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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CX24123-21Z,557
CX24123-21Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tray
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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LPC2930FET208,551
LPC2930FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FBD208,551 LPC2939.pdf
LPC2939FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FET208,551
LPC2939FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MFRC52201HN1,151 MFRC522.pdf
MFRC52201HN1,151
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC523.pdf
MFRC52301HN1,157
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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MFRC53001T/0FE,518
MFRC53001T/0FE,518
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32SO
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V ~ 5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-SO
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P89LPC9201FDH,112 P89LPC92X1.pdf
P89LPC9201FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9211FDH,112 P89LPC92X1.pdf
P89LPC9211FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
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P89LPC922A1FDH,112 P89LPC92X1.pdf
P89LPC922A1FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC922A1FN,112 P89LPC92X1.pdf
P89LPC922A1FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9241FDH,112 P89LPC92X1.pdf
P89LPC9241FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9251FDH,112 P89LPC92X1.pdf
P89LPC9251FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9301FDH,512 P89LPC9301_931A1.pdf
P89LPC9301FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC931A1FDH,512 P89LPC9301_931A1.pdf
P89LPC931A1FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9321FA,529 P89LPC9321.pdf
P89LPC9321FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9331FDH,512 P89LPC9331_9341_9351_9361.pdf
P89LPC9331FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC9341FDH,512 P89LPC9331_9341_9351_9361.pdf
P89LPC9341FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9351FA,529 P89LPC9331_9341_9351_9361.pdf
P89LPC9351FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9401FBD,557 P89LPC9401.pdf
P89LPC9401FBD,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 23
DigiKey Programmable: Not Verified
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P89LPC9402FBD,557 P89LPC9402.pdf
P89LPC9402FBD,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 64LQFP
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PBSS5140V,315 PBSS5140V.pdf
PBSS5140V,315
Виробник: NXP USA Inc.
Description: TRANS PNP 40V 1A SOT666
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PCA24S08D/DG,118 PCA24S08.pdf
PCA24S08D/DG,118
Виробник: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
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PCA9557D/DG,118 PCA9557.pdf
PCA9557D/DG,118
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9575PW2,118 PCA9575.pdf
PCA9575PW2,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 28TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 28-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+87.63 грн
Мінімальне замовлення: 2500
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PDTA143ZK,135 PDTA143Z_Series_Rev2009.pdf
PDTA143ZK,135
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PESD3V3L1UA,115 PESD3V3L1UA_UB_UL.pdf
PESD3V3L1UA,115
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PHP165NQ08T,127 PHP165NQ08T.pdf
PHP165NQ08T,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8250 pF @ 25 V
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PMN38EN,135 PMN38EN.pdf
PMN38EN,135
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 5.4A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 3A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 6.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 495 pF @ 25 V
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PMN49EN,135 PMN49EN.pdf
PMN49EN,135
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 4.6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 47mOhm @ 2A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V
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PMN49EN,165 PMN49EN.pdf
PMN49EN,165
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 4.6A 6TSOP
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