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BUK7619-100B,118 BUK7619-100B,118 NXP USA Inc. BUK7619-100B.pdf Description: MOSFET N-CH 100V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK761R8-30C,118 BUK761R8-30C,118 NXP USA Inc. BUK761R8-30C.pdf Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7880-55A,115 BUK7880-55A,115 NXP USA Inc. BUK7880-55A.pdf Description: MOSFET N-CH 55V 7A SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7E07-55B,127 BUK7E07-55B,127 NXP USA Inc. BUK7E07-55B.pdf Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Power Dissipation (Max): 203W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7E4R3-75C,127 BUK7E4R3-75C,127 NXP USA Inc. Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A,118 NXP USA Inc. BUK9213-30A.pdf Description: MOSFET N-CH 30V 55A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
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BY329-1000,127 BY329-1000,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
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BY329-1200,127 BY329-1200,127 NXP USA Inc. BY329_SERIES.pdf Description: DIODE GEN PURP 1.2KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
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CGY888C,112 CGY888C,112 NXP USA Inc. CGY888C.pdf Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
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CX24123-11Z,518 CX24123-11Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-11Z,557 CX24123-11Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-21Z,518 CX24123-21Z,518 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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CX24123-21Z,557 CX24123-21Z,557 NXP USA Inc. Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tray
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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LPC2930FET208,551 LPC2930FET208,551 NXP USA Inc. Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FBD208,551 LPC2939FBD208,551 NXP USA Inc. LPC2939.pdf Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FET208,551 LPC2939FET208,551 NXP USA Inc. Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MFRC52201HN1,151 MFRC52201HN1,151 NXP USA Inc. MFRC522.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC52301HN1,157 NXP USA Inc. MFRC523.pdf Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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MFRC53001T/0FE,518 MFRC53001T/0FE,518 NXP USA Inc. Description: IC RFID READER 13.56MHZ 32SO
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V ~ 5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-SO
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P89LPC9201FDH,112 P89LPC9201FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9211FDH,112 P89LPC9211FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
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P89LPC922A1FDH,112 P89LPC922A1FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC922A1FN,112 P89LPC922A1FN,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9241FDH,112 P89LPC9241FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9251FDH,112 P89LPC9251FDH,112 NXP USA Inc. P89LPC92X1.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9301FDH,512 P89LPC9301FDH,512 NXP USA Inc. P89LPC9301_931A1.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC931A1FDH,512 P89LPC931A1FDH,512 NXP USA Inc. P89LPC9301_931A1.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9321FA,529 P89LPC9321FA,529 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9331FDH,512 P89LPC9331FDH,512 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC9341FDH,512 P89LPC9341FDH,512 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9351FA,529 P89LPC9351FA,529 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9401FBD,557 P89LPC9401FBD,557 NXP USA Inc. P89LPC9401.pdf Description: IC MCU 8BIT 8KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 23
DigiKey Programmable: Not Verified
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P89LPC9402FBD,557 P89LPC9402FBD,557 NXP USA Inc. P89LPC9402.pdf Description: IC MCU 8BIT 8KB FLASH 64LQFP
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PBSS5140V,315 PBSS5140V,315 NXP USA Inc. PBSS5140V.pdf Description: TRANS PNP 40V 1A SOT666
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PCA24S08D/DG,118 PCA24S08D/DG,118 NXP USA Inc. PCA24S08.pdf Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
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PCA9557D/DG,118 PCA9557D/DG,118 NXP USA Inc. PCA9557.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9575PW2,118 PCA9575PW2,118 NXP USA Inc. PCA9575.pdf Description: IC XPND 400KHZ I2C SMBUS 28TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 28-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+91.19 грн
Мінімальне замовлення: 2500
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PDTA143ZK,135 PDTA143ZK,135 NXP USA Inc. PDTA143Z_Series_Rev2009.pdf Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PESD3V3L1UA,115 PESD3V3L1UA,115 NXP USA Inc. PESD3V3L1UA_UB_UL.pdf Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PHP165NQ08T,127 PHP165NQ08T,127 NXP USA Inc. PHP165NQ08T.pdf Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8250 pF @ 25 V
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PMN38EN,135 PMN38EN,135 NXP USA Inc. PMN38EN.pdf Description: MOSFET N-CH 30V 5.4A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 3A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 6.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 495 pF @ 25 V
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PMN49EN,135 PMN49EN,135 NXP USA Inc. PMN49EN.pdf Description: MOSFET N-CH 30V 4.6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 47mOhm @ 2A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V
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PMN49EN,165 PMN49EN,165 NXP USA Inc. PMN49EN.pdf Description: MOSFET N-CH 30V 4.6A 6TSOP
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PRTR5V0U1T,215 PRTR5V0U1T,215 NXP USA Inc. PRTR5V0U1T.pdf Description: TVS DIODE 5.5VWM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
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PRTR5V0U2D,115 PRTR5V0U2D,115 NXP USA Inc. PRTR5V0U2D.pdf Description: TVS DIODE 5.5VWM SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Capacitance @ Frequency: 1pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 2
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q101
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TDA19977BHV/15/C1' TDA19977BHV/15/C1' NXP USA Inc. TDA19977A%2CB.pdf Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
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TDA19977BHV/15/C1, TDA19977BHV/15/C1, NXP USA Inc. TDA19977A,B.pdf Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19977BHV/15/C1: TDA19977BHV/15/C1: NXP USA Inc. TDA19977A,B.pdf Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1' TDA19978BHV/15/C1' NXP USA Inc. Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1, TDA19978BHV/15/C1, NXP USA Inc. Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1: TDA19978BHV/15/C1: NXP USA Inc. Description: IC INTFACE SPECIALIZED 144HLQFP
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TDA3664TT/N1,118 TDA3664TT/N1,118 NXP USA Inc. TDA3664.pdf Description: IC REG LINEAR 5V 100MA 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-TSSOP
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
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TDA5140AT/C1,112 TDA5140AT/C1,112 NXP USA Inc. TDA5140A.pdf Description: IC MOTOR DRIVER 4V-18V 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 4V ~ 18V
Applications: General Purpose
Technology: Bipolar
Voltage - Load: 1.7V ~ 16V
Supplier Device Package: 20-SO
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Obsolete
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TDA5140AT/C1,118 TDA5140AT/C1,118 NXP USA Inc. TDA5140A.pdf Description: IC MOTOR DRIVER 4V-18V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 4V ~ 18V
Applications: General Purpose
Technology: Bipolar
Voltage - Load: 1.7V ~ 16V
Supplier Device Package: 20-SO
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Obsolete
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TDA6651TT/C3,118 TDA6651TT/C3,118 NXP USA Inc. TDA665%280%2C1%29TT.pdf Description: IC MXR/OSC AND SYNTH 38-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Mixer
Supplier Device Package: 38-TSSOP
Part Status: Obsolete
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TDA8025HN/C1,518 TDA8025HN/C1,518 NXP USA Inc. TDA8025.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.2V, 1.8V, 3V
Supplier Device Package: 32-HVQFN (5x5)
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TDA8025HN/C1,551 TDA8025HN/C1,551 NXP USA Inc. TDA8025.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
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TDA8025HN/C1,557 TDA8025HN/C1,557 NXP USA Inc. TDA8025.pdf Description: IC INTFACE SPECIALIZED 32HVQFN
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TDA8295HN/C1,518 TDA8295HN/C1,518 NXP USA Inc. TDA8295.pdf Description: IC VIDEO DEMODULATOR 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V
Applications: Consumer Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Control Interface: I2C
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TDA8295HN/C1,551 TDA8295HN/C1,551 NXP USA Inc. TDA8295.pdf Description: IC VIDEO DEMODULATOR 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V
Applications: Consumer Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Control Interface: I²C
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BUK7619-100B,118 BUK7619-100B.pdf
BUK7619-100B,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 25A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK761R8-30C,118 BUK761R8-30C.pdf
BUK761R8-30C,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 100A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 25A, 10V
Power Dissipation (Max): 333W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 10349 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7880-55A,115 BUK7880-55A.pdf
BUK7880-55A,115
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 7A SOT-223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 10A, 10V
Power Dissipation (Max): 8W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: SC-73
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 12 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 500 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7E07-55B,127 BUK7E07-55B.pdf
BUK7E07-55B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 7.1mOhm @ 25A, 10V
Power Dissipation (Max): 203W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 53 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3760 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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BUK7E4R3-75C,127
BUK7E4R3-75C,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 100A I2PAK
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BUK9213-30A,118 BUK9213-30A.pdf
BUK9213-30A,118
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 55A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 25A, 10V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: DPAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±15V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 37 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2852 pF @ 25 V
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BY329-1000,127 BY329_SERIES.pdf
BY329-1000,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1000 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 800 V
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BY329-1200,127 BY329_SERIES.pdf
BY329-1200,127
Виробник: NXP USA Inc.
Description: DIODE GEN PURP 1.2KV 8A TO220AC
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 135 ns
Technology: Standard
Current - Average Rectified (Io): 8A
Supplier Device Package: TO-220AC
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.85 V @ 20 A
Current - Reverse Leakage @ Vr: 1 mA @ 1000 V
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CGY888C,112 CGY888C.pdf
CGY888C,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Tube
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 280 mA
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CX24123-11Z,518
CX24123-11Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-11Z,557
CX24123-11Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 64TQFP
Packaging: Tray
Package / Case: 64-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 64-TQFP (10x10)
Control Interface: Parallel, Serial
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CX24123-21Z,518
CX24123-21Z,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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CX24123-21Z,557
CX24123-21Z,557
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 80TQFP
Packaging: Tray
Package / Case: 80-TQFP
Mounting Type: Surface Mount
Function: Demodulator
Applications: Consumer Video
Supplier Device Package: 80-TQFP (14x14)
Part Status: Obsolete
Control Interface: Parallel, Serial
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LPC2930FET208,551
LPC2930FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FBD208,551 LPC2939.pdf
LPC2939FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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LPC2939FET208,551
LPC2939FET208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32B 768KB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: ARM9®
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MFRC52201HN1,151 MFRC522.pdf
MFRC52201HN1,151
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
Part Status: Obsolete
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MFRC52301HN1,157 MFRC523.pdf
MFRC52301HN1,157
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.3V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-HVQFN (5x5)
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MFRC53001T/0FE,518
MFRC53001T/0FE,518
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 32SO
Packaging: Tape & Reel (TR)
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: SPI
Type: RFID Reader
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 3.3V ~ 5V
Standards: ISO 14443, MIFARE
Supplier Device Package: 32-SO
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P89LPC9201FDH,112 P89LPC92X1.pdf
P89LPC9201FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9211FDH,112 P89LPC92X1.pdf
P89LPC9211FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
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P89LPC922A1FDH,112 P89LPC92X1.pdf
P89LPC922A1FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC922A1FN,112 P89LPC92X1.pdf
P89LPC922A1FN,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Not Verified
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P89LPC9241FDH,112 P89LPC92X1.pdf
P89LPC9241FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9251FDH,112 P89LPC92X1.pdf
P89LPC9251FDH,112
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Data Converters: A/D 4x8b; D/A 1x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I²C, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Obsolete
Number of I/O: 18
DigiKey Programmable: Verified
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P89LPC9301FDH,512 P89LPC9301_931A1.pdf
P89LPC9301FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC931A1FDH,512 P89LPC9301_931A1.pdf
P89LPC931A1FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9321FA,529 P89LPC9321.pdf
P89LPC9321FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9331FDH,512 P89LPC9331_9341_9351_9361.pdf
P89LPC9331FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28TSSOP
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P89LPC9341FDH,512 P89LPC9331_9341_9351_9361.pdf
P89LPC9341FDH,512
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
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P89LPC9351FA,529 P89LPC9331_9341_9351_9361.pdf
P89LPC9351FA,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
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P89LPC9401FBD,557 P89LPC9401.pdf
P89LPC9401FBD,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
Supplier Device Package: 64-LQFP (14x14)
Number of I/O: 23
DigiKey Programmable: Not Verified
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P89LPC9402FBD,557 P89LPC9402.pdf
P89LPC9402FBD,557
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 64LQFP
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PBSS5140V,315 PBSS5140V.pdf
PBSS5140V,315
Виробник: NXP USA Inc.
Description: TRANS PNP 40V 1A SOT666
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PCA24S08D/DG,118 PCA24S08.pdf
PCA24S08D/DG,118
Виробник: NXP USA Inc.
Description: IC EEPROM 8KBIT I2C 400KHZ 8SO
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PCA9557D/DG,118 PCA9557.pdf
PCA9557D/DG,118
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16SO
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: No
Supplier Device Package: 16-SO
Current - Output Source/Sink: 10mA, 25mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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PCA9575PW2,118 PCA9575.pdf
PCA9575PW2,118
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 28TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.1V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 28-TSSOP
Current - Output Source/Sink: 1mA, 3mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+91.19 грн
Мінімальне замовлення: 2500
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PDTA143ZK,135 PDTA143Z_Series_Rev2009.pdf
PDTA143ZK,135
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A SMT3
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 5V
Supplier Device Package: SMT3; MPAK
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 47 kOhms
Resistors Included: R1 and R2
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PESD3V3L1UA,115 PESD3V3L1UA_UB_UL.pdf
PESD3V3L1UA,115
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 11VC SOD323
Packaging: Tape & Reel (TR)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 150°C (TA)
Capacitance @ Frequency: 34pF @ 1MHz
Current - Peak Pulse (10/1000µs): 4.5A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: SOD-323
Unidirectional Channels: 1
Voltage - Breakdown (Min): 5.3V
Voltage - Clamping (Max) @ Ipp: 11V
Power - Peak Pulse: 45W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
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PHP165NQ08T,127 PHP165NQ08T.pdf
PHP165NQ08T,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 25A, 10V
Power Dissipation (Max): 250W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 165 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8250 pF @ 25 V
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PMN38EN,135 PMN38EN.pdf
PMN38EN,135
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 5.4A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 3A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 6.1 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 495 pF @ 25 V
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PMN49EN,135 PMN49EN.pdf
PMN49EN,135
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 4.6A 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.6A (Tc)
Rds On (Max) @ Id, Vgs: 47mOhm @ 2A, 10V
Power Dissipation (Max): 1.75W (Tc)
Vgs(th) (Max) @ Id: 2V @ 1mA
Supplier Device Package: SC-74
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 8.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 350 pF @ 30 V
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PMN49EN,165 PMN49EN.pdf
PMN49EN,165
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 4.6A 6TSOP
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PRTR5V0U1T,215 PRTR5V0U1T.pdf
PRTR5V0U1T,215
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 1pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: SOT-23 (TO-236AB)
Unidirectional Channels: 1
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
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PRTR5V0U2D,115 PRTR5V0U2D.pdf
PRTR5V0U2D,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM SC74
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Capacitance @ Frequency: 1pF @ 1MHz
Voltage - Reverse Standoff (Typ): 5.5V (Max)
Supplier Device Package: SC-74
Unidirectional Channels: 2
Voltage - Breakdown (Min): 6V
Power Line Protection: Yes
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q101
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TDA19977BHV/15/C1' TDA19977A%2CB.pdf
TDA19977BHV/15/C1'
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
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TDA19977BHV/15/C1, TDA19977A,B.pdf
TDA19977BHV/15/C1,
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19977BHV/15/C1: TDA19977A,B.pdf
TDA19977BHV/15/C1:
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1'
TDA19978BHV/15/C1'
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1,
TDA19978BHV/15/C1,
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Applications: HDTV
Supplier Device Package: 144-HLQFP (20x20)
Part Status: Obsolete
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TDA19978BHV/15/C1:
TDA19978BHV/15/C1:
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 144HLQFP
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TDA3664TT/N1,118 TDA3664.pdf
TDA3664TT/N1,118
Виробник: NXP USA Inc.
Description: IC REG LINEAR 5V 100MA 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-TSSOP
Voltage - Output (Min/Fixed): 5V
Part Status: Obsolete
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
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TDA5140AT/C1,112 TDA5140A.pdf
TDA5140AT/C1,112
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-18V 20SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 4V ~ 18V
Applications: General Purpose
Technology: Bipolar
Voltage - Load: 1.7V ~ 16V
Supplier Device Package: 20-SO
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Obsolete
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TDA5140AT/C1,118 TDA5140A.pdf
TDA5140AT/C1,118
Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 4V-18V 20SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: 0°C ~ 70°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 4V ~ 18V
Applications: General Purpose
Technology: Bipolar
Voltage - Load: 1.7V ~ 16V
Supplier Device Package: 20-SO
Motor Type - AC, DC: Brushless DC (BLDC)
Part Status: Obsolete
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TDA6651TT/C3,118 TDA665%280%2C1%29TT.pdf
TDA6651TT/C3,118
Виробник: NXP USA Inc.
Description: IC MXR/OSC AND SYNTH 38-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Mixer
Supplier Device Package: 38-TSSOP
Part Status: Obsolete
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TDA8025HN/C1,518 TDA8025.pdf
TDA8025HN/C1,518
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: Analog
Voltage - Supply: 1.2V, 1.8V, 3V
Supplier Device Package: 32-HVQFN (5x5)
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TDA8025HN/C1,551 TDA8025.pdf
TDA8025HN/C1,551
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
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TDA8025HN/C1,557 TDA8025.pdf
TDA8025HN/C1,557
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HVQFN
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TDA8295HN/C1,518 TDA8295.pdf
TDA8295HN/C1,518
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 40HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V
Applications: Consumer Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Control Interface: I2C
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TDA8295HN/C1,551 TDA8295.pdf
TDA8295HN/C1,551
Виробник: NXP USA Inc.
Description: IC VIDEO DEMODULATOR 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Demodulator
Voltage - Supply: 1.08V ~ 1.32V, 2.97V ~ 3.63V
Applications: Consumer Video
Supplier Device Package: 40-HVQFN (6x6)
Part Status: Obsolete
Control Interface: I²C
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