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MC56F8027VLH MC56F8027VLH NXP USA Inc. MC56F8037.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC68HC11A1CFNE3R MC68HC11A1CFNE3R NXP USA Inc. MC68HC11A.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11D0CFBE2 MC68HC11D0CFBE2 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE2 MC68HC11D0CFNE2 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE3R MC68HC11D0CFNE3R NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11E0MFNE2 MC68HC11E0MFNE2 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1CFNE3R MC68HC11E1CFNE3R NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1MFNE3 MC68HC11E1MFNE3 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1VFNE3 MC68HC11E1VFNE3 NXP USA Inc. M68HC11E.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11K0CFNE3 MC68HC11K0CFNE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K0CFUE4 MC68HC11K0CFUE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE3 MC68HC11K1CFNE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE4R MC68HC11K1CFNE4R NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tape & Reel (TR)
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE3 MC68HC11K1CFUE3 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE4 MC68HC11K1CFUE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1VFNE4 MC68HC11K1VFNE4 NXP USA Inc. M68HC11K.pdf Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC908EY16MFA MC68HC908EY16MFA NXP USA Inc. MC68HC908EY16%2C8.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Verified
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MC68HC908QT2CFQ MC68HC908QT2CFQ NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC7410TVU400LE NXP USA Inc. MPC7410.pdf Description: IC MPU MPC74XX 400MHZ 360FCCBGA
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MC7448TVU1000ND MC7448TVU1000ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
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MC8610PX1066JB MC8610PX1066JB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610PX1333JB MC8610PX1333JB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Part Status: Obsolete
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MC8610TPX1066JB MC8610TPX1066JB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 1.066GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.066GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8610TPX800GB MC8610TPX800GB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Part Status: Obsolete
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MC8610TVT1066JB MC8610TVT1066JB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT1066JB MC8610VT1066JB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT800GB MC8610VT800GB NXP USA Inc. MPC8610.pdf Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Box
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8640DHX1000HC MC8640DHX1000HC NXP USA Inc. MPC8640_MPC8640D.pdf Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Packaging: Box
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640DHX1067NC MC8640DHX1067NC NXP USA Inc. Description: IC MPU MPC86XX 1.067GHZ 1023BGA
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MC8640DTHX1000HC NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Packaging: Box
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640DTHX1000NC MC8640DTHX1000NC NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8640DTHX1067NC MC8640DTHX1067NC NXP USA Inc. Description: IC MPU MPC86XX 1.067GHZ 1023BGA
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MC8640HX1000HC NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640HX1067NC MC8640HX1067NC NXP USA Inc. Description: IC MPU MPC86XX 1.067GHZ 994BGA
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MC8640THX1000HC NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640THX1000NC NXP USA Inc. Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640THX1067NC MC8640THX1067NC NXP USA Inc. Description: IC MPU MPC86XX 1.067GHZ 994BGA
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MC8641DTHX1000GC MC8641DTHX1000GC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8641DTHX1000NC MC8641DTHX1000NC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8641DTVU1333JC MC8641DTVU1333JC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MC8641THX1000GC MC8641THX1000GC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
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MC8641THX1000NC MC8641THX1000NC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
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MC8641TVU1333JC MC8641TVU1333JC NXP USA Inc. MCP8641(D).pdf Description: IC MPU MPC86XX 1.333GHZ 994BGA
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MC908JK3ECDWER MC908JK3ECDWER NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908JK3EMDWER MC908JK3EMDWER NXP USA Inc. MC68HC908Jx(1,3).pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908QY2ACDWER MC908QY2ACDWER NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC92460ZU MC92460ZU NXP USA Inc. MC92604FS.pdf Description: IC TELECOM INTERFACE 480TBGA
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MC9328MX21CJM MC9328MX21CJM NXP USA Inc. MC9328MX21.pdf Description: IC MPU I.MX21 266MHZ 289MAPBGA
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MC9RS08KA4CPG MC9RS08KA4CPG NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC9RS08KA4CTG MC9RS08KA4CTG NXP USA Inc. Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC9RS08KA8CTG MC9RS08KA8CTG NXP USA Inc. SC9RS08KA2.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 1836 шт:
термін постачання 21-31 дні (днів)
2+174.01 грн
10+124.64 грн
96+102.37 грн
192+91.90 грн
288+89.81 грн
576+86.75 грн
1056+83.13 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MC9RS08KB12CWJ MC9RS08KB12CWJ NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 12KB FLASH 20SOIC
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MC9RS08KB2CDC MC9RS08KB2CDC NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 2KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Last Time Buy
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 1898 шт:
термін постачання 21-31 дні (днів)
3+131.67 грн
10+92.90 грн
25+84.53 грн
100+70.71 грн
250+66.60 грн
500+64.12 грн
Мінімальне замовлення: 3
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MC9S08AC32CFGER MC9S08AC32CFGER NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC32MFDE MC9S08AC32MFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC9S08AC32MFJE MC9S08AC32MFJE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08AC48MFDE MC9S08AC48MFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
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MC9S08AC48MFGE MC9S08AC48MFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC48MFJE MC9S08AC48MFJE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 32LQFP
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MC9S08AC48MFUE MC9S08AC48MFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 48KB FLASH 64QFP
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MC56F8027VLH MC56F8037.pdf
MC56F8027VLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 2K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC68HC11A1CFNE3R MC68HC11A.pdf
MC68HC11A1CFNE3R
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11D0CFBE2 MC68HC711D3.pdf
MC68HC11D0CFBE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44QFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-QFP (10x10)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE2 MC68HC711D3.pdf
MC68HC11D0CFNE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11D0CFNE3R MC68HC711D3.pdf
MC68HC11D0CFNE3R
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 44PLCC
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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MC68HC11E0MFNE2 M68HC11E.pdf
MC68HC11E0MFNE2
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1CFNE3R M68HC11E.pdf
MC68HC11E1CFNE3R
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1MFNE3 M68HC11E.pdf
MC68HC11E1MFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11E1VFNE3 M68HC11E.pdf
MC68HC11E1VFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC68HC11K0CFNE3 M68HC11K.pdf
MC68HC11K0CFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K0CFUE4 M68HC11K.pdf
MC68HC11K0CFUE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE3 M68HC11K.pdf
MC68HC11K1CFNE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFNE4R M68HC11K.pdf
MC68HC11K1CFNE4R
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tape & Reel (TR)
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE3 M68HC11K.pdf
MC68HC11K1CFUE3
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1CFUE4 M68HC11K.pdf
MC68HC11K1CFUE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC11K1VFNE4 M68HC11K.pdf
MC68HC11K1VFNE4
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 84PLCC
Packaging: Tube
Package / Case: 84-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 84-PLCC (29.29x29.29)
Number of I/O: 37
DigiKey Programmable: Not Verified
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MC68HC908EY16MFA MC68HC908EY16%2C8.pdf
MC68HC908EY16MFA
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Verified
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MC68HC908QT2CFQ MC68HC908QY4.pdf
MC68HC908QT2CFQ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC7410TVU400LE MPC7410.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360FCCBGA
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MC7448TVU1000ND MPC7448ECS01AD.pdf
MC7448TVU1000ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
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MC8610PX1066JB MPC8610.pdf
MC8610PX1066JB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610PX1333JB MPC8610.pdf
MC8610PX1333JB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Part Status: Obsolete
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MC8610TPX1066JB MPC8610.pdf
MC8610TPX1066JB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.066GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8610TPX800GB MPC8610.pdf
MC8610TPX800GB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
Part Status: Obsolete
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MC8610TVT1066JB MPC8610.pdf
MC8610TVT1066JB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT1066JB MPC8610.pdf
MC8610VT1066JB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.066GHZ 783BGA
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MC8610VT800GB MPC8610.pdf
MC8610VT800GB
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 800MHZ 783FCPBGA
Packaging: Box
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: DIU, LCD
Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI
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MC8640DHX1000HC MPC8640_MPC8640D.pdf
MC8640DHX1000HC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Packaging: Box
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640DHX1067NC
MC8640DHX1067NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
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MC8640DTHX1000HC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
Packaging: Box
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640DTHX1000NC
MC8640DTHX1000NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8640DTHX1067NC
MC8640DTHX1067NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 1023BGA
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MC8640HX1000HC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640HX1067NC
MC8640HX1067NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 994BGA
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MC8640THX1000HC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640THX1000NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
Packaging: Box
Package / Case: 994-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 994-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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MC8640THX1067NC
MC8640THX1067NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.067GHZ 994BGA
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MC8641DTHX1000GC MCP8641(D).pdf
MC8641DTHX1000GC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8641DTHX1000NC MCP8641(D).pdf
MC8641DTHX1000NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 1023FCCBGA
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MC8641DTVU1333JC MCP8641(D).pdf
MC8641DTVU1333JC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 1023BGA
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MC8641THX1000GC MCP8641(D).pdf
MC8641THX1000GC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
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MC8641THX1000NC MCP8641(D).pdf
MC8641THX1000NC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.0GHZ 994FCCBGA
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MC8641TVU1333JC MCP8641(D).pdf
MC8641TVU1333JC
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.333GHZ 994BGA
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MC908JK3ECDWER MC68HC908Jx(1,3).pdf
MC908JK3ECDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908JK3EMDWER MC68HC908Jx(1,3).pdf
MC908JK3EMDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
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MC908QY2ACDWER MC68HLC908QY4.pdf
MC908QY2ACDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC92460ZU MC92604FS.pdf
MC92460ZU
Виробник: NXP USA Inc.
Description: IC TELECOM INTERFACE 480TBGA
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MC9328MX21CJM MC9328MX21.pdf
MC9328MX21CJM
Виробник: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289MAPBGA
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MC9RS08KA4CPG
MC9RS08KA4CPG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-PDIP
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC9RS08KA4CTG
MC9RS08KA4CTG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
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MC9RS08KA8CTG SC9RS08KA2.pdf
MC9RS08KA8CTG
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 1836 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+174.01 грн
10+124.64 грн
96+102.37 грн
192+91.90 грн
288+89.81 грн
576+86.75 грн
1056+83.13 грн
Мінімальне замовлення: 2
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MC9RS08KB12CWJ MC9RS08KB12.pdf
MC9RS08KB12CWJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 12KB FLASH 20SOIC
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MC9RS08KB2CDC MC9RS08KB12.pdf
MC9RS08KB2CDC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Part Status: Last Time Buy
Number of I/O: 6
DigiKey Programmable: Not Verified
на замовлення 1898 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+131.67 грн
10+92.90 грн
25+84.53 грн
100+70.71 грн
250+66.60 грн
500+64.12 грн
Мінімальне замовлення: 3
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MC9S08AC32CFGER MC9S08AC60AD.pdf
MC9S08AC32CFGER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC32MFDE MC9S08AC60.pdf
MC9S08AC32MFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC9S08AC32MFJE MC9S08AC60AD.pdf
MC9S08AC32MFJE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08AC48MFDE MC9S08AC60.pdf
MC9S08AC48MFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
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MC9S08AC48MFGE MC9S08AC60.pdf
MC9S08AC48MFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AC48MFJE MC9S08AC60.pdf
MC9S08AC48MFJE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
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MC9S08AC48MFUE MC9S08AC60.pdf
MC9S08AC48MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64QFP
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